Water cooling device for silicon epitaxial growth

Abstract

The utility model relates to a water cooling device for epitaxial growth of silicon. The water cooling device comprises a containing box, a water tank is fixedly installed outside the containing box, a motor is fixedly installed at the bottom of the containing box, a rotating disc is fixedly installed at the position of an output shaft of the motor, and a cooling mechanism is arranged in the containing box. According to the water cooling device for silicon epitaxy growth, firstly, processed silicon epitaxy is put into the rotating disc, at the moment, the electric push rod drives the water collecting box and the high-pressure spray head to move downwards to the position close to the silicon epitaxy, then the controller drives the booster pump to start, and cold water enters the circulating pipe and slowly flows in the circulating pipe to achieve the effects of primary heat absorption and cooling; the heated hot water flows back to the water tank through the circulating pipe, and meanwhile, the controller drives the electromagnetic valve on the water guide pipe to start, so that cold water enters the water collecting box through the water guide pipe and is sprayed out by the high-pressure spray head to further cool the silicon epitaxy, and therefore, higher cooling efficiency is ensured, and the heated hot water is guided into the water tank through the return pipe at the moment.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon epitaxy, in particular to a water cooling device used for silicon epitaxial growth. Background Art

[0002] Silicon epitaxy, the growth of a single crystalline semiconductor film on a suitable crystalline substrate is epitaxial growth. All "epitaxial growths" are similar, and the substrate is usually composed of crystals of the same material as the deposited semiconductor.

[0003] The silicon epitaxial growth process is carried out at high temperature. After the process is completed, the reaction chamber needs to be quickly cooled by air cooling and water cooling to facilitate the robot to take the wafer. At present, silicon epitaxial equipment is often cooled by spraying, but during the cooling process, due to the evaporation of high temperature, the spray water will be evaporated in large quantities, resulting in a large amount of water required for the cooling device, wasting water resources. At the same time, uneven spraying will lead to poor quality of silicon epitaxy. Some recyclable water cooling devices lack filtering components, which leads to reduced water purity and affects the silicon epitaxial growth effect. Therefore, a water cooling device for silicon epitaxial growth is proposed to solve the above-mentioned problems. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a water-cooling device for silicon epitaxial growth, which has the advantage of high cooling efficiency and solves the problem that current silicon epitaxial equipment is often cooled by spraying, but during the cooling process, due to the evaporation of high temperature, a large amount of spray water will be evaporated, resulting in a large water demand for the cooling device and a waste of water resources. At the same time, uneven spraying will lead to poor quality of silicon epitaxy. Some recyclable water-cooling devices lack filtering components, which leads to reduced water purity and affects the silicon epitaxial growth effect.

[0005] To achieve the above object, the utility model provides the following technical solution: a water cooling device for silicon epitaxial growth, comprising a containing box, a water tank is fixedly installed on the outside of the containing box, a motor is fixedly installed on the bottom of the containing box, a turntable is fixedly installed on the output shaft of the motor, and a cooling mechanism is arranged inside the containing box;

[0006] The cooling mechanism includes a circulation pipe, an electric push rod, a water collecting box, a high-pressure nozzle, a sewage tank, a water pipe, a filter, an activated carbon plate, an air cooler and cooling fins. The circulation pipe is fixedly installed on the left side of the water tank, the electric push rod is fixedly installed inside the receiving box, the water collecting box is fixedly installed on the bottom of the electric push rod, the high-pressure nozzle is fixedly installed on the bottom of the water collecting box, the sewage tank is arranged inside the receiving box, the water pipe is fixedly connected to the rear side of the water collecting box, the filter is installed inside the water tank, the activated carbon plate is arranged inside the water tank, the air cooler is fixedly installed on the right side of the water tank, and cooling fins are fixedly installed on the rear side of the water tank.

[0007] Furthermore, the circulation pipe is U-shaped, surrounds the outside of the turntable and fits with the inner wall of the containing box, and a booster pump is arranged outside the circulation pipe.

[0008] Furthermore, one end of the circulation pipe away from the left side of the water tank is interconnected with the rear side of the water tank, a water collecting bucket is fixedly installed on the top of the water tank, and an observation window is arranged on the front side of the water tank.

[0009] Furthermore, there are two electric push rods, the bottoms of the two electric push rods are interconnected with the top of the water collecting box, the water pipe is a corrugated hose, and the side of the water pipe away from the water collecting box is interconnected with the rear side of the water tank.

[0010] Furthermore, the activated carbon plate is located at the bottom of the filter screen, the number of the air coolers is two, and the air outlet pipes of the two air coolers both extend to the inside of the water tank.

[0011] Furthermore, the outside of the sewage tank is connected to a return pipe interconnected with the water tank, and a controller is arranged outside the containing box, and the controller is electrically connected to the electric push rod, the motor and the cooling fan.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] 1. The water cooling device for silicon epitaxial growth cools down the heated silicon epitaxy by setting a containing box, which is convenient for taking the silicon epitaxy. By setting a motor, the controller drives the motor to start and drive the turntable to rotate, so that the silicon epitaxy in the turntable is sprayed more evenly and the cooling effect is better. By setting a cooling mechanism, the various structures of the cooling mechanism cooperate with each other to achieve a higher cooling efficiency for the silicon epitaxy and facilitate water saving.

[0014] 2. The water cooling device for silicon epitaxial growth is provided with a circulation pipe, and the controller drives the boost pump to start. At this time, the cold water in the water tank enters the circulation pipe, and the cold water flowing through the circulation pipe can absorb the heat in the containing box, so as to achieve the effect of cooling the containing box. By providing an electric push rod, the controller drives the electric push rod to move up and down to drive the high-pressure nozzle to move closer to the silicon epitaxy and spray more accurately. By providing a sewage tank, the cooling water sprayed by the high-pressure nozzle is collected in the sewage tank after cooling the silicon epitaxy. At this time, the solenoid valve starts the sewage to flow into the water tank from the return pipe. By providing a filter net and an activated carbon plate, the sewage introduced into the return pipe can be filtered, so as to ensure that the water can be recycled. By providing a cooling fan and a heat sink fin, the heated cold water in the water tank can be cooled, so as to facilitate the recycling of cold water. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional schematic diagram of the utility model;

[0016] Figure 2 It is a cross-sectional schematic diagram of the utility model;

[0017] Figure 3 It is a partial rear view schematic diagram of the utility model.

[0018] In the figure: 1 containing box, 2 water tank, 3 motor, 4 turntable, 5 cooling mechanism, 501 circulation pipe, 502 electric push rod, 503 water collecting box, 504 high pressure nozzle, 505 sewage tank, 506 water pipe, 507 filter screen, 508 activated carbon plate, 509 air cooler, 510 cooling fins. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 A water cooling device for silicon epitaxial growth comprises a containing box 1, a water tank 2 is fixedly mounted on the outside of the containing box 1, a motor 3 is fixedly mounted on the bottom of the containing box 1, a turntable 4 is fixedly mounted on the output shaft of the motor 3, and a cooling mechanism 5 is arranged inside the containing box 1;

[0021] The cooling mechanism 5 includes a circulation pipe 501, an electric push rod 502, a water collecting box 503, a high-pressure nozzle 504, a sewage tank 505, a water pipe 506, a filter 507, an activated carbon plate 508, an air cooler 509 and a heat dissipation fin 510. The circulation pipe 501 is fixedly installed on the left side of the water tank 2, the electric push rod 502 is fixedly installed inside the receiving box 1, the water collecting box 503 is fixedly installed on the bottom of the electric push rod 502, the high-pressure nozzle 504 is fixedly installed on the bottom of the water collecting box 503, the sewage tank 505 is arranged inside the receiving box 1, the water pipe 506 is fixedly connected to the rear side of the water collecting box 503, the filter 507 is installed inside the water tank 2, the activated carbon plate 508 is arranged inside the water tank 2, the air cooler 509 is fixedly installed on the right side of the water tank 2, and the heat dissipation fin 510 is fixedly installed on the rear side of the water tank 2.

[0022] exist Figure 1 and Figure 2In the figure, by setting a cooling mechanism 5, the various structures of the cooling mechanism 5 cooperate with each other to achieve a higher cooling efficiency for silicon epitaxy and an effect of saving water. The cooling mechanism 5 includes a circulation pipe 501, an electric push rod 502, a water collecting box 503, a high-pressure nozzle 504, a sewage tank 505, a water pipe 506, a filter screen 507, an activated carbon plate 508, an air cooler 509 and heat dissipation fins 510. The circulation pipe 501 is U-shaped, and the circulation pipe 501 surrounds the outside of the turntable 4 and fits with the inner wall of the containing box 1. A booster pump is arranged on the outside of the circulation pipe 501.

[0023] exist Figure 1 and Figure 2 In the figure, one end of the circulation pipe 501 away from the left side of the water tank 2 is connected to the rear side of the water tank 2, a water collecting bucket is fixedly installed on the top of the water tank 2, and an observation window is arranged on the front side of the water tank 2.

[0024] exist Figure 1 and Figure 3 In the figure, there are two electric push rods 502, the bottoms of the two electric push rods 502 are interconnected with the top of the water collecting box 503, the water pipe 506 is a corrugated hose, and the side of the water pipe 506 away from the water collecting box 503 is interconnected with the back side of the water tank 2. By setting the electric push rods 502, the controller drives the electric push rods 502 to rise and fall, which can drive the high-pressure nozzle 504 to move up and down, so that the high-pressure nozzle 504 is closer to the silicon epitaxial and the spraying is more accurate.

[0025] exist Figure 2 and Figure 3 In the figure, the activated carbon plate 508 is located at the bottom of the filter 507, and there are two air coolers 509. The air outlet pipes of the two air coolers 509 extend to the inside of the water tank 2. By setting the filter 507 and the activated carbon plate 508, the sewage introduced into the return pipe can be filtered, thereby ensuring that the water can be recycled.

[0026] exist Figure 2 and Figure 3 In the figure, the outside of the sewage tank 505 is connected with a return pipe interconnected with the water tank 2, and a controller is arranged outside the storage box 1, and the controller is electrically connected with the electric push rod 502, the motor 3 and the cooling fan 509.

[0027] To sum up, when the water cooling device for silicon epitaxial growth is used, the processed silicon epitaxy will first be placed in the turntable 4. At this time, the electric push rod 502 drives the water collecting box 503 and the high-pressure nozzle 504 to move downward to a position close to the silicon epitaxy. Then the controller drives the boost pump to start, and cold water enters the circulation pipe 501, and slowly flows in the circulation pipe 501 to achieve the initial heat absorption and cooling effect. The heated hot water returns to the water tank 2 through the circulation pipe 501, and is cooled by the air cooler 509 and the heat sink fins 510. At the same time, the controller drives the solenoid valve on the water pipe 506 to start, so that cold water enters the water collecting box 503 through the water pipe 506 and is sprayed out by the high-pressure nozzle 504, further cooling the silicon epitaxy, thereby ensuring a higher cooling efficiency. At this time, the heated hot water is introduced into the water tank 2 by the return pipe, and the filter screen 507 and the activated carbon plate 508 can filter the sewage introduced by the return pipe, thereby ensuring that the water can be recycled.

[0028] The electrical components appearing in this article are all connected to the external controller and 220V AC power, and the controller can be a conventional known device that plays a control role such as a computer. The specific model specifications of each device in this article need to be selected and determined based on the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water cooling device for silicon epitaxial growth, comprising a containing box (1), characterized in that: A water tank (2) is fixedly mounted on the outside of the containing box (1), a motor (3) is fixedly mounted on the bottom of the containing box (1), a rotating disk (4) is fixedly mounted on the output shaft of the motor (3), and a cooling mechanism (5) is arranged inside the containing box (1); The cooling mechanism (5) comprises a circulation pipe (501), an electric push rod (502), a water collection box (503), a high-pressure nozzle (504), a sewage tank (505), a water pipe (506), a filter screen (507), an activated carbon plate (508), a cooling fan (509) and a heat dissipation fin (510); the circulation pipe (501) is fixedly installed on the left side of the water tank (2); the electric push rod (502) is fixedly installed inside the containing box (1); and the water collection box is fixedly installed on the bottom of the electric push rod (502). (503), a high-pressure nozzle (504) is fixedly installed at the bottom of the water collecting box (503), a sewage tank (505) is arranged inside the containing box (1), a water pipe (506) is fixedly connected to the rear side of the water collecting box (503), a filter screen (507) is installed inside the water tank (2), an activated carbon plate (508) is arranged inside the water tank (2), a cooling fan (509) is fixedly installed on the right side of the water tank (2), and a heat dissipation fin (510) is fixedly installed on the rear side of the water tank (2).

2. A water cooling device for silicon epitaxial growth according to claim 1, characterized in that: The circulation pipe (501) is U-shaped, surrounds the outside of the turntable (4) and fits closely to the inner wall of the containing box (1), and a booster pump is arranged outside the circulation pipe (501).

3. The water cooling device for silicon epitaxial growth according to claim 1, characterized in that: One end of the circulation pipe (501) away from the left side of the water tank (2) is connected to the rear side of the water tank (2), a water collecting bucket is fixedly installed on the top of the water tank (2), and an observation window is provided on the front side of the water tank (2).

4. The water cooling device for silicon epitaxial growth according to claim 1, characterized in that: There are two electric push rods (502), the bottoms of the two electric push rods (502) are interconnected with the top of the water collecting box (503), the water pipe (506) is a corrugated hose, and the side of the water pipe (506) away from the water collecting box (503) is interconnected with the rear side of the water tank (2).

5. The water cooling device for silicon epitaxial growth according to claim 1, characterized in that: The activated carbon plate (508) is located at the bottom of the filter screen (507), and there are two air coolers (509), and the air outlet pipes of the two air coolers (509) both extend into the interior of the water tank (2).

6. The water cooling device for silicon epitaxial growth according to claim 1, characterized in that: The outside of the sewage tank (505) is connected to a return pipe interconnected with the water tank (2), and the outside of the containing box (1) is provided with a controller, and the controller is electrically connected to the electric push rod (502), the motor (3) and the cooling fan (509).

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