Colloid assembly and electronic equipment support

Abstract

The embodiment of the utility model provides a colloid assembly and an electronic equipment support. The colloid assembly comprises a base, a support and colloid. The colloid is arranged between the bracket and the base; the rubber body is provided with a first rubber body part and a second rubber body part, and the second rubber body part and the first rubber body part are connected and can be mutually opened or mutually folded; at the moment, the first rubber part is connected to the first mounting part and is encapsulated with the first mounting part; the second colloid part is connected to the second mounting part and is encapsulated on the second mounting part, so that the two ends of the colloid are encapsulated on the first mounting part and the second mounting part respectively, the tensile strength of the colloid, the base and the bracket is improved, and meanwhile, the second colloid part and the first colloid part are integrally connected, so that the tensile strength of the colloid is improved; therefore, the connection stability between the base and the support is guaranteed, the tensile strength of the colloid assembly is guaranteed, the service life of the colloid assembly is prolonged, and the tensile capacity of the colloid assembly is improved.

Description

Technical Field

[0001] The present application relates to the technical field of colloid components, and in particular to a colloid component and an electronic device bracket. Background Art

[0002] With the development of science and technology, electronic equipment brackets are used in people's lives. The electronic equipment brackets are used to support electronic equipment. The colloid component is a part of the electronic equipment bracket. In the prior art, the colloid component includes a base, a bracket and a colloid. The colloid is located between the base and the bracket. The two ends of the colloid are respectively connected to the base and the bracket. At this time, the colloid is fixed to the base and the bracket by screws. However, during the use of the colloid, the screws are easy to loosen, resulting in low tensile strength of the existing colloid component. Utility Model Content

[0003] The embodiments of the present application provide a colloid component and an electronic device bracket, which are connected to a first mounting portion by a first colloid portion and are coated with glue on the first mounting portion; the second colloid portion is connected to the second mounting portion and is coated with glue on the second mounting portion, so that the two ends of the colloid are respectively coated with glue on the first mounting portion and the second mounting portion, thereby improving the tensile strength of the colloid and the base and the bracket. At the same time, the second colloid portion is integrally connected to the first colloid portion, thereby improving the tensile strength of the colloid itself, thereby ensuring the connection stability between the base and the bracket and the tensile strength of the colloid component, thereby improving the service life and tensile resistance of the colloid component.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0005] According to one aspect of an embodiment of the present application, a colloid component is provided, which is applied to an electronic device bracket;

[0006] The colloid component comprises:

[0007] A base, used to connect an electronic device or a support; the base is provided with a first mounting portion;

[0008] A bracket is arranged on one side of the base; the bracket is provided with a second mounting portion;

[0009] A colloid is arranged between the bracket and the base; the colloid is provided with a first colloid part and a second colloid part, the second colloid part is connected to the first colloid part, and can be opened or folded with each other;

[0010] The first colloid part is connected to the first mounting part and is covered with rubber; the second colloid part is connected to the second mounting part and is covered with rubber; the second colloid part is integrally connected to the first colloid part.

[0011] Optionally, the first mounting portion is provided with a through hole;

[0012] The first colloid part is coated on the first mounting part from the bottom thereof upwards and connected to the base through the first mounting part; a part of the structure in the first colloid part is plugged into the via hole to improve the connection strength between the first colloid part and the first mounting part.

[0013] Optionally, the first colloid portion is provided with a first boss portion;

[0014] The first boss portion is arranged from the bottom of the first mounting portion upward through the via hole and is glued to the inner side wall of the via hole.

[0015] Optionally, the first colloid portion wraps the first mounting portion and is connected to the base via the first mounting portion; the first mounting portion is located inside the first colloid portion.

[0016] Optionally, the base is provided with a first receiving portion, which is located at one side of the first mounting portion and is for the first colloid portion to pass through; the first receiving portion is used to receive the first colloid portion or the second colloid portion.

[0017] Optionally, the second mounting portion is provided with a snap-fitting groove;

[0018] The second colloid part is wrapped around the second mounting part from the top downward and connected to the bracket via the second mounting part; a part of the structure in the second colloid part is inserted into the engaging groove to improve the connection strength between the second colloid part and the second mounting part.

[0019] Optionally, the engaging groove is arranged on a side wall of the second mounting portion and is recessed inwardly;

[0020] The second colloid part is provided with a second boss part; the second boss part is inserted into the engaging groove from the top of the second mounting part, and is glued to the inner side wall of the engaging groove.

[0021] Optionally, there are multiple colloids, and the multiple colloids are arranged on both sides of the first mounting portion or the second mounting portion and connected to each other; the multiple colloids are connected in an integrated manner.

[0022] Optionally, the bracket is magnetically connected or adsorbed to the base.

[0023] An electronic device bracket comprises the colloid component and the electronic device; the colloid component is located outside the electronic device, and the base of the colloid component is magnetically attracted or glued to the electronic device or the support.

[0024] In the technical solutions provided in some embodiments of the present application, the first colloid part is connected to the first mounting part and is coated with rubber on the first mounting part; the second colloid part is connected to the second mounting part and is coated with rubber on the second mounting part, so that the two ends of the colloid are respectively coated with rubber on the first mounting part and the second mounting part, thereby improving the tensile strength of the colloid and the base and the bracket. At the same time, the second colloid part is integrally connected to the first colloid part, thereby improving the tensile strength of the colloid itself, thereby ensuring the connection stability between the base and the bracket and the tensile strength of the colloid assembly, thereby improving the service life and tensile resistance of the colloid assembly.

[0025] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0027] Figure 1 A schematic diagram of a colloid assembly according to an embodiment of the present application is shown;

[0028] Figure 2 Shows Figure 1 A top view of

[0029] Figure 3 Shows Figure 2 A cross-sectional view;

[0030] Figure 4 Shows Figure 3 A partial enlarged view of point B in the middle;

[0031] Figure 5 A schematic diagram of a colloid in a colloid assembly according to an embodiment of the present application is shown.

[0032] Reference numerals

[0033] 100. Colloid components;

[0034] 10. base; 11. first mounting portion; 11a. through hole; 12. first receiving portion; 13. second magnet;

[0035] 20. bracket; 21. second mounting portion; 21a. engaging groove; 22. first magnet;

[0036] 30, colloid; 31, first colloid portion; 311, first boss portion; 32, second colloid portion; 321, second boss portion. DETAILED DESCRIPTION

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of example embodiments to those skilled in the art.

[0038] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, while some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0039] Please refer to the attached Figures 1 to 5 The embodiment of the present application provides a colloid component 100, which is used to support an electronic device or a support. In this case, the colloid component 100 is a part of the electronic device bracket.

[0040] In the embodiment of the present application, the colloid assembly 100 includes a base 10, a bracket 20 and a colloid 30. The base 10 is used to connect an electronic device or a support and to support the bracket 20 and the colloid 30.

[0041] The base 10 is used to connect the electronic device or the support so that the electronic device or the support is fixed to the base 10, thereby fixing the electronic device or the support. Optionally, the base 10 is adsorbed on the electronic device through a magnet. The electronic device can be a mobile phone or an electronic tablet, and the support can be a mobile phone case.

[0042] At this time, the base 10 is provided with a first mounting portion 11 , and the first mounting portion 11 is in a long strip shape.

[0043] In the embodiment of the present application, the bracket 20 is arranged on one side of the base 10; the bracket 20 is provided with a second mounting portion 21; the colloid 30 is arranged between the bracket 20 and the base 10; the colloid 30 is provided with a first colloid portion 31 and a second colloid portion 32, and the second colloid portion 32 is connected to the first colloid portion 31 and can be opened or folded with each other. At this time, the second colloid portion 32 and the first colloid portion 31 are opened with each other under tension, or are folded with each other under pressure.

[0044] Among them, the first colloid part 31 is connected to the first mounting part 11 and is covered with rubber on the first mounting part 11; the second colloid part 32 is connected to the second mounting part 21 and is covered with rubber on the second mounting part 21, so that the two ends of the colloid 30 are respectively covered with rubber on the first mounting part 11 and the second mounting part 21, thereby improving the tensile strength of the colloid 30 and the base 10 and the bracket 20. At the same time, the second colloid part 32 is integrally connected to the first colloid part 31, thereby improving the tensile strength of the colloid 30 itself, thereby ensuring the connection stability between the base 10 and the bracket 20 and ensuring the tensile strength of the colloid assembly 100, thereby improving the service life and tensile resistance of the colloid assembly 100.

[0045] The first mounting portion 11 is provided with a through hole 11a, and the through hole 11a is located in the middle of the first mounting portion 11. The first colloid portion 31 is encapsulated on the first mounting portion 11 from the bottom of the first mounting portion 11 upward, and is connected to the base 10 through the first mounting portion 11, so that the first colloid portion 31 is fixed to the base 10 by encapsulation, avoiding fixation by screws; a part of the structure in the first colloid portion 31 is inserted into the through hole 11a to improve the connection strength between the first colloid portion 31 and the first mounting portion 11, further enhance the connection strength between the first colloid portion 31 and the base 10, and avoid the first colloid portion 31 from easily separating from the base 10.

[0046] There are multiple via holes 11a, which are arranged along the length direction of the first mounting portion 11. The arrangement of multiple via holes 11a increases the connection stability between the via holes 11a and the first colloid portion 31, thereby facilitating the increase of the connection stability between the first colloid portion 31 and the base 10.

[0047] The first colloid part 31 is provided with a first boss part 311; the first boss part 311 is upwardly penetrated in the through hole 11a from the bottom of the first mounting part 11, and is glued to the inner side wall of the through hole 11a. At this time, the first boss part 311 is protruded from the bottom to the top by the first colloid part 31, and the outer contour of the first boss part 311 is adapted to the inner contour of the through hole 11a. The first boss part 311 is upwardly penetrated in the through hole 11a from the bottom of the first mounting part 11, and is glued to the inner side wall of the through hole 11a. The first boss part 311 and the through hole 11a are interference fit, so as to improve the connection stability between the first boss part 311 and the through hole 11a, so as to facilitate the first colloid part 31 to be connected with the through hole 11a relative to the first mounting part 11 through the first boss part 311.

[0048] The first colloid portion 31 wraps the first mounting portion 11 and is connected to the base 10 via the first mounting portion 11; the first mounting portion 11 is within the first colloid portion 31, so that the first colloid portion 31 is exposed to the outer surface of the first mounting portion 11, thereby facilitating the electronic device or the support to be fixed to the first mounting portion 11 via the first colloid portion 31, and then the outer surface of the electronic device or the support contacts the outer surface of the first colloid portion 31, thereby preventing the first mounting portion 11 from cutting the electronic device or the support.

[0049] The base 10 is provided with a first receiving portion 12, which is located at one side of the first mounting portion 11 and is provided for the first colloid portion 31 to pass through; the first receiving portion 12 is used to receive the first colloid portion 31 or the second colloid portion 32, at this time, the first receiving portion 12 is located at the outer side of the first mounting portion 11 and is provided for the first colloid portion 31 to pass through; the first receiving portion 12 is used to receive the first colloid portion 31 or the second colloid portion 32, so that the first colloid portion 31 and the second colloid portion 32 can be accommodated in the first receiving portion 12 after being folded, so as to facilitate the colloid 30 to be accommodated in the base 10, thereby reducing the longitudinal space of the colloid assembly 100 after being folded, and facilitating storage.

[0050] The second mounting portion 21 is provided with a snap-fitting groove 21a, which is located in the middle of the second mounting portion 21. The second colloid portion 32 is rubber-coated on the second mounting portion 21 from the top downward, and is connected to the bracket 20 through the second mounting portion 21, so that the second colloid portion 32 is fixed to the bracket 20 by rubber-coating, avoiding fixing the bracket 20 by screws. Part of the structure in the second colloid portion 32 is inserted into the snap-fitting groove 21a to improve the connection strength between the second colloid portion 32 and the second mounting portion 21, further enhance the connection strength between the second colloid portion 32 and the bracket 20, and avoid the second colloid portion 32 from easily detaching from the bracket 20.

[0051] The engaging groove 21a is arranged on the side wall of the second mounting portion 21 and is recessed inwardly; the second colloid portion 32 is provided with a second boss portion 321; the second boss portion 321 is inserted into the engaging groove 21a by the top of the second mounting portion 21 and is glued to the inner side wall of the engaging groove 21a. At this time, the second boss portion 321 is protruded upward from the bottom by the second colloid portion 32, and the outer contour of the second boss portion 321 is adapted to the inner contour of the engaging groove 21a; the second boss portion 321 is inserted into the engaging groove 21a by the top of the second mounting portion 21 and is glued to the inner side wall of the engaging groove 21a. The second boss portion 321 and the engaging groove 21a are interference fit, so as to improve the connection stability between the second boss portion 321 and the engaging groove 21a, thereby facilitating the second colloid portion 32 to be connected with the engaging groove 21a relative to the second mounting portion 21 through the second boss portion 321.

[0052] There are multiple colloids 30, and the multiple colloids 30 are arranged on both sides of the first mounting portion 11 or the second mounting portion 21 and are connected to each other; the multiple colloids 30 are connected in an integrated manner, which improves the tensile strength of the multiple colloids 30 themselves, thereby ensuring the connection stability between the base 10 and the bracket 20 and the tensile strength of the colloid assembly 100, thereby improving the service life and tensile resistance of the colloid assembly 100.

[0053] The bracket 20 is magnetically connected or adsorbed to the base 10 so that the bracket 20 and the base 10 are connected under the magnetic effect after the colloid 30 is folded, thereby preventing the bracket 20 from automatically separating from the base 10. The bracket 20 is provided with a first magnet 22, and the base 10 is provided with a second magnet 13. The first magnet 22 and the second magnet 13 are arranged opposite to each other. When the second magnet 13 is close to the first magnet 22, the base 10 can be magnetically connected to the bracket 20 under the magnetic effect between the first magnet 22 and the second magnet 13.

[0054] In another embodiment, an electronic device bracket includes a colloid component 100 and an electronic device; the colloid component 100 is located on the outside of the electronic device, and the base 10 of the colloid component 100 is magnetically attracted or glued to the electronic device or a support member, so that the electronic device or the support member is fixed to the base 10 of the colloid component 100 under the action of magnetism, thereby facilitating the colloid component 100 to support the electronic device.

[0055] In the technical solutions provided in some embodiments of the present application, the base 10 is used to connect the electronic device or the support; the base 10 is provided with a first mounting portion 11; the bracket 20 is provided on one side of the base 10; the bracket 20 is provided with a second mounting portion 21; the colloid 30 is provided between the bracket 20 and the base 10; the colloid 30 is provided with a first colloid portion 31 and a second colloid portion 32, the second colloid portion 32 is connected to the first colloid portion 31, and can be opened or folded with each other; at this time, the first colloid portion 31 is connected to the first mounting portion 11, and the colloid is encapsulated with the first mounting portion 11. 1; The second colloid part 32 is connected to the second mounting part 21 and is coated with rubber on the second mounting part 21, so that the two ends of the colloid 30 are respectively coated with rubber on the first mounting part 11 and the second mounting part 21, thereby improving the tensile strength of the colloid 30 and the base 10 and the bracket 20. At the same time, the second colloid part 32 is integrally connected to the first colloid part 31, thereby improving the tensile strength of the colloid 30 itself, thereby ensuring the connection stability between the base 10 and the bracket 20 and ensuring the tensile strength of the colloid assembly 100, thereby improving the service life and tensile resistance of the colloid assembly 100.

[0056] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0057] In the description of this application, the terms "second" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "second" and "second" may explicitly or implicitly include one or more features.

[0058] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A colloid component, characterized in that: include: A base (10) is used to connect an electronic device or a support; the base (10) is provided with a first mounting portion (11); A bracket (20) is arranged on one side of the base (10); the bracket (20) is provided with a second mounting portion (21); The colloid (30) is arranged between the bracket (20) and the base (10); the colloid (30) is provided with a first colloid part (31) and a second colloid part (32); the second colloid part (32) is connected to the first colloid part (31), and can be opened or folded with each other; The first colloid part (31) is connected to the first mounting part (11) and is encapsulated by rubber on the first mounting part (11); the second colloid part (32) is connected to the second mounting part (21) and is encapsulated by rubber on the second mounting part (21); the second colloid part (32) and the first colloid part (31) are connected in one piece.

2. The colloid assembly according to claim 1, characterized in that: The first mounting portion (11) is provided with a through hole (10a); The first colloid part (31) is encapsulated on the first mounting part (11) from the bottom of the first mounting part (11) upwards, and is connected to the base (10) via the first mounting part (11); a part of the structure in the first colloid part (31) is plugged into the through hole (10a) to improve the connection strength between the first colloid part (31) and the first mounting part (11).

3. The colloid assembly according to claim 2, characterized in that: The first colloid part (31) is provided with a first boss part (311); The first boss portion (311) is arranged from the bottom of the first mounting portion (11) upwardly through the through hole (10a) and is glued to the inner side wall of the through hole (10a).

4. The colloid assembly according to claim 2, characterized in that: The first colloid part (31) wraps the first mounting part (11) and is connected to the base (10) via the first mounting part (11); the first mounting part (11) is located inside the first colloid part (31).

5. The colloid assembly according to claim 1, characterized in that: The base (10) is provided with a first receiving portion (12), the first receiving portion (12) being located at one side of the first mounting portion (11) and being provided for the first colloid portion (31) to pass through; the first receiving portion (12) is used for receiving the first colloid portion (31) or the second colloid portion (32).

6. The colloid assembly according to claim 1, characterized in that: The second mounting portion (21) is provided with a snap-fitting groove (21a); The second colloid part (32) is wrapped around the second mounting part (21) from the top of the second mounting part (21) downwards and connected to the bracket (20) via the second mounting part (21); a part of the structure in the second colloid part (32) is inserted into the engaging groove (21a) to improve the connection strength between the second colloid part (32) and the second mounting part (21).

7. The colloid assembly according to claim 6, characterized in that: The engaging groove (21a) is arranged on the side wall of the second mounting portion (21) and is recessed inwardly; The second colloid part (32) is provided with a second boss part (321); the second boss part (321) is inserted into the engaging groove (21a) from the top of the second mounting part (21) and is glued to the inner side wall of the engaging groove (21a).

8. The colloid assembly according to claim 1, characterized in that: There are a plurality of the colloids (30), and the plurality of the colloids (30) are arranged on both sides of the first mounting portion (11) or the second mounting portion (21) and are connected to each other; the plurality of the colloids (30) are connected in an integrated manner.

9. The colloid assembly according to claim 1, characterized in that: The bracket (20) and the base (10) are connected magnetically or by adsorption.

10. An electronic equipment bracket, characterized in that: It comprises a colloid component (100) as described in any one of claims 1 to 9 and an electronic device; the colloid component (100) is located outside the electronic device, and the base (10) of the colloid component (100) is magnetically attracted or glued to the electronic device or the support.

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