Wafer warping degree detection device based on WET cleaning machine table

Abstract

The utility model provides a wafer warping degree detection device based on a WET cleaning machine, and the device is provided with an ultrasonic transceiver based on the WET cleaning machine, so as to calculate the warping degree of a wafer through the ultrasonic distance measurement principle. Wherein the wafer is vertically arranged, so that the deformation of the wafer caused by gravity can be effectively reduced, and the accuracy of wafer warping degree detection can be improved; the wafer warping degree detection is integrated in the WET cleaning machine, and the wafer warping degree detection can be directly carried out in the WET cleaning process, so that the time can be saved, and the production efficiency can be improved; furthermore, the ultrasonic wave provided by the ultrasonic transceiver is used for detecting the warping degree of the wafer, and meanwhile, the cleaning effect on the wafer can be enhanced.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment and relates to a wafer warpage detection device based on a WET cleaning machine. Background Art

[0002] As semiconductor devices develop towards miniaturization, thinness, and low power consumption, the thickness of chips is becoming thinner and thinner. As the thickness of the wafer decreases, the hardness of the wafer itself decreases, making the wafer warping more and more serious. In addition, the thin film manufacturing process of multiple materials is required during the chip processing process. Due to the differences in the characteristics of different materials at different temperatures, the wafer will generate stress, which will also cause the wafer to warp and deform.

[0003] The warping of the wafer changes the shape of the wafer, which will bring risks such as fragmentation and scratches to the chip manufacturing process, such as poor precision during lithography, inability to perform lithography operations due to the inability of the lithography machine to achieve good adsorption of the wafer, and wafer cracking during transportation or processing due to excessive stress on the wafer itself. Therefore, it is very important to measure the warpage of the wafer.

[0004] Most of the existing wafer warpage measurement equipment places the wafer flat on a plane formed by three support pins to support the wafer, and then performs a line scan to obtain the profile of the wafer surface by measuring the Z-axis focus distance. However, when the wafer is supported by the pins, the wafer will be deformed by its own gravity and the support force of the pins. The actual tested wafer warpage is the result of the combined effect of stress, gravity and the support force of the pins, and thus cannot truly reflect the actual warpage of the wafer. In addition, the wafer warpage measurement equipment and the wafer process equipment are carried out in two different machines, which is time-consuming.

[0005] Therefore, it is necessary to provide a wafer warpage detection device based on a WET cleaning machine. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a wafer warpage detection device based on a WET cleaning machine, so as to solve the problems of low accuracy and long time consumption of wafer warpage detection in the prior art.

[0007] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a wafer warpage detection device based on a WET cleaning machine, and the wafer warpage detection device comprises:

[0008] A tank body, used to contain a wafer cleaning solution;

[0009] A wafer base, the wafer base is located in the tank body and is used to carry a wafer placed vertically, and the wafer is immersed in the wafer cleaning solution;

[0010] An ultrasonic transmitter, used to provide ultrasonic waves into the wafer cleaning solution;

[0011] An ultrasonic receiver, used for receiving the ultrasonic wave reflected by the surface of the wafer;

[0012] A controller is in communication with the ultrasonic receiver and calculates the warpage of the wafer according to the ultrasonic wave received by the ultrasonic receiver.

[0013] Optionally, the ultrasonic transmitter and the ultrasonic receiver are an integrated ultrasonic transceiver.

[0014] Optionally, M ultrasonic transceivers are provided, where M>1 and is an integer.

[0015] Optionally, a driving member is further included, wherein the driving member is connected to the ultrasonic transceiver and communicates with the controller to drive the ultrasonic transceiver to move.

[0016] Optionally, the driving member drives the ultrasonic transceiver to move in a manner including horizontal movement and vertical movement or a combination thereof.

[0017] Optionally, a display is also included, and the display communicates with the controller to display the warpage detection result of the wafer.

[0018] Optionally, the display includes an ultrasonic imager for displaying the detected morphology of the wafer.

[0019] Optionally, a heater is also included to heat the wafer cleaning solution.

[0020] Optionally, the controller communicates with the ultrasonic receiver by wireless communication or wired communication.

[0021] Optionally, an alarm is also included, and the alarm communicates with the controller; the alarm includes an acoustic alarm, a optical alarm, or an audible and visual alarm.

[0022] As described above, the wafer warpage detection device based on the WET cleaning machine of the present invention is based on the WET cleaning machine and an ultrasonic transceiver is set to calculate the wafer warpage by using the ultrasonic ranging principle.

[0023] In the utility model, the wafer is placed vertically, which can effectively reduce the deformation of the wafer caused by gravity, thereby improving the accuracy of wafer warpage detection; the wafer warpage detection is integrated in the WET cleaning machine, and the wafer warpage detection can be directly performed during the WET cleaning process, thereby saving time and improving production efficiency; further, the ultrasonic wave provided by the ultrasonic transceiver can enhance the cleaning effect of the wafer while being used to detect the warpage of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Shown is a schematic structural diagram of a wafer warpage detection device based on a WET cleaning machine in the present invention.

[0025] Component number description

[0026] 100 tank

[0027] 200 Wafer Base

[0028] 300 Ultrasonic Transceiver

[0029] 400 Controller

[0030] 500 Drive parts

[0031] 600 Display

[0032] 700 Alarm

[0033] 800 Wafer Cleaning Fluid

[0034] 900 Wafer

[0035] 110 Heater DETAILED DESCRIPTION

[0036] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] See also Figure 1 This embodiment provides a wafer warpage detection device based on a WET cleaning machine, and the wafer warpage detection device includes: a trough body 100, a wafer base 200, an ultrasonic transceiver 300 and a controller 400.

[0040] The tank body 100 is used to contain a wafer cleaning liquid 800 so as to clean the wafer 900 in the wafer cleaning liquid 800. There is no limitation on the type of the wafer cleaning liquid 800, such as deionized water.

[0041] The wafer base 200 is located in the tank body 100, and is used to carry the wafer 900 placed vertically, and the wafer 900 is completely immersed in the wafer cleaning solution 800, so as to facilitate the cleaning process of the wafer 900. The size of the wafer 900 may include, for example, 4 inches, 6 inches, 8 inches, 12 inches, etc., which are not limited here. The type of the wafer base 200 can also be selected according to specific needs. For example, the wafer base 200 can be a base with a receiving groove at the bottom and can carry one wafer 900, or a base that can carry multiple wafers 900 at the same time.

[0042] It should be noted that the wafer 900 is placed on the wafer base 200 in a vertical direction, so that when performing wafer warpage detection, the deformation of the wafer 900 caused by gravity can be effectively reduced to improve the accuracy of wafer warpage detection. When performing wafer warpage detection, the ultrasonic wave emitted by the ultrasonic transceiver 300 acts on the front or back of the wafer 900, and after being reflected by the wafer 900, the ultrasonic wave can be received by the ultrasonic transceiver 300, so that the warpage of the wafer 900 can be calculated according to the ultrasonic ranging principle through the controller 400 communicating with the ultrasonic transceiver 300.

[0043] Among them, the controller 400 can be a device with storage and data processing functions, such as a computer, and the controller 400 can also be used to control the switching state of the ultrasonic transceiver 300. The specific type of the controller 400 is not limited here, and the communication method between the controller 400 and the ultrasonic transceiver 300 may include wired communication or wireless communication, which can be selected according to needs.

[0044] In this embodiment, the ultrasonic device used to provide ultrasonic waves to the wafer cleaning solution 800 and receive the ultrasonic waves reflected from the surface of the wafer 900 is an integrated ultrasonic transceiver 300, but it is not limited thereto. The ultrasonic transceiver 300 can also be composed of an independently arranged ultrasonic transmitter (not shown) and an ultrasonic receiver (not shown) so as to provide ultrasonic waves to the wafer cleaning solution 800 through the ultrasonic transmitter, and to receive the ultrasonic waves reflected from the surface of the wafer 900 through the ultrasonic receiver. No excessive restrictions are made here. For example, when an ultrasonic transmitter for providing ultrasonic waves required for cleaning wafers is provided in the WET cleaning machine, an ultrasonic receiver corresponding to the ultrasonic transmitter can be directly provided, and by adjusting the position distribution and quantity of the ultrasonic transmitter and the ultrasonic transmitter, the warpage of the wafer 900 can be detected while cleaning the wafer 900.

[0045] Among them, it is preferred that the ultrasonic transceiver 300 is in direct contact with the wafer cleaning fluid 800 so that the transmission medium of the ultrasonic wave is the wafer cleaning fluid 800, thereby reducing the deviation caused by the ultrasonic wave in the transmission medium and improving the accuracy of wafer warpage detection.

[0046] In this embodiment, due to the setting of the ultrasonic transceiver 300, while providing the ultrasonic waves required for detecting the warpage of the wafer 900, the ultrasonic waves propagated in the wafer cleaning liquid 800 can also enhance the cleaning effect on the wafer 900, thereby improving the cleaning effect of the WET machine on the wafer while performing wafer warpage detection.

[0047] like Figure 1 In this embodiment, a driving member 500 connected to the ultrasonic transceiver 300 is further provided, so that the driving member 500 drives the ultrasonic transceiver 300 to operate, so as to perform a more comprehensive scan of each area of ​​the wafer 900 and achieve a more accurate measurement of the wafer warpage.

[0048] The driving member 500 can communicate with the controller 400 so as to realize regulation of the driving member 500 through the controller 400. The type of the driving member 500 is not limited here, and a stepping motor or the like can be used.

[0049] Furthermore, the driving member 500 may drive the ultrasonic transceiver 300 to move in a horizontal movement or a vertical movement or a combination thereof, so that the ultrasonic transceiver 300 can scan along the radial direction of the wafer 900 to collect more comprehensive data.

[0050] In another embodiment, M ultrasonic transceivers 300 may be provided to realize more comprehensive data collection of the wafer 900, where M may be an integer such as 2, 3, or 5, so that by providing a plurality of ultrasonic transceivers 300 at corresponding positions of each region of the wafer 900 to be tested, multiple sets of data may be collected simultaneously at one time, thereby improving time efficiency. The distribution of the ultrasonic transceivers 300 is not limited here, and is preferably provided corresponding to radially equidistant spacing of the wafer 900 to be tested.

[0051] As an example, the wafer warpage detection device may further include a display 600 , and the display 600 may communicate with the controller 400 to display the warpage detection result of the wafer 900 .

[0052] Specifically, after the display 600 is set, the staff can directly observe the warpage detection result of the wafer 900 and timely understand the warpage degree of the wafer 900. The display 600 may include, for example, an ultrasonic imager to directly display the morphology of the wafer 900, but the type of the display 600 is not limited thereto. For example, the display 600 may also be a display that only displays warpage-related data or warpage-related curves, which is not limited here. The specific type of the display 600 may be selected according to needs.

[0053] As an example, the wafer warpage detection device may further include a heater 110 , so as to heat the wafer cleaning solution 800 through the heater 110 .

[0054] Specifically, after the heater 110 is provided, the heater 110 can be used to heat the wafer cleaning solution 800 to achieve a more effective cleaning effect. Of course, as required, the heater 110 can also be used to test the wafer warpage of the wafer 900 under different temperature environments. The specific type of the heater 110 is not excessively limited here, and the heater 110 can communicate with the controller 400 to control the heater through the controller 400.

[0055] As an example, an alarm 700 is also included, and the alarm 700 communicates with the controller 400 ; the alarm 700 includes an acoustic alarm 700 , a visual alarm 700 , or an audible and visual alarm 700 .

[0056] Specifically, after the alarm 700 is set to communicate with the controller 400, when the abnormal warpage of the wafer 900 is detected, the alarm 700 can be activated in time by the controller 400 to realize the timely alarm of the abnormal detection result of the wafer warpage, so that the staff can handle it in time and improve the production efficiency. According to the needs, the alarm 700 can be selected as a sound alarm, a light alarm or a sound and light alarm, and the specific type of the alarm 700 is not excessively limited here.

[0057] In summary, the utility model discloses a wafer warpage detection device based on a WET cleaning machine, and an ultrasonic transceiver is arranged on the WET cleaning machine to calculate the wafer warpage by using the ultrasonic ranging principle.

[0058] In the utility model, the wafer is placed vertically, which can effectively reduce the deformation of the wafer caused by gravity, thereby improving the accuracy of wafer warpage detection; the wafer warpage detection is integrated in the WET cleaning machine, and the wafer warpage detection can be directly performed during the WET cleaning process, thereby saving time and improving production efficiency; further, the ultrasonic wave provided by the ultrasonic transceiver can enhance the cleaning effect of the wafer while being used to detect the warpage of the wafer. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0059] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A wafer warpage detection device based on a WET cleaning machine, characterized in that: The wafer warpage detection device comprises: A tank body, used to contain a wafer cleaning solution; A wafer base, the wafer base is located in the tank body and is used to carry a wafer placed vertically, and the wafer is immersed in the wafer cleaning solution; An ultrasonic transmitter, used to provide ultrasonic waves into the wafer cleaning solution; An ultrasonic receiver, used for receiving the ultrasonic wave reflected by the surface of the wafer; A controller is in communication with the ultrasonic receiver and calculates the warpage of the wafer according to the ultrasonic wave received by the ultrasonic receiver.

2. The wafer warpage detection device according to claim 1, characterized in that: The ultrasonic transmitter and the ultrasonic receiver are an integrated ultrasonic transceiver.

3. The wafer warpage detection device according to claim 2, characterized in that: M ultrasonic transceivers are provided, where M>1 and is an integer.

4. The wafer warpage detection device according to claim 2, characterized in that: It also includes a driving member, which is connected to the ultrasonic transceiver and communicates with the controller to drive the ultrasonic transceiver to move.

5. The wafer warpage detection device according to claim 4, characterized in that: The driving member drives the ultrasonic transceiver to move in a manner that includes horizontal movement and vertical movement or a combination thereof.

6. The wafer warpage detection device according to claim 1, characterized in that: A display is also included, and the display communicates with the controller to display the warpage detection result of the wafer.

7. The wafer warpage detection device according to claim 6, characterized in that: The display includes an ultrasonic imager for displaying the detected morphology of the wafer.

8. The wafer warpage detection device according to claim 1, characterized in that: A heater is also included to heat the wafer cleaning solution.

9. The wafer warpage detection device according to claim 1, characterized in that: The communication method between the controller and the ultrasonic receiver includes wireless communication or wired communication.

10. The wafer warpage detection device according to claim 1, characterized in that: An alarm is also included, and the alarm communicates with the controller; the alarm includes an acoustic alarm, a light alarm, or an audible and visual alarm.

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