Semiconductor chilling plate performance detection device

Abstract

The utility model provides a semiconductor chilling plate performance detection device, which relates to the technical field of semiconductor chilling plate performance detection and comprises a bearing plate, a threaded rod is in threaded connection with the inside of the bearing plate, one end of the threaded rod is rotatably connected with a supporting plate, and an anti-falling ring is fixedly mounted at the end of the threaded rod. A positioning hole is formed in the joint of the supporting plate and the anti-disengaging ring, and a through hole is formed in the bearing plate. According to the utility model, the bearing plate and the supporting plate are arranged to fix the semiconductor chilling plate and the detection plate respectively, and in the detection process, the semiconductor chilling plate and the detection plate are attached together by moving the bearing plate, so that the distance is shortened to ensure that the cooling capacity can be directly transmitted to the detection plate, the loss amount of the cooling capacity is reduced, and the detection efficiency is improved. The accuracy of detection data is improved, and a gap is easily generated between the semiconductor chilling plate and the detection plate in the detection process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration piece performance detection, in particular to a semiconductor refrigeration piece performance detection device. Background Art

[0002] Semiconductor refrigerator, also called thermoelectric refrigerator, is a heat pump. Semiconductor refrigerator performance testing refers to the process of testing and evaluating the cooling effect, cooling power, cooling temperature and other performance of semiconductor refrigerators.

[0003] In the prior art, for example, patent CN219777549U discloses a semiconductor refrigeration performance detection device, comprising: a detection mechanism, including a pressing block and a heat sink, with a semiconductor refrigeration plate sandwiched in between, wherein the pressing block contacts the cold end of the semiconductor refrigeration plate, and the heat sink contacts the hot end of the semiconductor refrigeration plate; a pressing block temperature sensor, which is arranged on the pressing block and contacts the cold end of the semiconductor refrigeration plate; a heat sink temperature sensor, which is arranged on the heat sink; an ambient temperature sensor, which is independently arranged in the detection environment; and an electric control mechanism, which is electrically connected to the semiconductor refrigeration plate, the pressing block temperature sensor, the heat sink temperature sensor and the ambient temperature sensor.

[0004] However, in the prior art, during the detection of the refrigeration performance of the semiconductor refrigeration sheet, since the positions of the semiconductor refrigeration sheet and the detection sheet are difficult to control, a gap is easily generated between the semiconductor refrigeration sheet and the detection sheet during the detection process. The presence of the gap during the detection process will allow some heat to enter between the semiconductor refrigeration sheet and the detection sheet, which will directly affect the cooling speed of the detection sheet. Utility Model Content

[0005] The utility model mainly provides a semiconductor refrigeration plate performance detection device which is convenient for improving detection efficiency and preventing cold leakage.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor refrigeration plate performance detection device, including a carrying plate, the internal thread of the carrying plate is connected to a threaded rod, one end of the threaded rod is rotatably connected to a support plate, an anti-slip ring is fixedly installed at the end of the threaded rod, a positioning hole is provided at the junction of the support plate and the anti-slip ring, a through hole is provided inside the carrying plate, a containing groove is provided on the upper surface of the support plate, a card slot is provided on the upper surface of the carrying plate, and a sealing cover plate is provided inside the card slot, the semiconductor refrigeration plate and the detection plate are attached together by moving the carrying plate, the distance is shortened to ensure that the cold can be directly transferred to the detection plate, the loss of cold is reduced, and the cold air will only move downward to contact the detection plate, thereby improving the accuracy of the detection data.

[0007] Preferably, a limiting plate is provided inside the through hole, one end of the limiting plate is fixedly connected to a positioning rod, and the position of the limiting plate can be adjusted by moving the positioning rod so as to adapt to semiconductor refrigeration plates of different sizes.

[0008] Preferably, the positioning rod is slidably connected to the supporting plate, and a receiving groove is provided on the hole wall of the through hole. The shape of the receiving groove is adapted to the shape of the limiting plate, and the limiting plate can enter the receiving groove to free up enough space to deploy the semiconductor cooling plate.

[0009] Preferably, a movable plate is slidably connected inside the support plate, and a positioning plate is fixedly connected to the other end of the movable plate. The position of the positioning plate is changed by moving the movable plate, thereby achieving the purpose of determining the position of the detection piece.

[0010] Preferably, the positioning plate is located inside the containing groove, and the movable plate passes through the supporting plate, and the detection sheet can be fixed by only moving the two movable plates.

[0011] Preferably, a wiring groove is opened on one side of the supporting plate, and an extension support rod is fixedly installed on one side of the sealing cover plate. The extension support rod is located inside the wiring groove. The wiring groove is used to place the wires on the semiconductor refrigeration plate to ensure that the semiconductor refrigeration plate and the detection plate can be completely fitted together.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, a carrier plate and a support plate are provided to fix the semiconductor refrigeration sheet and the detection sheet respectively to ensure the stability of the semiconductor refrigeration sheet and the detection sheet, wherein the existence of the through hole can provide a flow space for the cold energy, and in the process of detection, the carrier plate is moved to make the semiconductor refrigeration sheet and the detection sheet fit together, shortening the distance to ensure that the cold energy can be directly transferred to the detection sheet, reducing the loss of cold energy, and improving the accuracy of the detection data, and in the process of detection, a gap is easily generated between the semiconductor refrigeration sheet and the detection sheet.

[0014] 2. In the utility model, the positioning rod and the movable plate respectively determine the positions of the limit plate and the positioning plate, and can be docked with semiconductor refrigeration plates and detection plates of different sizes and volumes at the same time, thereby improving the adaptability of the device and improving the stability of the semiconductor refrigeration plates and the detection plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional structural schematic diagram of a semiconductor refrigeration sheet performance detection device is proposed for the utility model;

[0016] Figure 2A top view of a semiconductor refrigeration plate performance detection device is provided for the utility model;

[0017] Figure 3 A schematic diagram of the disassembly of the threaded rod and support plate structure of a semiconductor refrigeration plate performance detection device proposed in the utility model;

[0018] Figure 4 The utility model provides a schematic diagram of the disassembly of a supporting plate and a sealing cover plate structure of a semiconductor refrigeration plate performance detection device.

[0019] Legend: 1. Load-bearing plate; 2. Support plate; 3. Sealing cover plate; 4. Threaded rod; 5. Limit plate; 6. Positioning rod; 7. Slot; 8. Wiring groove; 9. Holding groove; 10. Positioning plate; 11. Movable plate; 12. Positioning hole; 13. Anti-slip ring; 14. Extension support rod; 15. Accommodating groove; 16. Through hole. DETAILED DESCRIPTION

[0020] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0021] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0022] See also Figure 1 , Figure 2 , Figure 3 and Figure 4The utility model provides a technical solution: a semiconductor refrigeration performance detection device, including a carrier plate 1, the inner thread of the carrier plate 1 is connected with a threaded rod 4, one end of the threaded rod 4 is rotatably connected with a support plate 2, an anti-slip ring 13 is fixedly installed at the end of the threaded rod 4, a positioning hole 12 is provided at the intersection of the support plate 2 and the anti-slip ring 13, a through hole 16 is provided inside the carrier plate 1, a holding groove 9 is provided on the upper surface of the support plate 2, a card slot 7 is provided on the upper surface of the carrier plate 1, a sealing cover plate 3 is provided inside the card slot 7, the interior of the carrier plate 1 is used to place the semiconductor refrigeration piece to be tested, and the inner side of the support plate 2 is used to place the test piece. When performing performance testing, firstly, in the test piece, Two temperature sensors are set on the chip, and then the detection chip is placed in the receiving groove 9 in the support plate 2, and then the semiconductor refrigeration chip is placed in the through hole 16 in the carrier plate 1, and the threaded rod 4 is rotated to drive the carrier plate 1 to move downward, and the carrier plate 1 is moved to the inside of the receiving groove 9, so that the semiconductor refrigeration chip is in contact with the detection chip, so as to detect the cooling effect of the semiconductor refrigeration chip. During the detection process, the space above the through hole 16 is closed by the sealing cover plate 3, so that the cold air will only move downward and contact the detection chip, so as to improve the accuracy of the detection data, and the threaded rod 4 is rotatably installed in the inside of the through hole 16 through the anti-slip ring 13 to ensure the stability of the support plate 2 itself.

[0023] according to Figure 2 and Figure 4 As shown, a limiting plate 5 is arranged inside the through hole 16, and one end of the limiting plate 5 is fixedly connected to a positioning rod 6. The limiting plate 5 is used to clamp and fix the semiconductor cooling plate. The position of the limiting plate 5 can be adjusted by moving the positioning rod 6 so as to adapt to semiconductor cooling plates of different sizes.

[0024] according to Figure 2 and Figure 4 As shown, the positioning rod 6 is slidably connected to the supporting plate 1, and a receiving groove 15 is opened on the hole wall of the through hole 16. The shape of the receiving groove 15 is adapted to the shape of the limiting plate 5. The limiting plate 5 can enter into the receiving groove 15 to free up enough space to deploy the semiconductor cooling plate to avoid affecting the stability of the semiconductor cooling plate.

[0025] according to Figure 3 As shown, a movable plate 11 is slidably connected inside the support plate 2, and a positioning plate 10 is fixedly connected to the other end of the movable plate 11. The position of the positioning plate 10 is changed by moving the movable plate 11, thereby achieving the purpose of determining the position of the detection piece.

[0026] according to Figure 3As shown, the positioning plate 10 is located inside the containing groove 9, and the movable plate 11 passes through the supporting plate 2. When fixing the detection piece, only the two movable plates 11 need to be moved. The movement of the movable plate 11 will drive the positioning plate 10 to move in the containing groove 9 to complete the fixation of the detection piece.

[0027] according to Figure 4 As shown, a wiring groove 8 is opened on one side of the carrier plate 1, and an extension support rod 14 is fixedly installed on one side of the sealing cover plate 3. The extension support rod 14 is located inside the wiring groove 8. The wiring groove 8 is used to place the wires on the semiconductor refrigeration plate to ensure that the semiconductor refrigeration plate is in a horizontal state in the carrier plate 1, and to ensure that the semiconductor refrigeration plate and the detection plate can be completely fitted together. The existence of the extension support rod 14 makes it convenient to install and remove the sealing cover plate 3, and the extension support rod 14 can also suppress the wires on the semiconductor refrigeration plate, thereby further improving the stability of the semiconductor refrigeration plate.

[0028] The use method and working principle of the device: First, two temperature sensors are set on the detection sheet, and the detection sheet is made of copper sheet. When performing performance testing, the detection sheet is placed in the holding groove 9 in the support plate 2, and the semiconductor cooling sheet is placed in the through hole 16 in the carrier plate 1 and fixed with the limit plate 5. The position of the limit plate 5 can be adjusted by moving the positioning rod 6. At the same time, the existence of the accommodating groove 15 also provides sufficient activity space for the limit plate 5 to avoid affecting the placement of the semiconductor cooling sheet;

[0029] Then, the threaded rod 4 is rotated to drive the carrier plate 1 to move downward, and the carrier plate 1 is moved to the inside of the receiving groove 9, so that the semiconductor refrigeration plate and the detection plate are in contact with each other, and the wires on the semiconductor refrigeration plate are in the wiring groove 8 to ensure that the semiconductor refrigeration plate and the detection plate can be completely fitted together. The cold energy generated by the semiconductor refrigeration plate is directly transferred to the detection plate to detect the cooling effect of the semiconductor refrigeration plate. During the detection process, the space above the through hole 16 is closed by the sealing cover plate 3, so that the cold air can only move downward and contact the detection plate.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A semiconductor refrigeration performance detection device, characterized in that: The invention comprises a bearing plate (1), wherein the inner thread of the bearing plate (1) is connected to a threaded rod (4), one end of the threaded rod (4) is rotatably connected to a support plate (2), an anti-slip ring (13) is fixedly installed at the end of the threaded rod (4), a positioning hole (12) is provided at the intersection of the support plate (2) and the anti-slip ring (13), a through hole (16) is provided inside the bearing plate (1), a containing groove (9) is provided on the upper surface of the support plate (2), a clamping groove (7) is provided on the upper surface of the bearing plate (1), and a sealing cover plate (3) is provided inside the clamping groove (7).

2. A semiconductor refrigeration performance detection device according to claim 1, characterized in that: A limiting plate (5) is arranged inside the through hole (16), and one end of the limiting plate (5) is fixedly connected to a positioning rod (6).

3. A semiconductor refrigeration performance detection device according to claim 2, characterized in that: The positioning rod (6) is slidably connected to the bearing plate (1), and a receiving groove (15) is provided on the hole wall of the through hole (16), and the shape of the receiving groove (15) is adapted to the shape of the limiting plate (5).

4. A semiconductor refrigeration performance detection device according to claim 1, characterized in that: A movable plate (11) is slidably connected inside the support plate (2), and a positioning plate (10) is fixedly connected to the other end of the movable plate (11).

5. A semiconductor refrigeration performance detection device according to claim 4, characterized in that: The positioning plate (10) is located inside the containing groove (9), and the movable plate (11) passes through the supporting plate (2).

6. A semiconductor refrigeration performance detection device according to claim 1, characterized in that: A wiring groove (8) is provided on one side of the bearing plate (1), and an extension rod (14) is fixedly mounted on one side of the sealing cover plate (3), wherein the extension rod (14) is located inside the wiring groove (8).

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