Signal generator and test equipment

Abstract

The utility model discloses a signal generator and test equipment, and belongs to the field of display panel test. Comprising a signal generator body and a TEC heat dissipation module. The signal generator body comprises a base, a radiator, a fan and a PCB, a fixing plate of the radiator covers an opening of the base to form a sealing cavity, the fan is located on fins of the radiator, the PCB is inserted into the sealing cavity, and a chip is arranged on the PCB; the TEC heat dissipation module comprises a TEC refrigeration sheet, the TEC refrigeration sheet is located in the sealing cavity, and the first surface and the second surface of the TEC refrigeration sheet are fixed to a fixing plate of the radiator and the chip in parallel respectively. According to the signal generator provided by the utility model, the temperature of the chip can be controlled to be lower than the high-temperature environment temperature through the refrigeration surface of the TEC refrigeration sheet, so that the stable performance or normal use of the chip is ensured, and the overall height of the signal generator can be reduced at the same time.

Description

Technical Field

[0001] The utility model belongs to the field of display panel testing, and specifically relates to a signal generator and testing equipment. Background Art

[0002] In the field of display panel production, it is necessary to perform a dot screen test on the display panel through a lighting detection device. The dot screen test stage is very important for the quality control of the display panel. In this stage, it can be detected whether the display panel has bad pixels, such as bright or dark pixels. The signal generator (PG) is the signal source used to perform a dot screen test on the display panel.

[0003] In the related art, a PCB board is inserted into the signal generator, and the chip on the PCB board is very easy to heat up during the test. According to the Arrhenius formula, the operating life of the chip is halved and the performance stability is reduced for every 10°C increase in chip temperature. In industrial-grade chips, due to their relatively low junction temperature, when the junction temperature is reached, the chip performance deteriorates or cannot be used.

[0004] Existing signal generators usually use air cooling or water cooling to cool the chip. However, air cooling or water cooling can only dissipate heat, but cannot control the temperature of the chip to be lower than the high temperature environment temperature, so that the chip often cannot meet the cooling requirements in a high temperature environment, resulting in unstable chip performance or failure to use normally. Utility Model Content

[0005] In view of the above defects or improvement needs of the prior art, the utility model provides a signal generator and a testing device, the purpose of which is to control the temperature of the chip to be lower than the high temperature ambient temperature through the cooling surface of the TEC cooling plate, thereby ensuring the stable performance or normal use of the chip, and at the same time reducing the overall height of the signal generator.

[0006] In a first aspect, the utility model provides a signal generator, including a signal generator body and a TEC heat dissipation module;

[0007] The signal generator body comprises a base, a heat sink, a fan and a PCB board, the fixing plate cover of the heat sink is arranged on the opening of the base to form a sealed cavity, the fan is located on the fins of the heat sink, the PCB board is inserted in the sealed cavity, and the PCB board has a chip;

[0008] The TEC heat dissipation module comprises a TEC cooling plate, the TEC cooling plate is located in the sealed cavity, and a first surface and a second surface of the TEC cooling plate are respectively fixed in parallel on a fixing plate of the heat sink and on the chip.

[0009] Optionally, the TEC heat dissipation module further comprises a bakelite board having a positioning hole, the TEC cooling sheet is inserted into the positioning hole, the bakelite board is fixed on a fixing plate of the radiator and is located in the sealed cavity.

[0010] Optionally, the TEC heat dissipation module further includes an aluminum block, and the aluminum block is sandwiched between the TEC cooling plate and the chip.

[0011] Optionally, a thermal pad is sandwiched between the first surface of the TEC cooling plate and the fixing plate of the heat sink, between the second surface of the TEC cooling plate and the aluminum block, and between the aluminum block and the chip.

[0012] Optionally, the fan is inserted into the fin of the radiator, and a fan mesh cover is provided on the fin of the radiator, and the fan mesh cover is directly opposite to the fan to cover the fan.

[0013] Optionally, the fan is a bracket fan or a turbo fan.

[0014] Optionally, a heat dissipation fan is provided in the sealed cavity, the heat dissipation fan is arranged opposite to the PCB board, and the base has a ventilation hole arranged opposite to the heat dissipation fan.

[0015] Optionally, a bracket is provided in the sealed cavity, and the heat dissipation fan is inserted into the bracket.

[0016] Optionally, the PCB board is a signal board, and the chip is a main control chip.

[0017] In a second aspect, the utility model provides a testing device, wherein the testing device comprises a signal generator as described in the first aspect.

[0018] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0019] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0020] For a signal generator provided in an embodiment of the utility model, on the one hand, since the fan is located on the fins of the radiator, the TEC refrigeration sheet is located in the sealed cavity, and the first surface (heating surface) and the second surface (cooling surface) of the TEC refrigeration sheet are respectively fixed in parallel on the fixing plate of the radiator and on the chip, when the signal generator is working, the chip on the PCB board in a high-temperature environment can control the temperature of the chip to be lower than the high-temperature environment temperature by contacting with the cooling surface of the TEC refrigeration sheet, thereby achieving precise cooling and ensuring stable chip performance or normal use. The heating surface of the TEC refrigeration sheet is cooled by the radiator and the fan. Among them, the TEC refrigeration sheet controls the input current, and the material with thermoelectric energy conversion characteristics can make the heating surface on one side heat up and the cooling surface on the other side cool down, thereby meeting the cooling demand in a high-temperature environment.

[0021] On the other hand, since the fixing plate cover of the radiator is arranged on the opening of the base to form a sealed cavity, the radiator can be used as a cover plate of the signal generator body when cooling, avoiding the use of an additional cover plate, which not only reduces the cost but also reduces the overall height of the signal generator.

[0022] That is to say, a signal generator provided by an embodiment of the utility model can control the temperature of the chip to be lower than the high temperature environment temperature through the cooling surface of the TEC cooling plate, thereby ensuring stable performance or normal use of the chip, and at the same time reducing the overall height of the signal generator. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a signal generator provided by an embodiment of the utility model;

[0024] Figure 2 It is an exploded schematic diagram of a signal generator provided by an embodiment of the utility model;

[0025] Figure 3 It is a structural schematic diagram of a TEC heat dissipation module provided in an embodiment of the utility model.

[0026] In all the drawings, the same reference numerals represent the same technical features, specifically:

[0027] 1. Signal generator body; 11. Base; 111. Side panel; 112. Bottom panel; 12. Radiator; 13. Fan; 131. Fan grille; 132. Bolt; 14. PCB board; 141. Chip; 15. Cooling fan; 16. Bracket; 2. TEC cooling module; 21. TEC cooling sheet; 22. Bakelite board; 23. Aluminum block; 24. Thermal pad. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] Example:

[0034] Figure 1 is a structural schematic diagram of a signal generator provided by an embodiment of the utility model, Figure 2 is an exploded schematic diagram of a signal generator provided by an embodiment of the utility model, Figure 3 This is a schematic diagram of the structure of the TEC heat dissipation module provided by the embodiment of the utility model, combined with Figure 1 , Figure 2 and Figure 3 As shown, it includes a signal generator body 1 and a TEC heat dissipation module 2.

[0035] The signal generator body 1 includes a base 11, a heat sink 12, a fan 13 and a PCB board 14. The fixed plate cover of the heat sink 12 is arranged on the opening of the base 11 to form a sealed cavity. The fan 13 is located on the fins of the heat sink 12. The PCB board 14 is inserted in the sealed cavity, and the PCB board 14 has a chip 141.

[0036] The TEC heat dissipation module 2 includes a TEC cooling plate 21 (semiconductor refrigerator). The TEC cooling plate 21 is located in the sealed cavity, and the first surface and the second surface of the TEC cooling plate 21 are respectively fixed in parallel on the fixing plate of the heat sink 12 and the chip 141 .

[0037] For a signal generator provided in an embodiment of the utility model, on the one hand, since the fan 13 is located on the fins of the radiator 12, the TEC cooling sheet 21 is located in the sealed cavity, and the first surface (heating surface) and the second surface (cooling surface) of the TEC cooling sheet 21 are respectively fixed in parallel on the fixing plate of the radiator 12 and the chip 141, when the signal generator is working, the chip 141 on the PCB board 14 in a high temperature environment can control the temperature of the chip 141 to be lower than the high temperature environment temperature by contacting with the cooling surface of the TEC cooling sheet 21, thereby achieving precise cooling and ensuring the stable performance or normal use of the chip 141. The heating surface of the TEC cooling sheet 21 is cooled by the radiator 12 and the fan 13. Among them, the TEC cooling sheet 21 controls the input current, and the material with thermoelectric energy conversion characteristics can make the heating surface on one side heat up and the cooling surface on the other side cool down, thereby meeting the cooling demand in a high temperature environment.

[0038] On the other hand, since the fixing plate cover of the radiator 12 is arranged on the opening of the base 11 to form a sealed cavity, the radiator 12 can be used as a cover of the signal generator body 1 when cooling, avoiding the use of an additional cover, which not only reduces the cost but also reduces the overall height of the signal generator.

[0039] That is to say, the signal generator provided by the embodiment of the utility model can control the temperature of the chip 141 to be lower than the high temperature environment temperature through the cooling surface of the TEC cooling plate 21, thereby ensuring the stable performance or normal use of the chip 141, and at the same time reducing the overall height of the signal generator.

[0040] It is easy to understand that the radiator 12 includes a fixing plate and fins that are connected to each other, wherein the fixing plate serves as a mounting end for installing and fixing the radiator 12 .

[0041] Continue to see Figure 2 and Figure 3 The TEC heat dissipation module 2 further includes a bakelite board 22 having a positioning hole, the TEC cooling sheet 21 is inserted into the positioning hole, the bakelite board 22 is fixed on the fixing plate of the radiator 12, and is located in the sealed cavity.

[0042] In the above embodiment, on the one hand, the bakelite board 22 can realize the positioning of the TEC cooling sheet 21. On the other hand, the bakelite board 22 has a low thermal conductivity, and when the outer peripheral wall of the TEC cooling sheet 21 is covered, the first surface and the second surface thereof are prevented from affecting the temperature control due to mutual influence.

[0043] For example, the bakelite board 22 may be fixed to the heat sink 12 by screws.

[0044] Furthermore, the TEC heat dissipation module 2 further includes an aluminum block 23 , which is sandwiched between the TEC cooling sheet 21 and the chip 141 .

[0045] It is easy to understand that the TEC cooling sheet 21 is a ceramic structure and is fragile, so it is very easy to damage the TEC cooling sheet 21 during installation. By setting the aluminum block 23 on the TEC cooling sheet 21, it is possible to prevent the chip 141 from directly contacting the TEC cooling sheet 21. In addition, since the aluminum block 23 has a high structural strength, good thermal conductivity, and low specific heat capacity, it can quickly cool down, thereby quickly realizing heat transfer between the TEC cooling sheet 21 and the chip 141.

[0046] Exemplarily, the aluminum block 23 is a square structure.

[0047] In this embodiment, a thermal pad 24 is sandwiched between the first surface of the TEC cooling plate 21 and the fixed plate of the heat sink 12, between the second surface of the TEC cooling plate 21 and the aluminum block 23, and between the aluminum block 23 and the chip 141. By providing the thermal pad 24, gaps between the TEC cooling plate 21 and the heat sink 12, between the TEC cooling plate 21 and the aluminum block 23, and between the aluminum block 23 and the chip 141 can be avoided to affect heat transfer, and soft contact can be achieved.

[0048] In one implementation of the utility model, the fan 13 is inserted on the fins of the radiator 12, and a fan mesh cover 131 is provided on the fins of the radiator 12, and the fan mesh cover 131 is directly opposite to the fan 13 to cover the fan 13. The insertion of the fan 13 on the fins can effectively reduce the volume of the signal generator body 1. In addition, the fan mesh cover 131 can cover the fan 13 to avoid safety risks during the operation of the fan 13.

[0049] Exemplarily, the fan 13 is a bracket fan or a turbo fan. In addition, a plurality of studs penetrate the fan grille 131, the fan 13, the heat sink 12 and the TEC heat dissipation module 2 and are fixed on the PCB board 14, thereby increasing the overall connection strength.

[0050] In addition, a cooling fan 15 is provided in the sealed cavity, and the cooling fan 15 is arranged opposite to the PCB board 14, and a ventilation hole is arranged opposite to the cooling fan 15 on the base 11, so that the cooling fan 15 can further cool the PCB board 14 and the chip 141, thereby increasing the cooling efficiency.

[0051] Furthermore, a bracket 16 is provided in the sealed cavity, and the heat dissipation fan 15 is inserted into the bracket 16 , so that the heat dissipation fan 15 lamp is installed through the bracket 16 .

[0052] Exemplarily, the base 11 includes a plurality of side panels 111 and a bottom panel 112 , the bracket 16 is disposed on the inner side of the side panels 111 , and corresponding vents are disposed on the two side panels 111 corresponding to the bracket 16 , thereby achieving airflow.

[0053] In an implementation of the present invention, the PCB board 14 may be a signal board, and the chip 141 may be a main control chip.

[0054] Among them, the main control chip can process the signal transmitted by the signal board and realize the control of the peripherals. In addition, the main control chip has high power and generates a lot of heat, and the temperature it reaches is often high, so it needs to be temperature controlled by the TEC heat dissipation module 2.

[0055] It is easy to understand that the signal board also has power chips, clock chips and driver chips, but the power of these chips is often lower than that of the main control chip, and the temperature reached during operation is lower. In addition, the signal generator body 1 also has PCB boards such as a control board and a power base board inserted in layers in the signal generator body 1, and separated by columns. Among them, the signal board is located at the top layer.

[0056] For example, there may be multiple brackets 16 , which can support the cooling fan 15 and other circuit boards such as a signal board, a control board, and a power supply baseboard.

[0057] It should be noted that components such as the signal board and the main control chip are conventional hardware structures in this field.

[0058] An embodiment of the utility model further provides a testing device, which includes a signal generator as described above.

[0059] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A signal generator, characterized in that: It comprises a signal generator body (1) and a TEC heat dissipation module (2); The signal generator body (1) comprises a base (11), a heat sink (12), a fan (13) and a PCB board (14); the fixing plate cover of the heat sink (12) is arranged on the opening of the base (11) to form a sealed cavity; the fan (13) is located on the fins of the heat sink (12); the PCB board (14) is inserted into the sealed cavity; and the PCB board (14) has a chip (141); The TEC heat dissipation module (2) comprises a TEC cooling sheet (21), the TEC cooling sheet (21) is located in the sealed cavity, and a first surface and a second surface of the TEC cooling sheet (21) are respectively fixed in parallel on a fixing plate of the heat sink (12) and on the chip (141).

2. A signal generator according to claim 1, characterized in that: The TEC heat dissipation module (2) further comprises a bakelite board (22), the bakelite board (22) having a positioning hole, the TEC cooling sheet (21) being inserted into the positioning hole, the bakelite board (22) being fixed on a fixing plate of the heat sink (12) and being located in the sealed cavity.

3. A signal generator according to claim 1, characterized in that: The TEC heat dissipation module (2) further comprises an aluminum block (23), wherein the aluminum block (23) is sandwiched between the TEC cooling plate (21) and the chip (141).

4. A signal generator according to claim 3, characterized in that: A thermal pad (24) is sandwiched between the first surface of the TEC cooling sheet (21) and the fixing plate of the heat sink (12), between the second surface of the TEC cooling sheet (21) and the aluminum block (23), and between the aluminum block (23) and the chip (141).

5. A signal generator according to claim 1, characterized in that: The fan (13) is inserted into the fins of the radiator (12), and a fan mesh cover (131) is provided on the fins of the radiator (12), and the fan mesh cover (131) is directly opposite to the fan (13) to cover the fan (13).

6. A signal generator according to claim 5, characterized in that: The fan (13) is a bracket fan or a turbo fan.

7. A signal generator according to any one of claims 1 to 6, characterized in that: A heat dissipation fan (15) is arranged in the sealed cavity, the heat dissipation fan (15) is arranged opposite to the PCB board (14), and the base (11) has a ventilation opening arranged opposite to the heat dissipation fan (15).

8. A signal generator according to claim 7, characterized in that: A bracket (16) is provided in the sealed cavity, and the heat dissipation fan (15) is inserted into the bracket (16).

9. A signal generator according to any one of claims 1 to 6, characterized in that: The PCB board (14) is a signal board, and the chip (141) is a main control chip.

10. A testing device, characterized in that: The testing device comprises a signal generator as described in any one of claims 1-9.

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