High-efficiency heat dissipation chip packaging structure

Abstract

The utility model relates to the technical field of chip packaging, in particular to an efficient heat dissipation chip packaging structure which comprises a first assembling shell and a second assembling shell, a heat dissipation mechanism is fixedly arranged at the top end of the first assembling shell, and the heat dissipation mechanism comprises an assembling shell, a splicing column, an assembling plate, a driver, a shaft rod and blades. Four assembling shells are arranged at the top end of a first assembling shell, three splicing columns are arranged in the assembling shells, one ends of the three splicing columns are jointly connected with an assembling plate, a driving machine is arranged at the top end of the assembling plate, a shaft rod is arranged at the top end of the driving machine, blades are arranged at the two ends of the shaft rod, and the bottom ends of the assembling shells are directly communicated with the interior of the device. When the internal temperature rises, the driving machine drives the shaft rod to rotate, the shaft rod drives the blades to rotate, the wind directions of the blades face outwards, internal hot air is dissipated out, the cooling effect is achieved, the four heat dissipation mechanisms operate together, and the heat dissipation effect is remarkable.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a high-efficiency heat dissipation chip packaging structure. Background Art

[0002] Currently, in the IC integrated circuit industry, the FC-BGA (Flip Chip Ball Grid Array) packaging format is also the most important packaging format for graphics acceleration chips. Heat is generated during the chip packaging process. To ensure the normal operation of the chip, the generated heat needs to be dissipated and volatilized in time, but the existing chip packaging structure cannot meet the market demand.

[0003] For example, an efficient heat dissipation chip packaging structure disclosed in the authorization announcement number CN 214313189 U, although the device realizes that the heat inside the substrate can be dissipated in time through the tin in the heat dissipation through-hole, and the heat dissipation inside the chip will be more direct, making the overall heat dissipation effect better, but it does not solve the problem that the existing device has poor heat dissipation effect and cannot fix the chip. For this reason, we propose an efficient heat dissipation chip packaging structure. Utility Model Content

[0004] The purpose of the utility model is to provide a chip packaging structure with high efficiency in heat dissipation, so as to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A high-efficiency heat dissipation chip packaging structure comprises a first assembly shell and a second assembly shell, a heat dissipation mechanism is fixedly arranged at the top of the first assembly shell, the heat dissipation mechanism comprises an assembly shell, a splicing column, an assembly plate, a driving machine, a shaft rod and blades, a plurality of assembly shells are fixedly arranged at the top of the first assembly shell, a plurality of splicing columns are fixedly arranged inside the assembly shell, an assembly plate is fixedly arranged at one end of the plurality of splicing columns, a driving machine is fixedly arranged at the top of the assembly plate, a shaft rod is fixedly arranged at the top of the driving machine, and blades are fixedly arranged at both ends of the shaft rod;

[0007] A fixing mechanism is fixedly provided inside the first assembling shell and the second assembling shell, and the fixing mechanism includes an assembling block, a threaded groove, a splicing screw, a metal layer, a magnet assembly, a spring, a telescopic connecting piece, a grid and a chip; assembling blocks are fixedly provided at both ends of the first assembling shell and the second assembling shell, a threaded groove is provided inside the assembling block, and a splicing screw is movably provided inside the threaded groove; a metal layer is fixedly provided on the inner surface of the first assembling shell and the second assembling shell, and a magnet assembly is movably provided on the surface of the metal layer; a spring is fixedly provided at the bottom end of the magnet assembly, and a telescopic connecting piece is fixedly provided inside the spring, and a grid is fixedly provided at the other end of the telescopic connecting piece and the spring, and a chip is movably provided at the other end of the grid;

[0008] Preferably, a plurality of positioning grooves are fixedly provided inside the first assembly shell, and a plurality of positioning posts are fixedly provided inside the second assembly shell. By providing four positioning grooves inside the first assembly shell and four positioning posts inside the second assembly shell, and inserting the positioning posts into the positioning grooves, it is easier to fix the entire device by splicing screws;

[0009] Preferably, a plurality of wiring tubes are fixedly arranged at one end of the first assembly shell and the second assembly shell, and the chip connection circuit is facilitated by arranging a plurality of wiring tubes at one end of the first assembly shell and the second assembly shell;

[0010] Preferably, a protective net is movably provided at the top of the blade, and the protective net is provided at the top of the blade to prevent small insects from entering the device and causing damage to the chip;

[0011] Preferably, a smoke sensor is fixedly arranged inside the first assembled shell, and an alarm light is fixedly arranged on the top of the first assembled shell. By arranging the smoke sensor inside the first assembled shell and the alarm light on the top of the first assembled shell, a fire will occur when the internal chip is short-circuited or fails, and smoke will be generated. The smoke sensor senses the smoke and warns the staff through the alarm light;

[0012] Preferably, a thermal insulation board is fixedly provided on the surfaces of the first assembled shell and the second assembled shell. By providing the thermal insulation board on the surfaces of the first assembled shell and the second assembled shell, excessive external temperature is prevented from being transmitted to the internal temperature, causing the internal temperature to become high.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. This is an efficient heat dissipation chip packaging structure, by arranging four assembly shells on the top of a first assembly shell, three splicing columns are arranged inside the assembly shells, one end of the three splicing columns is commonly connected to an assembly board, a driving machine is arranged on the top of the assembly board, a shaft is arranged on the top of the driving machine, blades are arranged at both ends of the shaft, and the bottom end of the assembly shell is directly passed through the inside of the device. When the internal temperature rises, the driving machine drives the shaft to rotate, and the shaft drives the blades to rotate. The wind direction of the blades faces outward to dissipate the internal hot air, thereby achieving a cooling effect. The four heat dissipation mechanisms work together, and the heat dissipation effect is significant.

[0015] 2. This is an efficient heat dissipation chip packaging structure, by arranging assembling blocks at both ends of a first assembling shell and a second assembling shell, a threaded groove is provided inside the assembling block, a splicing screw is movably provided inside the threaded groove, a metal layer is arranged on the inner surface of the first assembling shell and the second assembling shell, a magnet assembly is movably provided on the surface of the metal layer, a spring is arranged at the bottom end of the magnet assembly, a telescopic connecting piece is arranged inside the spring, a grid is arranged at the other end of the telescopic connecting piece and the spring, a chip is movably provided at the other end of the grid, the magnet assembly can be adsorbed at any point of the metal layer, the chip is fixed inside the device by the extrusion of the telescopic connecting piece and the spring, and there is no obstruction on the upper and lower surfaces, which is not only convenient for fixing the chip, but also allows the two surfaces of the chip to dissipate heat to the greatest extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the installation of the drive machine of the utility model;

[0018] Figure 3 For this utility model Figure 2 The enlarged schematic diagram of point A in the middle;

[0019] Figure 4 For this utility model Figure 2 The enlarged schematic diagram of point B in the middle;

[0020] Figure 5 It is a schematic diagram of the installation of the spliced ​​column of the utility model.

[0021] In the figure: 1. first assembly shell; 2. second assembly shell; 3. assembly shell; 4. splicing column; 5. assembly plate; 6. drive motor; 7. shaft; 8. blade; 9. assembly block; 10. threaded groove; 11. splicing screw; 12. metal layer; 13. magnet assembly; 14. spring; 15. telescopic connector; 16. grid; 17. chip; 18. positioning groove; 19. positioning column; 20. wiring tube; 21. protective net; 22. smoke sensor; 23. alarm light: 24. insulation board. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 5 As shown, the technical solution provided by the utility model is:

[0024] A high-efficiency heat dissipation chip packaging structure comprises a first assembly shell 1 and a second assembly shell 2. A heat dissipation mechanism is fixedly arranged at the top of the first assembly shell 1. The heat dissipation mechanism comprises an assembly shell 3, a splicing column 4, an assembly plate 5, a driving machine 6, a shaft 7 and a blade 8. A plurality of assembly shells 3 are fixedly arranged at the top of the first assembly shell 1. A plurality of splicing columns 4 are fixedly arranged inside the assembly shell 3. An assembly plate 5 is fixedly arranged at one end of the plurality of splicing columns 4. A driving machine 6 is fixedly arranged at the top of the assembly plate 5. A shaft 7 is fixedly arranged at the top of the driving machine 6. Blades 8 are fixedly arranged at both ends of the shaft 7.

[0025] The first assembling shell 1 and the second assembling shell 2 are fixedly provided with a fixing mechanism inside, and the fixing mechanism includes an assembling block 9, a thread groove 10, a splicing screw 11, a metal layer 12, a magnet assembly 13, a spring 14, a telescopic connecting piece 15, a grid 16 and a chip 17. The assembling blocks 9 are fixedly provided at both ends of the first assembling shell 1 and the second assembling shell 2, the interior of the assembling block 9 is provided with a thread groove 10, and the interior of the thread groove 10 is movably provided with a splicing screw 11, the metal layer 12 is fixedly provided on the inner surface of the first assembling shell 1 and the second assembling shell 2, and the surface of the metal layer 12 is movably provided with a magnet assembly 13, the bottom end of the magnet assembly 13 is fixedly provided with a spring 14, the interior of the spring 14 is fixedly provided with a telescopic connecting piece 15, the other end of the telescopic connecting piece 15 and the spring 14 is fixedly provided with a grid 16, and the other end of the grid 16 is movably provided with a chip 17;

[0026] Through the above scheme, four assembly shells 3 are arranged at the top of the first assembly shell 1, three splicing columns 4 are arranged inside the assembly shell 3, one end of the three splicing columns 4 is connected to an assembly plate 5, a driving machine 6 is arranged at the top of the assembly plate 5, a shaft 7 is arranged at the top of the driving machine 6, blades 8 are arranged at both ends of the shaft 7, and the bottom end of the assembly shell 3 is directly connected to the inside of the device. When the temperature inside rises, the driving machine 6 drives the shaft 7 to rotate, and the shaft 7 drives the blades 8 to rotate. The wind direction of the blades 8 faces outward, and the internal heat is dissipated, thereby achieving a cooling effect. The four heat dissipation mechanisms work together, and the heat dissipation effect is significant. By arranging assembly blocks 9 at both ends of the first assembly shell 1 and the second assembly shell 2, a threaded groove 1 is provided inside the assembly block 9 0, a splicing screw 11 is movably arranged inside the thread groove 10, a metal layer 12 is arranged on the inner surface of the first assembled shell 1 and the second assembled shell 2, a magnet assembly 13 is movably arranged on the surface of the metal layer 12, a spring 14 is arranged at the bottom end of the magnet assembly 13, a telescopic connecting piece 15 is arranged inside the spring 14, a grid 16 is arranged at the other end of the telescopic connecting piece 15 and the spring 14, a chip 17 is movably arranged at the other end of the grid 16, the magnet assembly 13 can be adsorbed at any place of the metal layer 12, the chip 17 is fixed inside the device by the extrusion of the telescopic connecting piece 15 and the spring 14, and there is no obstruction on the upper and lower surfaces, which is not only convenient for fixing the chip 17, but also allows the two surfaces of the chip 17 to dissipate heat to the maximum extent;

[0027] In this embodiment, preferably, a plurality of positioning grooves 18 are fixedly disposed inside the first assembled shell 1, and a plurality of positioning columns 19 are fixedly disposed inside the second assembled shell 2;

[0028] According to the above scheme, by setting four positioning grooves 18 inside the first assembly shell 1 and four positioning posts 19 inside the second assembly shell 2, the positioning posts 19 are inserted into the positioning grooves 18, which makes it easier to fix the entire device by splicing screws 11;

[0029] In this embodiment, preferably, a plurality of wiring tubes 20 are fixedly disposed at one end of the first assembled shell 1 and the second assembled shell 2;

[0030] Through the above solution, by providing a plurality of wiring tubes 20 at one end of the first assembly shell 1 and the second assembly shell 2, it is convenient for the chip 17 to connect to the circuit;

[0031] In this embodiment, preferably, a protective net 21 is movably provided at the top of the blade 8;

[0032] Through the above solution, by setting the protective net 21 at the top of the blade 8, small insects are prevented from entering the device and causing damage to the chip 17;

[0033] In this embodiment, preferably, a smoke sensor 22 is fixedly disposed inside the first assembled shell 1, and an alarm light 23 is fixedly disposed on the top of the first assembled shell 1;

[0034] According to the above scheme, by setting a smoke sensor 22 inside the first assembled shell 1 and setting an alarm light 23 at the top of the first assembled shell 1, when the internal chip 17 is short-circuited or fails, a fire will occur, smoke will be ignited, the smoke sensor 22 senses the smoke, and alerts the staff through the alarm light 23;

[0035] In this embodiment, preferably, a thermal insulation board 24 is fixedly provided on the surface of the first assembled shell 1 and the second assembled shell 2;

[0036] Through the above scheme, by arranging the insulation board 24 on the surfaces of the first assembled shell 1 and the second assembled shell 2, it is prevented that the external temperature is too high and is transmitted to the internal temperature, causing the internal temperature to become high.

[0037] When in use, a high-efficiency heat dissipation chip packaging structure of the present embodiment is provided with four assembly shells 3 at the top of the first assembly shell 1, three splicing columns 4 are provided inside the assembly shell 3, one end of the three splicing columns 4 is connected to an assembly plate 5, a driving machine 6 is provided at the top of the assembly plate 5, a shaft 7 is provided at the top of the driving machine 6, blades 8 are provided at both ends of the shaft 7, and the bottom end of the assembly shell 3 is directly connected to the inside of the device. When the temperature inside rises, the driving machine 6 drives the shaft 7 to rotate, and the shaft 7 drives the blades 8 to rotate. The wind direction of the blades 8 faces outward to dissipate the internal hot air, thereby achieving a cooling effect. The four heat dissipation mechanisms work together, and the heat dissipation effect is significant. By providing assembly blocks 9 at both ends of the first assembly shell 1 and the second assembly shell 2, the assembly blocks 9 are provided inside. A thread groove 10 is provided in the first assembling shell 1 and the second assembling shell 2, and a splicing screw 11 is movably arranged inside the thread groove 10. A metal layer 12 is arranged on the inner surface of the first assembling shell 1 and the second assembling shell 2, and a magnet assembly 13 is movably arranged on the surface of the metal layer 12. A spring 14 is arranged at the bottom end of the magnet assembly 13, and a telescopic connecting piece 15 is arranged inside the spring 14. A grid 16 is arranged at the other end of the telescopic connecting piece 15 and the spring 14, and a chip 17 is movably arranged at the other end of the grid 16. The magnet assembly 13 can be adsorbed at any position of the metal layer 12, and the chip 17 is fixed inside the device by squeezing the telescopic connecting piece 15 and the spring 14, and there is no obstruction on the upper and lower surfaces, which is not only convenient for fixing the chip 17, but also allows the two surfaces of the chip 17 to dissipate heat to the greatest extent.

[0038] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. An efficient heat dissipation chip packaging structure, characterized in that: The invention comprises a first assembly shell (1) and a second assembly shell (2), wherein a heat dissipation mechanism is fixedly arranged at the top of the first assembly shell (1), and the heat dissipation mechanism comprises an assembly shell (3), a splicing column (4), an assembly plate (5), a driving machine (6), a shaft (7) and blades (8), wherein a plurality of assembly shells (3) are fixedly arranged at the top of the first assembly shell (1), a plurality of splicing columns (4) are fixedly arranged inside the assembly shell (3), an assembly plate (5) is fixedly arranged at one end of the plurality of splicing columns (4), a driving machine (6) is fixedly arranged at the top of the assembly plate (5), a shaft (7) is fixedly arranged at the top of the driving machine (6), and blades (8) are fixedly arranged at both ends of the shaft (7); A fixing mechanism is fixedly arranged inside the first assembling shell (1) and the second assembling shell (2), and the fixing mechanism comprises an assembling block (9), a thread groove (10), a splicing screw (11), a metal layer (12), a magnet assembly (13), a spring (14), a telescopic connecting piece (15), a grid (16) and a chip (17). The assembling blocks (9) are fixedly arranged at both ends of the first assembling shell (1) and the second assembling shell (2), and the assembling blocks (9) are provided with a thread groove (10) inside. The thread groove (10) is movable inside the assembling block (9). A splicing screw (11) is provided, a metal layer (12) is fixedly provided on the inner surface of the first assembling shell (1) and the second assembling shell (2), a magnet assembly (13) is movably provided on the surface of the metal layer (12), a spring (14) is fixedly provided at the bottom end of the magnet assembly (13), a telescopic connecting piece (15) is fixedly provided inside the spring (14), a grid (16) is fixedly provided at the other end of the telescopic connecting piece (15) and the spring (14), and a chip (17) is movably provided at the other end of the grid (16).

2. The high-efficiency heat dissipation chip packaging structure according to claim 1, characterized in that: A plurality of positioning grooves (18) are fixedly arranged inside the first assembled shell (1), and a plurality of positioning columns (19) are fixedly arranged inside the second assembled shell (2).

3. The high-efficiency heat dissipation chip packaging structure according to claim 1, characterized in that: A plurality of wiring tubes (20) are fixedly arranged at one end of the first assembled shell (1) and the second assembled shell (2).

4. The high-efficiency heat dissipation chip packaging structure according to claim 1, characterized in that: A protective net (21) is movably provided at the top end of the blade (8).

5. The high-efficiency heat dissipation chip packaging structure according to claim 1, characterized in that: A smoke sensor (22) is fixedly arranged inside the first assembled shell (1), and an alarm light (23) is fixedly arranged on the top of the first assembled shell (1).

6. The high-efficiency heat dissipation chip packaging structure according to claim 1, characterized in that: A thermal insulation board (24) is fixedly provided on the surfaces of the first assembled shell (1) and the second assembled shell (2).

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