Combined wavelength light emitting diode

Abstract

The utility model discloses a combined wavelength light-emitting diode, which comprises one or more light-emitting diode bodies, the light emitting diode bodies are provided with combined splicing structures; each light-emitting diode body comprises a base body, a circuit board, a plurality of contact end groups, a first wavelength light-emitting chip, a second wavelength light-emitting chip, a third wavelength light-emitting chip and a fourth wavelength light-emitting chip; the base body is provided with a heat dissipation structure. According to the utility model, combined wavelength light-emitting diodes with different specifications can be formed according to requirements by arranging the combined splicing structure, so that the applicability is improved, and the risk of subsequent maintenance is reduced; the heat dissipation structure is arranged to increase the contact area between the inside and the outside, so that the heat dissipation efficiency is improved; the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip are arranged to provide light rays with different functions, adjustment is not needed, the adjustment time is saved, and the use efficiency and the applicability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of beauty instrument accessories, in particular to a combined wavelength light emitting diode. Background Art

[0002] Light-emitting diodes, or LEDs for short, can emit visible light when electrons and holes recombine, and can therefore be used to make light-emitting diodes. Depending on the material, diodes can emit light of different wavelengths and colors to suit various instruments.

[0003] Among them, the red and blue light-emitting diodes can be used to achieve beauty effects, which have good applicability. Common beauty LEDs can only emit light of different wavelengths according to chips of different materials to meet different beauty needs. However, a single LED has a small effect. When used, the diodes need to be assembled as a cluster to cooperate with other equipment to form light with beauty effects. Multiple LEDs are often troublesome to electrically connect to the PCB board, and are prone to squeezing each other, affecting the installation angle, and then affecting the overall lighting effect, and even causing adverse effects on the skin. In response to the above problems, people invented patent number: CN201920756051.5, which discloses a light-emitting diode with a beauty function, including a first colloid, a second colloid, a lead frame and an LED chip. The top of the first colloid is provided with an open groove, the second colloid and the connecting ring are integrated into the open groove through the limiting edge, the first colloid is fixed by plugging with the slot on the other first colloid through the plug block, the two lead frames pass through the first colloid and are electrically connected to the cathode rod and the anode rod respectively, the LED chip is installed on the wedge-shaped bracket, and the LED chip is electrically connected to the cathode rod and the anode rod respectively through metal wires. The structure of the light-emitting diode is simple and easy to implement. Different LED chips are used to radiate light with different effects to achieve a beauty effect. At the same time, each light-emitting diode can be spliced ​​and arranged with each other, which ensures the uniformity of the installation angle and spacing, enhances the light-emitting effect, and improves the beauty effect. However, the light-emitting diode still has the following problems: 1. It is spliced ​​to ensure the uniformity of the installation angle and spacing, but the splicing method cannot realize the electrical connection of the two light-emitting diodes according to the needs. When electrical connection is required, each light-emitting diode needs to be welded and connected. The splicing electrical connection steps are cumbersome. When maintenance and replacement are required, heating operation is required. This method may cause the side light-emitting diodes to be damaged due to excessive temperature, affecting the maintenance efficiency; 2. The existing light-emitting diodes with beauty functions wrap the LED chip, and the contact area of ​​the LED chip with the outside world is small. The LED chip generates heat when working. Since the contact area of ​​the LED chip with the outside world is small, the accumulation of heat affects the emission performance and effect of the light, and reduces the service life; 3. The existing light-emitting diodes with beauty functions can only provide light of one wavelength, and cannot provide light of multiple different wavelengths at the same time. When it is necessary to convert light of other wavelengths, the conversion time is long, which affects the use efficiency of beauty equipment and has low applicability. Utility Model Content

[0004] The utility model aims to solve the technical problems that the light emitting diodes in the prior art cannot realize the electrical connection of two light emitting diodes, the installation steps are complicated, the heat dissipation effect is poor and the applicability is low.

[0005] The technical solution adopted by the utility model to achieve the above-mentioned purpose is:

[0006] A combination wavelength light-emitting diode includes one or more light-emitting diode bodies; the light-emitting diode bodies are all provided with a combination splicing structure; the light-emitting diode bodies are all provided with a substrate and a circuit board, the substrate is provided with a cavity, the circuit board is arranged in the cavity, and the circuit board is provided with multiple groups of contact end groups; the multiple groups of contact end groups are arranged on the circuit board in an array manner, and the multiple groups of contact end groups are respectively provided with a first wavelength light-emitting chip, a second wavelength light-emitting chip, a third wavelength light-emitting chip and a fourth wavelength light-emitting chip; the substrate is also provided with a heat dissipation structure.

[0007] As a further improvement, the heat dissipation structure includes multiple heat dissipation components, and the multiple heat dissipation components are respectively arranged on the four side surfaces and the bottom surface of the substrate; the four outer side surfaces and the bottom surface of the substrate are provided with grooves, and the grooves are provided with multiple openings; the heat dissipation components include a heat dissipation layer, a heat conductive layer and a connecting block, the heat dissipation layer is arranged in the groove, the heat conductive layer is arranged on the four inner side surfaces of the substrate, the connecting block is arranged between the heat conductive layer and the heat dissipation layer, and the heat conductive layer is used to send heat to the heat dissipation layer through the connecting block and dissipate it to the outer surface of the substrate.

[0008] As a further improvement, the heat dissipation layer, the connection block and the heat-conducting layer are all heat-conducting silicone layers; the heat dissipation layer is provided with a plurality of heat dissipation grooves, and both side lines of the heat dissipation grooves are inverted with inclined surfaces.

[0009] As a further improvement, the mirror-image-opposite side walls of the substrate are further provided with a plurality of through openings, and the through openings are all arranged below the heat dissipation layer; the plurality of contact end groups each include two contact terminals, the contact terminals are respectively arranged in the through openings, and the contact terminals are all arranged on the heat-conducting layer on the bottom surface.

[0010] As a further improvement, the contact terminals are all provided with pin ends, and the pin ends are respectively passed through the through opening to the outside of the substrate; the combined splicing structure includes a plurality of first splicing structures and a plurality of second splicing structures, the first splicing structures are respectively arranged on the pin ends of the same side, and the second splicing structures are respectively arranged on the pin ends of another same side; the first splicing structure is used to connect with another second splicing structure of the light-emitting diode body.

[0011] As a further improvement, the first splicing structure includes two buckle blocks, and the two buckle blocks are arranged at two ends of the pin end in a mirror-image manner, and the two buckle blocks form a buckle groove structure.

[0012] As a further improvement, the second splicing structures all include plug-in blocks, and the plug-in blocks are all provided with elastic protrusions.

[0013] As a further improvement, the wavelength of the first wavelength light emitting chip is 630nm; the wavelength of the second wavelength light emitting chip is 660nm; the wavelength of the third wavelength light emitting chip is 810nm; and the wavelength of the fourth wavelength light emitting chip is 830nm.

[0014] As a further improvement, the two contact terminals are directly connected or connected by wires.

[0015] Compared with the prior art, the above one or more technical solutions in the combined wavelength light emitting diode provided by the embodiment of the utility model have at least one of the following technical effects:

[0016] 1. The utility model provides a combined splicing structure to make the two LED bodies detachable and easy to assemble quickly. It can form combined wavelength LEDs of different specifications according to needs, improve applicability, and does not require all pin ends to be soldered to the control circuit board, preventing solder joint leakage from affecting connection stability. It is also convenient to quickly replace a single LED body with problems, and does not require the combined wavelength LED to be replaced as a whole, thereby improving the convenience of maintenance and reducing the risk of subsequent maintenance.

[0017] 2. By providing a heat dissipation structure to increase the contact area between the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip and the outside world, the heat dissipation efficiency is improved, and the service life of the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip is extended;

[0018] 3. By setting a first wavelength light-emitting chip, a second wavelength light-emitting chip, a third wavelength light-emitting chip and a fourth wavelength light-emitting chip to provide a plurality of different wavelengths of light, light with different functions is provided without the need for adjustment, saving adjustment time, thereby improving the efficiency of subsequent instrument use and greatly improving applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 This is a schematic diagram of the overall structure of the combined wavelength light emitting diode of this embodiment;

[0021] Figure 2 is a schematic top view of the combined wavelength light emitting diode of this embodiment;

[0022] Figure 3 for Figure 2 AA cross-sectional view in FIG.

[0023] Figure 4 It is a bottom view of the combined wavelength light emitting diode of this embodiment. DETAILED DESCRIPTION

[0024] The following description is only a preferred embodiment of the present invention and does not limit the protection scope of the present invention.

[0025] For example, see the attached Figures 1 to 4 A combination wavelength light-emitting diode 1 includes one or more light-emitting diode bodies 2; the light-emitting diode bodies 2 are all provided with a combination splicing structure 3; the light-emitting diode bodies 2 include a substrate 20 and a circuit board 21, the substrate 20 is provided with a cavity, the circuit board 21 is arranged in the cavity, and the circuit board 21 is provided with a plurality of contact terminal groups 22; the plurality of contact terminal groups 22 are arranged on the circuit board 21 in an array, and the plurality of contact terminal groups 22 are respectively provided with a first wavelength light-emitting chip 23, a second wavelength light-emitting chip 24, a third wavelength light-emitting chip 25 and a fourth wavelength light-emitting chip 26; the substrate 20 is also provided with a heat dissipation structure 4.

[0026] The heat dissipation structure 4 includes a plurality of heat dissipation components 40, and the plurality of heat dissipation components 40 are respectively arranged on the four side surfaces and the bottom surface of the substrate 20; the four outer side surfaces and the bottom surface of the substrate 20 are provided with grooves, and the grooves are provided with a plurality of openings; the heat dissipation components 40 include a heat dissipation layer 400, a heat conductive layer 401 and a connecting block 402, the heat dissipation layer 400 is arranged in the groove, the heat conductive layer 401 is arranged on the four inner side surfaces of the substrate 20, the connecting block 402 is arranged between the heat conductive layer 401 and the heat dissipation layer 400, and the heat conductive layer 401 is used to send heat to the heat dissipation layer 400 through the connecting block 402 and dissipate it to the outer surface of the substrate 20. The heat dissipation layer 400, the connecting block 402 and the heat-conducting layer 401 are all heat-conducting silicone layers; the heat dissipation layer 400 is provided with a plurality of heat dissipation grooves 403, and both sides of the heat dissipation grooves 403 are inverted with inclined surfaces 404. The heat dissipation grooves 403 and the inclined surfaces 404 are convenient for increasing the heat dissipation area, thereby improving the heat dissipation efficiency and effect of the first wavelength light-emitting chip 23, the second wavelength light-emitting chip 24, the third wavelength light-emitting chip 25 and the fourth wavelength light-emitting chip 26, reducing the influence of heat, and extending the service life of the first wavelength light-emitting chip 23, the second wavelength light-emitting chip 24, the third wavelength light-emitting chip 25 and the fourth wavelength light-emitting chip 26; the heat dissipation structure 4 is used to increase the contact area between the first wavelength light-emitting chip 23, the second wavelength light-emitting chip 24, the third wavelength light-emitting chip 25 and the fourth wavelength light-emitting chip 26 and the outside world, thereby improving the heat dissipation efficiency and extending the service life of the first wavelength light-emitting chip 23, the second wavelength light-emitting chip 24, the third wavelength light-emitting chip 25 and the fourth wavelength light-emitting chip 26.

[0027] The mirror-image-opposite side walls of the substrate 20 are further provided with a plurality of through openings 1, and the through openings 1 are all arranged below the heat dissipation layer 400; the plurality of contact end groups 22 each include two contact terminals 220, and the contact terminals 220 are respectively arranged in the through openings 1, and the contact terminals 220 are all arranged on the heat-conducting layer 401 on the bottom surface.

[0028] The contact terminals 220 are each provided with a pin end 221, and the pin ends 221 are respectively passed through the through opening 1 to the outside of the base 20; the combined splicing structure 3 includes a plurality of first splicing structures 30 and a plurality of second splicing structures 31, the first splicing structures 30 are respectively arranged on the pin ends 221 of the same side, and the second splicing structures 31 are respectively arranged on the pin ends 221 of the other same side; the first splicing structure 30 is used to connect with the second splicing structure 31 of the other light-emitting diode body 2; the first splicing structure 30 includes two buckle blocks 300, the two buckle blocks are arranged at the two ends of the pin end 221 in a mirror image, and the two buckle blocks 300 form a buckle groove structure; the second splicing structure 31 includes The plug-in block 310 is provided with an elastic protrusion 311, the buckle groove is used for positioning, and the elastic protrusion 311 is used to ensure the connection stability, thereby ensuring the conduction stability of the electrical connection; the combined splicing structure 3 enables a detachable connection between the two light-emitting diode bodies 2, which is convenient for rapid assembly, and can form combined wavelength light-emitting diodes 1 of different specifications according to needs, thereby improving applicability, and there is no need for all pin ends 221 to be welded to the control circuit board 21, thereby preventing solder joint leakage from affecting the connection stability, and facilitating the rapid replacement of a problematic single light-emitting diode body 2, without the need to replace the combined wavelength light-emitting diode 1 as a whole, thereby improving the convenience of maintenance and reducing the risk of subsequent maintenance.

[0029] The wavelength of the first wavelength light-emitting chip 23 is 630nm, and the first wavelength light-emitting chip 23 is used to emit light that increases cell activity, so that the combined wavelength light-emitting diode 1 has the functions of whitening and removing spots, rejuvenating and removing wrinkles, increasing skin elasticity, improving skin condition, repairing damaged skin, shrinking pores and tightening skin, and anti-aging and anti-oxidation; the wavelength of the second wavelength light-emitting chip 24 is 660nm, so that it emits light for lowering blood lipids and blood viscosity, so that the combined wavelength light-emitting diode 1 can emit light for preventing thrombosis; the wavelength of the third wavelength light-emitting chip 25 is 810nm, which is used to emit infrared light with regulating function; the wavelength of the fourth wavelength light-emitting chip 26 is 830nm, which is used to emit light that accelerates wound healing and makes the skin more delicate.

[0030] The two contact terminals 220 are directly connected or connected by wires, so as to achieve electrical conduction between the two contact terminals 220 .

[0031] The utility model provides a combined splicing structure to enable a detachable connection between two light-emitting diode bodies, which is convenient for rapid assembly, and can form combined wavelength light-emitting diodes of different specifications according to needs, thereby improving applicability, and it is not necessary to solder all pin ends to the control circuit board, so as to prevent solder joint leakage from affecting the connection stability, and it is convenient to quickly replace a single light-emitting diode body with a problem, and it is not necessary to replace the combined wavelength light-emitting diode as a whole, thereby improving the convenience of maintenance and reducing the risk of subsequent maintenance; a heat dissipation structure is provided to increase the contact area between the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip and the outside world, thereby improving the heat dissipation efficiency and extending the service life of the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip; the first wavelength light-emitting chip, the second wavelength light-emitting chip, the third wavelength light-emitting chip and the fourth wavelength light-emitting chip are provided to provide a plurality of different wavelengths of light, thereby providing light with different functions, without the need for adjustment, saving adjustment time, thereby improving the use efficiency of subsequent instruments and greatly improving applicability.

[0032] The present invention is not limited to the above-mentioned embodiments. Other light-emitting diodes for combining wavelengths obtained by using the same or similar structures or devices as the above-mentioned embodiments of the present invention are all within the protection scope of the present invention.

Claims

1. A combined wavelength light emitting diode, characterized in that: The combined wavelength light-emitting diode includes one or more light-emitting diode bodies; the light-emitting diode bodies are all provided with a combined splicing structure; the light-emitting diode bodies are all provided with a substrate and a circuit board, the substrate is provided with a concave cavity, the circuit board is arranged in the concave cavity, and the circuit board is provided with multiple groups of contact end groups; the multiple groups of contact end groups are arranged on the circuit board in an array manner, and the multiple groups of contact end groups are respectively provided with a first wavelength light-emitting chip, a second wavelength light-emitting chip, a third wavelength light-emitting chip and a fourth wavelength light-emitting chip; the substrate is also provided with a heat dissipation structure.

2. The combined wavelength light emitting diode according to claim 1, characterized in that: The heat dissipation structure includes multiple heat dissipation components, which are respectively arranged on the four side surfaces and the bottom surface of the substrate; the four outer side surfaces and the bottom surface of the substrate are provided with grooves, and the grooves are provided with multiple openings; the heat dissipation components include a heat dissipation layer, a heat conductive layer and a connecting block, the heat dissipation layer is arranged in the groove, the heat conductive layer is arranged on the four inner side surfaces of the substrate, the connecting block is arranged between the heat conductive layer and the heat dissipation layer, and the heat conductive layer is used to send heat to the heat dissipation layer through the connecting block and dissipate it to the outer surface of the substrate.

3. The combined wavelength light emitting diode according to claim 2, characterized in that: The heat dissipation layer, the connection block and the heat conduction layer are all heat conduction silicone layers; the heat dissipation layer is provided with a plurality of heat dissipation grooves, and both sides of the heat dissipation grooves are inclined.

4. The combined wavelength light emitting diode according to claim 3, characterized in that: The mirror-image-opposite side walls of the substrate are also provided with a plurality of through openings 1, and the through openings 1 are all arranged below the heat dissipation layer; the plurality of contact end groups each include two contact terminals, the contact terminals are respectively arranged in the through openings 1, and the contact terminals are all arranged on the heat-conducting layer on the bottom surface.

5. The combined wavelength light emitting diode according to claim 4, characterized in that: The contact terminals are all provided with pin ends, and the pin ends are respectively passed through the through opening to the outside of the substrate; the combined splicing structure includes a plurality of first splicing structures and a plurality of second splicing structures, the first splicing structures are respectively arranged on the pin ends of the same side, and the second splicing structures are respectively arranged on the pin ends of another same side; the first splicing structure is used to connect with the second splicing structure of another light-emitting diode body.

6. The combined wavelength light emitting diode according to claim 5, characterized in that: The first splicing structure includes two buckle blocks, which are arranged at two ends of the pin end in a mirror-image manner, and the two buckle blocks form a buckle groove structure.

7. The combined wavelength light emitting diode according to claim 6, characterized in that: The second splicing structures all include plug-in blocks, and the plug-in blocks are all provided with elastic protrusions.

8. The combined wavelength light emitting diode according to claim 7, characterized in that: The wavelength of the first wavelength light emitting chip is 630 nm; the wavelength of the second wavelength light emitting chip is 660 nm; the wavelength of the third wavelength light emitting chip is 810 nm; and the wavelength of the fourth wavelength light emitting chip is 830 nm.

9. The combined wavelength light emitting diode according to claim 8, characterized in that: The two contact terminals are directly connected or connected by wires.

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