IC packaging carrier plate

Abstract

The embodiment of the utility model discloses an IC packaging carrier plate, and relates to the technical field of electronic packaging, the IC packaging carrier plate comprises a packaging substrate and a fixing part, the packaging substrate is provided with a notch, and a solder ball is arranged in the notch; the fixed part is arranged on the packaging chip, the fixed part is connected with the welding ball, the welding ball can be fixed on the packaging substrate through the notch, and the packaging chip and the welding ball can be prevented from falling off through the fixed part.

Description

Technical Field

[0001] The present application relates to the technical field of electronic packaging, and in particular to an IC packaging substrate. Background Art

[0002] IC package substrate (ICPackageSubstrate, referred to as IC substrate, also known as packaging substrate) is a key carrier in the packaging and testing process. It is developed based on the relevant technologies of PCB board and is used to establish signal connection between IC and PCB. IC substrate can also protect circuit, fix circuit and dissipate waste heat. When using IC substrate, firstly, the integrated circuit card chip is attached to the IC card packaging frame through the fully automatic placement machine, and then the contacts on the integrated circuit chip and the nodes on the IC card packaging frame are connected by the wire bonding machine to realize the circuit connection. Finally, the integrated circuit chip is protected by packaging materials to form an integrated circuit card module for later application.

[0003] The existing IC substrates have the characteristics of high density, high precision, high performance, miniaturization and thinness, but they are also accompanied by the disadvantages of unstable adhesion and easy falling off.

[0004] Therefore, how to achieve a stable connection between the packaging substrate and the solder balls is an important technical problem that needs to be solved urgently. Utility Model Content

[0005] In order to solve the problems existing in the prior art, the utility model provides an IC packaging carrier, which can fix solder balls on the packaging substrate by providing notches, and the fixing part connects the solder balls with the packaging chip to prevent the packaging substrate, the packaging chip and the solder balls from falling off.

[0006] The technical solution adopted by the utility model to solve the above technical problems is as follows:

[0007] The present application provides an IC package carrier, characterized by comprising:

[0008] A packaging substrate, wherein a notch is formed on the packaging substrate and a solder ball is disposed in the notch;

[0009] A fixing part is arranged on the packaged chip and connected to the solder ball.

[0010] Optionally, in some embodiments of the present application, the notch is arranged on both sides of the packaging substrate, wherein the notch on one side corresponds to the packaging chip, and the notch on this side is provided with a first opening and a second opening, the diameter of the first opening is smaller than the diameter of the second opening, and the solder ball is located at the position of the first opening so that the solder ball is fixed to the packaging substrate.

[0011] Optionally, in some embodiments of the present application, the first opening is disposed on the surface of the packaging substrate, the second opening is located inside the packaging substrate, and the second opening is connected to the first opening.

[0012] Optionally, in some embodiments of the present application, a first angle is formed in the second opening, and the first angle is an angle between an inner wall in the second opening and a surface of the packaging substrate corresponding to the second opening, and the first angle is 45 degrees.

[0013] Optionally, in some embodiments of the present application, the notch further includes a third opening and a fourth opening, the diameter of the third opening is smaller than the diameter of the fourth opening, and the solder ball is located at the position of the third opening so that the solder ball is fixed to the packaging substrate.

[0014] Optionally, in some embodiments of the present application, the third opening is disposed on the surface of the packaging substrate, the fourth opening is located inside the packaging substrate, and the third opening is connected to the fourth opening.

[0015] Optionally, in some embodiments of the present application, a second angle is formed in the third opening, and the second angle is an angle between an inner wall in the third opening and a surface of the packaging substrate corresponding to the fourth opening, and the second angle is 45 degrees.

[0016] Optionally, in some embodiments of the present application, the fixing portion is located on a side of the packaged chip close to the packaged substrate, and the solder balls are connected via the fixing portion.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] The utility model can fix the solder balls by providing the notches. When the package substrate is mounted on the PCB, the package substrate is heated by the high-temperature air cavity to melt the solder balls. The melted parts of the solder balls flow into the second opening and the fourth opening in the notches, so that the solder balls and the package substrate can be fixed. The cooled solder balls can be firmly fixed on the package substrate to prevent the solder balls from falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of the side structure of an IC package carrier provided in an embodiment of the present application;

[0021] Figure 2 for Figure 1 Enlarged view of area A in the middle;

[0022] Figure 3 for Figure 1 Enlarged view of area B.

[0023] Description of reference numerals:

[0024] 100, packaging substrate; 110, notch; 111, first opening; 112, second opening; 113, third opening; 114, fourth opening; 115, first angle; 116, second angle; 200, solder ball; 300, packaging chip; 400, fixing part; 410, fixing groove; 500, plastic sealing glue. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the present application. It is understood that the drawings are only provided for reference and illustration, and are not used to limit the present application. The connection relationship shown in the drawings is only for the convenience of clear description and does not limit the connection method.

[0026] Specifically, Figure 1 As shown, the embodiment of the present application provides an IC packaging carrier, wherein the IC packaging carrier is mainly composed of a packaging substrate 100 and a packaging chip 300, the packaging chip 300 is loaded on the packaging substrate 100 and fixed by a plastic sealant 500, wherein a plurality of solder balls 200 are arranged on the packaging substrate 100, and the solder balls 200 are fixed by a notch 110 on the packaging substrate 100, the notch 110 is composed of a first opening 111 and a second opening 112, the first opening 111 and the second opening 112 are located on one side of the packaging substrate 100, and the first opening 111 is connected to the first opening 111. The first opening 111 is located on the surface of the packaging substrate 100, and the second opening 112 is located inside the packaging substrate 100, so that the solder ball 200 is conveniently fixed on the packaging substrate 100 through the first opening 111. In the embodiment of the present application, the solder ball 200 is mainly made of tin, so that when the solder ball 200 is melted at a high temperature, the partially melted tin liquid of the solder ball 200 will fill into the second opening 112. After the solder ball 200 cools down, the filled tin liquid can effectively fix the packaging substrate 100 to prevent the packaging substrate 100 from falling off.

[0027] In the above, a first angle 115 is set in the second opening 112, and the first angle 115 is the angle between the inner wall of the second opening 112 and the surface of the packaging substrate 100 corresponding to the second opening 112. The specific position of the first angle 115 is as follows: Figure 2 As shown, the first angle 115 is 45 degrees. On the one hand, this angle can ensure that the tin liquid fully flows into the second opening 112 and fills the second opening 112, thereby strengthening the connection strength between the solder ball 200 and the packaging substrate 100; on the other hand, it can reduce the amount and difficulty of grooving and facilitate the manufacture of the packaging substrate 100.

[0028] Correspondingly, a third opening 113 and a fourth opening 114 are provided on the other side of the packaging substrate 100 . The third opening 113 is connected to the fourth opening 114 and the diameter of the third opening 113 is smaller than that of the fourth opening 114 . The solder ball 200 can be fixedly installed on the packaging substrate 100 through the third opening 113 .

[0029] The third opening 113 and the fourth opening 114 are the same as the first opening 111 and the second opening 112, and are both provided with a second angle 116. The third opening 113 is provided on the surface of the packaging substrate 100, and the fourth opening 114 is located inside the packaging substrate 100. The second angle 116 is the angle between the inner wall of the third opening 113 and the surface of the packaging substrate 100 corresponding to the fourth opening 114. The second angle 116 is 45 degrees. The functions and effects realized are the same as those realized by the first opening 111 and the second opening 112, and will not be discussed in detail here.

[0030] In the present application, a fixing part 400 is also provided, and the fixing part 400 is located on the packaged chip 300 , and specifically on the side of the packaged chip 300 close to the packaged substrate 100 . The solder ball 200 can be connected through the fixing part 400 , so as to facilitate the installation of the packaged chip 300 on the packaged substrate 100 .

[0031] In the present application, the fixing part 400 is mainly composed of a colloid, and a fixing groove 410 is opened on the colloid at the position corresponding to the solder ball 200. The solder ball 200 is electrically connected to the packaged chip 300 through the fixing groove 410, which facilitates the use of the packaged substrate 100 and also prevents the solder ball 200 and the packaged chip 300 from falling off.

[0032] The above embodiments are only used to illustrate the technical method of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical method of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the utility model.

Claims

1. An IC packaging substrate, characterized in that: include: A packaging substrate, wherein a notch is formed on the packaging substrate and a solder ball is disposed in the notch; A fixing portion, the fixing portion is arranged on a side of the packaged chip facing the packaged substrate, and the fixing portion is connected to the solder ball; A fixing groove is provided on the fixing portion at a position corresponding to the solder ball, the solder ball is located in the fixing groove, and the solder ball is electrically connected to the packaged chip through the fixing groove.

2. The IC package carrier according to claim 1, characterized in that: The notches are arranged at two sides of the packaging substrate, wherein the notch on one side corresponds to the packaging chip, the notch further comprises a third opening and a fourth opening, the diameter of the third opening is smaller than the diameter of the fourth opening, and the solder ball is located at the position of the third opening so that the solder ball is fixed to the packaging substrate; The notch on the other side is provided with a first opening and a second opening, the diameter of the first opening is smaller than the diameter of the second opening, and the solder ball is located at the position of the first opening so that the solder ball is fixed to the packaging substrate.

3. The IC package carrier according to claim 2, characterized in that: The first opening is disposed on the surface of the packaging substrate, the second opening is located inside the packaging substrate, and the second opening is connected to the first opening.

4. The IC package carrier according to claim 3, characterized in that: A first angle is formed in the second opening. The first angle is an angle between an inner wall in the second opening and a surface of the packaging substrate corresponding to the second opening. The first angle is 45 degrees.

5. The IC package carrier according to claim 2, characterized in that: The third opening is disposed on the surface of the packaging substrate, the fourth opening is located inside the packaging substrate, and the third opening is connected to the fourth opening.

6. The IC package carrier according to claim 5, characterized in that: A second angle is formed in the third opening. The second angle is an angle between an inner wall in the third opening and a surface of the packaging substrate corresponding to the fourth opening. The second angle is 45 degrees.

7. The IC package carrier according to claim 1, characterized in that: The fixing portion is located on a side of the packaged chip close to the packaged substrate, and the solder balls are connected via the fixing portion.

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