Cooling device for air conditioner and air conditioner

Abstract

The utility model relates to the technical field of household appliances, and discloses a cooling device for an air conditioner, the air conditioner comprises a to-be-cooled element and a refrigerant circulation loop, and the cooling device comprises a cooling shell, a spray pipe and a flow guide pipe. The cooling shell is provided with a cooling cavity and a cooling surface, a liquid outlet is formed in the bottom surface of the cooling cavity, and the cooling surface is attached to a to-be-cooled element; the spray pipe communicates with the refrigerant circulation loop, and the spray pipe comprises an atomizing nozzle extending into the cooling cavity; the flow guide pipe is used for communicating the refrigerant circulation loop with the liquid outlet. The cooling device is installed on the air conditioner. The air conditioner is provided with a condenser, and the flowing direction of a refrigerant in the refrigerant circulation loop is limited from the condenser to the cooling device. Through the arrangement, the heat dissipation efficiency of the cooling device on the to-be-cooled element is improved. Meanwhile, the utility model further discloses the air conditioner.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, for example, to a cooling device for an air conditioner and an air conditioner. Background Art

[0002] At present, air conditioners have been widely used in people's daily life. People can use air conditioners to cool or heat the room to adjust the indoor temperature. However, with the development of society and the improvement of living standards, people's requirements for the quality of life are getting higher and higher. For example, people now also set IPM (intelligent power module) in the air conditioner to integrate multiple functions into one module, thereby achieving more precise and efficient control of the motor, which is crucial for variable frequency air conditioners. However, during use, IPM will generate heat and keep itself in a high temperature state. If it is in a high temperature state for a long time, its life will be reduced.

[0003] In the related art, for example, the patent publication number is CN106016507A, and the patent name is Invention of a Radiator for Air Conditioner Inverter and Inverter Air Conditioner, which discloses a radiator and an inverter air conditioner equipped with the radiator, wherein the radiator is provided with a pipeline for circulating refrigerant. In this way, when the temperature of the IPM is too high, the IPM can be cooled by the refrigerant circulating in the pipeline.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] In the related art, the existing air conditioner provided with a radiator can only dissipate heat from the IPM through the flowing refrigerant, and the heat dissipation efficiency is low.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The embodiment of the present disclosure provides a cooling device for an air conditioner and an air conditioner, in which when the temperature of the cooling element of the air conditioner is high, the cooling surface of the cooling device can dissipate heat from the cooling element. The cooling device can flash vaporize the refrigerant to improve the heat dissipation efficiency of the cooling device.

[0009] The disclosed embodiment provides a cooling device for an air conditioner, the air conditioner includes a component to be cooled and a refrigerant circulation loop, and the cooling device includes: a cooling shell, a nozzle and a guide pipe. The cooling shell is provided with a cooling cavity and a cooling surface, the bottom surface of the cooling cavity is provided with a liquid outlet, and the cooling surface is attached to the component to be cooled; the nozzle is connected to the refrigerant circulation loop, and the nozzle includes an atomizing nozzle extending into the cooling cavity; the guide pipe is used to connect the refrigerant circulation loop and the liquid outlet; wherein the refrigerant in the refrigerant circulation loop can be atomized by the atomizing nozzle and sprayed into the cooling cavity, and the refrigerant in the cooling cavity can flow back to the refrigerant circulation loop through the liquid outlet and the guide pipe.

[0010] In some embodiments, the cooling device further comprises: a valve element. The valve element is arranged on the nozzle and is used to block or open the nozzle.

[0011] In some embodiments, the cooling device further comprises: a temperature sensor. The temperature sensor is arranged at a position corresponding to the cooling housing and the element to be cooled, and is used to obtain the temperature of the element to be cooled; wherein the temperature sensor is electrically connected to the valve element, and can control the valve element to block or conduct the nozzle.

[0012] In some embodiments, a guide groove is further provided on the bottom surface of the cooling cavity, and the guide groove is connected to the liquid outlet; wherein the guide direction of the guide groove is limited to be toward the liquid outlet.

[0013] In some embodiments, the cooling device further comprises: a heat pipe. The heat pipe is bent and arranged on the cooling surface.

[0014] In some embodiments, the cooling surface is provided with a mounting groove for mounting the heat pipe; wherein the depth of the mounting groove is greater than or equal to the thickness of the heat pipe.

[0015] In some embodiments, the mounting slot is provided with a buckle; wherein the heat pipe can be buckled into the mounting slot via the buckle.

[0016] The embodiment of the present disclosure also provides an air conditioner comprising: an air conditioner body and the above cooling device for the air conditioner. The air conditioner body comprises a component to be cooled; wherein the cooling device for the air conditioner is installed at a position of the air conditioner body corresponding to the component to be cooled.

[0017] In some embodiments, the air conditioner further comprises: a condenser, an evaporator and a refrigerant circulation loop. The refrigerant circulation loop is used to connect the condenser and the evaporator; wherein the cooling device is arranged between the condenser and the evaporator, the nozzle and the guide pipe of the cooling device are respectively connected to the refrigerant circulation loop, and the connection between the nozzle and the refrigerant circulation loop is located on the side close to the condenser, and the connection between the guide pipe and the refrigerant circulation loop is located on the side close to the evaporator.

[0018] In some embodiments, the diameter of the nozzle is less than or equal to 1 / 2 of the diameter of the pipe of the refrigerant circulation loop.

[0019] The cooling device for an air conditioner and the air conditioner provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] The embodiment of the present disclosure provides a cooling device for an air conditioner, the air conditioner includes a component to be cooled and a refrigerant circulation loop, and the cooling device includes: a cooling shell, a nozzle and a guide pipe. The cooling shell is provided with a cooling cavity and a cooling surface, the bottom surface of the cooling cavity is provided with a liquid outlet, and the cooling surface is attached to the component to be cooled; the nozzle is connected to the refrigerant circulation loop, and the nozzle includes an atomizing nozzle extending into the cooling cavity; the guide pipe is used to connect the refrigerant circulation loop and the liquid outlet; wherein the refrigerant in the refrigerant circulation loop can be atomized and sprayed into the cooling cavity through the atomizing nozzle, and the refrigerant in the cooling cavity can flow back to the refrigerant circulation loop through the liquid outlet and the guide pipe. The cooling device is installed on the air conditioner. The air conditioner is provided with a condenser, and the flow direction of the refrigerant in the refrigerant circulation loop is limited to from the condenser to the cooling device. In this way, when the temperature of the component to be cooled is high, the high-pressure liquid refrigerant that can flow out of the condenser can be sprayed into the cooling cavity through the nozzle and the nozzle. At this time, the refrigerant sprayed into the cooling cavity will flash and atomize and exchange heat with the cooling surface and the element to be cooled to reduce the temperature of the element to be cooled, thereby ensuring the stability of the element to be cooled. This arrangement improves the heat dissipation efficiency of the cooling device to the element to be cooled.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a structural schematic diagram of an air conditioner provided by an embodiment of the present disclosure;

[0024] Figure 2 is a schematic structural diagram of a cooling device provided by an embodiment of the present disclosure;

[0025] Figure 3 is a cross-sectional view of a cooling device provided by an embodiment of the present disclosure;

[0026] Figure 4 It is a schematic diagram of the structure of a cooling surface provided in an embodiment of the present disclosure.

[0027] Reference numerals:

[0028] 01: refrigerant circulation circuit; 02: condenser; 03: evaporator; 04: compressor; 05: component to be cooled; 06: cooling device; 07: valve body component;

[0029] 10: cooling shell; 11: cooling cavity; 12: cooling surface; 13: liquid outlet; 14: guide groove; 15: heat pipe;

[0030] 20: nozzle; 21: nozzle;

[0031] 30: Flow guide tube. DETAILED DESCRIPTION

[0032] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0033] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0034] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0035] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0036] Unless otherwise stated, the term "plurality" means two or more.

[0037] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0038] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0039] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0040] Existing air conditioners are generally equipped with computer boards such as IPM. The computer board will generate heat during use to increase its own temperature. If the computer board itself is in a high temperature state for a long time, its service life will be reduced. Therefore, a cooling device is also provided in the air conditioner, which is used to dissipate heat from the computer board to prevent it from being in a high temperature state.

[0041] In the related art, fins and heat dissipation pipes are provided at the computer board. The two sides of the fins are respectively attached to the computer board and the heat dissipation pipe, and the heat dissipation pipe is connected to the refrigerant circulation circuit so that the refrigerant flowing in the heat dissipation pipe dissipates the heat of the computer board through the fins. However, the existing heat dissipation method has low heat dissipation efficiency, and the computer board may still be in a high temperature state.

[0042] Combination Figures 1 to 4 As shown, the embodiment of the present disclosure provides a cooling device 06 for an air conditioner and an air conditioner. When the temperature of the component 05 to be cooled of the air conditioner is high, the cooling surface 12 of the cooling device 06 can be used to dissipate the heat of the component 05 to be cooled. The cooling device 06 can flash vaporize the refrigerant to improve the heat dissipation efficiency of the cooling device 06, thereby preventing the component 05 to be cooled from being in a high temperature state.

[0043] like Figures 1 to 4As shown, the embodiment of the present disclosure provides a cooling device 06 for an air conditioner, the air conditioner includes a component to be cooled 05 and a refrigerant circulation loop 01, and the cooling device 06 includes: a cooling shell 10, a nozzle 20 and a guide pipe 30. The cooling shell 10 is provided with a cooling cavity 11 and a cooling surface 12, the bottom surface of the cooling cavity 11 is provided with a liquid outlet 13, and the cooling surface 12 is attached to the component to be cooled 05; the nozzle 20 is connected to the refrigerant circulation loop 01, and the nozzle 20 includes an atomizing nozzle 21 extending into the cooling cavity 11; the guide pipe 30 is used to connect the refrigerant circulation loop 01 and the liquid outlet 13; wherein, the refrigerant in the refrigerant circulation loop 01 can be atomized and sprayed into the cooling cavity 11 through the atomizing nozzle 21, and the refrigerant in the cooling cavity 11 can flow back to the refrigerant circulation loop 01 through the liquid outlet 13 and the guide pipe 30.

[0044] Specifically, the component to be cooled 05 of the air conditioner can be a computer board such as an IPM. The bottom end surface of the cooling shell 10 constitutes a cooling surface 12, and the cooling surface 12 is attached to the component to be cooled 05. The top of the cooling shell 10 is provided with an opening, and the nozzle 20 extends from the outside of the cooling shell 10 through the opening into the cooling shell 10, so that the nozzle 21 is in the cooling cavity 11. The pipeline at the connection between the refrigerant circulation loop 01 and the nozzle 20 flows with high-pressure liquid refrigerant, and the flow direction of the refrigerant is limited to flow from the refrigerant circulation loop 01 to the nozzle 20.

[0045] When the temperature of the component to be cooled 05 is higher than the temperature threshold, the high-pressure liquid refrigerant in the refrigerant circulation loop 01 can be sprayed into the cooling cavity 11 through the nozzle 20 and the nozzle 21. At this time, since the refrigerant is a high-pressure liquid refrigerant, flash atomization will occur after the refrigerant is sprayed into the cooling cavity 11, so as to quickly cool the cooling surface 12, thereby quickly cooling the component to be cooled 05. Such a setting can improve the efficiency of heat dissipation of the component to be cooled 05, thereby avoiding the component to be cooled 05 from being in a high temperature state, and increasing the service life of the component to be cooled 05.

[0046] After the refrigerant in the cooling cavity 11 exchanges heat on the cooling surface 12 , the refrigerant will condense on the bottom surface of the cooling cavity 11 under the action of gravity and flow back into the refrigerant circulation loop 01 through the liquid outlet 13 to avoid the refrigerant accumulating in the cooling cavity 11 .

[0047] In the above embodiment, the opening of the cooling shell 10 is arranged at its top end, so that the nozzle 21 is directly facing the bottom end surface of the cooling shell 10, that is, the cooling surface 12. In this way, the high-pressure liquid refrigerant can be directly sprayed on the cooling surface 12 and flash atomized. Such an arrangement can further improve the heat dissipation efficiency of the cooling device 06 to the cooling element 05.

[0048] It can be understood that the flash atomization phenomenon is the flash evaporation phenomenon. After the high-pressure saturated liquid enters the container with lower pressure, due to the sudden decrease in pressure, part of the high-pressure saturated liquid will quickly evaporate into steam. In the above phase change process, a large amount of heat will be absorbed, thereby achieving the effect of rapid heat dissipation of the cooling element 05.

[0049] Optionally, a sealing structure is provided at the opening of the cooling shell 10 to prevent the refrigerant in the cooling cavity 11 from flowing out of the opening.

[0050] In some embodiments, the cooling device 06 further includes a valve element 07 . The valve element 07 is disposed on the nozzle 20 and is used to block or open the nozzle 20 .

[0051] Specifically, when the air conditioner is in cooling mode, the valve element 07 is opened to conduct the nozzle 20. At this time, part of the high-pressure liquid refrigerant processed by the condenser 02 can be sprayed into the cooling cavity 11 through the nozzle 20 and the nozzle 21.

[0052] When the air conditioner is in heating mode, the valve element 07 is closed to block the nozzle 20 to prevent the refrigerant flowing from the evaporator 03 from entering the cooling cavity 11 .

[0053] In some embodiments, the cooling device 06 further includes: a temperature sensor. The temperature sensor is disposed at a position corresponding to the cooling housing 10 and the element to be cooled 05, and is used to obtain the temperature of the element to be cooled 05; wherein the temperature sensor is electrically connected to the valve element 07, and can control the valve element 07 to block or conduct the nozzle 20.

[0054] Specifically, the temperature sensor is electrically connected to the valve element 07 to control the valve element 07 to close or open according to the temperature of the component to be cooled 05. At the same time, when the valve element 07 is open, the temperature sensor can also control the opening degree of the valve element 07.

[0055] In the initial state, the valve body element 07 is in a closed state to block the nozzle 20 .

[0056] When the temperature sensor detects that the temperature of the component to be cooled 05 is higher than the temperature threshold, the valve body component 07 can be controlled to open to conduct the nozzle 20, so that the high-pressure refrigerant in the refrigerant circulation loop 01 is sprayed into the cooling cavity 11 through the nozzle 20 and the nozzle 21. At the same time, the temperature sensor can also control the opening of the valve body component 07 according to the temperature of the component to be cooled 05, thereby controlling the amount of refrigerant sprayed into the cooling cavity 11, and further controlling the heat dissipation efficiency of the cooling device 06 on the component to be cooled 05.

[0057] After the temperature sensor detects that the temperature of the to-be-cooled element 05 is reduced below the temperature threshold, the valve body element 07 may be controlled to close to block the nozzle 20 .

[0058] In practical applications, the opening of the valve element 07 is proportional to the temperature of the component to be cooled 05, that is, the higher the temperature of the component to be cooled 05, the larger the opening of the valve element 07. In this way, the amount of refrigerant sprayed into the cooling cavity 11 can be dynamically adjusted according to the temperature of the component to be cooled 05, so as to achieve the effect of saving refrigerant.

[0059] In some embodiments, a guide groove 14 is further provided on the bottom surface of the cooling cavity 11 , and the guide groove 14 is connected to the liquid outlet 13 ; wherein the guide direction of the guide groove 14 is limited to be toward the liquid outlet 13 .

[0060] Specifically, the bottom surface of the cooling cavity 11 is provided with a groove to form a guide groove 14. The bottom surface of the guide groove 14 is an inclined surface, and the height of the bottom surface of the guide groove 14 near the liquid outlet 13 is lower than the height of the bottom surface of the guide groove 14 far from the liquid outlet 13.

[0061] Optionally, the bottom surface of the cooling cavity 11 is an inclined surface, and the height of the bottom surface of the cooling cavity 11 close to the guide groove 14 is lower than the height of the bottom surface far from the guide groove 14, so that the refrigerant in the cooling cavity 11 flows into the guide groove 14 under the action of gravity.

[0062] In some embodiments, the cooling device 06 further includes a heat pipe 15 . The heat pipe 15 is bent and arranged on the cooling surface 12 .

[0063] Specifically, the heat pipe 15 is fixedly arranged on the cooling surface 12, and the two sides of the heat pipe 15 are respectively attached to the cooling surface 12 and the cooling element 05. The heat pipe 15 is a bent structure, and the shape of the heat pipe 15 corresponds to the cooling surface 12 to increase the contact area between the heat pipe 15 and the cooling surface 12.

[0064] It is understandable that the heat pipe 15 mainly transfers heat by phase change of the working fluid, and the thermal resistance is very small, so it has a high thermal conductivity. The heat pipe 15 is arranged on the cooling surface 12 to improve the heat exchange efficiency between the cooling device 06 and the component to be cooled 05, thereby improving the heat dissipation capacity of the cooling device 06 to the component to be cooled 05.

[0065] In some embodiments, the cooling surface 12 is provided with a mounting groove for mounting the heat pipe 15 ; wherein the depth of the mounting groove is greater than or equal to the thickness of the heat pipe 15 .

[0066] Specifically, the depth of the mounting groove is greater than or equal to the thickness of the heat pipe 15, so as to prevent the heat pipe 15 from protruding from the cooling surface 12, causing the cooling surface 12 to be unable to fit with the component to be cooled 05. At the same time, installing the heat pipe 15 in the mounting groove can increase the contact area between the heat pipe 15 and the cooling surface 12, thereby improving the heat exchange efficiency between the heat pipe 15 and the cooling surface 12.

[0067] Furthermore, the depth of the mounting groove is the same as the thickness of the heat pipe 15 , so that the heat pipe 15 and the cooling surface 12 can be attached to the component 05 to be cooled at the same time.

[0068] In some embodiments, the mounting groove is provided with a buckle; wherein the heat pipe 15 can be buckled into the mounting groove by the buckle.

[0069] Optionally, a plurality of buckles are provided at the edge of the mounting groove, and the plurality of buckles are evenly arranged along the length direction of the mounting groove. After the heat pipe 15 is installed in the mounting groove, the buckle can abut against the heat pipe 15 to prevent the heat pipe 15 from coming out of the mounting groove.

[0070] Combination Figure 1 As shown, the embodiment of the present disclosure also provides an air conditioner including: an air conditioner body and the above-mentioned cooling device 06 for the air conditioner. The air conditioner body includes a component to be cooled 05; wherein the cooling device 06 for the air conditioner is installed at a position corresponding to the air conditioner body and the component to be cooled 05.

[0071] Specifically, the cooling surface 12 of the cooling device 06 is in contact with the component 05 to be cooled.

[0072] In practical applications, if the air conditioner body includes a plurality of components to be cooled 05 , a plurality of cooling devices 06 may be provided accordingly, and the plurality of components to be cooled 05 may be cooled respectively by the plurality of cooling devices 06 .

[0073] In an air conditioner using the cooling device 06 for air conditioners provided in the present application, when the temperature of the component 05 to be cooled of the air conditioner is high, the cooling surface 12 of the cooling device 06 can be used to dissipate the heat of the component 05 to be cooled. The cooling device 06 can flash vaporize and atomize the refrigerant to improve the heat dissipation efficiency of the cooling device 06, thereby preventing the component 05 to be cooled from being in a high temperature state.

[0074] In some embodiments, the air conditioner further includes: a condenser 02, an evaporator 03 and a refrigerant circulation loop 01. The refrigerant circulation loop 01 is used to connect the condenser 02 and the evaporator 03; wherein the cooling device 06 is arranged between the condenser 02 and the evaporator 03, the nozzle 20 and the guide pipe 30 of the cooling device 06 are respectively connected to the refrigerant circulation loop 01, and the connection between the nozzle 20 and the refrigerant circulation loop 01 is located on the side close to the condenser 02, and the connection between the guide pipe 30 and the refrigerant circulation loop 01 is located on the side close to the evaporator 03.

[0075] Specifically, the air conditioner further includes a compressor 04. The condenser 02 and the evaporator 03 are connected through the refrigerant circulation loop 01, and the flow direction of the refrigerant is limited to flowing from the condenser 02 to the evaporator 03. The cooling device 06 is arranged between the condenser 02 and the evaporator 03, and the connection between the spray pipe 20 and the refrigerant circulation loop 01 is located on the side close to the condenser 02, and the connection between the guide pipe 30 and the refrigerant circulation loop 01 is located on the side close to the evaporator 03. In this way, when the air conditioner is turned on in the cooling mode, the high-pressure liquid refrigerant flowing out of the condenser 02 can be sprayed into the cooling cavity 11, and then flows into the refrigerant circulation loop 01 through the guide pipe 30 to complete the cycle.

[0076] In some embodiments, the diameter of the nozzle 20 is less than or equal to 1 / 2 of the diameter of the pipeline of the refrigerant circulation loop 01 .

[0077] Specifically, the diameter of the nozzle 20 is a first diameter, the diameter of the pipeline of the refrigerant circulation loop 01 is a second diameter, and the first diameter is less than or equal to 1 / 2 of the second diameter. For example, the first diameter may be 1 / 2, 1 / 3, 1 / 4, 1 / 5 or 1 / 6 of the second diameter. In this way, it is possible to avoid excessive refrigerant from the refrigerant circulation loop 01 flowing into the cooling cavity 11, so as to avoid affecting the cooling effect of the air conditioner.

[0078] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A cooling device for an air conditioner, the air conditioner comprising a component to be cooled and a refrigerant circulation loop, characterized in that: The cooling device comprises: A cooling shell is provided with a cooling cavity and a cooling surface, the bottom surface of the cooling cavity is provided with a liquid outlet, and the cooling surface is attached to the element to be cooled; a spray pipe connected to the refrigerant circulation circuit, the spray pipe comprising an atomizing nozzle extending into the cooling cavity; and, A flow guide pipe, used for connecting the refrigerant circulation loop and the liquid outlet; Among them, the high-pressure liquid refrigerant in the refrigerant circulation loop can be atomized through the atomizing nozzle and sprayed into the cooling cavity, and the refrigerant in the cooling cavity can flow back to the refrigerant circulation loop through the liquid outlet and the guide pipe.

2. The cooling device according to claim 1, characterized in that: Also includes: The valve body element is arranged on the nozzle and is used for blocking or conducting the nozzle.

3. The cooling device according to claim 2, characterized in that: Also includes: A temperature sensor is disposed at a position of the cooling housing corresponding to the element to be cooled, and is used to obtain the temperature of the element to be cooled; Wherein, the temperature sensor is electrically connected to the valve body element, and can control the valve body element to block or conduct the nozzle.

4. The cooling device according to claim 1, characterized in that: The bottom surface of the cooling cavity is also provided with a guide groove, and the guide groove is connected with the liquid outlet; Wherein, the guiding direction of the guiding groove is limited to be toward the liquid outlet.

5. The cooling device according to claim 1, characterized in that: Also includes: The heat pipe is bent and arranged on the cooling surface.

6. The cooling device according to claim 5, characterized in that: The cooling surface is provided with a mounting groove for mounting the heat pipe; Wherein, the depth of the mounting groove is greater than or equal to the thickness of the heat pipe.

7. The cooling device according to claim 6, characterized in that: The mounting groove is provided with a buckle; Wherein, the heat pipe can be clamped in the installation groove through the buckle.

8. An air conditioner, characterized in that: include: The air conditioner body includes the element to be cooled; and, A cooling device for an air conditioner as claimed in any one of claims 1 to 7; The cooling device for the air conditioner is installed at a position of the air conditioner body corresponding to the component to be cooled.

9. The air conditioner according to claim 8, characterized in that: Also includes: Condenser; Evaporator; and, A refrigerant circulation loop, used for connecting the condenser and the evaporator; In which, the cooling device is arranged between the condenser and the evaporator, the nozzle and the guide pipe of the cooling device are respectively connected to the refrigerant circulation loop, and the connection between the nozzle and the refrigerant circulation loop is located on the side close to the condenser, and the connection between the guide pipe and the refrigerant circulation loop is located on the side close to the evaporator.

10. The air conditioner according to claim 9, characterized in that: The diameter of the nozzle is less than or equal to 1 / 2 of the diameter of the pipeline of the refrigerant circulation loop.

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