Hot end heat exchange device and semiconductor refrigeration refrigerator

Abstract

The utility model relates to the technical field of semiconductor refrigeration, and provides a hot end heat exchange device and a semiconductor refrigeration refrigerator. The hot end heat exchange device comprises a hot end heat exchanger and a gravity assisted heat pipe, and a containing cavity used for containing a gas-liquid two-phase coexisting refrigerant is defined by the hot end heat exchanger. The gravity heat pipe comprises a gas outlet pipe section, a phase change heat exchange pipe section and a liquid return pipe section which are communicated in sequence, the gas outlet pipe section and the liquid return pipe section are arranged along a first plane, and the phase change heat exchange pipe section is arranged along a second plane intersected with the first plane; therefore, the phase change heat exchange pipe section is not limited to be arranged above the gas outlet pipe section, more downward extension is allowed to obtain a larger heat dissipation area, and the heat dissipation effect on the hot end of the semiconductor refrigeration element can be improved. According to the semiconductor refrigeration refrigerator, the phase change heat exchange pipe sections of the hot end heat exchange device are cooled through the side plates of the refrigerator body, it is guaranteed that the semiconductor refrigeration refrigerator can operate continuously and stably, and better refrigeration performance is achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor refrigeration technology, and in particular to a hot end heat exchange device and a semiconductor refrigeration refrigerator. Background Art

[0002] Semiconductor refrigeration equipment is a device that uses semiconductor refrigeration elements for refrigeration. Semiconductor refrigeration elements are based on the "Peltier effect". Through the potential energy change of electrons and holes in the energized circuit, heat absorption and heat release phenomena are generated, so that the semiconductor refrigeration element forms a cold end and a hot end, and then the cold end is used to achieve the refrigeration function. While the cold end of the semiconductor refrigeration element is cooling, its hot end will generate a lot of heat. If the semiconductor refrigeration element is to operate continuously and reliably, or if the refrigeration capacity of the cooling end is to be improved, it is necessary to improve the heat dissipation efficiency of the hot end, reduce the heat accumulation of the hot end, and reduce the temperature difference between the two ends so that the cold end can generate more coldness.

[0003] In the related art, a gravity heat pipe system is often used to dissipate heat from the hot end of a semiconductor refrigeration element. The principle is mainly based on the phase change process of the working fluid inside the gravity heat pipe, which transfers and dissipates heat through the cycle of evaporation and condensation.

[0004] However, in order to meet certain cooling performance requirements, gravity heat pipes need to have a larger heat dissipation area, while the space for semiconductor refrigeration equipment is usually limited. Existing hot-end heat exchange devices either have insufficient heat exchange area and low cooling efficiency, or occupy a large space, which reduces the space utilization of semiconductor refrigeration equipment and makes it difficult to meet usage requirements. Utility Model Content

[0005] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a hot end heat exchange device, which can increase the heat dissipation area while avoiding occupying too much space to meet the use requirements.

[0006] The present application also proposes a semiconductor refrigeration refrigerator having the above-mentioned hot end heat exchange device.

[0007] According to the hot end heat exchange device of the first aspect embodiment of the present application, the hot end heat exchange device is used for semiconductor refrigeration equipment, including a hot end heat exchanger and a gravity heat pipe, the hot end heat exchanger is defined with a containing cavity for accommodating a refrigerant in which gas and liquid coexist; both ends of the gravity heat pipe are connected to the containing cavity, the gravity heat pipe is configured to allow the gas-phase refrigerant in the containing cavity to pass into it from one end and undergo phase change heat exchange, and to allow the liquid-phase refrigerant formed by phase change to flow back to the containing cavity from the other end under the action of gravity, along the flow direction of the refrigerant, the gravity heat pipe includes a gas outlet pipe section, a phase change heat exchange pipe section and a liquid reflux pipe section connected in sequence, the gas outlet pipe section and the liquid reflux pipe section are extended along a first plane, the phase change heat exchange pipe section is extended along a second plane, and the first plane intersects with the second plane.

[0008] According to the hot end heat exchange device of the embodiment of the present application, at least the following beneficial effects are achieved: the hot end heat exchange device of the present application forms a gravity heat pipe by connecting at least the gas outlet pipe section, the phase change heat pipe section and the liquid return pipe section in sequence, so that the refrigerant in the accommodating cavity of the hot end heat exchanger forms a large flux of evaporation and condensation cycle, thereby achieving heat dissipation of the hot end of the semiconductor refrigeration element. In addition, by arranging the gas outlet pipe section and the liquid return pipe section along the first plane, and arranging the phase change heat pipe section along a second plane intersecting the first plane, the phase change heat pipe section is not limited to being arranged above the gas outlet pipe section, allowing the phase change heat pipe section to extend downward more to obtain a larger heat dissipation area, thereby improving the heat dissipation efficiency of the phase change heat pipe section and improving the heat dissipation effect on the hot end of the semiconductor refrigeration element.

[0009] According to some embodiments of the present application, the bottom end of the phase change heat pipe segment is lower than the top end of the accommodating cavity.

[0010] According to some embodiments of the present application, the gravity heat pipe also includes a gas riser section, which is vertically extended, and the gas outlet section is horizontally extended, and the gas outlet section is connected to the phase change heat pipe section through the gas riser section.

[0011] According to some embodiments of the present application, the gravity heat pipe further includes a transition connecting pipe section, the transition connecting pipe section is bent, and the gas outlet pipe section is connected to the gas riser pipe section through the transition connecting pipe section.

[0012] According to some embodiments of the present application, there are multiple phase-change heat pipe segments, and the multiple phase-change heat pipe segments are extended side by side.

[0013] According to some embodiments of the present application, the flow area of ​​the gas outlet pipe segment is smaller than the sum of the flow areas of the multiple phase change heat pipe segments.

[0014] According to some embodiments of the present application, a heat exchange plane is formed on the side of the phase change heat pipe section facing away from the hot end heat exchanger;

[0015] And / or, the angle between the first plane and the second plane is greater than or equal to 90°;

[0016] And / or, the gas outlet pipe section is in communication with the top of the accommodating chamber;

[0017] And / or, the liquid reflux pipe section is in communication with a side portion of the accommodating chamber.

[0018] According to some embodiments of the present application, the number of the gravity heat pipes is two groups, and the two groups of the gravity heat pipes are respectively located on two opposite sides of the hot-end heat exchanger.

[0019] According to some embodiments of the present application, a gas-phase joint pipeline connected to the accommodating cavity is provided on the hot-end heat exchanger, the gas outlet pipe sections of the two groups of gravity heat pipes are connected to each other, and the gas-phase joint pipeline is connected to one of the gas outlet pipe sections and bends toward the extension direction of the gas outlet pipe section connected thereto.

[0020] A refrigerator according to an embodiment of the second aspect of the present application comprises a cabinet shell, a semiconductor refrigeration element and a hot end heat exchange device as described in any of the above embodiments, wherein the hot end heat exchanger of the hot end heat exchange device is arranged on the inner wall of the back plate of the cabinet shell, the hot end heat exchanger is connected to the hot end of the semiconductor refrigeration element for heat exchange, and the phase change heat pipe section of the hot end heat exchange device abuts against the inner side of a side plate of the cabinet shell.

[0021] The refrigerator according to the second aspect of the present application has at least the following beneficial effects:

[0022] The semiconductor refrigeration refrigerator of this embodiment uses the side panels of the box body to dissipate heat from the phase change heat pipe section of the hot end heat exchange device, so that the phase change heat pipe section avoids the gas outlet pipe section located on the inner side of the back plate, allowing a phase change heat pipe section with a larger area to be set, thereby forming better heat dissipation for the semiconductor hot end, ensuring that the semiconductor refrigeration refrigerator can operate continuously and stably with better refrigeration performance.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is an axonometric schematic diagram of a hot end heat exchange device according to an embodiment of the present application;

[0026] Figure 2 It is a right side schematic diagram of a hot end heat exchange device according to an embodiment of the present application;

[0027] Figure 3 This is an axonometric schematic diagram of another hot end heat exchange device according to an embodiment of the present application;

[0028] Figure 4 It is an axonometric schematic diagram of the assembly state of a hot end heat exchange device and a cabinet shell of a semiconductor refrigeration refrigerator according to an embodiment of the present application.

[0029] Reference numerals:

[0030] 1. Hot end heat exchanger;

[0031] 2. Gravity heat pipe; 21. Gas outlet pipe section; 22. Phase change heat pipe section; 221. Oblique extension pipe section; 222. Corner pipe section; 23. Liquid reflux pipe section; 24. Gas riser pipe section; 25. Transition connection pipe section; 26. Gas phase joint pipeline;

[0032] 3. Box shell. DETAILED DESCRIPTION

[0033] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0034] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meanings of "multiple", "multiple roots", and "multiple groups" are two or more.

[0035] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0036] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0038] At present, judging from the development of the market situation, semiconductor refrigeration technology has become increasingly widely used in electronics, communications, medical experiments, automobiles, industry, aerospace and other fields due to its small size, ability to achieve precise and rapid temperature control, and its quietness, reliability and environmental protection. The market demand is also increasing.

[0039] Semiconductor refrigeration equipment is a device that uses semiconductor refrigeration elements for refrigeration. Semiconductor refrigeration elements are based on the "Peltier effect". Through the potential energy change of electrons and holes in the energized circuit, heat absorption and heat release phenomena are generated, so that the semiconductor refrigeration element forms a cold end and a hot end, and then the cold end is used to achieve the refrigeration function. While the cold end of the semiconductor refrigeration element is cooling, its hot end will generate a lot of heat. If the semiconductor refrigeration element is to operate continuously and reliably, or if the refrigeration capacity of the cooling end is to be improved, it is necessary to improve the heat dissipation efficiency of the hot end, reduce the heat accumulation of the hot end, and reduce the temperature difference between the two ends so that the cold end can generate more coldness.

[0040] In related technologies, gravity heat pipe systems are often used to dissipate heat from the hot end of semiconductor refrigeration elements. The principle is mainly based on the phase change process of the internal working fluid. The liquid working fluid first absorbs heat and vaporizes in the evaporation section, and then the vapor flows to the condensation section under the action of the pressure difference, and releases heat in the condensation section and condenses back into liquid. In this process, the liquid working fluid flows back to the evaporation section by gravity, thereby realizing the transfer and dissipation of heat from the hot end of the semiconductor through the cycle of evaporation and condensation.

[0041] However, the heat dissipation of the gravity heat pipe requires a larger heat dissipation area, while the space of the semiconductor refrigeration equipment is usually limited. The gravity heat pipe of the existing hot end heat exchange device is usually arranged on the side where the semiconductor refrigeration element of the refrigeration equipment is located, such as the back side of the semiconductor refrigeration equipment. Specifically, the liquid storage tank storing the refrigerant is used for heat exchange along the hot end of the semiconductor refrigeration element. Since the gas phase refrigerant is formed on the upper part of the liquid storage tank, the evaporation section pipeline of the gravity heat pipe needs to be connected to the upper part of the liquid storage tank and extend obliquely upward. In this way, if the condensation section and the evaporation section of the gravity heat pipe are to be arranged on the same plane, the gravity heat pipe can only be arranged above the evaporation section pipeline. Therefore, it is more difficult to obtain sufficient heat dissipation area in the already narrow space above the semiconductor refrigeration element.

[0042] Some solutions are to set up multiple layers of gravity heat pipes along the side perpendicular to the semiconductor refrigeration element. Although the heat exchange area is increased, a part of the space of the refrigeration equipment is sacrificed, reducing the overall space utilization. In addition, the multi-layered gravity heat pipes usually require support structures such as brackets or connecting ribs, which are complicated to manufacture and have high manufacturing costs. Therefore, the existing hot end heat exchange device is difficult to meet the use requirements.

[0043] To this end, in a first aspect, an embodiment of the present application proposes a hot end heat exchange device that can increase the heat dissipation area while avoiding occupying too much space to meet usage requirements.

[0044] The hot end heat exchange device disclosed in the embodiment of the present application can be used for, but is not limited to, various electronic equipment cooling devices such as computer CPU radiators and graphics card radiators; refrigeration equipment such as small household refrigerators, car refrigerators, and wine cabinets; medical refrigerators for storing blood, vaccines, etc.; portable refrigeration boxes, refrigeration backpacks and other easy-to-carry refrigeration products; cooling systems for cooling equipment in communication base stations; precise temperature control instruments used in scientific research experiments; local refrigeration modules in some high-end office equipment; refrigeration components for specific equipment in the aerospace field; and refrigeration appliances for local temperature control on some special industrial production lines, etc.

[0045] In a second aspect, the utility model provides a semiconductor refrigeration refrigerator using the hot end heat exchange device.

[0046] Combination Figure 1 and Figure 2 As shown, the hot end heat exchange device of the first aspect embodiment of the present application can be used for the semiconductor refrigeration equipment as described above. The hot end heat exchange device includes a hot end heat exchanger 1 and a gravity heat pipe 2.

[0047] The hot end heat exchanger 1 is defined with a receiving chamber for containing a refrigerant in which gas and liquid coexist. A heat exchange surface suitable for exchanging heat with the semiconductor hot end can be provided on the outside of the hot end heat exchanger 1. When in use, the lower space of the receiving chamber can store part of the liquid phase refrigerant, and the upper space of the receiving chamber can store part of the gas phase refrigerant after being heated and evaporated. The contained refrigerant can be water, methanol or ethanol, etc.

[0048] Both ends of the gravity heat pipe 2 are connected to the accommodating cavity. The gravity heat pipe 2 is configured to allow the gas-phase refrigerant in the accommodating cavity to pass through from one end thereof and undergo phase change heat transfer, and to allow the liquid-phase refrigerant formed by phase change to flow back to the accommodating cavity from the other end thereof under the action of gravity. Specifically, one end of the gravity heat pipe 2 for passing the gas-phase refrigerant should be connected to the partial space in the upper part of the accommodating cavity where the evaporated gas is stored; the gravity heat pipe 2 can first extend upward to lead the gas-phase refrigerant to a certain height for condensation, and the condensation pipe section can extend downward in a circuitous manner horizontally to condense the gas-phase refrigerant to form a liquid-phase refrigerant, and allow the liquid-phase refrigerant to flow downward under the action of gravity; the end of the condensation pipe section can be connected to the partial space in the accommodating cavity where the liquid-phase refrigerant is stored.

[0049] Along the flow direction of the refrigerant, the gravity heat pipe 2 includes a gas outlet pipe section 21, a phase change heat pipe section 22 and a liquid reflux pipe section 23 which are connected in sequence, wherein the gas outlet pipe section 21 is used to receive the gas-phase refrigerant discharged from the accommodating chamber, and to direct the evaporated gas-phase refrigerant to the top of the phase change heat pipe section 22; the phase change heat pipe section 22 condenses the internal gas-phase refrigerant to form a liquid-phase refrigerant through heat exchange with the outside, and causes the liquid-phase refrigerant to flow downward under the action of gravity; the liquid reflux pipe section 23 is used to receive the liquid-phase refrigerant discharged from the phase change heat pipe section 22, and causes the liquid-phase refrigerant to flow back to the accommodating chamber.

[0050] Specifically, the phase change heat exchange pipe segment 22 may include a plurality of obliquely extended pipe segments 221 and a plurality of corner pipe segments 222. Along the flow direction of the refrigerant, the obliquely extended pipe segments 221 form a certain downward inclination angle with the horizontal plane, and the plurality of obliquely extended pipe segments 221 are arranged vertically in sequence; each corner pipe segment 222 is used to connect two adjacent obliquely extended pipe segments 221, thereby forming a pipeline extending downward in a circuitous manner, which can form a larger heat exchange area on the one hand, and on the other hand, can also enable the gas-phase refrigerant to be more fully cooled and condensed into a liquid phase.

[0051] Among them, the gas outlet pipe section 21 and the liquid return pipe section 23 are extended along the first plane, and the phase change heat pipe section 22 is extended along the second plane, and the first plane intersects the second plane. The above-mentioned first plane and second plane are two virtual reference planes. For example, during production and processing, the first plane and the second plane can be defined as planes parallel to two adjacent side walls of the box body of the semiconductor refrigeration device to be applied later. The extension along a certain plane is based on the relative concept between the first plane and the second plane, that is, the gas outlet pipe section 21 and the liquid return pipe section 23 are extended and arranged close to the first plane relative to the second plane, and the phase change heat pipe section 22 is extended and arranged close to the second plane relative to the first plane. In addition, close to the plane extension, the center line of each local pipe section of the gravity heat pipe 2 can be parallel to the corresponding first plane or second plane, or it can be at a certain angle, and the spacing between each local pipe section and the corresponding first plane or second plane can also have a certain gap.

[0052] According to the hot end heat exchange device of the embodiment of the present application, through the gravity heat pipe 2 formed by at least the gas outlet pipe section 21, the phase change heat pipe section 22 and the liquid return pipe section 23 connected in sequence, the refrigerant in the accommodating cavity of the hot end heat exchanger 1 is passed into from one end thereof and out from the other end thereof. Since the flow directions of the gas phase refrigerant and the liquid phase refrigerant are consistent and there is no convection interference between them, a cycle of evaporation and condensation with a relatively large flux can be formed, thereby improving the heat dissipation performance of the hot end of the semiconductor refrigeration element to a certain extent.

[0053] In addition, by arranging the gas outlet pipe section 21 and the liquid reflux pipe section 23 along the first plane, and arranging the phase change heat pipe section 22 along a second plane intersecting the first plane, the phase change heat pipe section 22 is not limited to being arranged above the gas outlet pipe section 21. Since there is no interference from the gas outlet pipe section 21 below the phase change heat pipe section 22, the entire phase change heat pipe section 22 is allowed to extend downward more to obtain a larger heat dissipation area, thereby improving the heat dissipation efficiency of the phase change heat pipe section 22. At the same time, since the gravity heat pipe 2 is entirely arranged in contact with the first plane and the second plane, when used in a semiconductor refrigeration device, it can also be arranged in contact with two adjacent walls of the box of the semiconductor refrigeration device, and will not occupy too much space of the semiconductor refrigeration device.

[0054] like Figure 2 As shown, according to some embodiments of the present application, the bottom end of the phase change heat pipe segment 22 is lower than the top end of the accommodating cavity. In other words, the bottom end of the phase change heat pipe segment 22 can extend downward to a position equal to the height of the partial space of the accommodating cavity where the gas phase refrigerant is stored, or to a position equal to the height of the partial space of the accommodating cavity where the liquid phase refrigerant is stored, or even to a position lower than the entire accommodating cavity, so that the phase change heat pipe segment 22 can obtain a larger heat exchange area.

[0055] like Figure 1 As shown, according to some embodiments of the present application, the gravity heat pipe 2 also includes a gas riser section 24, the gas riser section 24 is vertically extended, the gas outlet section 21 is horizontally extended, and the gas outlet section 21 is connected to the phase change heat pipe section 22 through the gas riser section 24. Such an arrangement can make the gas outlet section 21 and / or the gas riser section 24 occupy as little space as possible along the first plane, thereby reducing the occupation of the corresponding side space of the semiconductor refrigeration device. Of course, it should be understood that in other embodiments, the gas outlet section 21 can also be inclined relative to the horizontal plane, and / or the gas riser section 24 can also be inclined relative to the vertical plane.

[0056] In this embodiment, since the gas outlet pipe section 21 and the gas riser pipe section 24 are perpendicular to each other, the flow direction of the gas is deflected by 90 degrees when it flows from the gas outlet pipe section 21 to the gas riser pipe section 24. In order to avoid the sharp deflection of the airflow to form a large resistance, according to some further embodiments of the present application, the gravity heat pipe 2 also includes a transition connecting pipe section 25, which is bent, and the gas outlet pipe section 21 is connected to the gas riser pipe section 24 through the transition connecting pipe section 25. Since the transition connecting pipe section 25 is bent, the airflow from the gas outlet pipe section 21 to the gas riser pipe section 24 can be smoothly turned to ensure the smoothness of the gas flow.

[0057] According to some embodiments of the present application, there are multiple phase change heat pipe segments 22, and multiple phase change heat pipe segments 22 are arranged to extend side by side. Exemplarily, there are two phase change heat pipe segments 22, and the two phase change heat pipe segments 22 are extended close to each other or at a set distance, thereby greatly increasing the heat exchange area without taking up too much space.

[0058] In a further embodiment, the flow area of ​​the gas outlet pipe section 21 is smaller than the sum of the flow areas of the multiple phase change heat exchange pipe sections 22. Since the gas flow rate in the gas outlet pipe section 21 is approximately equal to the gas flow rate at the inlet of the phase change heat exchange pipe section 22, the gas flow rate in the gas outlet pipe section 21 is faster than the gas flow rate in the phase change heat exchange pipe section 22, thereby shortening the retention time of the gas phase refrigerant in the gas outlet pipe section 21 and reducing the amount of condensation of the gas phase refrigerant in the gas outlet pipe section 21; in addition, a larger flow area can also make the liquid phase refrigerant in the multiple phase change heat exchange pipe sections 22 form a stronger siphon force, thereby increasing the circulation flux of the refrigerant and further improving the heat exchange efficiency.

[0059] According to some embodiments of the present application, a heat exchange plane is formed on the side of the phase change heat pipe segment 22 facing away from the hot end heat exchanger 1. In other words, the cross section of the phase change heat pipe segment 22 is D-shaped, and the setting of the heat exchange plane can form a larger contact area between the phase change heat pipe segment 22 and the box wall of the semiconductor refrigeration device, thereby improving the heat dissipation efficiency.

[0060] According to some embodiments of the present application, the angle between the first plane and the second plane is equal to 90°, so that the gas outlet pipe section 21, the liquid reflux pipe section 23 and the phase change heat pipe section 22 can better fit with the two mutually perpendicular walls of the semiconductor refrigeration equipment, thereby improving the heat exchange effect.

[0061] According to other embodiments of the present application, the angle between the first plane and the second plane is greater than 90°. In this way, when the gravity heat pipe 2 is adapted to be installed on two mutually perpendicular walls of the semiconductor refrigeration device, a certain elastic deformation can be caused, so that the phase change heat pipe section 22 and the corresponding wall of the semiconductor refrigeration device are more closely abutted, thereby improving the heat exchange effect.

[0062] like Figure 3 As shown, according to other embodiments of the present application, the number of gravity heat pipes 2 is two groups, and the two groups of gravity heat pipes 2 are respectively located on opposite sides of the hot end heat exchanger 1. Therefore, conversion heat pipe sections 22 can be arranged on both sides adjacent to the side wall where the semiconductor refrigeration element of the semiconductor refrigeration device is located, further increasing the heat exchange area and improving the heat dissipation efficiency.

[0063] According to other embodiments of the present application, the gas outlet pipe section 21 is connected to the top of the accommodating chamber so that the evaporated gas-phase refrigerant in the accommodating chamber can be discharged more easily. According to other embodiments of the present application, the liquid return pipe section 23 is connected to the side of the accommodating chamber. On the one hand, this spatial position arrangement makes it easier for the liquid return pipeline to communicate with the phase change heat pipe section 22; on the other hand, the liquid-phase refrigerant refluxed from the liquid return pipe section 23 passes through the side of the accommodating chamber, which can form a turbulent effect on the liquid-phase refrigerant in the accommodating chamber, thereby improving the heat exchange efficiency of the hot-end heat exchanger 1. In particular, in the embodiment where the gravity heat pipe 2 is arranged on both opposite sides of the hot-end heat exchanger 1, the liquid-phase refrigerant refluxed from the opposite sides of the accommodating chamber can also form convection, which can better improve the heat exchange efficiency of the hot-end heat exchanger 1.

[0064] By connecting the gas outlet pipe section 21 to the top of the hot end heat exchanger 1 and connecting the liquid reflux pipe section 23 to the side of the hot end heat exchanger 1, it is possible to avoid occupying too much thickness space and better match the inlet and outlet positions of the pipeline phase heat exchanger pipe section 22.

[0065] According to other embodiments of the present application, a gas-phase joint pipeline 26 connected to the accommodating cavity is provided on the hot-end heat exchanger 1, and the gas outlet pipe sections 21 of the two groups of gravity heat pipes 2 are connected to each other, and the gas-phase joint pipeline 26 is connected to one of the gas outlet pipe sections. In other words, the gas outlet pipe sections 21 of the two groups of gravity heat pipes 2 are connected to the accommodating cavity through a gas-phase joint pipeline 26, thereby saving an interface on the hot-end heat exchanger 1 and simplifying the structure of the hot-end heat exchanger 1. In addition, the gas-phase joint pipeline 26 is bent in the extension direction of the gas outlet pipe section 21 connected thereto, thereby allowing the gas to flow more smoothly from the gas-phase joint pipeline 26 to the gas outlet pipe section 21 connected thereto, reducing the airflow resistance. Moreover, the airflow will naturally flow to the other gas outlet pipe section 21 under the action of the air pressure.

[0066] like Figure 4 As shown, the semiconductor refrigeration refrigerator of the second embodiment of the present application includes a box shell 3, a semiconductor refrigeration element and a hot end heat exchange device as in any of the above embodiments. The semiconductor refrigeration element is generally arranged on the inner tank, and the hot end of the semiconductor refrigeration element is exposed on the outside of the inner tank. The hot end heat exchanger 1 of the hot end heat exchange device can be pre-installed on the inner wall of the back plate of the box shell 3. The hot end heat exchanger 1 is in contact with the hot end of the semiconductor refrigeration element and is heat-exchanged and connected. The phase change heat pipe segment 22 of the hot end heat exchange device is in contact with the inner side of one side plate of the box shell 3. Specifically, the phase change heat pipe segment 22 can be bonded to the side plate by aluminum foil tape. On the one hand, it can assist in fixing the phase change heat pipe segment 22, and on the other hand, it can also improve the heat exchange effect between the phase change heat pipe segment 22 and the side wall.

[0067] The semiconductor refrigeration refrigerator of this embodiment uses the side panels of the box body to dissipate heat from the phase change heat pipe section 22 of the hot end heat exchange device, so that the phase change heat pipe section 22 avoids the gas outlet pipe section located on the inner side of the back plate, allowing a larger area of ​​the phase change heat pipe section 22 to be set, thereby forming better heat dissipation for the semiconductor hot end, ensuring that the semiconductor refrigeration refrigerator can operate continuously and stably with better refrigeration performance.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A hot end heat exchange device, used in semiconductor refrigeration equipment, characterized in that: include: The hot end heat exchanger is defined with a receiving chamber for containing a gas-liquid two-phase coexisting refrigerant; A gravity heat pipe, both ends of which are connected to the accommodating cavity. The gravity heat pipe is configured to allow the gas-phase refrigerant in the accommodating cavity to pass into it from one end and undergo phase change heat transfer, and to allow the liquid-phase refrigerant formed by phase change to flow back to the accommodating cavity from the other end under the action of gravity. Along the flow direction of the refrigerant, the gravity heat pipe includes a gas outlet pipe section, a phase change heat transfer pipe section and a liquid reflux pipe section that are connected in sequence. The gas outlet pipe section and the liquid reflux pipe section are extended along a first plane, and the phase change heat transfer pipe section is extended along a second plane, and the first plane intersects with the second plane.

2. The hot end heat exchange device according to claim 1, characterized in that: The bottom end of the phase change heat pipe section is lower than the top end of the accommodating cavity.

3. The hot end heat exchange device according to claim 1, characterized in that: The gravity heat pipe also includes a gas riser pipe section, which is vertically extended, and the gas outlet pipe section is horizontally extended. The gas outlet pipe section is connected to the phase change heat pipe section through the gas riser pipe section.

4. The hot end heat exchange device according to claim 3, characterized in that: The gravity heat pipe also includes a transition connecting pipe section, which is bent, and the gas outlet pipe section is connected to the gas rising pipe section through the transition connecting pipe section.

5. The hot end heat exchange device according to claim 1, characterized in that: The number of the phase-change heat pipe segments is multiple, and the multiple phase-change heat pipe segments are extended side by side.

6. The hot end heat exchange device according to claim 5, characterized in that: The flow area of ​​the gas outlet pipe section is smaller than the sum of the flow areas of the multiple phase change heat pipe sections.

7. The hot end heat exchange device according to claim 1, characterized in that: A heat exchange plane is formed on the side of the phase change heat pipe section facing away from the hot end heat exchanger; And / or, the angle between the first plane and the second plane is greater than or equal to 90°; And / or, the gas outlet pipe section is in communication with the top of the accommodating chamber; And / or, the liquid reflux pipe section is in communication with a side portion of the accommodating chamber.

8. The hot end heat exchange device according to any one of claims 1 to 7, characterized in that: The number of the gravity heat pipes is two groups, and the two groups of gravity heat pipes are respectively located on two opposite sides of the hot end heat exchanger.

9. The hot end heat exchange device according to claim 8, characterized in that: The hot end heat exchanger is provided with a gas phase joint pipeline connected to the accommodating cavity, the gas outlet pipe sections of the two groups of gravity heat pipes are connected to each other, and the gas phase joint pipeline is connected to one of the gas outlet pipe sections and bends in the extension direction of the gas outlet pipe section connected to it.

10. A semiconductor refrigeration refrigerator, characterized in that: It comprises a box shell, a semiconductor refrigeration element and a hot end heat exchange device as claimed in any one of claims 1 to 9, wherein the hot end heat exchanger of the hot end heat exchange device is arranged on the inner wall of the back plate of the box shell, the hot end heat exchanger is connected to the hot end of the semiconductor refrigeration element for heat exchange, and the phase change heat pipe section of the hot end heat exchange device abuts against the inner side of a side plate of the box shell.

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