Gas inlet assembly for semiconductor tail gas treatment equipment

Abstract

The utility model provides a gas inlet component for semiconductor tail gas treatment equipment, which comprises a gas inlet, a gas inlet pipe, a main board, a main board baffle and a gas outlet, and the gas inlet pipe comprises a first-section gas inlet pipe, a second-section gas inlet pipe and a third-section gas inlet pipe; the first-section air inlet pipe, the second-section air inlet pipe and the third-section air inlet pipe are sequentially connected, the air inlet is formed in the first-section air inlet pipe, the air outlet is formed in the third-section air inlet pipe, the third-section air inlet pipe is fixedly connected with the main plate, the main plate baffle is fixedly connected with the main plate, the main plate baffle right faces the air outlet, and a certain gap is formed between the main plate baffle and the main plate. Preferably, a pressure sensor opening is formed in the section of air inlet pipe. Preferably, a cooling water opening is formed in the second-section air inlet pipe and communicated with a cooling cavity, and the cooling cavity is defined by the first wall of the first-section air inlet pipe and the second wall of the second-section air inlet pipe.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor tail gas treatment, in particular to an air intake component for semiconductor tail gas treatment equipment. Background Art

[0002] Semiconductor tail gas treatment refers to a series of technical measures to purify the waste gas containing harmful chemicals generated during the semiconductor manufacturing process to meet environmental protection standards and protect the production environment and employee health. Due to its unique production process, the semiconductor manufacturing industry will produce a large amount of tail gas containing organic matter, acidic gas, alkaline gas, toxic and harmful gas (such as volatile organic compounds VOCs, ammonia, etc.). If these tail gases are discharged directly without treatment, they will cause serious pollution to the environment, affect air quality, and even pose a threat to human health. Therefore, an efficient and reliable tail gas treatment system is an indispensable part of the semiconductor industry.

[0003] However, in the prior art, the uneven airflow during semiconductor exhaust gas intake will result in reduced processing efficiency. In addition, the uneven airflow may also cause pressure fluctuations within the system, increasing the instability of equipment operation and potential safety hazards.

[0004] Therefore, the prior art needs to be solved urgently. Summary of the invention

[0005] The purpose of the utility model is to provide an air intake assembly for semiconductor tail gas treatment equipment to address the deficiencies of the prior art. Based on the above problems, the utility model proposes an air intake assembly for semiconductor tail gas treatment equipment, which disperses the tail gas flow and increases the inlet area of ​​the tail gas flow to ensure uniform distribution of the air flow.

[0006] The technical solution of the utility model is achieved in this way:

[0007] An air intake assembly for semiconductor exhaust treatment equipment comprises an air inlet, an air intake pipe, a main board, a main board baffle and an air outlet, wherein the air intake pipe comprises a one-stage air intake pipe, a two-stage air intake pipe and a three-stage air intake pipe; the one-stage air intake pipe, the two-stage air intake pipe and the three-stage air intake pipe are connected in sequence, the air inlet is arranged on the one-stage air intake pipe, the air outlet is arranged on the three-stage air intake pipe, the three-stage air intake pipe is fixedly connected to the main board, the main board baffle is fixedly connected to the main board, the main board baffle is opposite to the air outlet and has a certain gap with the main board.

[0008] In the air intake assembly for semiconductor tail gas treatment equipment as described above, a pressure sensor port is provided on the section of the air intake pipe.

[0009] In the air intake assembly for semiconductor exhaust treatment equipment as described above, the two-stage air intake pipe is provided with a cooling water inlet, the cooling water inlet is connected to a cooling cavity, and the cooling cavity is formed by the first wall of the one-stage air intake pipe and the second wall of the two-stage air intake pipe.

[0010] As described above, the air intake assembly for semiconductor exhaust treatment equipment, the three-section air intake pipe includes a third outer wall and a third inner wall, the third outer wall and the third inner wall have a gap to form a circulation cavity, a circulating water inlet is arranged below the third outer wall, the circulating water inlet is connected to the circulation cavity, a circulating water outlet is arranged at the upper end of the circulation cavity, and the circulation cavity is connected to the air outlet through the circulating water outlet.

[0011] In the air intake assembly for semiconductor tail gas treatment equipment as described above, the upper part of the third inner wall is conical.

[0012] In the air intake assembly for semiconductor tail gas treatment equipment as described above, the main board baffle is circular, and the diameter of the main board baffle is larger than the diameter of the air outlet.

[0013] In the air intake assembly for semiconductor tail gas treatment equipment as described above, the gap between the main board baffle and the main board is 1 / 4 to 1 / 2 of the diameter of the air outlet.

[0014] In the air intake assembly for semiconductor tail gas treatment equipment as described above, the mainboard baffle is fixedly connected to the mainboard via a fixed sleeve.

[0015] In the air intake assembly for semiconductor exhaust treatment equipment as described above, a pressure plate is provided below the three-section air intake pipe, and the three-section air intake pipe is fixedly connected to the main board through the pressure plate; the two-section air intake pipe and the three-section air intake pipe are connected through a flange.

[0016] In the air inlet assembly for semiconductor tail gas treatment equipment as described above, the diameter of the air outlet is larger than the diameter of the air inlet.

[0017] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0018] 1. The utility model provides an air intake assembly for semiconductor exhaust treatment equipment, wherein the main board baffle is fixedly connected to the main board, the main board baffle is directly opposite to the air outlet and has a certain gap with the main board, the semiconductor exhaust enters from the air inlet, passes through a first air inlet pipe, a second air inlet pipe, and a third air inlet pipe in sequence, and enters the interior of the semiconductor exhaust treatment equipment from the air outlet, and the exhaust gas flow is dispersed under the obstruction of the main board baffle, thereby increasing the inlet area of ​​the exhaust gas flow, ensuring uniform distribution of the airflow, maintaining the stability of the exhaust treatment system, and eliminating safety hazards.

[0019] 2. The utility model provides an air intake assembly for semiconductor exhaust treatment equipment, wherein the two-stage air intake pipe is provided with a cooling water inlet, and the cooling water inlet is connected to a cooling cavity, and the cooling cavity is formed by the first wall of the one-stage air intake pipe and the second wall of the two-stage air intake pipe. The cooling water in the cooling cavity effectively reduces the intake temperature.

[0020] 3. The utility model provides an air intake assembly for semiconductor exhaust gas treatment equipment, wherein the circulating water inlet is connected to the circulating chamber, a circulating water outlet is provided at the upper end of the circulating chamber, the circulating chamber is connected to the air outlet through the circulating water outlet, and the circulating water enters the circulating chamber through the circulating water inlet, thereby reducing the heat in the exhaust gas and lowering its temperature. In addition, the presence of circulating water can also remove some soluble pollutant gases in the exhaust gas by water washing, thereby reducing the burden of subsequent exhaust gas treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, what is described below is only one embodiment of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the front three-dimensional structure of an air intake assembly for semiconductor tail gas treatment equipment provided by the utility model;

[0023] Figure 2 A schematic diagram of the back three-dimensional structure of an air intake assembly for semiconductor tail gas treatment equipment provided by the utility model;

[0024] Figure 3 A schematic diagram of the top view of the structure of an air intake assembly for semiconductor tail gas treatment equipment provided by the utility model;

[0025] Figure 4 The utility model provides Figure 3 AA cross-sectional diagram of ;

[0026] Figure 5 A schematic diagram of the side structure of an air intake assembly for semiconductor tail gas treatment equipment provided by the utility model;

[0027] Figure 6 The utility model provides Figure 5 Schematic diagram of the BB cross section.

[0028] In the figure, 1-air inlet, 2-one section of air inlet pipe, 3-two section of air inlet pipe, 4-three section of air inlet pipe, 5-pressure plate, 6-main board, 7-main board baffle, 8-fixed sleeve, 9-air outlet, 201-first wall, 202-pressure sensor port, 301-second wall, 302-cooling water inlet, 303-cooling chamber, 401-third outer wall, 402-third inner wall, 403-circulating water inlet, 404-circulating water outlet, 405-circulating chamber. DETAILED DESCRIPTION

[0029] In the following description, it should be understood that the terms "first", "second", etc. are only used to distinguish one element from another, without requiring or implying any actual relationship or order between these elements. In fact, the first element can also be called the second element, and vice versa. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the structure, device or equipment including a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also include elements inherent to such structure, device or equipment. In the absence of more restrictions, the elements defined by the statement "including one..." do not exclude the existence of other identical elements in the structure, device or equipment including the elements. Each embodiment is described in a progressive manner herein, and each embodiment focuses on the differences from other embodiments, and the same similar parts between the embodiments can be referred to each other. The terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. in this document indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing this document and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of this document, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection of two elements, it can be a direct connection, or it can be indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. In this document, unless otherwise specified, the term "plurality" means two or more.

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] like Figure 1-6 As shown, an air intake assembly for semiconductor exhaust treatment equipment includes an air inlet 1, an air intake pipe, a main board 6, a main board baffle 7 and an air outlet 9, wherein the air intake pipe includes a first-stage air intake pipe 2, a second-stage air intake pipe 3 and a third-stage air intake pipe 4; the first-stage air intake pipe 2, the second-stage air intake pipe 3 and the third-stage air intake pipe 4 are connected in sequence, the air inlet 1 is arranged on the first-stage air intake pipe 2, the air outlet 9 is arranged on the third-stage air intake pipe 4, the third-stage air intake pipe 4 is fixedly connected to the main board 6, the main board baffle 7 is fixedly connected to the main board 6, the main board baffle 7 is opposite to the air outlet 9 and has a certain gap with the main board 6.

[0032] Preferably, a pressure sensor port 202 is provided on the section of the air intake pipe 2. The pressure sensor port 202 is provided with a pressure sensor for monitoring the pressure of the intake air.

[0033] Preferably, a cooling water inlet 302 is provided on the second-stage air intake pipe 3, and the cooling water inlet 302 is connected to a cooling cavity 303, and the cooling cavity 303 is formed by the first wall 201 of the first-stage air intake pipe 2 and the second wall 301 of the second-stage air intake pipe 3. The cooling water in the cooling cavity 303 can effectively reduce the intake air temperature.

[0034] Preferably, the three-section air inlet pipe 4 includes a third outer wall 401 and a third inner wall 402, and the third outer wall 401 and the third inner wall 402 have a gap to form a circulation cavity 405, and a circulating water inlet 403 is arranged below the third outer wall 401, and the circulating water inlet 403 is connected to the circulation cavity 405, and a circulating water outlet 404 is arranged at the upper end of the circulation cavity 405, and the circulation cavity 405 is connected to the air outlet 9 through the circulating water outlet 404. On the one hand, the circulating water enters the circulation chamber 405 through the circulating water inlet 403, flows in the circulation chamber 405, and then flows out from the circulating water outlet 404. This process can effectively absorb and take away the heat in the exhaust gas and reduce its temperature. For the high-temperature exhaust gas generated in the semiconductor manufacturing process, cooling can prevent harmful substances in the exhaust gas from becoming more active or undergoing chemical reactions due to high temperature, and also helps to protect subsequent processing from damage by high temperature. On the other hand, the circulating water flowing through the wall of the third inner wall 402 can clean the exhaust gas and assist in removing some soluble pollutant gases in the exhaust gas, thereby reducing the burden of subsequent exhaust gas treatment.

[0035] Preferably, the upper portion of the third inner wall 402 is conical, and this shape can facilitate the circulating water to flow into the air outlet 9 along the upper portion of the third inner wall 402 .

[0036] Preferably, the mainboard baffle 7 is circular, and the diameter of the mainboard baffle 7 is larger than the diameter of the air outlet 9. When the high-speed airflow enters the semiconductor tail gas treatment device through the air outlet 9, the large-area mainboard baffle 7 allows the semiconductor tail gas to diffuse rapidly, which can better guide and control the direction of the airflow, and the airflow slows down when passing through the large-area mainboard baffle 7, reducing the noise generated by the high-speed airflow.

[0037] Preferably, the gap between the mainboard baffle 7 and the mainboard 6 is 1 / 4 to 1 / 2 of the diameter of the air outlet 9. This gap is of moderate size and can properly guide the airflow to be evenly dispersed after passing through the mainboard baffle 7. If the gap between the mainboard baffle 7 and the mainboard 6 is less than 1 / 4 of the diameter of the air outlet 9, a gap that is too small may cause excessive airflow resistance and affect the air intake efficiency; if the gap between the mainboard baffle 7 and the mainboard 6 is greater than 1 / 2 of the diameter of the air inlet 1, a gap that is too large may cause uneven airflow dispersion and affect the subsequent cleaning effect. A suitable gap ratio ensures that the airflow can transition smoothly, without excessive deceleration or excessive dispersion. Preferably, the gap between the mainboard baffle 7 and the air outlet 9 is 1 / 2 of the diameter of the air outlet 9.

[0038] In this embodiment, the number of the mainboard baffles 7 is the same as the number of the air outlets 9, which is four. Preferably, the mainboard baffles 7 are fixedly connected to the mainboard 6 via a fixing sleeve 8. There are four fixing sleeves 8, and each mainboard baffle 7 is fixed to the mainboard 6 via four fixing sleeves 8.

[0039] Preferably, a pressure plate 5 is provided below the three-section air intake pipe 4, and the three-section air intake pipe 4 is fixedly connected to the main board 6 via the pressure plate 5; the two-section air intake pipe 3 and the three-section air intake pipe 4 are connected via a flange.

[0040] Preferably, the diameter of the air outlet 9 is larger than the diameter of the air inlet 1, and the flow velocity changes more gently, which can reduce the eddy current and turbulence generated by the airflow, thereby reducing the noise caused by the impact and friction of the airflow.

[0041] The principle of the utility model is as follows:

[0042] The semiconductor tail gas enters from the air inlet 1, passes through the first section air inlet pipe 2, the second section air inlet pipe 3, and the third section air inlet pipe 4 in turn, and enters the semiconductor tail gas treatment equipment from the air outlet 9. Under the obstruction of the main board baffle 7, the tail gas flow is dispersed, increasing the inlet area of ​​the tail gas flow and ensuring uniform distribution of the air flow. In the first section air inlet pipe 2, the pressure sensor provided at the pressure sensor port 202 can monitor the pressure of the intake air; in the second section air inlet pipe 3, the cooling water in the cooling cavity 303 effectively reduces the intake air temperature; in the third section air inlet pipe 4, the circulating water in the circulating cavity 405 enters the circulating cavity 405 through the circulating water inlet 403, flows in the cavity of the circulating cavity 405, and then flows out from the circulating water outlet 404, which can effectively absorb and take away the heat in the tail gas and reduce its temperature. In addition, the presence of circulating water can also assist in removing some soluble pollutants in the tail gas, thereby reducing the burden of subsequent tail gas treatment.

[0043] The utility model provides an air intake assembly for semiconductor tail gas treatment equipment, which effectively disperses the tail gas flow before entering the semiconductor tail gas treatment equipment, increases the inlet area, ensures the uniform distribution of the air flow, and improves the stability of the tail gas treatment.

[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An air intake assembly for semiconductor tail gas treatment equipment, characterized in that: The invention comprises an air inlet (1), an air inlet pipe, a main board (6), a main board baffle (7) and an air outlet (9), wherein the air inlet pipe comprises a first air inlet pipe (2), a second air inlet pipe (3) and a third air inlet pipe (4); the first air inlet pipe (2), the second air inlet pipe (3) and the third air inlet pipe (4) are connected in sequence, the air inlet (1) is arranged on the first air inlet pipe (2), the air outlet (9) is arranged on the third air inlet pipe (4), the third air inlet pipe (4) is fixedly connected to the main board (6), the main board baffle (7) is fixedly connected to the main board (6), and the main board baffle (7) is directly opposite to the air outlet (9) and has a certain gap with the main board (6).

2. The air intake assembly for semiconductor tail gas treatment equipment according to claim 1, characterized in that: A pressure sensor port (202) is provided on the section of the air intake pipe (2).

3. The air intake assembly for semiconductor tail gas treatment equipment according to claim 2, characterized in that: The second-stage air intake pipe (3) is provided with a cooling water inlet (302), the cooling water inlet (302) being connected to a cooling cavity (303), the cooling cavity (303) being formed by enclosing a first wall (201) of the first-stage air intake pipe (2) and a second wall (301) of the second-stage air intake pipe (3).

4. The air intake assembly for semiconductor tail gas treatment equipment according to claim 3, characterized in that: The three-section air intake pipe (4) comprises a third outer wall (401) and a third inner wall (402); the third outer wall (401) and the third inner wall (402) have a gap to form a circulation cavity (405); a circulation water inlet (403) is provided below the third outer wall (401); the circulation water inlet (403) is connected to the circulation cavity (405); a circulation water outlet (404) is provided at the upper end of the circulation cavity (405); the circulation cavity (405) is connected to the air outlet (9) via the circulation water outlet (404).

5. The air intake assembly for semiconductor tail gas treatment equipment according to claim 4, characterized in that: The upper part of the third inner wall (402) is conical.

6. The air intake assembly for semiconductor tail gas treatment equipment according to claim 5, characterized in that: The mainboard baffle (7) is circular, and the diameter of the mainboard baffle (7) is greater than the diameter of the air outlet (9).

7. The air intake assembly for semiconductor tail gas treatment equipment according to claim 6, characterized in that: The gap between the mainboard baffle (7) and the mainboard (6) is 1 / 4 to 1 / 2 of the diameter of the air outlet (9).

8. The air intake assembly for semiconductor tail gas treatment equipment according to claim 7, characterized in that: The mainboard baffle (7) is fixedly connected to the mainboard (6) via a fixed sleeve (8).

9. The air intake assembly for semiconductor tail gas treatment equipment according to claim 1, characterized in that: A pressing plate (5) is provided below the three-section air intake pipe (4), and the three-section air intake pipe (4) is fixedly connected to the main board (6) via the pressing plate (5); the two-section air intake pipe (3) and the three-section air intake pipe (4) are connected via a flange.

10. The air intake assembly for semiconductor tail gas treatment equipment according to claim 9, characterized in that: The diameter of the air outlet (9) is greater than the diameter of the air inlet (1).

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