Continuous resistance wire surface treatment equipment

Abstract

The utility model relates to the technical field of resistance wires, and discloses continuous resistance wire surface treatment equipment, which comprises a main body mechanism, a secondary frame, a polishing mechanism and a water sprinkler, the secondary frame is positioned at the top of the main body mechanism, the polishing mechanism is positioned in the middle of the top of the main body mechanism, and the water sprinkler is positioned at the rear end of the top of the main body mechanism; the main body mechanism comprises a main plate, supporting legs are fixedly connected to the bottom of the main plate, a water tank is fixedly connected to the bottom of the main plate, a water outlet is formed in the front face of the water tank, and a water inlet is formed in the surface of the main plate. The polishing mechanism is arranged, specifically, a polishing main plate, polishing mounting holes, a support, a top positioning hole, a lower polishing plate, a mounting hole, a lower polishing block, a top supporting block, a top mounting hole, an upper polishing main plate, an upper polishing mounting hole, a press machine, a telescopic shell, a telescopic rod and an upper polishing block are mounted; the effects of being high in stability and convenient to disassemble, repair and maintain during use are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of resistance wires, in particular to a continuous resistance wire surface treatment device. Background Art

[0002] In the production process of resistance wire, in order to improve its surface quality and performance, the resistance wire needs to undergo a series of surface treatments.

[0003] Application number: CN202322271045.X discloses a surface treatment device for resistance wire production, including a processing table, a disassembly mechanism is arranged above the processing table, an adjustment mechanism is arranged on the top of the processing table, a guide mechanism is arranged on the top of the processing table, and the disassembly mechanism includes an installation box, a slide is slidably connected to the inside of the installation box, and a holder is fixedly connected to one side of the slide. The surface treatment device for resistance wire production extends the connecting rod on one side of the grinding ring into the installation box, so that the block is stuck between the holders on both sides. At this time, the slides on both sides move back to back and compress the reset spring at the same time. When the spherical block continues to extend inward, under the elastic force of the reset spring, the holders on both sides move relatively to clamp the block. When the grinding ring needs to be replaced, as above, it can be known that the connecting rod can be pulled outward, so that the grinding ring is easy to disassemble and assemble.

[0004] The above patent has certain defects when in use. When grinding, the surface of the resistance wire will produce a certain amount of processing dust, which is not easily visible to the naked eye. The operating workers will be contaminated by the device processing, which may lead to artificial diseases. In addition, when the device is clamped and ground, it has a clamping spring inside, which has low stability and lifespan, resulting in the need for multiple replacements, repairs and maintenance during the overall life of the device, resulting in a large amount of labor costs.

[0005] In view of the above problems, we proposed a continuous resistance wire surface treatment equipment. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a continuous resistance wire surface treatment device.

[0007] The utility model is implemented by the following technical scheme: a continuous resistance wire surface treatment device, comprising a main body mechanism, a secondary frame, a grinding mechanism and a sprinkler, wherein the secondary frame is located at the top of the main body mechanism, the grinding mechanism is located at the middle of the top of the main body mechanism, and the sprinkler is located at the top rear end of the main body mechanism;

[0008] The main structure includes a main board, the bottom of the main board is fixedly connected to a supporting foot, the bottom of the main board is fixedly connected to a water tank, the front of the water tank is provided with a drain outlet, the surface of the main board is provided with a water inlet, the surface of the main board is provided with a polished positioning hole, and the surface of the main board is provided with a sub-frame positioning hole.

[0009] Through the above technical solution, the overall structure has good disassembly, repair and maintenance functions, and has good cleaning and processing functions.

[0010] As a further improvement of the above scheme, there are four supporting feet, which are symmetrically and evenly distributed on the bottom of the mainboard; there are four water inlets, which are symmetrically and evenly distributed on the surface of the mainboard; there are four polishing positioning holes, which are symmetrically and evenly distributed on the surface of the mainboard; there are eight sub-frame positioning holes, which are symmetrically and evenly distributed on the surface of the mainboard.

[0011] Through the above technical solution, the whole can be easily disassembled and repaired.

[0012] As a further improvement of the above solution, the sub-frame includes a sub-frame plate, a frame block is fixedly connected to the top of the sub-frame plate, and a sub-frame mounting hole is provided on the surface of the sub-frame plate.

[0013] Through the above technical solution, the secondary frame can be easily disassembled, repaired and replaced.

[0014] As a further improvement of the above solution, there are two sub-racks, and each sub-rack plate has four sub-rack mounting holes symmetrically and evenly distributed, and the sub-rack mounting holes are threadedly connected and fixed to the sub-rack positioning holes.

[0015] Through the above technical solution, the connection is stabilized.

[0016] As a further improvement of the above scheme, the grinding mechanism includes a grinding main board, the surface of the grinding main board is provided with a grinding mounting hole, the top of the grinding main board is fixedly connected with a bracket, the front of the bracket is provided with a top positioning hole, the top of the grinding main board is threadedly connected with a lower grinding plate, the surface of the lower grinding plate is provided with a mounting hole, the top of the lower grinding plate is fixedly connected with a lower grinding block, the top of the bracket is threadedly connected with a top support block, the surface of the top support block is provided with a top mounting hole, the top of the top support block is threadedly connected with an upper grinding main board, the bottom of the upper grinding main board is provided with an upper grinding mounting hole, the bottom of the upper grinding main board is fixedly connected with a press, the bottom of the press is fixedly connected with a telescopic shell, the interior of the telescopic shell is provided with a telescopic rod, and the bottom of the telescopic rod is fixedly connected with an upper grinding block.

[0017] Through the above technical solution, the grinding of the mechanism is stabilized, the life of the device is increased, and it is easy to disassemble, repair, maintain and replace parts.

[0018] As a further improvement of the above scheme, there are four grinding mounting holes, which are symmetrically and evenly distributed on the surface of the grinding mainboard, and the grinding mounting holes are threadedly connected and fixed with the grinding positioning holes. There are four brackets, and the top positioning hole is located on the front side of the bracket and passes through the bracket. There are four mounting holes, which are symmetrically and evenly distributed on the front and rear end surfaces of the top of the lower grinding plate. The lower grinding plate is threadedly connected to the grinding mainboard through the mounting holes. There are four top mounting holes, and the four top mounting holes are threadedly connected and fixed to the four top positioning holes. There are four upper grinding mounting holes, and the upper grinding mainboard is threadedly connected and fixed with the top support block through the upper grinding mounting holes. There are two telescopic shells.

[0019] Through the above technical solution, the overall connection is stable and easy to repair and maintain.

[0020] As a further improvement of the above solution, the sprinkler includes a water pump, and a water spray pipe is fixedly connected to the top of the water pump.

[0021] Through the above technical solution, the mechanism has a good cleaning effect.

[0022] As a further improvement of the above solution, the sprinkler is used to spray the treatment liquid to perform cleaning and surface treatment functions.

[0023] Through the above technical solution, different treatment effects can be achieved by using different treatment liquids.

[0024] Compared with the prior art, the beneficial effects of the present invention are:

[0025] The utility model achieves that the overall structure has good disassembly and maintenance functions, good cleaning and processing functions, and high stability and durability by setting up a main structure, specifically by installing a main board, supporting feet, a water tank, a drain outlet, a water inlet, grinding positioning holes, and secondary frame positioning holes.

[0026] The utility model achieves the effects of high stability and easy disassembly and maintenance during use by arranging a grinding mechanism, specifically by installing a grinding mainboard, a grinding mounting hole, a bracket, a top positioning hole, a lower grinding plate, a mounting hole, a lower grinding block, a top supporting block, a top mounting hole, an upper grinding mainboard, an upper grinding mounting hole, a press, a telescopic shell, a telescopic rod, and an upper grinding block.

[0027] The utility model achieves good disassembly effect of the sub-frame by arranging the sub-frame, specifically by installing the sub-frame plate, the frame block and the sub-frame mounting holes.

[0028] The utility model achieves the cleaning and treatment effects by arranging a sprinkler, specifically by installing a water pump and a water spray pipe, so that different treatment liquids can be replaced according to different needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the main structure of the utility model;

[0031] Figure 3 This is a schematic diagram of the sub-frame structure of the utility model;

[0032] Figure 4 This is a schematic diagram of the grinding mechanism structure of the utility model;

[0033] Figure 5 This is a schematic diagram of the grinding mechanism structure of the utility model;

[0034] Figure 6 This is a schematic diagram of the structure of the sprinkler of the utility model.

[0035] Description of main symbols:

[0036] 1. Main body; 101. Main board; 102. Support foot; 103. Water tank; 104. Drain; 105. Water inlet; 106. Grinding positioning hole; 107. Secondary frame positioning hole; 2. Secondary frame; 201. Secondary frame plate; 202. Frame block; 203. Secondary frame mounting hole; 3. Grinding mechanism; 301. Grinding main board; 302. Grinding mounting hole; 303. Bracket; 304. Top positioning hole; 305. Lower grinding plate; 306. Mounting hole; 307. Lower grinding block; 308. Top support block; 309. Top mounting hole; 310. Upper grinding main board; 311. Upper grinding mounting hole; 312. Press; 313. Telescopic shell; 314. Telescopic rod; 315. Upper grinding block; 4. Sprinkler; 401. Water pump; 402. Spray pipe. DETAILED DESCRIPTION

[0037] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0038] Example:

[0039] Please combine Figure 1-6, a continuous resistance wire surface treatment device of this embodiment includes a main body mechanism 1, a sub-frame 2, a grinding mechanism 3 and a sprinkler 4, the sub-frame 2 is located at the top of the main body mechanism 1, the grinding mechanism 3 is located at the top middle of the main body mechanism 1, and the sprinkler 4 is located at the top rear end of the main body mechanism 1;

[0040] The main body mechanism 1 includes a main board 101, a supporting foot 102 is fixedly connected to the bottom of the main board 101, a water tank 103 is fixedly connected to the bottom of the main board 101, a drain port 104 is arranged on the front of the water tank 103, a water inlet 105 is arranged on the surface of the main board 101, a polished positioning hole 106 is arranged on the surface of the main board 101, a sub-frame positioning hole 107 is arranged on the surface of the main board 101, there are four supporting feet 102, and the four supporting feet 102 are symmetrically and evenly distributed at the bottom of the main board 101, there are four water inlets 105, and the four water inlets 105 are symmetrically and evenly distributed on the surface of the main board 101, there are four polished positioning holes 106, and the four polished positioning holes 106 are symmetrically and evenly distributed on the surface of the main board 101, there are eight sub-frame positioning holes 107, and the eight sub-frame positioning holes 107 are symmetrically and evenly distributed on the surface of the main board 101.

[0041] The sub-frame 2 includes a sub-frame plate 201, the top of which is fixedly connected with a frame block 202, and the surface of the sub-frame plate 201 is provided with sub-frame mounting holes 203. There are two sub-frames 2, and each sub-frame plate 201 has four sub-frame mounting holes 203 symmetrically and evenly distributed, and the sub-frame mounting holes 203 are threadedly connected and fixed with the sub-frame positioning holes 107.

[0042] The grinding mechanism 3 includes a grinding mainboard 301, the surface of the grinding mainboard 301 is provided with a grinding mounting hole 302, the top of the grinding mainboard 301 is fixedly connected with a bracket 303, the front of the bracket 303 is provided with a top positioning hole 304, the top of the grinding mainboard 301 is threadedly connected with a lower grinding plate 305, the surface of the lower grinding plate 305 is provided with a mounting hole 306, the top of the lower grinding plate 305 is fixedly connected with a lower grinding block 307, the top of the bracket 303 is threadedly connected with a top support block 308, the surface of the top support block 308 is provided with a top mounting hole 309, the top of the top support block 308 is threadedly connected with an upper grinding mainboard 310, the bottom of the upper grinding mainboard 310 is provided with an upper grinding mounting hole 311, the bottom of the upper grinding mainboard 310 is fixedly connected with a press 312, the bottom of the press 312 is fixedly connected with a telescopic shell 313, the interior of the telescopic shell 313 is provided with a telescopic rod 314, the telescopic rod 314 The bottom is fixedly connected with an upper grinding block 315, the number of grinding mounting holes 302 is four, and the four grinding mounting holes 302 are symmetrically and evenly distributed on the surface of the grinding main board 301, the grinding mounting holes 302 are threadedly connected and fixed with the grinding positioning holes 106, the number of brackets 303 is four, the top positioning hole 304 is located at the front of the bracket 303 and passes through the bracket 303, the number of mounting holes 306 is four, and the four mounting holes 306 are symmetrically and evenly distributed on the front and rear end surfaces of the top of the lower grinding plate 305, the lower grinding plate 305 is threadedly connected to the grinding main board 301 through the mounting holes 306, the number of top mounting holes 309 is four, and the four top mounting holes 309 are threadedly connected and fixed to the four top positioning holes 304, the number of upper grinding mounting holes 311 is four, the upper grinding main board 310 is threadedly connected and fixed with the top support block 308 through the upper grinding mounting holes 311, and the number of telescopic shells 313 is two.

[0043] The sprinkler 4 comprises a water pump 401, and a water spray pipe 402 is fixedly connected to the top of the water pump 401. The function of the sprinkler 4 is to spray the treatment liquid to play a role in cleaning and surface treatment.

[0044] The implementation principle of a continuous resistance wire surface treatment device in the embodiment of the present application is as follows: first, by placing the main body 1 at the desired assembly line position, aligning the polishing main board 301 with the polishing positioning hole 106 through the polishing mounting hole 302 and fixing it with threads, fixing the lower polishing plate 305 with the polishing main board 301 through the mounting hole 306, fixing the top support block 308 with the top positioning hole 304 through the top mounting hole 309, fixing the upper polishing main board 310 with the top support block 311 through the upper polishing mounting hole 312. 08 is threadedly installed and fixed, how to align and install the sub-frame 2 with the sub-frame positioning hole 107 through the sub-frame mounting hole 203, install the sprinkler 4 and the top of the main board 101, and then insert and connect the resistance wire. By starting the transmission, the resistance wire is assisted by the left sub-frame mounting hole 203 to the left lower grinding block 307 for initial grinding, and fine grinding is performed through the right lower grinding block 307. The water pump 401 runs synchronously to transmit the treated liquid to the water pipe 402 for treatment, and the resistance wire is transmitted to the next water flow link through the right sub-frame mounting hole 203.

[0045] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A continuous resistance wire surface treatment device, characterized in that: It comprises a main body mechanism (1), a secondary frame (2), a grinding mechanism (3) and a sprinkler (4), wherein the secondary frame (2) is located at the top of the main body mechanism (1), the grinding mechanism (3) is located at the middle of the top of the main body mechanism (1), and the sprinkler (4) is located at the rear end of the top of the main body mechanism (1); The main body mechanism (1) comprises a main board (101), the bottom of the main board (101) is fixedly connected to a supporting foot (102), the bottom of the main board (101) is fixedly connected to a water tank (103), the front of the water tank (103) is provided with a drain port (104), the surface of the main board (101) is provided with a water inlet (105), the surface of the main board (101) is provided with a polished positioning hole (106), and the surface of the main board (101) is provided with a sub-frame positioning hole (107).

2. A continuous resistance wire surface treatment device as claimed in claim 1, characterized in that: The number of the supporting legs (102) is four, and the four supporting legs (102) are symmetrically and evenly distributed at the bottom of the main board (101); the number of the water inlets (105) is four, and the four water inlets (105) are symmetrically and evenly distributed on the surface of the main board (101); the number of the polishing positioning holes (106) is four, and the four polishing positioning holes (106) are symmetrically and evenly distributed on the surface of the main board (101); the number of the sub-frame positioning holes (107) is eight, and the eight sub-frame positioning holes (107) are symmetrically and evenly distributed on the surface of the main board (101).

3. A continuous resistance wire surface treatment device as claimed in claim 1, characterized in that: The secondary frame (2) comprises a secondary frame plate (201), a frame block (202) is fixedly connected to the top of the secondary frame plate (201), and a secondary frame mounting hole (203) is provided on the surface of the secondary frame plate (201).

4. A continuous resistance wire surface treatment device as claimed in claim 3, characterized in that: There are two sub-frames (2), and each sub-frame plate (201) has four sub-frame mounting holes (203) symmetrically and evenly distributed, and the sub-frame mounting holes (203) are threadedly connected and fixed to the sub-frame positioning holes (107).

5. A continuous resistance wire surface treatment device as claimed in claim 1, characterized in that: The grinding mechanism (3) comprises a grinding main board (301), the surface of the grinding main board (301) is provided with a grinding mounting hole (302), the top of the grinding main board (301) is fixedly connected with a bracket (303), the front of the bracket (303) is provided with a top positioning hole (304), the top of the grinding main board (301) is threadedly connected with a lower grinding plate (305), the surface of the lower grinding plate (305) is provided with a mounting hole (306), the top of the lower grinding plate (305) is fixedly connected with a lower grinding block (307), and the top of the bracket (303) is threadedly connected with A top support block (308) is provided on the surface of the top support block (308), the top of the top support block (308) is threadedly connected to an upper grinding main board (310), and an upper grinding mounting hole (311) is provided at the bottom of the upper grinding main board (310); the bottom of the upper grinding main board (310) is fixedly connected to a press (312), the bottom of the press (312) is fixedly connected to a telescopic shell (313), a telescopic rod (314) is provided inside the telescopic shell (313), and the bottom of the telescopic rod (314) is fixedly connected to an upper grinding block (315).

6. A continuous resistance wire surface treatment device as claimed in claim 5, characterized in that: The number of the polishing mounting holes (302) is four, and the four polishing mounting holes (302) are symmetrically and evenly distributed on the surface of the polishing main board (301). The polishing mounting holes (302) are threadedly connected and fixed to the polishing positioning holes (106). The number of the brackets (303) is four, and the top positioning hole (304) is located on the front side of the bracket (303) and penetrates the bracket (303). The number of the mounting holes (306) is four, and the four mounting holes (306) are located at the front and rear of the top of the lower polishing plate (305). The surfaces at both ends are symmetrically and evenly distributed, the lower grinding plate (305) is threadedly connected to the grinding main board (301) through the mounting hole (306), the number of the top mounting holes (309) is four, the four top mounting holes (309) are threadedly connected and fixed to the four top positioning holes (304), the number of the upper grinding mounting holes (311) is four, the upper grinding main board (310) is threadedly connected and fixed to the top support block (308) through the upper grinding mounting holes (311), and the number of the telescopic shells (313) is two.

7. A continuous resistance wire surface treatment device as claimed in claim 1, characterized in that: The sprinkler (4) comprises a water pump (401), and a water spray pipe (402) is fixedly connected to the top of the water pump (401).

8. A continuous resistance wire surface treatment device as claimed in claim 7, characterized in that: The function of the sprinkler (4) is to spray the treatment liquid to achieve cleaning and surface treatment.

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