Centering and leveling device for wafer supporting ring cutting

Abstract

The utility model discloses a centering and leveling device for wafer support ring cutting, which comprises a base, a support column is arranged on the upper surface of the base, a connecting rod is welded on the upper surface of the support column, a support platform is arranged on the upper surface of the connecting rod, a bearing platform is fixedly connected to the middle position of the upper surface of the support platform, and a turntable is arranged between the support platform and the base. A plurality of arc-shaped grooves are formed in the upper surface of the rotating disc, an arc-shaped groove is formed in the lower surface of the rotating disc, a through hole is formed in the middle of the rotating disc, a plurality of straight notches are formed in the supporting platform, centering push rods are movably inserted into the straight notches, and the outer surfaces of the centering push rods are sleeved with upper limiting pieces and lower limiting pieces. According to the utility model, the worm rotates to drive the turntable to rotate, so that the centering push rod can move along the straight notch, and then the centering push rod can quickly center and level a wafer, thereby avoiding the problem that the clamping jaws are easy to deviate or shake in the wafer centering process and are difficult to ensure the stability and accuracy of positioning.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a centering and leveling device for cutting a wafer support ring. Background Art

[0002] In semiconductor manufacturing, wafers often need to be thinned to improve device performance. After wafer thinning, the support ring on the edge of the wafer also needs to be cut and removed. In order to ensure more precise wafer processing, the wafer usually needs to be centered to ensure that the center of the wafer is precisely concentric with the center of the operating table, thereby ensuring the processing quality of the wafer.

[0003] Traditional wafer leveling is to push the wafer to horizontal position by the clamping claws, which are prone to offset or shaking. It is difficult to ensure the stability and accuracy of positioning during the centering process. The operation is relatively complicated, and the structure is complex, which is not convenient for positioning and horizontal adjustment. Therefore, it is urgent to design a centering and leveling device for wafer support ring cutting to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a centering and leveling device for wafer support ring cutting to solve the above-mentioned shortcomings in the prior art.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A centering and leveling device for wafer support ring cutting comprises a base, a support column is arranged on the upper surface of the base, and a connecting rod is arranged on the upper surface of the support column, a support platform is arranged on the upper surface of the connecting rod, and a bearing platform is fixedly connected to the middle position of the upper surface of the support platform, a turntable is arranged between the support platform and the base, and a plurality of arc grooves are opened on the upper surface of the turntable, a circular arc groove is opened on the lower surface of the turntable, and a through hole is opened in the middle of the turntable, a plurality of straight grooves are opened on the support platform, a centering push rod is movably inserted in the inside of the straight groove, and an upper limit piece and a lower limit piece are sleeved on the outer surface of the centering push rod, and one end of the centering push rod is slidably inserted in the inside of the arc groove.

[0007] Preferably, the upper limit member and the lower limit member are respectively arranged on the upper surface and the lower surface of the supporting platform.

[0008] Preferably, a rubber piece is movably inserted into one end of the centering push rod, and a bolt is provided on one side of the rubber piece.

[0009] Preferably, a worm is provided on one side of the turntable, and teeth are provided on one side of the turntable, and the teeth are meshed with the worm.

[0010] Preferably, a support seat is fixedly connected to the upper surface of the base, and a motor is arranged on the upper surface of the support seat, and a moving end of the motor is fixedly connected to the worm.

[0011] Preferably, a plurality of balls are provided on the support column, and the plurality of balls are slidably connected in the arc groove.

[0012] In the above technical solution, the utility model provides a centering and leveling device for wafer support ring cutting, which has the following beneficial effects:

[0013] (1) The worm gear rotates to drive the turntable to rotate, so that the centering push rod can move along the straight slot, and then the centering push rod can quickly center and level the wafer, avoiding the easy deviation or shaking of the clamp during the wafer centering process, making it difficult to ensure the stability and accuracy of positioning.

[0014] (2) Through the cooperation between the worm and the turntable, the centering push rod can quickly position the center of the wafer. At the same time, the centering push rod can also clamp the wafer, making the wafer more stable during further processing.

[0015] (3) The ball bearings on the support column cooperate with the circular grooves on the lower surface of the turntable, which can effectively reduce the friction between the turntable and the support column, making the turntable rotate better. The structure is simple and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 A three-dimensional schematic diagram of the overall structure of an embodiment of a centering and leveling device for wafer support ring cutting provided by the utility model.

[0018] Figure 2 A three-dimensional schematic diagram of the overall structure from another perspective provided for an embodiment of a centering and leveling device for wafer support ring cutting of the utility model.

[0019] Figure 3 A three-dimensional schematic diagram of a turntable structure provided in an embodiment of a centering and leveling device for wafer support ring cutting of the utility model.

[0020] Figure 4 An exploded schematic diagram of a support column and a turntable structure provided in an embodiment of a centering and leveling device for wafer support ring cutting according to the utility model.

[0021] 1 base, 2 support column, 3 connecting rod, 4 ball, 5 turntable, 6 support platform, 7 straight slot, 8 through hole, 9 support seat, 10 motor, 11 worm, 12 upper limit piece, 13 lower limit piece, 14 centering push rod, 15 rubber piece, 16 bolt, 17 arc groove, 18 circular groove, 19 bearing platform. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] like Figure 1-4 As shown, a centering and leveling device for wafer support ring cutting provided by an embodiment of the utility model comprises a base 1, a support column 2 is arranged on the upper surface of the base 1, and a connecting rod 3 is welded on the upper surface of the support column 2, a support platform 6 is arranged on the upper surface of the connecting rod 3, and a bearing platform 19 is fixedly connected to the middle position of the upper surface of the support platform 6, a turntable 5 is arranged between the support platform 6 and the base 1, and a plurality of arc grooves 17 are opened on the upper surface of the turntable 5, a circular arc groove 18 is opened on the lower surface of the turntable 5, and a through hole 8 is opened in the middle of the turntable 5, a plurality of straight grooves 7 are opened on the support platform 6, and a centering push rod 14 is movably inserted inside the straight groove 7, and an upper limit member 12 and a lower limit member 13 are sleeved on the outer surface of the centering push rod 14, and one end of the centering push rod 14 is slidably inserted in the arc groove 17.

[0024] Specifically, in this embodiment, a base 1 is provided, a support column 2 is provided on the upper surface of the base 1, and a connecting rod 3 is provided on the upper surface of the support column 2, a support platform 6 is provided on the upper surface of the connecting rod 3, and a bearing platform 19 is fixedly connected to the middle position of the upper surface of the support platform 6, and a plurality of fixed supports are fixedly connected to the outer side of the bearing platform 19, and the fixed supports are fixedly connected to the support platform 6 by bolts, and the bearing platform 19 can be disassembled by bolts, and a turntable 5 is provided between the support platform 6 and the base 1, and a plurality of arc grooves 17 are opened on the upper surface of the turntable 5, and a circular arc groove 18 is opened on the lower surface of the turntable 5 , and a through hole 8 is opened in the middle of the turntable 5, the support column 3 is in a boss shape, and the protruding position is adapted to the through hole 8, the support column 3 is inserted on the turntable 5, and a plurality of straight slots 7 are opened on the support platform 6, and the straight slot holes 7 are arranged in a circular array on the support platform 6, and a centering push rod 14 is movably inserted inside the straight slots 7, and an upper limit piece 12 and a lower limit piece 13 are sleeved on the outer surface of the centering push rod 14, and one end of the centering push rod 14 is slidably inserted inside the arc groove 17, and a plurality of arc grooves 17 are also provided, and correspond to the straight slots 7, and the centering push rod 14 can slide inside the straight slot 7 through the arc groove 17.

[0025] The utility model provides a centering and leveling device for wafer support ring cutting, which drives the turntable 5 to rotate by rotating the worm 11, so that the centering push rod 14 can move along the straight slot 7, and then the centering push rod 14 can quickly center and level the wafer, avoiding the clamping jaws from easily shifting or shaking during the wafer centering process, making it difficult to ensure the stability and accuracy of positioning.

[0026] In an embodiment provided by the utility model, the upper limit member 12 and the lower limit member 13 are respectively arranged on the upper surface and the lower surface of the support platform 6. By the upper limit member 12 and the lower limit member 13 respectively fitting with the support platform 6, the centering push rod 14 can be axially positioned so that the centering push rod 14 can only move along the length direction of the straight slot 7.

[0027] In another embodiment provided by the utility model, a rubber part 15 is movably inserted into one end of the centering push rod 14, and a bolt 16 is provided on one side of the rubber part 15. A threaded hole is provided at the upper end of the centering push rod 14, and the bolt 16 fixes the rubber part 15 on the centering push rod 14 through the threaded hole on the centering push rod 14. The rubber part 15 can be quickly replaced through the bolt 16.

[0028] In another embodiment provided by the utility model, a worm 11 is provided on one side of the turntable 5, and teeth are opened on one side of the turntable 5, and the teeth are meshed with the worm 11. The worm 11 and the teeth cooperate with each other to drive the turntable 5 to rotate, thereby adjusting the position of the centering push rod 14.

[0029] In an embodiment provided by the utility model, a support seat 9 is fixedly connected to the upper surface of the base 1, and a motor 10 is arranged on the upper surface of the support seat 9. The moving end of the motor 10 is fixedly connected to the worm 11. The motor 10 rotates, thereby transmitting power to the worm 11, so that the worm 11 drives other components to rotate, thereby realizing rapid leveling of the wafer.

[0030] In another embodiment provided by the utility model, a plurality of balls 4 are arranged on the support column 2, and the plurality of balls 4 are slidably connected in the arc groove 18. By cooperating with the balls 4 on the support column 2 and the arc groove 18 on the lower surface of the turntable 5, the friction between the turntable 5 and the support column 2 can be effectively reduced, so that the turntable 5 can rotate better.

[0031] Working principle: Power is transmitted through the motor 10 to rotate the worm 11, which meshes with the teeth on the turntable 5 to drive the turntable 5 to rotate. The ball 4 on the support column 2 cooperates with the circular groove 18 on the lower surface of the turntable 5 to reduce the friction between the turntable 5 and the support column 2, so that the turntable 5 can rotate better. The arc groove 17 on the turntable 5 can make the centering push rod 14 move along the length direction of the straight slot 7. The upper limit member 12 cooperates with the lower limit member 13 to limit the axial movement of the centering push rod 14, so that the centering push rod 14 can only move along the length direction of the straight slot 7, so that the rubber member 15 can clamp and position the wafer in the center. When cutting the wafer support ring, the clamping of the rubber member 15 can make the cutting more stable. After cutting is completed, the centering push rod 14 returns to its original position by reversing the motor 10 to wait for the next positioning.

[0032] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A centering and leveling device for wafer support ring cutting, comprising a base (1), characterized in that: A support column (2) is arranged on the upper surface of the base (1), and a connecting rod (3) is arranged on the upper surface of the support column (2); a support platform (6) is arranged on the upper surface of the connecting rod (3), and a bearing platform (19) is fixedly connected to the middle position of the upper surface of the support platform (6); a turntable (5) is arranged between the support platform (6) and the base (1), and a plurality of arc grooves (17) are provided on the upper surface of the turntable (5); a circular arc groove (18) is provided on the lower surface of the turntable (5), and a through hole (8) is provided in the middle of the turntable (5); a plurality of straight grooves (7) are provided on the support platform (6), and a centering push rod (14) is movably inserted inside the straight groove (7), and an upper limit piece (12) and a lower limit piece (13) are sleeved on the outer surface of the centering push rod (14), and one end of the centering push rod (14) is slidably inserted inside the arc groove (17).

2. The centering and leveling device for wafer support ring cutting according to claim 1, characterized in that: The upper limit member (12) and the lower limit member (13) are respectively arranged on the upper surface and the lower surface of the support platform (6).

3. The centering and leveling device for wafer support ring cutting according to claim 1, characterized in that: A rubber piece (15) is movably inserted into one end of the centering push rod (14), and a bolt (16) is arranged on one side of the rubber piece (15).

4. The centering and leveling device for wafer support ring cutting according to claim 1, characterized in that: A worm (11) is provided on one side of the rotating disk (5), and teeth are provided on one side of the rotating disk (5), and the teeth and the worm (11) are meshed with each other.

5. The centering and leveling device for wafer support ring cutting according to claim 1, characterized in that: A support seat (9) is fixedly connected to the upper surface of the base (1), and a motor (10) is arranged on the upper surface of the support seat (9), and a moving end of the motor (10) is fixedly connected to the worm (11).

6. The centering and leveling device for wafer support ring cutting according to claim 1, characterized in that: A plurality of balls (4) are arranged on the support column (2), and the plurality of balls (4) are slidably connected in the circular arc groove (18).

Images