Semiconductor device plastic package body flash shear
By designing a plastic-sealed flap shear of a semiconductor device including a support frame and a sliding plate, the problems of semiconductor devices sliding down and scratching on their hands when cutting the flap are solved, achieving a safe and stable flap removal effect.
Patent Information
- Application Number
- CN202420425568.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-06
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-03-06
AI Technical Summary
The prior art is difficult to stably clamp semiconductor devices, resulting in easy slipping or scratching of the hand when the plastic seal is cut off.
Design a plastic sealed flap shear of semiconductor device, including a support frame and sliding plate, supports the semiconductor device through V-shaped blocks and avoids grooves, and cuts the flap with the cutting head on the sliding plate to ensure that the operator avoids the blade with both hands .
Effectively prevent semiconductor devices from slipping and scratching the operator's hands, achieving a safe and stable flash removal process.
Smart Images
Figure CN222521840U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of flash cutting tools for semiconductor device plastic package bodies, in particular to a flash cutting tool for semiconductor device plastic package bodies. Background Art
[0002] Due to the wear of the plastic packaging mold, the edges of some semiconductor devices appear as follows after packaging. Figure 6 In the state shown, currently, workers mainly hold the semiconductor device with one hand and use a utility knife with the other hand to cut off the flash. Since the overall size of the semiconductor device is small, the length and width are usually between 10mm and 20mm, it is very difficult to hold it tightly. In the process of cutting the flash, it often slips and even causes the hand holding the semiconductor chip to be scratched. Therefore, it is very necessary to design a tool that can stably clamp the semiconductor device and safely cut off the flash of the plastic package. Utility Model Content
[0003] In order to solve the deficiencies of the prior art, the utility model provides a flash cutter for a plastic package of a semiconductor device, which can more safely cut off the flash on the plastic package and effectively prevent scratches on the human body.
[0004] In order to achieve the purpose of this utility model, the following scheme is proposed:
[0005] A flash trimmer for a semiconductor device plastic package body comprises a support frame and a sliding plate.
[0006] The support frame is a long frame structure, and the inner hole width of the frame is greater than the thickness of the semiconductor device. A V-shaped block is provided below the front of the support frame, and a V-shaped groove is provided on the top surface. The extension direction of the V-shaped groove is perpendicular to the front of the support frame, and an avoidance groove is provided at the bottom of the V-shaped groove. A lower finger ring is provided below the back or side of the support frame.
[0007] The sliding plate is slidably arranged on the upper section of the support frame, and the sliding plate is movable along the up and down directions of the support frame. An upper finger ring is arranged on the rear side of the back of the sliding plate, and the directions of the upper finger ring and the lower finger ring holes are consistent. A knife head is arranged at the bottom of the sliding plate, and the blade of the knife head is flush with the side of the sliding plate facing the front of the support frame.
[0008] The beneficial effect of the utility model is that the solution supports the semiconductor device through the V-shaped block and the pressure block, which effectively prevents the problem of loose grip of the human hand. In the process of cutting off the flash, the operator's hands can effectively avoid the blade, which can prevent the human hand from being scratched. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.
[0010] Figure 1A front structural schematic diagram of the present application is shown.
[0011] Figure 2 A front structural schematic diagram of the present application when fixing a semiconductor device is shown.
[0012] Figure 3 A schematic diagram of the back structure of the present application when fixing a semiconductor device is shown.
[0013] Figure 4 A schematic diagram of the front structure of the present application when cutting off the flash is shown.
[0014] Figure 5 A schematic diagram of the back structure when the flash is cut off in the present application is shown.
[0015] Figure 6 A schematic structural diagram of a semiconductor device is shown.
[0016] Markings in the figure: support frame -1, V-shaped block -11, avoidance groove -111, lower finger ring -2, sliding plate -3, cutter head -31, tension spring -32, upper finger ring -4, pressure plate -5, compression spring -51, rectangular groove -52. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.
[0018] like Figures 1 to 5 As shown, a flash trimmer for a semiconductor device plastic package body includes: a support frame 1 and a sliding plate 3.
[0019] The support frame 1 is a long frame structure, and the inner hole width of the frame is greater than the thickness of the semiconductor device. A V-shaped block 11 is provided below the front surface of the support frame 1, and its top surface has a V-shaped groove. The extension direction of the V-shaped groove is perpendicular to the front surface of the support frame 1, and an avoidance groove 111 is provided at the bottom of the V-shaped groove. A lower finger ring 2 is provided below the back or side of the support frame 1.
[0020] The sliding plate 3 is slidably arranged on the upper section of the support frame 1, and the sliding plate 3 is movable along the up and down directions of the support frame 1. An upper finger ring 4 is arranged on the back and rear side of the sliding plate 3, and the directions of the holes of the upper finger ring 4 and the lower finger ring 2 are consistent. A knife head 31 is arranged at the bottom of the sliding plate 3, and the blade of the knife head 31 is flush with the side of the sliding plate 3 facing the front of the support frame 1.
[0021] For the posture of use, taking the right hand as an example, insert the index finger of the right hand into the lower ring 2, insert the thumb of the right hand into the upper ring 4, and close the thumb and index finger to drive the sliding plate 3 to move toward the lower end of the support frame 1. When in use, the end of the semiconductor device that needs to cut the flash is facing the back of the support frame 1, and the side of the plastic package is supported in the V-shaped groove, and the end face of the end of the plastic package to cut the flash is close to the front and blade of the sliding plate 3, and then close the thumb and index finger, so that the sliding plate 3 can drive the cutter head 31 to move toward the semiconductor device, so that the flash on the outside of the plastic package is cut by the blade of the cutter head 31. The reason for setting the avoidance groove 111 is as follows: many adjacent sides of the plastic package have flash. When the side that contacts the V-shaped groove has flash or the pins of the semiconductor device face the V-shaped groove, the avoidance groove 111 can be used to pass through the flash and the pins to fix the semiconductor device. The semiconductor device is supported by the V-shaped groove of the V-shaped block 11, which effectively prevents the problem of loose grip by the operator. In the process of cutting off the flash, both hands of the operator can effectively avoid the blade, which can prevent the hands from being scratched.
[0022] Preferably, Figure 3 As shown, the cutter head 31 is screwed to the bottom of the sliding plate 3 so as to facilitate replacement or grinding after wear.
[0023] Preferably, Figures 1 to 5 As shown, the top of the sliding plate 3 is connected to the top of the support frame 1 through a tension spring 32. When the tension spring 32 is in a natural state, the distance between the blade of the cutter head 31 and the V-block 11 is greater than the width and length of the plastic package body, so that after cutting off the flash, the sliding plate 3 can be automatically retracted to the top of the support frame 1, thereby facilitating the next material discharge.
[0024] Preferably, Figure 1 , Figure 2 and Figure 4 As shown, a pressure plate 5 is provided in the upper section of the support frame 1 for sliding along the length direction, and the top of the pressure plate 5 is connected to the top of the sliding plate 3 by a compression spring 51. The bottom of the pressure plate 5 has a slot aligned with the V-groove of the V-block 11. The slot has a V-shaped structure, and a rectangular slot 52 is provided at the bottom of the slot, which is aligned with the avoidance slot 111, for avoiding the flash on the plastic package. When the compression spring 51 is in a natural state, the position of the slot is lower than the blade of the cutter head 31. In this way, before the blade contacts the flash, the side of the plastic package can be pressed by the slot, and the plastic package can be pressed by the V-groove and the slot together. When the sliding plate 3 continues to descend, the compression spring 51 will be compressed.
[0025] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.
Claims
1. A flash trimmer for a semiconductor device plastic package, characterized in that: include: The support frame (1) is in the form of a long frame structure, wherein the width of the inner hole of the frame is greater than the thickness of the semiconductor device; a V-shaped block (11) is provided below the front surface of the support frame (1); the top surface of the V-shaped block (11) has a V-shaped groove; the extension direction of the V-shaped groove is perpendicular to the front surface of the support frame (1); an avoidance groove (111) is provided at the bottom of the V-shaped groove; and a lower finger ring (2) is provided below the back or side surface of the support frame (1); A sliding plate (3) is slidably arranged on the upper section of the support frame (1), and the sliding plate (3) is arranged to move in the up-down direction along the support frame (1). An upper finger ring (4) is arranged on the rear side of the back of the sliding plate (3), and the orientation of the holes of the upper finger ring (4) and the lower finger ring (2) are consistent. A knife head (31) is arranged at the bottom of the sliding plate (3), and the blade of the knife head (31) is flush with the side of the sliding plate (3) facing the front of the support frame (1).
2. The flash trimmer for semiconductor device plastic package according to claim 1, characterized in that: The cutter head (31) is screwed to the bottom of the sliding plate (3).
3. The flash trimmer for semiconductor device plastic package according to claim 1, characterized in that: The top of the sliding plate (3) is connected to the top of the support frame (1) via a tension spring (32). When the tension spring (32) is in a natural state, the distance between the blade of the cutter head (31) and the V-shaped block (11) is greater than the width and length of the plastic package body.
4. The flash trimmer for semiconductor device plastic package according to claim 1, characterized in that: A pressure plate (5) is provided in the upper section of the support frame (1) so as to slide along the length direction. The top of the pressure plate (5) is connected to the top of the sliding plate (3) via a compression spring (51). The bottom of the pressure plate (5) has a slot aligned with the V-shaped slot of the V-shaped block (11). The slot is in a V-shaped structure, and a rectangular slot (52) aligned with the avoidance slot (111) is provided at the bottom of the slot. When the compression spring (51) is in a natural state, the position of the slot is lower than the blade of the cutter head (31).