800G DR8 silicon light engine

Abstract

The utility model relates to an 800G DR8 silicon optical engine, which comprises a base and a ribbon fiber, a silicon optical chip is fixed on the base, a bare optical fiber of the ribbon fiber extends into a V-shaped groove of the silicon optical chip and is tightly pressed by a glass cover plate, a glass cushion block is fixed on the base below the ribbon fiber, a plastic layer of the ribbon fiber is fixed with the glass cushion block through flexible glue, and the silicon optical chip is fixed on the base. And the bare optical fiber of the ribbon fiber is fixed with the glass cushion block through the hard glue. The beneficial effects are that the glass cushion block is fixed below the ribbon fiber on the pedestal, the plastic layer of the ribbon fiber is fixed with the glass cushion block through the flexible glue, the bare optical fiber of the ribbon fiber is fixed with the glass cushion block through the hard glue, and the design can prevent the optical alignment of the bare optical fiber and the silicon optical chip from being influenced when the optical fiber is bent; the 800G DR8 silicon optical light engine does not adopt an expensive optical fiber array, but can achieve the same effect as the optical fiber array, so that the cost is greatly saved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical engines, and in particular to an 800G DR8 silicon photonic engine. Background Art

[0002] The structure of the traditional 800G DR8 silicon photonic engine is as follows Figure 1 and Figure 2 As shown in the figure, the silicon photonic chip used in the 800G DR8 silicon photonic engine has its own V-groove. The bare optical fiber of the optical fiber in the fiber array extends into the V-groove of the silicon photonic chip and is pressed by the glass cover. The V-groove of the silicon photonic chip can passively align the optical fiber, so there is no need for coupling. However, the bare optical fiber of this type of fiber array extends at least 4mm, and there is a bare optical fiber stress problem, which can easily affect the optical alignment of the bare optical fiber and the silicon photonic chip. In addition, this type of fiber array is an unconventional fiber array, so it is relatively expensive. Utility Model Content

[0003] The technical problem to be solved by the present invention is to provide an 800G DR8 silicon photonic engine to overcome the deficiencies in the above-mentioned prior art.

[0004] The utility model provides a technical solution to the above technical problems as follows: an 800G DR8 silicon photonic engine, comprising: a base and a parallel fiber, a silicon photonic chip is fixed on the base, the bare optical fiber of the parallel fiber extends into the V-groove of the silicon photonic chip and is pressed by a glass cover, a glass pad is fixed on the base below the parallel fiber, the plastic layer of the parallel fiber is fixed to the glass pad via soft glue, and the bare optical fiber of the parallel fiber is fixed to the glass pad via hard glue.

[0005] On the basis of the above technical solution, the present invention can also be improved as follows.

[0006] Furthermore, the upper surface of the glass block has a first plane and a second plane with different heights, the second plane is higher than the first plane, and the plastic layer with fiber is fixed to the first plane of the glass block via soft glue, and the bare optical fiber with fiber is fixed to the second plane of the glass block via hard glue.

[0007] Furthermore, the silicon photonic chip, the glass cover plate and the bare optical fiber with parallel fibers are fixed with light-transmitting glue.

[0008] Furthermore, the refractive index of the light-transmitting glue is 1.39 to 1.45.

[0009] Furthermore, the silicon photonic chip has eight V-grooves and the fiber ribbon has eight optical fibers.

[0010] Furthermore, the base is made of tungsten copper.

[0011] Furthermore, two light emitting components coupled to two light input waveguides of the silicon photonic chip are fixed on the base.

[0012] Furthermore, the optical emission component includes: a DFB laser, a lens and an optical isolator arranged in sequence along the light propagation direction, and the DFB laser is fixed to the base via a ceramic heat sink.

[0013] The beneficial effects of the utility model are as follows: a glass pad is fixed on the base below the fiber-optic cable, and the plastic layer of the fiber-optic cable is fixed to the glass pad via soft glue, and the bare optical fiber of the fiber-optic cable is fixed to the glass pad via hard glue. This design can prevent the optical alignment of the bare optical fiber and the silicon photonic chip from being affected when the optical fiber is bent. In addition, the 800G DR8 silicon photonic engine does not use an expensive optical fiber array, but can achieve the same effect as an optical fiber array, greatly saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A top view of an 800G DR8 silicon photonics engine in the prior art;

[0015] Figure 2 This is the main view of the 800G DR8 silicon photonics engine in the prior art;

[0016] Figure 3 A top view of the 800G DR8 silicon photonics engine in the present invention;

[0017] Figure 4 This is the front view of the 800G DR8 silicon photonics engine in the present invention;

[0018] Figure 5 This is a structural diagram of the parallel fiber in the utility model;

[0019] Figure 6 It is a structural diagram of the glass pad in the utility model.

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0021] 1. Base, 2. Fiber optic cable, 210, plastic layer, 220, bare optical fiber, 3. Silicon photonic chip, 4. Glass cover, 5. Glass spacer, 510, first plane, 520, second plane, 6. Soft glue, 7. Hard glue, 8. Optical emitting component, 810, DFB laser, 820, lens, 830, optical isolator, 840, ceramic heat sink. DETAILED DESCRIPTION

[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0023] Example 1

[0024] like Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, an 800G DR8 silicon photonics engine includes: a base 1 and a ribbon fiber 2, wherein the bare optical fiber 220 of the ribbon fiber 2 is produced by a thermal stripping process, and the end face of the bare optical fiber 220 is produced by a mechanical or laser cutting process. A silicon photonics chip 3 is fixed on the base 1, and the bare optical fiber 220 of the ribbon fiber 2 extends into the V-groove of the silicon photonics chip 3 and is pressed by a glass cover plate 4, and the output light of the silicon photonics chip 3 is coupled into the bare optical fiber 220. In addition, a glass pad 5 is fixed on the base 1 below the ribbon fiber 2, the plastic layer 210 of the ribbon fiber 2 is fixed to the glass pad 5 via a soft glue 6, and the bare optical fiber 220 of the ribbon fiber 2 is fixed to the glass pad 5 via a hard glue 7. This design can prevent the optical alignment of the bare optical fiber 220 and the silicon photonics chip 3 from being affected when the optical fiber is bent. In addition, the 800G DR8 silicon photonics engine does not use an expensive optical fiber array, but can achieve the same effect as an optical fiber array, greatly saving costs.

[0025] Example 2

[0026] like Figure 4 , Figure 6 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0027] The upper surface of the glass pad 5 has a first plane 510 and a second plane 520 of different heights. The second plane 520 is higher than the first plane 510. The plastic layer 210 with the fiber 2 is fixed to the first plane 510 of the glass pad 5 via the soft glue 6, and the bare optical fiber 220 with the fiber 2 is fixed to the second plane 520 of the glass pad 5 via the hard glue 7. The glass pad 5 with this structure can better adapt to the fixation of the fiber 2.

[0028] Example 3

[0029] like Figure 3 , Figure 4 As shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the details are as follows:

[0030] The silicon photonic chip 3, the glass cover plate 4 and the bare optical fiber 220 of the parallel fiber 2 are fixed by light-transmitting glue, and the refractive index of the light-transmitting glue is preferably 1.39-1.45.

[0031] Example 4

[0032] like Figure 3 , Figure 5 As shown, this embodiment is a further improvement on the basis of Embodiment 1, 2 or 3, and the details are as follows:

[0033] The silicon photonic chip 3 has eight V-grooves, and the ribbon fiber 2 has eight optical fibers, the plastic layers 210 of the eight optical fibers are connected together, and the eight bare optical fibers 220 of the ribbon fiber 2 extend into the eight V-grooves on the silicon photonic chip 3, respectively. The outer diameter of the plastic layer 210 of the optical fiber is 250um. In addition, the base 1 is preferably made of tungsten copper.

[0034] Example 5

[0035] like Figure 3 As shown, this embodiment is a further improvement on the basis of Embodiment 1, 2, 3 or 4, and the details are as follows:

[0036] Two optical emitting components 8 coupled to two optical input waveguides of the silicon photonic chip 3 are fixed on the base 1, wherein the optical emitting component 8 includes: a DFB laser 810, a lens 820 and an optical isolator 830 arranged in sequence along the light propagation direction, the lens 820 is fixed to the base 1, the optical isolator 830 is fixed to the base 1 or the silicon photonic chip 3, and the DFB laser 810 is fixed to the base 1 via a ceramic heat sink 840. The light emitted by the DFB laser 810 is coupled into the optical input waveguide of the silicon photonic chip 3 via the lens 820 and the optical isolator 830 in sequence.

[0037] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An 800G DR8 silicon photonics engine, characterized in that: include: A base (1) and a parallel fiber (2), wherein a silicon photonic chip (3) is fixed on the base (1), a bare optical fiber (220) of the parallel fiber (2) extends into a V-groove of the silicon photonic chip (3) and is pressed by a glass cover (4), a glass pad (5) is fixed on the base (1) below the parallel fiber (2), a plastic layer (210) of the parallel fiber (2) is fixed to the glass pad (5) via a soft glue (6), and a bare optical fiber (220) of the parallel fiber (2) is fixed to the glass pad (5) via a hard glue (7).

2. The 800G DR8 silicon photonics engine according to claim 1, characterized in that: The upper surface of the glass spacer (5) has a first plane (510) and a second plane (520) of different heights, wherein the second plane (520) is higher than the first plane (510), and the plastic layer (210) of the ribbon fiber (2) is fixed to the first plane (510) of the glass spacer (5) via soft glue (6), and the bare optical fiber (220) of the ribbon fiber (2) is fixed to the second plane (520) of the glass spacer (5) via hard glue (7).

3. The 800G DR8 silicon photonics engine according to claim 1, characterized in that: The silicon photonic chip (3), the glass cover plate (4) and the bare optical fiber (220) of the parallel fiber (2) are fixed by using light-transmitting glue.

4. The 800G DR8 silicon photonics engine according to claim 3, characterized in that: The refractive index of the light-transmitting glue is 1.39-1.

45.

5. The 800G DR8 silicon photonics engine according to claim 1, characterized in that: The silicon photonic chip (3) is provided with eight V-grooves, and the ribbon fiber (2) has eight optical fibers.

6. The 800G DR8 silicon photonics engine according to claim 1, characterized in that: The base (1) is made of tungsten copper.

7. The 800G DR8 silicon photonics engine according to any one of claims 1 to 6, characterized in that: Two light emitting components (8) coupled to two light input waveguides of the silicon photonic chip (3) are fixed on the base (1).

8. The 800G DR8 silicon photonics engine according to claim 7, characterized in that: The light emitting assembly (8) comprises: a DFB laser (810), a lens (820) and an optical isolator (830) arranged in sequence along a light propagation direction; the DFB laser (810) is fixed to the base (1) via a ceramic heat sink (840).

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