Multi-layer circuit board beneficial to heat dissipation

Abstract

The utility model relates to the field of multi-layer circuit boards, in particular to a multi-layer circuit board beneficial to heat dissipation. The utility model relates to a multi-layer circuit board beneficial to heat dissipation, which comprises a protection plate, the LED lamp further comprises an elastic piece, a mounting plate, heat conduction fins and the like. The protection plate is fixedly connected with a plurality of elastic pieces; the protection plate is fixedly connected with a plurality of mounting plates; the mounting plates and the elastic pieces are arranged at intervals; a plurality of heat-conducting fins are fixedly connected to each mounting plate; and each heat conducting fin penetrates through the corresponding mounting plate. The adjacent circuit board bodies are separated and supported through the heat-conducting fins, a fan of a case conveniently blows air to the surfaces of the circuit board bodies for heat dissipation, the tooth-shaped grooves are formed in the heat-conducting fins, the contact area of the heat-conducting fins and the circuit board bodies is reduced, then air flowing out of the flow guide cavity flows out through the tooth-shaped grooves, and the heat dissipation efficiency is improved. The heat dissipation structure facilitates heat dissipation of the contact positions of the heat conduction fins and the circuit board body, and is remarkable in heat dissipation effect, simple in structure and high in practicability.

Description

Technical Field

[0001] The utility model relates to the field of multilayer circuit boards, in particular to a multilayer circuit board which is beneficial to heat dissipation. Background Art

[0002] In the prior art, air cooling is generally used to cool the multi-layer circuit board. However, when air cooling is used to cool the multi-layer circuit board, it is impossible to effectively dissipate the heat at the contact position between the circuit board and the support. Heat accumulates at the contact position between the circuit board and the support. A higher temperature is generated during the operation of the multi-layer board. Long-term high temperature will cause the multi-layer board to malfunction and be damaged. Utility Model Content

[0003] In order to overcome the disadvantages that the contact position between the circuit board and the support cannot be effectively dissipated, heat accumulates at the contact position between the circuit board and the support, and high temperature may cause the multilayer board to malfunction and be damaged, the utility model provides a multilayer circuit board that is conducive to heat dissipation.

[0004] The technical solution is: a multi-layer circuit board that is conducive to heat dissipation, including a protective plate; a U-shaped groove is opened in the protective plate, and the U-shaped groove runs through from front to back; it also includes an elastic member, a mounting plate and a thermal fin; the protective plate is fixedly connected to a plurality of elastic members; the protective plate is fixedly connected to a plurality of mounting plates; each mounting plate is spaced apart from the elastic member; each mounting plate is fixedly connected to a plurality of thermal fins; each thermal fin runs through the corresponding mounting plate; the thermal fin cooperates with the elastic member.

[0005] Furthermore, the elastic member is composed of a fixed box, a spring and a telescopic block; a plurality of springs are fixedly connected to the telescopic block; all the springs are fixedly connected to the fixed box; and the elastic coefficients of the springs in the fixed box gradually increase from front to back.

[0006] Furthermore, an arc-shaped chamfer is provided at the lower portion of the telescopic block of the elastic member.

[0007] Furthermore, a plurality of tooth-shaped grooves are formed on the upper portion of each heat-conducting fin.

[0008] Furthermore, each heat-conducting fin is provided with a flow-guiding cavity, the upper portion of which is open; each heat-conducting fin is provided with an air hole; and each air hole is connected to a corresponding flow-guiding cavity.

[0009] Furthermore, the air holes of the heat conducting fins start at a position below the mounting plate.

[0010] Furthermore, a wedge-shaped surface is provided in the flow guiding cavity of each heat conducting fin.

[0011] The beneficial effects of the utility model are as follows: 1. The utility model separates and supports adjacent circuit board bodies through heat-conducting fins, which is convenient for the fan of the chassis to blow air to the surface of the circuit board body for heat dissipation, and tooth-shaped grooves are opened on the heat-conducting fins to reduce the contact area between the heat-conducting fins and the circuit board body. Then, the air flowing out of the guide cavity also flows out through the tooth-shaped grooves, which is convenient for heat dissipation at the contact position between the heat-conducting fins and the circuit board body. The heat dissipation effect is remarkable, the structure is simple, and the practicability is strong.

[0012] 2. By setting a wedge-shaped surface in the guide cavity, not only the overall structural strength of the heat-conducting fins can be increased, but also the air entering the guide cavity can be guided upward, which is beneficial to the heat dissipation of the contact position between the circuit board body and the heat-conducting fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the multi-layer circuit board which is conducive to heat dissipation of the utility model;

[0014] Figure 2 This is a front view of the multi-layer circuit board that is beneficial to heat dissipation of the utility model;

[0015] Figure 3 This is a schematic diagram of the installation position of the heat conducting fins of the utility model;

[0016] Figure 4 It is a schematic diagram of the internal structure of the heat conducting fin of the utility model.

[0017] Figure numbers: 1-protection plate, 2-elastic member, 3-mounting plate, 4-heat-conducting fins, 5-circuit board body, 4001-flow guide cavity, 4002-air hole, 4003-toothed groove, 4004-wedge surface. DETAILED DESCRIPTION

[0018] The utility model is described in detail below in conjunction with the accompanying drawings.

[0019] Example

[0020] A multilayer circuit board that is conducive to heat dissipation, according to Figure 1-4 As shown, it includes a protective plate 1; a U-shaped groove is opened in the protective plate 1, and the U-shaped groove is connected front to back;

[0021] It also includes an elastic member 2, a mounting plate 3 and a heat-conducting fin 4; the protective plate 1 is fixed with three elastic members 2 distributed up and down on the left and right parts; the protective plate 1 is welded with three mounting plates 3 distributed up and down; each mounting plate 3 is spaced apart from the elastic member 2; each mounting plate 3 is welded with five heat-conducting fins 4 distributed left and right; each heat-conducting fin 4 passes through the corresponding mounting plate 3; the heat-conducting fin 4 cooperates with the elastic member 2 to fix the circuit board body 5.

[0022] The elastic member 2 is composed of a fixed box, a spring and a telescopic block; a plurality of springs arranged equidistantly are fixedly connected to the telescopic block; all the springs are fixedly connected to the fixed box; the elastic coefficient of the spring in the fixed box increases gradually from front to back.

[0023] The lower part of the telescopic block of the elastic member 2 is provided with an arc chamfer.

[0024] A plurality of tooth-shaped grooves 4003 are formed on the upper portion of each heat-conducting fin 4 .

[0025] Each heat-conducting fin 4 has a guide cavity 4001 with an opening at the top. Each heat-conducting fin 4 has a wind hole 4002 at the front. Each wind hole 4002 is connected to the corresponding guide cavity 4001 .

[0026] The air holes 4002 of the heat conducting fins 4 start at a position below the mounting plate 3 .

[0027] A wedge-shaped surface 4004 is disposed in the flow guiding cavity 4001 of each heat conducting fin 4 .

[0028] The working steps of the above embodiment are:

[0029] When inserting the circuit board body 5 into the position between the elastic member 2 and the thermal fins 4, first align the rear part of the circuit board body 5 to the bottom of the elastic member 2. The lower part of the telescopic block of the elastic member 2 is provided with an arc chamfer. When the circuit board body 5 contacts the lower part of the elastic member 2, it prevents the circuit board body 5 from being stuck and causing damage to the circuit board body 5. Then, the telescopic block of the elastic member 2 is lifted upward, the spring of the elastic member 2 is compressed, and then the circuit board body 5 is continued to be pushed backward until the rear end of the circuit board body 5 is flush with the rear end of the mounting plate 3. The circuit board body 5 is lowered so that the lower surface of the circuit board body 5 contacts the upper part of the thermal fins 4. The two elastic members 2 press the circuit board body 5 onto the corresponding thermal fins 4, thereby completing the fixation of the circuit board body 5. Repeat the above operation to fix each circuit board body 5 in turn.

[0030] When in use, the multi-layer circuit board is facing the fan of the chassis, and the adjacent circuit board bodies 5 are separated by the heat-conducting fins 4. The fan blows air to the heat-conducting fins 4 and the circuit board bodies 5 to achieve rapid heat dissipation of the circuit board bodies 5, and the air blown by the fan also enters the guide cavity 4001 through the air holes 4002, and then the air is blown out along the wedge surface 4004 in the guide cavity 4001, and the air is directly blown to the contact position between the circuit board body 5 and the heat-conducting fins 4, so as to achieve a quick heat dissipation of the circuit board body 5. The heat is dissipated at the position, and a tooth-shaped groove 4003 is opened on the upper part of the thermal fin 4, which effectively reduces the contact area between the thermal fin 4 and the circuit board body 5, which is beneficial to the heat dissipation of the circuit board body 5. Then, the air flowing out of the guide cavity 4001 flows to both sides through the tooth-shaped groove 4003, and the heat on the upper part of the tooth-shaped groove 4003 is blown out to both sides, reducing the accumulation of heat at the contact position between the circuit board body 5 and the thermal fin 4, and then the heat is dissipated to the outside with the air flow between adjacent thermal fins 4, with good heat dissipation effect, simple structure and strong practicality.

[0031] The wedge-shaped surface 4004 is provided in the guide cavity 4001, which can not only increase the overall structural strength of the thermal fin 4, but also guide the air entering the guide cavity 4001 upward, which is beneficial to the heat dissipation of the contact position between the circuit board body 5 and the thermal fin 4, and the heat dissipation effect is significant.

[0032] Although the present disclosure has been described with respect to only a limited number of embodiments, those skilled in the art having benefit of this disclosure will appreciate that various other embodiments may be designed without departing from the scope of the present invention. Therefore, the scope of the present invention should be limited only by the appended claims.

Claims

1. A multilayer circuit board that is conducive to heat dissipation, comprising a protective plate (1); a U-shaped groove is formed in the protective plate (1), and the U-shaped groove is connected from front to back; characterized in that: It also includes an elastic member (2), a mounting plate (3) and heat-conducting fins (4); the protective plate (1) is fixedly connected to a plurality of elastic members (2); the protective plate (1) is fixedly connected to a plurality of mounting plates (3); each mounting plate (3) is spaced apart from the elastic member (2); each mounting plate (3) is fixedly connected to a plurality of heat-conducting fins (4); each heat-conducting fin (4) passes through a corresponding mounting plate (3); and the heat-conducting fins (4) cooperate with the elastic member (2).

2. A multilayer circuit board that is conducive to heat dissipation according to claim 1, characterized in that: The elastic member (2) is composed of a fixed box, a spring and a telescopic block; a plurality of springs are fixedly connected to the telescopic block; all the springs are fixedly connected to the fixed box; and the elastic coefficients of the springs in the fixed box gradually increase from front to back.

3. A multilayer circuit board that is conducive to heat dissipation according to claim 2, characterized in that: The lower part of the telescopic block of the elastic member (2) is provided with an arc chamfer.

4. A multilayer circuit board that is conducive to heat dissipation according to claim 1, characterized in that: A plurality of tooth-shaped grooves (4003) are formed on the upper portion of each heat-conducting fin (4).

5. A multilayer circuit board that is conducive to heat dissipation according to claim 4, characterized in that: Each heat-conducting fin (4) has a flow guide cavity (4001) formed therein, and the upper portion of the flow guide cavity (4001) is open; each heat-conducting fin (4) has an air hole (4002) formed therein; and each air hole (4002) is connected to a corresponding flow guide cavity (4001).

6. A multilayer circuit board that is conducive to heat dissipation according to claim 5, characterized in that: The air hole (4002) of the heat conducting fin (4) starts at a position below the mounting plate (3).

7. A multilayer circuit board that is conducive to heat dissipation according to claim 5, characterized in that: A wedge-shaped surface (4004) is provided in the flow guide cavity (4001) of each heat-conducting fin (4).

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