Circuit board, battery and electric device

Abstract

The utility model relates to the technical field of batteries, and provides a circuit board, a battery and a power utilization device.The circuit board comprises a circuit board body and a flexible cantilever structure arranged on the circuit board body, and the flexible cantilever structure comprises a first buffer section, a buffer connection section and a second buffer section which are arranged in sequence; one end of the first buffer section is connected with the circuit board body, the other end of the first buffer section is connected with the buffer connection section, and a first reserved gap is formed between the first buffer section and the circuit board body; one end of the second buffer section is connected with the buffer connecting section, the other end of the second buffer section extends, and a second reserved gap is formed between the second buffer section and the first buffer section; and a collection part is arranged at the extension end of the second buffer section. Compared with an existing cantilever structure, according to the scheme, the situations that the cantilever is torn or snapped under the working condition that the extrusion or stretching displacement is large can be avoided, and therefore more stable application performance is provided, and application safety is improved.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a circuit board, a battery and an electrical device. Background Art

[0002] Battery integration usually requires stacking cells into modules or modular forms, fixing them through the limit installation of the end, side panels and box body, and then realizing high-voltage series and parallel output and cell voltage and temperature information collection through CCS (wiring harness isolation board assembly / cell connection assembly). Considering that the cell will expand and displace during operation and cyclic charging and discharging, the voltage and temperature signal collection in CCS generally uses a flexible circuit board to absorb the displacement of the cell during use.

[0003] At present, the flexible circuit boards on the market are designed with buffer cantilevers for absorbing the expansion displacement of the battery cells. However, the current buffer cantilevers can be well used for buffering in extrusion scenarios, but for stretching scenarios, they can only increase a certain size through a small degree of warping deformation. Therefore, they need to be extruded in the direction of battery cell expansion during installation. However, due to space constraints, the battery cells at the edge of the module / module can often only be stretched, resulting in serious safety accidents such as the buffer cantilever breaking, the loss of voltage and temperature collection information, the reduction of vehicle power, and even power failure in projects with large battery cell expansion displacement. Utility Model Content

[0004] In order to overcome at least one disadvantage of the above-mentioned prior art, the purpose of the present application is to provide a circuit board, a battery and an electrical device.

[0005] The technical means adopted by this application to solve the above technical problems are:

[0006] The present application provides a circuit board, comprising:

[0007] A circuit board body and a flexible cantilever structure arranged on the circuit board body, wherein the flexible cantilever structure comprises a first buffer section, a buffer connection section and a second buffer section arranged in sequence;

[0008] One end of the first buffer section is connected to the circuit board body, and the other end is connected to the buffer connection section, and a first reserved gap is formed between the first buffer section and the circuit board body;

[0009] One end of the second buffer section is connected to the buffer connection section, and the other end is extended, and a second reserved gap is formed between the second buffer section and the first buffer section;

[0010] A collecting portion is provided at the extending end of the second buffer section.

[0011] In some embodiments, the flexible cantilever structure at the same position on the circuit board body is provided with one;

[0012] Alternatively, at least two flexible cantilever structures are provided at the same position on the circuit board body, and the two flexible cantilever structures are connected in sequence.

[0013] In some embodiments, along the length direction of the circuit board, the first buffer section, the second buffer section, and the circuit board body overlap or are arranged parallel to each other.

[0014] In some embodiments, at least one weak connection portion is provided between the flexible cantilever structure and the circuit board body.

[0015] In some embodiments, the weak connection portion is connected between the buffer connection section and the circuit board body;

[0016] And / or, the weak connection portion is connected between the collection portion and the circuit board body.

[0017] In some embodiments, the inner angles of the first reserved gap and / or the second reserved gap are arranged to be smoothly transitioned.

[0018] In some embodiments, the thickness of the first reserved gap and / or the second reserved gap at the inner corner edge is greater than the thickness of the flexible cantilever structure.

[0019] In some embodiments, the width of the buffer connecting segment is 1-1.5 times the width of the first buffer segment or the second buffer segment.

[0020] In some embodiments, a collecting piece is provided on the collecting portion, and the collecting piece is located on the inner side of the flexible cantilever structure.

[0021] On the other hand, the present application provides a battery having the circuit board as described above disposed therein.

[0022] In addition, the present application also provides an electrical device, which is equipped with the battery described above.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] In the present application, by setting the first buffer section, the buffer connection section and the second buffer section, the flexible cantilever structure can have a larger deformation amplitude, so that it can better cope with the extrusion or stretching conditions encountered by the circuit board. Compared with the existing cantilever structure, it can avoid the cantilever tearing, breaking, etc. that occur when the extrusion or stretching displacement is large, thereby providing more stable application performance and improving application safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a schematic structural diagram of a flexible cantilever structure according to one example of the present application.

[0027] Figure 2 This is a schematic diagram of the structure of a circuit board according to one example of the present application.

[0028] Figure 3 This is a schematic diagram of an application of a circuit board according to one example of this application.

[0029] Figure 4 This is a schematic diagram of the structure of a circuit board according to another example of the present application.

[0030] Figure 5 This is a schematic diagram of an application of a circuit board in another example of the present application.

[0031] Figure 6 This is a schematic diagram of the structure of a battery according to one example of the present application.

[0032] Marking Description:

[0033] 1-circuit board body, 11-weak connection part;

[0034] 2-flexible cantilever structure, 21-first buffer section, 22-buffer connection section, 23-second buffer section, 24-collection part, 241-collection sheet, 242-temperature sensor;

[0035] 3- The first reserved gap;

[0036] 4- Second reserved gap. DETAILED DESCRIPTION

[0037] In order to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0038] It should be noted that, unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. Similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0039] like Figures 1 to 6 As shown, in this embodiment, a circuit board is provided, including:

[0040] A circuit board body 1, a flexible cantilever structure 2 arranged on the circuit board body 1, wherein the flexible cantilever structure 2 comprises a first buffer section 21, a buffer connection section 22 and a second buffer section 23 arranged in sequence;

[0041] One end of the first buffer section 21 is connected to the circuit board body 1, and the other end is connected to the buffer connection section 22, and a first reserved gap 3 is formed between the first buffer section 21 and the circuit board body 1;

[0042] One end of the second buffer section 23 is connected to the buffer connection section 22, and the other end is extended. A second reserved gap 4 is formed between the second buffer section 23 and the first buffer section 21;

[0043] A collecting portion 24 is provided at the extending end of the second buffer section 23 .

[0044] In some embodiments, the hardness of the circuit board body 1 is different from the hardness of the flexible cantilever structure 2 ; for example, the hardness of the circuit board body 1 is set to be greater than the hardness of the flexible cantilever structure 2 .

[0045] In some embodiments, the hardness of the circuit board body 1 is set to be the same as the hardness of the flexible cantilever structure 2 .

[0046] In some embodiments, reference Figure 2 , Figure 3 As shown, the circuit board body 1 is arranged in a long strip structure, and along the length direction of the circuit board body 1, a plurality of flexible cantilever structures 2 are arranged at intervals on the long side of the circuit board body 1 to facilitate electrical connection at multiple locations.

[0047] In some embodiments, reference Figure 1 As shown, the flexible cantilever structure 2 is also provided at the end of the circuit board body 1 .

[0048] In some embodiments, the first buffer segment 21, the buffer connecting segment 22 and the second buffer segment 23 are connected to form a "U" shape or an "H" shape.

[0049] In the present embodiment, the first buffer section 21 can be used to cope with the tensile conditions encountered by the circuit board during use. When the collecting portion 24 is stressed and stretched, the entire flexible cantilever structure 2 is planarly arched with the buffer connection section 22 as the center. At this time, the first buffer section 21 is plane bending deformation, and the overall deformation amplitude is larger, that is, the tensile expansion displacement that can be absorbed is larger. At the same time, since the first buffer section 21 is plane bending deformation, the actual absorbed tensile expansion displacement will be associated with the length of the first buffer section 21, so the length of the first buffer section 21 can be better designed according to the required tensile displacement.

[0050] The second buffer section 23 can be used to cope with the extrusion condition encountered by the circuit board during use. When the collecting part 24 is subjected to force to promote extrusion, the entire flexible cantilever structure 2 is plane-bent with the second buffer section 23 as the center, so the extrusion displacement that can be absorbed will be greater. Similarly, the length of the second buffer section 23 can also be designed according to the required extrusion displacement.

[0051] When the conventional buffer cantilever is subjected to the force of tension or compression, the shear force formed at the node will increase, thus causing the cantilever to tear or break. In the present embodiment, the plane bending deformation of the flexible cantilever structure 2 can well overcome this problem.

[0052] In some embodiments, reference Figures 1 to 3 As shown, the flexible cantilever structure 2 is provided at the same position on the circuit board body 1; at this time, the two ends of the first buffer segment 21 are respectively connected to the circuit board body 1 and the buffer connecting segment 22, and the two ends of the second buffer segment 23 are respectively connected to the buffer connecting segment 22 and the collecting part 24, and the collecting part 24 is connected to the target collection object.

[0053] In some embodiments, at least two flexible cantilever structures 2 are provided at the same position on the circuit board body 1, and the two flexible cantilever structures 2 are connected in sequence. At this time, the first buffer section 21 of the first flexible cantilever structure 2 is connected to the circuit board body 1, and the first buffer section 21 of the second flexible cantilever structure 2 provided in sequence is connected to the second buffer section 23 or the collection part 24 of the first flexible cantilever structure 2.

[0054] The specific number of the flexible cantilever structures 2 disposed at the same location on the circuit board body 1 is not limited here. When two or more flexible cantilever structures 2 are disposed, the entire cantilever structure is disposed in an "S" shape.

[0055] In some embodiments, Figure 1 As shown, the flexible cantilever structure 2 is provided at the end of the circuit board body 1. At this time, along the length direction of the circuit board, the first buffer section 21 and the second buffer section 23 will fall within the range of the circuit board body 1. At this time, it can be considered that the first buffer section 21, the second buffer section 23 and the circuit board body 1 are overlapped in the length direction.

[0056] In some embodiments, Figures 1 to 3 As shown, the flexible cantilever structures 2 are arranged in multiple locations on the long side of the circuit board body 1. At this time, along the length direction of the circuit board, the first buffer section 21 and the second buffer section 23 on one of the flexible cantilever structures 2 are arranged parallel to the circuit board body 1.

[0057] As an application example, at least one weak connection portion 11 is provided between the flexible cantilever structure 2 and the circuit board body 1 .

[0058] In some embodiments, the width of the weak connection portion 11 is set between 0.3-3 mm, and can be quickly disconnected under a preset force, so that the flexible cantilever structure 2 can be used normally.

[0059] In some embodiments, the preset force is set within 2-10N.

[0060] In some embodiments, the weak connection portion 11 is connected between the buffer connection section 22 and the circuit board body 1 .

[0061] In some embodiments, the weak connection portion 11 is connected between the collecting portion 24 and the circuit board body 1 .

[0062] It can be understood here, refer to Figure 1 As shown, the weak connection part 11 can be provided at two locations at the same time, for example, the flexible cantilever structure 2 is provided at the long side of the circuit board body 1, in which case the weak connection part 11 is provided between the buffer connection section 22, the collection part 24 and the circuit board body 1. The weak connection part 11 can also be provided at only one location, for example, the flexible cantilever structure 2 is provided at the end of the circuit board body 1, in which case the weak connection part 11 can be provided only between the buffer connection section 22 and the circuit board body 1.

[0063] By setting the weak connection part 11, the relative position and state of the flexible cantilever structure 2 on the circuit board can be pre-fixed, which is convenient for the smooth installation operation; and when encountering stretching or extrusion conditions, the weak connection part 11 can be quickly disconnected, so that the flexible cantilever structure 2 can act on the stretching or extrusion conditions.

[0064] As an example of one application, Figure 1 As shown, the inner angles of the first reserved gap 3 and / or the second reserved gap 4 are arranged to be smoothly transitioned.

[0065] By setting the inner angle of the first reserved gap 3 and / or the second reserved gap 4 to a smooth transition, it is possible to avoid excessive stress concentration at the inner corner when encountering stretching or extrusion conditions, thereby improving the application reliability of the flexible cantilever structure 2.

[0066] As an application example, the thickness of the first reserved gap 3 and / or the second reserved gap 4 at the inner corner edge is greater than the thickness of the flexible cantilever structure 2 .

[0067] In some embodiments, the thickness of the first reserved gap 3 and / or the second reserved gap 4 at the inner corner edge can be reserved and designed when the circuit board is etched.

[0068] By increasing the thickness of the inner corner edges of the first reserved gap 3 and / or the second reserved gap 4 , the force bearing performance of the flexible cantilever structure 2 can be improved.

[0069] As an application example, the width of the buffer connecting section 22 is 1-1.5 times the width of the first buffer section 21 or the second buffer section 23 .

[0070] In some embodiments, the width of the first buffer section 21 is set to be the same as the width of the second buffer section 23 .

[0071] By designing the width of the buffer connection section 22 , the tensile strength of the flexible cantilever structure 2 can be improved.

[0072] As an example of one of the applications, refer to Figure 1 As shown, a collecting piece is provided on the collecting portion 24 , and the collecting piece is located on the inner side of the flexible cantilever structure 2 .

[0073] In some embodiments, the collection member includes a collection sheet 241 for connecting to a target collection component, such as a nickel sheet.

[0074] In some embodiments, the acquisition component includes a sensor, such as a temperature sensor 242 or the like.

[0075] By arranging the collecting member on the inner side of the flexible cantilever structure 2, it is possible to avoid contact friction that may occur when the flexible cantilever structure 2 is deformed, thereby improving the protection of the collecting member.

[0076] On the other hand, Figures 3 to 6 As shown, this embodiment provides a battery, in which the circuit board as described above is arranged.

[0077] In some embodiments, a power battery used in new energy vehicles is used as an example, and the circuit board is arranged on the side of the battery to detect the performance of the battery cells in the battery.

[0078] By applying the circuit board provided in this embodiment in the battery, the layout of the battery cells in the battery can be more flexible. At the same time, since the circuit board has a greater ability to absorb tensile expansion displacement or extrusion displacement, the performance of the battery in application can be safer and more stable.

[0079] In addition, this embodiment also provides an electrical device, in which the battery as described above is arranged.

[0080] In some embodiments, the electrical device includes a passenger car or industrial transportation equipment.

[0081] The beneficial effects brought about by the application of the circuit board on the battery can also be directly or indirectly reflected in the application of the electrical device. For example, it can facilitate the improvement of the application safety of the electrical device, and the stable performance output can improve the user experience.

[0082] The above description is only a specific implementation mode of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should also be included in the scope of protection of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection of the claims.

[0083] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A circuit board, characterized in that: include: A circuit board body and a flexible cantilever structure arranged on the circuit board body, wherein the flexible cantilever structure comprises a first buffer section, a buffer connection section and a second buffer section arranged in sequence; One end of the first buffer section is connected to the circuit board body, and the other end is connected to the buffer connection section, and a first reserved gap is formed between the first buffer section and the circuit board body; One end of the second buffer section is connected to the buffer connection section, and the other end is extended, and a second reserved gap is formed between the second buffer section and the first buffer section; A collecting portion is provided at the extending end of the second buffer section.

2. The circuit board according to claim 1, characterized in that: The flexible cantilever structure is provided with one at the same position on the circuit board body; Alternatively, at least two flexible cantilever structures are provided at the same position on the circuit board body, and the two flexible cantilever structures are connected in sequence.

3. The circuit board according to claim 1 or 2, characterized in that: Along the length direction of the circuit board, the first buffer section, the second buffer section and the circuit board body are overlapped or arranged parallel to each other.

4. The circuit board according to claim 1, characterized in that: At least one weak connection portion is provided between the flexible cantilever structure and the circuit board body.

5. The circuit board according to claim 4, characterized in that: The weak connection portion is connected between the buffer connection section and the circuit board body; And / or, the weak connection portion is connected between the collection portion and the circuit board body.

6. The circuit board according to claim 1, characterized in that: The inner angles of the first reserved gap and / or the second reserved gap are arranged to be smoothly transitioned.

7. The circuit board according to claim 1 or 6, characterized in that: The thickness at the inner corner edge of the first reserved gap and / or the second reserved gap is greater than the thickness of the flexible cantilever structure.

8. The circuit board according to claim 7, characterized in that: The width of the buffer connecting section is 1-1.5 times the width of the first buffer section or the second buffer section.

9. The circuit board according to claim 1, characterized in that: The collecting portion is provided with a collecting piece, and the collecting piece is located at the inner side of the flexible cantilever structure.

10. A battery, characterized in that: A circuit board as described in any one of claims 1 to 9 is arranged therein.

11. An electrical device, characterized in that: A battery as claimed in claim 10 is arranged therein.

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