PCB device with double connection modules

Abstract

The utility model relates to a PCB (printed circuit board) device with double connection modules, which belongs to the technical field of PCB mainboard design and comprises a golden finger connection end connected with peripheral equipment and a connector end connected with two peripheral equipment. The golden finger connecting end comprises a golden finger connecting area arranged on the PCB mainboard, the golden finger connecting area is located at one end of the PCB mainboard, one end of each golden finger connecting contact can be connected with a processor, and the other end of each golden finger connecting contact can be connected with first peripheral equipment; the connector end comprises a board-to-board connector area arranged on the PCB mainboard, the board-to-board connector area is located on the side, away from the golden finger connecting area, of the PCB mainboard, the board-to-board connector area is provided with a plurality of board-to-board connector contacts on the PCB mainboard, one end of each board-to-board connector contact is connected with the processor, and the other end of each board-to-board connector contact can be connected with second peripheral equipment. The advantages of a golden finger connector and a connector are combined, and a PCB connection solution which not only can ensure high-speed data transmission, but also has high flexibility and simplifies the installation process is provided.

Description

Technical Field

[0001] The utility model relates to a PCB device of a double-connection module, belonging to the technical field of PCB mainboard design. Background Art

[0002] The design and connection method of PCB (Printed Circuit Board) have a decisive influence on the performance, reliability and cost of the equipment.

[0003] The connection between PCBs mainly relies on two technologies: gold finger connection and BTB (Board To Board) connector. Gold finger connection relies on a row of exposed metal contact points on the edge of the PCB to achieve connection. However, the gold finger connection method is limited in terms of the number of connections and flexibility, especially when a large number of peripherals need to be connected, the problem of insufficient interfaces may be encountered. On the other hand, the BTB connector provides more connection flexibility and scalability, and is suitable for connecting multiple peripherals or modules, but its transmission rate and stability may be reduced compared to the gold finger connection.

[0004] The existing technology improves one of the connection methods, but cannot fully utilize the respective advantages of the two technologies. In practical applications, a compromise has to be made between connection speed, flexibility and cost. Summary of the invention

[0005] In view of the problem of slow connector connection speed or high cost in the above-mentioned prior art, the purpose of the utility model is to provide a PCB device with a dual connection module.

[0006] According to the implementation scheme of the utility model, a first solution is provided: a PCB device of a dual connection module, comprising:

[0007] A PCB mainboard, the PCB mainboard comprising a gold finger connection end connected to a first peripheral device, and at least one connector end connected to a second peripheral device;

[0008] The gold finger connection end includes a gold finger connection area arranged on the PCB main board, the gold finger connection area is located at one end of the PCB main board, the gold finger connection area is provided with a plurality of gold finger connection contacts at one end of the PCB main board, and one end of each gold finger connection contact can be connected to the processor, and the other end can be connected to the first peripheral device;

[0009] The connector end includes a board-to-board connector area arranged on the PCB main board, and the board-to-board connector area is located on a side of the PCB main board away from the gold finger connection area. The board-to-board connector area is provided with a plurality of board-to-board connector contacts on the PCB main board, and one end of each board-to-board connector contact is connected to the processor, and the other end can be connected to the second peripheral device.

[0010] Further, the gold finger connection end can be packaged as a first I / O interface, and the board-to-board connector area can be packaged as a second I / O interface.

[0011] Furthermore, the gold finger connection end is packaged as an M2 interface slot, and the gold finger connection end is connected to an M2-type solid state drive or a wireless network card through the M2 interface slot.

[0012] Furthermore, the board-to-board connector area includes a first board-to-board connector contact area and a second board-to-board connector contact area. The first connector can be welded and fixed in the first board-to-board connector contact area, and the second connector can be welded and fixed in the second board-to-board connector contact area.

[0013] Furthermore, the other end of each board-to-board connector contact is connected to the second peripheral device through the first connector or the second connector.

[0014] Furthermore, a processor installation area is provided on the PCB main board, and the processor installation area includes a plurality of processor connection contacts, and a processor can be installed on the processor installation area.

[0015] Furthermore, a square processor is installed on the processor installation area, and the contact pins of the square processor are distributed on four sides of the processor.

[0016] Furthermore, the processor installation area is arranged between the gold finger connection area and the board-to-board connector area of ​​the PCB mainboard.

[0017] Furthermore, the first board-to-board connector contact area and the second board-to-board connector contact area are respectively arranged at upper and lower ends of one side of the processor installation area.

[0018] Furthermore, the first connector or the second connector is connected to the second peripheral device via a snap-fit ​​structure.

[0019] Compared with the prior art, the technical solution provided by the present application has the following beneficial effects: by setting a gold finger connection end connected to a first peripheral device and at least one connector end connected to a second peripheral device on a PCB main board; the gold finger connector end, combining the advantages of the gold finger connector and the connector, provides a PCB connection solution that can ensure high-speed data transmission while having high flexibility and simplifying the installation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] in:

[0022] Figure 1 One of the schematic diagrams of the PCB device structure of the dual connection module in one embodiment;

[0023] Figure 2 This is the second schematic diagram of the PCB device structure of the dual connection module in one embodiment.

[0024] Reference numerals:

[0025] 10. PCB motherboard; 21. first connector; 22. second connector; 211. first board-to-board connector contact area; 221. second board-to-board connector contact area; 31. processor; 311. processor connection contacts; 41. gold finger connection contacts. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0027] The connection between PCBs mainly relies on two technologies: gold finger connection and BTB (Board To Board) connector. Gold finger connection relies on a row of exposed metal contact points on the edge of the PCB to achieve connection. However, the gold finger connection method is limited in terms of the number of connections and flexibility, especially when a large number of peripherals need to be connected, the problem of insufficient interfaces may be encountered. On the other hand, the BTB connector provides more connection flexibility and scalability, and is suitable for connecting multiple peripherals or modules, but its transmission rate and stability may be reduced compared to the gold finger connection.

[0028] The existing technology improves one of the connection methods, but cannot fully utilize the respective advantages of the two technologies. In practical applications, a compromise has to be made between connection speed, flexibility and cost.

[0029] In one embodiment, see Figure 1As shown, a PCB device of a dual connection module is provided, comprising:

[0030] A PCB main board 10, wherein the PCB main board 10 comprises a gold finger connection end connected to a first peripheral device, and at least one connector end connected to a second peripheral device;

[0031] The gold finger connection end includes a gold finger connection area arranged on the PCB main board 10, the gold finger connection area is located at one end of the PCB main board 10, and the gold finger connection area is provided with a plurality of gold finger connection contacts 41 at one end of the PCB main board 10, and each gold finger connection contact 41 can be connected to the processor 31 at one end, and can be connected to the first peripheral device at the other end;

[0032] The BTB connector end includes a board-to-board connector area arranged on the PCB main board 10, and the board-to-board connector area is located on a side of the PCB main board 10 away from the gold finger connection area. The board-to-board connector area is provided with a plurality of board-to-board connector contacts on the PCB main board 10, and one end of each board-to-board connector contact is connected to the processor 31, and the other end can be connected to the second peripheral device.

[0033] It should be noted that the connector end is a BTB connector end, and the board-to-board connector area is a BTB connector area.

[0034] The technical solution provided by this embodiment has the following beneficial effects: by providing a gold finger connection terminal connected to the first peripheral device and at least one BTB connector terminal connected to the second peripheral device on the PCB main board 10; the gold finger connector terminal combines the advantages of the gold finger connector and the BTB connector, and by integrating the gold finger connection terminal and the BTB connector terminal on the PCB main board 10, it can not only meet the needs of high-speed data transmission, but also provide great connection flexibility and expansibility. The key to this design lies in the organic combination of the two connection methods and optimized wiring to adapt to the needs of different application scenarios, providing a PCB connection solution that can ensure high-speed data transmission, has high flexibility and simplifies the installation process.

[0035] It is worth noting that this embodiment integrates the gold finger and the BTB connector. Compared with the single gold finger or BTB connection method in the prior art, this embodiment greatly enhances the connection flexibility and expansibility of the PCB by combining these two connection methods. This means that users can flexibly choose to use the gold finger or BTB connector, or use both at the same time, according to actual needs, to adapt to different application scenarios. This design optimizes the scope of use of the PCB and meets a wider range of equipment design requirements.

[0036] In one embodiment, the gold finger connection end can be packaged as a first I / O interface, and the board-to-board connector area can be packaged as a second I / O interface.

[0037] It should be noted that the first I / O interface is used for data input and output, and the second I / O interface is used for data input and output.

[0038] In one of the embodiments, the gold finger connection end is packaged as an M2 interface slot, and the gold finger connection end is connected to an M2 solid state drive or a wireless network card through the M2 interface slot.

[0039] It should be noted that the M2 interface slot is an interface standard for connecting an M2 solid-state drive (SSD) or a wireless network card. By optimizing the design of the gold finger connection end, a stable connection with the M2 slot or similar high-speed interface is ensured, providing reliability for high-speed data transmission. Compared with the existing technology, this design not only ensures the transmission rate, but also improves the stability and reliability of the connection and reduces the error rate during data transmission.

[0040] In one embodiment, see Figure 1 As shown, the board-to-board connector area includes a first board-to-board connector contact area 211 and a second board-to-board connector contact area 221. The first connector 21 can be welded and fixed in the first board-to-board connector contact area 211, and the second connector 22 can be welded and fixed in the second board-to-board connector contact area 221.

[0041] It should be noted that through the optimized design of internal wiring, signal interference is reduced and data transmission efficiency is improved.

[0042] In one embodiment, see Figure 1 As shown, the other end of each board-to-board connector contact is connected to the second peripheral device through the first connector 21 or the second connector 22 .

[0043] It should be noted that it can be connected to multiple peripheral devices.

[0044] In one embodiment, see Figure 2 As shown, a processor 31 installation area is provided on the PCB main board 10, and the processor 31 installation area includes a plurality of processor connection contacts 311, and the processor 31 can be installed on the processor 31 installation area.

[0045] In one embodiment, a square processor 31 is installed on the processor 31 installation area, and the contact pins of the square processor 31 are distributed on four sides of the processor 31.

[0046] In one embodiment, see Figure 1As shown, the processor 31 installation area is arranged between the gold finger connection area and the board-to-board connector area of ​​the PCB mainboard 10.

[0047] It should be noted that the gold finger connection area and the BTB connector area are interconnected through internal wiring, which ensures the high speed and stability of data transmission, as well as reduces signal interference and improves transmission efficiency.

[0048] In one embodiment, the first board-to-board connector contact area 211 and the second board-to-board connector contact area 221 are respectively disposed at the upper and lower ends of one side of the processor 31 installation area.

[0049] It should be noted that the board-to-board connector contact areas are separately arranged at the upper and lower ends of one side of the processor 31 installation area, so as to facilitate the connection between each board-to-board connector contact area and the peripheral device.

[0050] In one embodiment, see Figure 1 As shown, the first connector 21 or the second connector 22 is connected to the second peripheral device through a snap-fit ​​structure.

[0051] It should be noted that the BTB connector area design supports quick-fit installation without screw fixation. Compared with the existing technology, this design greatly simplifies the installation process and reduces installation time and production costs. This quick-fit design not only improves the efficiency of production and assembly, but also reduces the dependence on professional technicians, making installation easier.

[0052] It is worth noting that the optimized design of internal wiring reduces signal interference and improves data transmission efficiency. Compared with the existing technology, this optimized wiring design not only improves the signal transmission quality, but also makes it possible to miniaturize and high-density layout of PCB, further improving the overall performance and reliability of the equipment.

[0053] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. The above embodiments only express several implementation methods of the present application, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of this application. It should be pointed out that for ordinary technicians in this field, without departing from the concept of this application, several variations and improvements can be made, which all belong to the scope of protection of this application.

[0054] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly disposed on the other component; when a component is referred to as being "connected to" another component, it may be directly connected to the other component or indirectly connected to the other component. It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0056] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

Claims

1. A PCB device for a dual connection module, characterized in that: include: A PCB mainboard, the PCB mainboard comprising a gold finger connection end connected to a first peripheral device, and at least one connector end connected to a second peripheral device; The gold finger connection end includes a gold finger connection area arranged on the PCB main board, the gold finger connection area is located at one end of the PCB main board, the gold finger connection area is provided with a plurality of gold finger connection contacts at one end of the PCB main board, and one end of each gold finger connection contact can be connected to the processor, and the other end can be connected to the first peripheral device; The connector end includes a board-to-board connector area arranged on the PCB main board, and the board-to-board connector area is located on a side of the PCB main board away from the gold finger connection area. The board-to-board connector area is provided with a plurality of board-to-board connector contacts on the PCB main board, and one end of each board-to-board connector contact is connected to the processor, and the other end can be connected to the second peripheral device.

2. The PCB device of the dual connection module according to claim 1, characterized in that: The gold finger connection end can be packaged as a first I / O interface, and the board-to-board connector area can be packaged as a second I / O interface.

3. The PCB device of the dual connection module according to claim 1, characterized in that: The gold finger connection end is encapsulated as an M2 interface slot, and the gold finger connection end is connected to an M2 solid state drive or a wireless network card through the M2 interface slot.

4. The PCB device of the dual connection module according to claim 1, characterized in that: The board-to-board connector area includes a first board-to-board connector contact area and a second board-to-board connector contact area. The first connector can be fixed by welding in the first board-to-board connector contact area, and the second connector can be fixed by welding in the second board-to-board connector contact area.

5. The PCB device of the dual connection module according to claim 3, characterized in that: The other end of each board-to-board connector contact is connected to the second peripheral device through the first connector or the second connector.

6. The PCB device of the dual connection module according to claim 4, characterized in that: The PCB mainboard is provided with a processor installation area, the processor installation area includes a plurality of processor connection contacts, and the processor can be installed on the processor installation area.

7. The PCB device of the dual connection module according to claim 6, characterized in that: A square processor is installed on the processor installation area, and the contact pins of the square processor are distributed on four sides of the processor.

8. The PCB device of the dual connection module according to claim 6, characterized in that: The processor installation area is arranged between the gold finger connection area and the board-to-board connector area of ​​the PCB mainboard.

9. The PCB device of the dual connection module according to claim 8, characterized in that: The first board-to-board connector contact area and the second board-to-board connector contact area are respectively arranged at upper and lower ends of one side of the processor installation area.

10. The PCB device of the dual connection module according to claim 4, characterized in that: The first connector or the second connector is connected to the second peripheral device through a snap-fit ​​structure.

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