Efficient heat dissipation controller

By designing a combined structure of the heat dissipation cavity, aluminum substrate, insulating layer and copper foil layer in the controller, and combining the outside heat dissipation fins, the problem of heat accumulation in the controller in high power or high temperature environment is solved, and efficient heat dissipation is achieved. Improves the stability and reliability of the controller.

CN222532045UActive Publication Date: 2025-02-25XUZHOU TIANLI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420902946.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-28
Publication Date
2025-02-25
Estimated Expiration
2034-04-28

AI Technical Summary

Technical Problem

In high power or high temperature environments, the controller can easily lead to an increase in the inner cavity temperature, which will lead to heat accumulation of devices on the motherboard and increase operating risks.

Method used

An efficient heat dissipation controller is designed, using a combined structure of a heat dissipation cavity, an aluminum substrate, an insulating layer and a copper foil layer inside the controller body, and combined with the outside heat dissipation fins to achieve rapid heat dissipation and circulation.

Benefits of technology

Through this design, the temperature of the motherboard is effectively reduced, the stability and reliability of the controller is improved, the thermal conductivity, electrical insulation performance and mechanical processing performance are enhanced, and the heat dissipation efficiency is improved.

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Abstract

The utility model discloses an efficient heat dissipation controller, which comprises a controller main body, a first end cover, a connecting wire and a main board, a heat dissipation cavity is arranged at the bottom end in the controller main body, the main board is arranged in the controller main body above the heat dissipation cavity, an aluminum substrate is arranged at the bottom end in the main board, and the first end cover and the second end cover are arranged on the aluminum substrate. An aluminum substrate is arranged on the main board, an insulating layer is arranged on the main board above the aluminum substrate, a copper foil layer is arranged on the main board above the insulating layer, a first end cover and a second end cover are respectively arranged at two ends of the controller main body, connecting terminals are uniformly arranged on the first end cover, a line concentration part is arranged at the central position of the first end cover, and the second end cover is arranged at the central position of the second end cover. And connecting wires are uniformly arranged in the wire concentration part. According to the utility model, the controller main body, the heat dissipation fins, the mainboard, the electronic device, the mounting plate and the heat dissipation cavity are installed, so that the mainboard is ensured to work at a lower temperature, the stability and reliability of the controller main body are improved, and the heat dissipation efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of controllers, in particular to a high-efficiency heat dissipation controller. Background Art

[0002] A controller is a main command device that controls the starting, speed regulation, braking and reversing of a motor by changing the wiring of the main circuit or control circuit and the resistance value in the circuit in a predetermined order. It consists of a program counter, an instruction register, an instruction decoder, a timing generator and an operation controller. It is the "decision-making body" that issues commands, that is, it coordinates and directs the operation of the entire computer system. The scope of use of controllers is very wide.

[0003] The controller is generally composed of a shell, a mainboard and connecting wires, in which the mainboard is generally sealed inside the shell. When the controller power is high or the ambient temperature increases, the temperature inside the controller will increase, which will cause heat accumulation in the components on the mainboard and increase the risk of operation. Therefore, an efficient heat dissipation controller is needed. Utility Model Content

[0004] The purpose of the utility model is to provide a high-efficiency heat dissipation controller to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-efficiency heat dissipation controller, comprising a controller body, a first end cover, connecting wires and a main board, a heat dissipation cavity is opened at the bottom end inside the controller body, and a main board is arranged in the controller body above the heat dissipation cavity, an aluminum substrate is arranged at the bottom end inside the main board, an insulating layer is arranged on the main board above the aluminum substrate, and a copper foil layer is arranged on the main board above the insulating layer, a first end cover and a second end cover are respectively arranged at both ends of the controller body, and connecting terminals are evenly arranged on the first end cover, and indicator lights are evenly arranged on the first end cover above the connecting terminals, a wire collection part is arranged at the central position of the first end cover, connecting wires are evenly arranged inside the wire collection part, and the input ends of the connecting wires are all connected to the main board.

[0006] Preferably, mounting holes are evenly opened around both ends of the controller body, and the edges of the first end cover and the second end cover are evenly fixedly connected to the mounting holes by fixing screws.

[0007] Preferably, heat dissipation fins are evenly distributed on the outside of the controller body, and the heat dissipation fins are all made of copper alloy.

[0008] Preferably, the first end cover and the second end cover are symmetrically distributed with respect to the controller body, and mounting ears are evenly arranged on the first end cover and the second end cover.

[0009] Preferably, a wire outlet channel is provided at a central position inside the wire collection portion, and the connecting wires all pass through the inside of the wire outlet channel.

[0010] Preferably, mounting plates are provided on both sides of the main board, and the mounting plates are evenly fixedly connected to the inside of the controller body by screws.

[0011] Preferably, an electronic device is arranged on the top of the copper foil layer, and the bottom of the electronic device is fixedly connected to the copper foil layer via solder.

[0012] Preferably, contact pieces are evenly arranged inside the outlet channel, and one end of each contact piece is in contact with the connecting wire, and one end of each contact piece close to the outlet channel is connected to the inner wall of the outlet channel via a return spring.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the high-efficiency heat dissipation controller is equipped with a controller body, heat dissipation fins, a main board, electronic devices, a mounting plate and a heat dissipation cavity. The top of the controller body is provided with a heat dissipation cavity. The main board is fixed to the top of the heat dissipation cavity through the mounting plates on both sides, which is beneficial to the heat flow below the main board and avoids accumulation at the bottom of the main board. At the same time, the main board is provided with an aluminum substrate, an insulating layer and a copper foil layer from bottom to top in sequence. The electronic device is arranged on the copper foil layer. The heat generated when the electronic device is running is quickly conducted to the aluminum substrate through the insulating layer. The thermal conductivity coefficient of the aluminum substrate is extremely high. By using the aluminum substrate as the main board base layer, the heat generated when the electronic device is working can be quickly dissipated, ensuring that the main board works at a lower temperature, improving the stability and reliability of the controller body, and having good thermal conductivity, electrical insulation performance and mechanical processing performance. In addition, the outer side of the controller body is evenly distributed with heat dissipation fins, and the heat dissipation fins are made of copper alloy material, which can quickly conduct the heat in the controller body and further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the top view structure of the utility model;

[0016] Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model;

[0017] Figure 3This is a schematic diagram of the cross-sectional structure of the mainboard side wall of the utility model;

[0018] Figure 4 It is a schematic diagram of the cross-sectional structure of the line collection part of the utility model.

[0019] In the figure: 1. controller body; 2. second end cover; 3. mounting ear; 4. first end cover; 5. indicator light; 6. wire collection part; 7. connecting wires; 8. connecting terminals; 9. heat dissipation fins; 10. mounting holes; 11. mounting plate; 12. heat dissipation cavity; 13. main board; 14. electronic components; 15. copper foil layer; 16. insulating layer; 17. aluminum substrate; 18. outlet channel; 19. reset spring; 20. contact piece. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4 The utility model provides an embodiment: a high-efficiency heat dissipation controller, comprising a controller body 1, a first end cover 4, a connecting wire 7 and a main board 13, a heat dissipation cavity 12 is provided at the bottom of the controller body 1, and a main board 13 is provided in the controller body 1 above the heat dissipation cavity 12;

[0022] Mounting plates 11 are provided on both sides of the main board 13, and the mounting plates 11 are evenly fixedly connected to the inside of the controller body 1 by screws;

[0023] The mainboard 13 is fixed to the inside of the controller body 1 through the mounting plates 11 on both sides. A heat dissipation cavity 12 is provided below the mainboard 13 to facilitate the heat flow below the mainboard 13 and prevent heat from accumulating at the bottom of the mainboard 13.

[0024] An aluminum substrate 17 is disposed at the bottom of the main board 13, an insulating layer 16 is disposed on the main board 13 above the aluminum substrate 17, and a copper foil layer 15 is disposed on the main board 13 above the insulating layer 16;

[0025] An electronic device 14 is disposed on the top of the copper foil layer 15, and the bottom of the electronic device 14 is fixedly connected to the copper foil layer 15 via solder;

[0026] The heat generated by the electronic device 14 when it is running is quickly transferred to the aluminum substrate 17 through the insulating layer 16. The thermal conductivity of the aluminum substrate 17 is extremely high. By using the aluminum substrate 17 as the base layer of the main board 13, the heat generated by the electronic device 14 when it is working can be quickly dissipated.

[0027] The mainboard 13 is ensured to work at a relatively low temperature, thereby improving the stability and reliability of the controller body 1 and having good thermal conductivity, electrical insulation performance and mechanical processing performance;

[0028] The outside of the controller body 1 is evenly distributed with heat dissipation fins 9, and the heat dissipation fins 9 are made of copper alloy material, which can quickly conduct the heat in the controller body 1 and further improve the heat dissipation efficiency;

[0029] The first end cover 4 and the second end cover 2 are respectively provided at both ends of the controller body 1. Mounting holes 10 are evenly opened around the two ends of the controller body 1. The edges of the first end cover 4 and the second end cover 2 are evenly fixedly connected to the mounting holes 10 by fixing screws for mounting and disassembling the first end cover 4 and the second end cover 2.

[0030] The first end cover 4 and the second end cover 2 are symmetrically distributed with respect to the controller body 1, and mounting ears 3 are evenly arranged on the first end cover 4 and the second end cover 2, and the controller body 1 is fixedly installed by the mounting ears 3 on the first end cover 4 and the second end cover 2;

[0031] The first end cover 4 is evenly provided with connection terminals 8 for electrical connection, and the first end cover 4 above the connection terminals 8 is evenly provided with indicator lights 5 for displaying the working status, fault information, etc. of the equipment;

[0032] A wire collecting portion 6 is provided at the central position of the first end cover 4, and connecting wires 7 are evenly arranged inside the wire collecting portion 6;

[0033] An outlet channel 18 is provided at the central position inside the cable collection part 6, and the connecting wires 7 all pass through the outlet channel 18. One end of the connecting wire 7 is connected to the main board 13, and the other end passes through the outlet channel 18 in the cable collection part 6 to connect to the external device;

[0034] Contact members 20 are evenly arranged inside the outlet channel 18, and one end of the contact member 20 is in contact with the connecting wire 7, and one end of the contact member 20 close to the outlet channel 18 is connected to the inner wall of the outlet channel 18 through a return spring 19;

[0035] The contact piece 20 is in tight contact with the outside of the connecting wire 7, which is beneficial to the wire bundling and protects the connection between the connecting wire 7 and the wire collection part 6, so that the connecting wire 7 is not easily bent or damaged.

[0036] Working principle: When the embodiment of the present application is in use, the controller body 1 is fixedly installed through the mounting ears 3 on the first end cover 4 and the second end cover 2, and the main board 13 is fixed to the inside of the controller body 1 through the mounting plates 11 on both sides. A heat dissipation cavity 12 is arranged below the main board 13, which is conducive to the heat flow below the main board 13 and avoids heat accumulation at the bottom of the main board 13. At the same time, the main board 13 is provided with an aluminum substrate 17, an insulating layer 16 and a copper foil layer 15 from bottom to top, and the electronic device 14 is arranged on the copper foil layer 15. The heat generated by the electronic device 14 during operation is quickly conducted to the aluminum substrate 17 through the insulating layer 16. The thermal conductivity coefficient of the aluminum substrate 17 is extremely high. The aluminum substrate 17 is used as the base layer of the main board 13, which can quickly dissipate the heat generated by the electronic device 14 during operation, ensuring The main board 13 operates at a relatively low temperature, which improves the stability and reliability of the controller body 1 and has good thermal conductivity, electrical insulation and machining properties. In addition, the outer side of the controller body 1 is evenly distributed with heat dissipation fins 9, which are made of copper alloy and can quickly dissipate the heat in the controller body 1, further improving the heat dissipation efficiency. One end of the connecting wire 7 is connected to the main board 13, and the other end passes through the outlet channel 18 in the wire collection part 6 to connect with the external device. The outlet channel 18 is evenly provided with contact pieces 20 through the reset spring 19. The contact pieces 20 are pressed against the outer side of the connecting wire 7, which is beneficial to the wiring bundling and protects the connection between the connecting wire 7 and the wire collection part 6, so that the connecting wire 7 is not easily bent or damaged.

[0037] Obviously, the embodiments described above are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0038] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation controller, characterized in that: The controller comprises a controller body (1), a first end cover (4), a connecting wire (7) and a main board (13); a heat dissipation cavity (12) is provided at the bottom of the controller body (1), and a main board (13) is arranged in the controller body (1) above the heat dissipation cavity (12); an aluminum substrate (17) is provided at the bottom of the main board (13); an insulating layer (16) is provided on the main board (13) above the aluminum substrate (17), and a copper foil layer (15) is provided on the main board (13) above the insulating layer (16); a first end cover (4) and a second end cover (2) are provided at both ends of the controller body (1), and connecting terminals (8) are evenly provided on the first end cover (4); an indicator light (5) is evenly provided on the first end cover (4) above the connecting terminal (8); a wire collection portion (6) is provided at the central position of the first end cover (4), and connecting wires (7) are evenly provided inside the wire collection portion (6), and the input ends of the connecting wires (7) are all connected to the main board (13).

2. The high-efficiency heat dissipation controller according to claim 1, characterized in that: Mounting holes (10) are evenly formed around both ends of the controller body (1), and the edges of the first end cover (4) and the second end cover (2) are evenly fixedly connected to the mounting holes (10) by fixing screws.

3. The high-efficiency heat dissipation controller according to claim 1, characterized in that: Heat dissipation fins (9) are evenly distributed on the outside of the controller body (1), and the heat dissipation fins (9) are all made of copper alloy.

4. The high-efficiency heat dissipation controller according to claim 1, characterized in that: The first end cover (4) and the second end cover (2) are symmetrically distributed with respect to the controller body (1), and mounting ears (3) are evenly arranged on the first end cover (4) and the second end cover (2).

5. The high-efficiency heat dissipation controller according to claim 1, characterized in that: An outlet channel (18) is provided at a central position inside the line collection portion (6), and the connecting wires (7) all pass through the inside of the outlet channel (18).

6. The high-efficiency heat dissipation controller according to claim 1, characterized in that: Mounting plates (11) are provided on both sides of the main board (13), and the mounting plates (11) are evenly fixedly connected to the inside of the controller body (1) by screws.

7. The high-efficiency heat dissipation controller according to claim 1, characterized in that: An electronic device (14) is arranged on the top of the copper foil layer (15), and the bottom of the electronic device (14) is fixedly connected to the copper foil layer (15) via solder.

8. The high-efficiency heat dissipation controller according to claim 5, characterized in that: Contact pieces (20) are evenly arranged inside the outlet channel (18), and one end of each of the contact pieces (20) is in contact with the connecting wire (7), and one end of each of the contact pieces (20) close to the outlet channel (18) is connected to the inner wall of the outlet channel (18) via a return spring (19).