Efficient vapor chamber heat pipe radiator

Abstract

The utility model discloses an efficient vapor chamber heat pipe radiator which comprises a base, radiating fins and heat pipes, and a VC vapor chamber is in contact with a heat source and absorbs heat of the heat source; the radiating fins are arranged on the upper surface of the VC vapor chamber; the heat pipe is in contact with the VC vapor chamber and penetrates through the radiating fins; the heat pipe comprises a first contact section and a second contact section, the first contact section is installed on the VC vapor chamber and makes contact with the VC vapor chamber, the second contact section is connected with the first contact section, is wound in the direction away from the VC vapor chamber and penetrates through the cooling fins, and the heat pipe transmits heat of the VC vapor chamber to the cooling fins. The heat pipe is additionally arranged on the radiator, heat of the VC vapor chamber is absorbed through the heat pipe and quickly and uniformly transmitted to the radiating fins, the heat is sequentially taken away when airflow blows the radiating fins, and the radiating effect is integrally improved; the radiator is small in size, saves installation space, and can be matched with different installation structures to achieve the assembly effect.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and more specifically to a high-efficiency temperature averaging plate heat pipe radiator. Background Art

[0002] In some electronic products and electronic devices, a large amount of heat will be generated due to the high-speed operation of chips or other components. If the heat cannot be effectively dissipated, that is, the electronic products and electronic devices cannot be cooled quickly and effectively, it is easy to cause overheating and burn out.

[0003] At present, the commonly used heat dissipation structure is to adopt a FIN-type heat sink. The heat source is in contact with the bottom plate of the FIN-type heat sink. A number of heat dissipation FIN plates are arranged on the FIN-type heat sink. A heat dissipation gap is formed between adjacent heat dissipation FIN plates. When the air flows through the heat dissipation gap, it exchanges heat with the heat dissipation FIN plates. The heat dissipation FIN plates absorb the heat of the heat-generating components, and the air takes away the heat of the heat dissipation FIN plates, thereby achieving the purpose of cooling and heat dissipation.

[0004] In order to meet the heat dissipation requirements of high-power electronic equipment, it is necessary to increase the heat dissipation area of ​​the FIN plate heat sink. Considering that the mounting surface area of ​​the heat-generating components in the FIN plate heat sink is generally fixed, it is usually chosen to increase the height of the heat dissipation FIN plate to increase the heat dissipation area. Due to heat conduction and fan forced convection, the temperature difference between the root and the top of the FIN plate heat sink is significantly large, so that the top of the heat dissipation FIN plate cannot play an effective heat dissipation role. Therefore, simply increasing the height of the heat dissipation FIN plate cannot meet the heat dissipation requirements of high-power electronic equipment. Utility Model Content

[0005] In view of this, the utility model provides a high-efficiency temperature equalizing plate heat pipe radiator.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solution: a high-efficiency temperature averaging plate heat pipe radiator, comprising:

[0007] VC temperature plate, in contact with the heat source and absorbs the heat from the heat source;

[0008] The heat dissipation fins are arranged on the upper surface of the VC temperature averaging plate;

[0009] The heat pipe contacts the VC temperature plate and passes through the heat sink fins;

[0010] The heat pipe includes: a first contact section and a second contact section, the first contact section is installed on the VC temperature averaging board and contacts the VC temperature averaging board, the second contact section is connected to the first contact section and passes through the heat dissipation fins, and the heat pipe transfers the heat of the VC temperature averaging board to the heat dissipation fins.

[0011] As a preferred solution of the present invention, the first contact section of the heat pipe is flattened to increase the contact area with the VC temperature equalizing plate.

[0012] As a preferred solution of the utility model, the first contact sections of the heat pipes are arranged side by side and in contact with each other; and the second contact sections of the heat pipes are arranged at intervals.

[0013] As a preferred solution of the utility model, the heat dissipation fins are composed of a plurality of FIN sheets which are parallel to each other and arranged at intervals, and heat dissipation gaps are formed between adjacent FIN sheets.

[0014] As a preferred solution of the present invention, the second contact section extends upward away from the VC temperature equalizing plate and then extends horizontally and passes through multiple FIN sheets.

[0015] As a preferred solution of the utility model, six heat pipes are provided, and the height of the heat pipe located in the middle position is greater than the height of the heat pipes located at the two side positions.

[0016] As a preferred solution of the utility model, the heat dissipation fins are formed with channels through which the heat pipes pass, and the inner circumference of the channels is greater than the outer diameter of the heat pipes.

[0017] As a preferred solution of the present invention, the channel connects multiple FIN sheets.

[0018] As a preferred solution of the present invention, a heat source is installed at the bottom of the VC temperature equalizing plate.

[0019] As a preferred solution of the present invention, the VC temperature equalizing plate is provided with a mounting portion.

[0020] It can be seen from the above technical solution that compared with the prior art, the utility model has the following beneficial technical effects: the utility model adds a heat pipe to the radiator, absorbs the heat of the VC temperature equalizing plate through the heat pipe and transfers it quickly and evenly to the cooling fins, and takes away the heat when the airflow blows through the cooling fins, thereby improving the heat dissipation effect as a whole; and the radiator is small in size, saves installation space, and can be assembled with different installation structures to achieve the desired effect.

[0021] Other beneficial technical effects of the utility model are embodied in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the structure of the high-efficiency temperature averaging plate heat pipe radiator of the utility model;

[0024] Figure 2 This is a bottom angle schematic diagram of the high-efficiency temperature equalizing plate heat pipe radiator of the utility model;

[0025] Figure 3 This is a front angle schematic diagram of the high-efficiency temperature equalizing plate heat pipe radiator of the utility model;

[0026] Figure 4 It is an exploded view of the high-efficiency temperature equalizing plate heat pipe radiator of the utility model. DETAILED DESCRIPTION

[0027] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0028] Radiators are commonly used in electronic devices. Usually, a number of heat dissipation FIN sheets are provided on the radiator. The radiator absorbs the heat generated by the heat-generating components and conducts the heat through a number of heat dissipation FIN sheets, so that when the flowing air passes through the gaps between the heat dissipation FIN sheets, the air exchanges heat with the heat dissipation FIN sheets, and then takes away the heat on the heat dissipation FIN sheets; the heat dissipation is carried away by the continuous heat conduction of the heat dissipation FIN sheets and the flow of air, and the radiator achieves the cooling and heat dissipation effect on the heat-generating components. However, during the heat conduction process, the heat absorption on the side of the radiator close to the heat source is large, while the heat absorption on the side far from the heat source is small, resulting in a large temperature difference between the side close to the heat source and the side far from the heat source on the radiator, and the performance of the radiator cannot be fully utilized. Based on the problem of poor heat dissipation effect of the radiator in the prior art, the utility model improves the radiator in the prior art. For details, refer to the following embodiments.

[0029] High-efficiency vapor chamber heat pipe radiator, please refer to Figure 1-4 As shown, it includes: a VC temperature vapor chamber 100, heat dissipation fins 200 and a heat pipe 300. The heat dissipation fins 200 protrude upward perpendicularly to the first surface of the VC temperature vapor chamber 100. The heat pipe 300 is in contact with the VC temperature vapor chamber 100 and the heat dissipation fins 200 to quickly and evenly transfer the heat of the VC temperature vapor chamber 100 to the heat dissipation fins 200.

[0030] The VC temperature plate 100 is made of metal material and has good thermal conductivity, which can effectively transfer the heat from the heat source to the VC temperature plate 100 and then transfer it through the heat pipe 300;

[0031] Furthermore, the VC temperature homogenizing plate 100 can be made of aluminum. Currently, most of the heat sinks on the market are also made of aluminum, which has strong thermal conductivity, simple manufacturing process and moderate cost.

[0032] Optionally, the VC temperature vapor chamber 100 is a carrier for installing a heat source. The heat source in this embodiment refers to a heat-generating component with high heat generation in an electronic device.

[0033] Furthermore, the heat sink 200 is installed on the VC temperature averaging plate 100, and can absorb the heat on the VC temperature averaging plate 100. At the same time, when the airflow flows through the heat sink 200, it takes away the heat on the heat sink 200, thereby achieving the purpose of cooling. In the heat dissipation of high-power electronic equipment, it is usually chosen to increase the height of the heat sink 200 to increase the air contact area, thereby improving the heat exchange efficiency. However, if the height of the heat sink 200 is too high, it will also have a certain impact on the heat dissipation effect, resulting in a significantly larger temperature difference between the side of the heat sink 200 close to the VC temperature averaging plate 100 and the side of the heat sink 200 far from the VC temperature averaging plate 100. Therefore, in the heat dissipation of high-power electronic equipment, even if the height of the heat sink 200 is increased, the top of the heat sink 200 cannot play an effective heat dissipation role;

[0034] In this embodiment, a heat pipe 300 is added to the heat dissipation fin 200, which contacts the VC temperature plate 100 and passes through the heat dissipation fin 200;

[0035] Specifically, the heat pipe 300 includes: a first contact section 310 and a second contact section 320. The first contact section 310 is installed on the VC temperature evaporating plate 100 and contacts the VC temperature evaporating plate 100. The second contact section 320 is connected to the first contact section 310 and passes through the heat dissipation fin 200. The heat pipe 300 transfers the heat of the VC temperature evaporating plate 100 to a higher position of the heat dissipation fin 200, so that the top of the heat dissipation fin 200 can also achieve good heat dissipation.

[0036] The heat pipe 300 can be made of a copper pipe. The thermal conductivity of copper is better than that of aluminum. The heat pipe 300 is in contact with the VC temperature equalizer 100, and can quickly and massively absorb the heat of the VC temperature equalizer 100 and transfer it upward, so that the heat is better distributed on the heat sink fins 200, so that the high position / top of the heat sink fins 200 can also effectively play a role in heat dissipation, thereby enhancing the overall heat dissipation effect and meeting the heat dissipation requirements of high-power electronic devices or components such as laser pump source modules and high-power chips.

[0037] In one embodiment, the first contact section 310 of the heat pipe 300 is flattened to increase the contact area with the VC vapor chamber 100;

[0038] Specifically, the upper surface of the VC temperature plate 100 is a plane, and after the heat pipe 300 is flattened, the contact area between the heat pipe 300 and the VC temperature plate 100 can be increased, and the assembly is stable;

[0039] Of course, in the prior art, there is also a method of providing a groove on the surface of the VC temperature vapor chamber 100 so that the first contact section 310 of the heat pipe 300 is entirely or partially hidden in the groove, which can also achieve the purpose of stabilizing the assembly and increasing the contact area.

[0040] However, from the perspective of manufacturing process, it is simpler to install the heat pipe 300 by compression than to install it by slotting on the VC temperature homogenizing plate 100 . The slotting installation also needs to consider the diameter of the heat pipe 300 .

[0041] Furthermore, the first contact sections 310 of the heat pipes 300 are arranged side by side and in contact with each other; and the second contact sections 320 of the heat pipes 300 are arranged at intervals.

[0042] Furthermore, if Figure 4 As shown, the heat pipe 300 is arranged in a U shape, forming the first contact section 310 and the second contact section 320 .

[0043] In one embodiment, the heat dissipation fin 200 is composed of a plurality of FIN sheets 210 that are parallel to each other and arranged at intervals, and a heat dissipation gap is formed between adjacent FIN sheets 210;

[0044] The number and size of the FIN sheets 210 are set according to actual applications. The second contact section 320 extends upward away from the VC temperature vapor chamber 100 and then extends horizontally and passes through multiple FIN sheets 210. Then, the heat of the VC temperature vapor chamber 100 can be quickly transferred upward through the heat pipe 300.

[0045] In one embodiment, six heat pipes 300 are provided, and the height of the heat pipe 300 located in the middle is greater than the height of the heat pipes 300 located at the two side positions;

[0046] The number of heat pipes 300 can be changed according to the volume of the high-efficiency vapor chamber heat pipe radiator.

[0047] In one embodiment, the heat dissipation fin 200 is formed with a channel 201 through which the heat pipe 300 passes, and the inner perimeter of the channel 201 is greater than the outer diameter of the heat pipe 300;

[0048] like Figure 3-4 As shown, the inner circumference of the channel 201 is greater than the outer diameter of the heat pipe 300, which is mainly reflected in the fact that the channel 201 is non-circular and roughly gourd-shaped, which facilitates the installation of the heat pipe 300. During the installation of the heat pipe 300, the channel 201 can have a small amount of deformation to facilitate the passage of the heat pipe 300.

[0049] Furthermore, the channel 201 connects the multiple FIN sheets 210 , so that the inner wall of the channel 201 covers the surface of the heat pipe 300 as much as possible, so as to better absorb the heat of the heat pipe 300 and transfer the heat of the heat pipe 300 to the FIN sheet 210 .

[0050] Furthermore, the VC temperature vapor chamber 100 is provided with a mounting portion 110 ; when the high-efficiency heat sink is used, it is assembled in a specific application scenario through the mounting portion 110 .

[0051] The following further describes the use of this product:

[0052] When in use, the entire high-efficiency heat pipe heat dissipation device is installed in an electronic device, and the heat-generating components of the electronic device are installed at the VC temperature averaging plate 100 and are in close contact with the VC temperature averaging plate 100. Similarly, in order to further improve the heat absorption efficiency, a thermal conductive adhesive layer can also be added between the heat-generating components and the VC temperature averaging plate 100;

[0053] After the heat of the heat generating components is transferred to the VC temperature evaporating plate 100, part of the heat of the VC temperature evaporating plate 100 is directly absorbed by the heat dissipating fins 200, and part of the heat of the VC temperature evaporating plate 100 is absorbed by the heat pipe 300 and transferred to the high position of the heat dissipating fins 200 through the heat pipe 300, so that the heat is evenly distributed on the heat dissipating fins 200;

[0054] When the airflow flows through the heat dissipation fins 200 , the heat on the heat dissipation fins 200 can be quickly taken away, thereby improving the heat dissipation efficiency.

[0055] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. High-efficiency temperature-averaging plate heat pipe radiator, characterized by: include: The VC temperature plate (100) contacts the heat source and absorbs heat from the heat source; The heat dissipation fins (200) are arranged on the upper surface of the VC temperature averaging plate (100); A heat pipe (300) contacts the VC temperature equalizing plate (100) and passes through the heat dissipation fins (200); The heat pipe (300) comprises: a first contact section (310) and a second contact section (320); the first contact section (310) is mounted on a VC temperature averaging plate (100) and in contact with the VC temperature averaging plate (100); the second contact section (320) is connected to the first contact section (310) and passes through a heat dissipation fin (200); the heat pipe (300) transfers heat from the VC temperature averaging plate (100) to the heat dissipation fin (200).

2. The high-efficiency temperature-vaporizing plate heat pipe radiator according to claim 1 is characterized in that: The first contact section (310) of the heat pipe (300) is flattened to increase the contact area with the VC temperature homogenizing plate (100).

3. The high-efficiency vapor chamber heat pipe radiator according to claim 2, characterized in that: The first contact sections (310) of the heat pipes (300) are arranged side by side and in contact with each other; and the second contact sections (320) of the heat pipes (300) are arranged at intervals.

4. The high-efficiency vapor chamber heat pipe radiator according to claim 1, characterized in that: The heat dissipation fins (200) are composed of a plurality of FIN sheets (210) which are parallel to each other and arranged at intervals, and heat dissipation gaps are formed between adjacent FIN sheets (210).

5. The high-efficiency vapor chamber heat pipe radiator according to claim 4, characterized in that: The second contact section (320) extends upward away from the VC temperature homogenizing plate (100) and then extends horizontally and passes through a plurality of FIN sheets (210).

6. The high-efficiency temperature-vaporizing plate heat pipe radiator according to claim 1 or 5, characterized in that: Six heat pipes (300) are provided, and the height of the heat pipe (300) located in the middle is greater than the height of the heat pipes (300) located at both sides.

7. The high-efficiency vapor chamber heat pipe radiator according to claim 1, characterized in that: The heat dissipation fin (200) is formed with a channel (201) through which the heat pipe (300) passes, and the inner circumference of the channel (201) is greater than the outer diameter of the heat pipe (300).

8. The high-efficiency vapor chamber heat pipe radiator according to claim 7, characterized in that: The channel (201) connects a plurality of FIN sheets (210).

9. The high-efficiency vapor chamber heat pipe radiator according to claim 1, characterized in that: A heat source is installed at the bottom of the VC temperature equalizing plate (100).

10. The high-efficiency vapor chamber heat pipe radiator according to claim 1, characterized in that: The VC temperature equalizing plate (100) is provided with a mounting portion (110).

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