Heat dissipation device and servo controller

Abstract

The utility model relates to a heat dissipation device and a servo controller. The heat dissipation device comprises a protective cover and a cooling curved pipe arranged in the protective cover. One end of the cooling curved pipe penetrates through one side of the protective cover and is provided with a refrigeration piece and a starting semiconductor refrigeration piece, the bottom of the semiconductor refrigeration piece is a refrigeration face and located in the heat preservation frame, the semiconductor refrigeration piece refrigerates the interior of the heat preservation frame, the first fan is started, and external air is sucked into the heat preservation frame; air refrigerated by the semiconductor refrigeration sheet enters the cooling curved pipe, the cooling curved pipe is a copper pipe, cold air enters the cooling curved pipe, the cooling curved pipe is refrigerated, the cold air is transmitted into the protective cover, the second fan is started to enable external air to enter the protective cover through the filter screen, firstly, the air passes through the cooling curved pipe, and the air is refrigerated by the cooling curved pipe; cold air enters the protective cover, the cold air circulates in the protective cover, the cold air of accessories of the cooling curved pipe is guided to the other side of the protective cover, and the cooling curved pipe does not need to be fully paved in the protective cover.

Description

Technical Field

[0001] The utility model relates to the technical field of servo controller equipment, in particular to a heat dissipation device and a servo controller. Background Art

[0002] The servo controller, also known as a "servo drive" or "servo amplifier", is a controller used to control a servo motor, and is mainly used in high-precision positioning systems. Generally, the servo motor is controlled in three ways: position, speed, and torque to achieve high-precision transmission system positioning, and plays an important role in the drive system. In the prior art, the servo controller needs to control multiple motors, so a large number of electronic components need to be set up, including power components with large heat generation. A good heat dissipation effect is required to ensure the normal operation of the above-mentioned multi-axis servo controller. In order to ensure the heat dissipation effect, it is usually necessary to lay the above-mentioned substrate flat on a heat sink of the radiator, and a single heat sink or heat dissipation fan is difficult to achieve a good cooling effect on the servo controller. At the same time, a large number of copper heat-conducting parts are used, which is expensive.

[0003] For example, a servo controller disclosed in an authorized patent document with application number CN202122731012.X includes an interface board, a control board, a power board and a heat sink, wherein the upper surface of the interface board is provided with N power output terminals and N signal I / O terminals, each power output terminal and each signal I / O terminal corresponds to a controlled servo object, wherein N is an integer greater than or equal to 2; the control board is arranged between the lower surface of the interface board and the upper surface of the power board, and the control board is fixedly connected to the interface board; the power board is arranged between the lower surface of the control board and the upper surface of the heat sink, and the power board is fixedly connected to the control board; and the heat sink is fixedly connected to the power board. This servo controller can control multiple controlled servo objects at the same time, and has the advantages of small size, convenient maintenance, and good heat dissipation performance.

[0004] The above patent has the problem that a single heat sink or cooling fan is difficult to achieve a good cooling effect on the servo controller, and a large number of copper heat conducting parts are used, which is expensive. Therefore, we need to provide a heat dissipation device and a servo controller. Utility Model Content

[0005] The utility model aims to provide a heat dissipation device and a servo controller, which starts a semiconductor refrigeration plate, wherein the bottom of the semiconductor refrigeration plate is a cooling surface and is located in an insulation frame to cool the insulation frame, and starts a first fan to suck external air into the insulation frame, and the air cooled by the semiconductor refrigeration plate enters the cooling curve, wherein the cooling curve is a copper tube, and cold air enters the interior to cool the cooling curve, and transfers the cold air to the inside of the protective cover, and starts a second fan to let the external air enter the protective cover through a filter. First, the air will pass through the cooling curve, and the air will be cooled by the cooling curve and enter the protective cover. The cold air circulates in the protective cover, taking away the heat while draining the cold air attached to the cooling curve to the other side of the protective cover. There is no need to cover the entire protective cover with cooling curves, thereby saving resources, reducing costs, and solving the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solution: a heat dissipation device, comprising:

[0007] A protective cover, and a cooling curved pipe arranged inside the protective cover;

[0008] One end of the cooling curved pipe passes through one side of the protective cover and is equipped with a refrigeration component;

[0009] An air circulation member is installed on the surface of the protective cover;

[0010] The refrigeration component includes an insulation frame connected to one end of the cooling curved pipe, a first fan is fixedly installed inside the insulation frame, the first fan is arranged at the air inlet end of the cooling curved pipe, a semiconductor refrigeration plate is embedded in the top of the insulation frame, and a protective fence is embedded in one side of the insulation frame.

[0011] Preferably, the air circulation member comprises a filter screen embedded in one side of the protective cover, the filter screen is arranged on a side close to the cooling curved pipe, and two second fans are embedded in a side of the protective cover surface away from the filter screen.

[0012] Preferably, a cleaning piece for removing dust from the surface of the filter is installed on one side of the protective cover, and the cleaning piece includes two plate bodies fixedly installed on one side of the protective cover, two sliding rods are fixedly installed between the two plate bodies, push blocks are slidably installed on the surfaces of the two sliding rods, and a cleaning brush portion is installed on one side of the push blocks.

[0013] Preferably, two mounting seats are fixedly mounted on the surface of the cooling curved pipe, and the tops of the two mounting seats are fixedly mounted on the top of the inner wall of the protective cover by bolts.

[0014] Preferably, a paddle portion is installed on a side of the push block surface away from the cleaning brush portion, and one side of the cleaning brush portion is in contact with the surface of the filter screen.

[0015] Preferably, side panels are fixedly installed on both sides of the bottom of the protective cover, and limiting bolts are slidably installed inside the two side panels.

[0016] Preferably, the heating surface on the top of the semiconductor refrigeration plate is installed with a heat dissipation fin, and the cooling curved pipe is configured as a copper pipe.

[0017] A servo controller comprises a heat dissipation device. A servo controller body is arranged at the bottom of the protective cover. Mounting holes are provided on both sides of the servo controller body. The inside of the mounting holes is threadedly mounted with the surface of the limiting bolt.

[0018] Preferably, a heat conducting plate is embedded in the top of the servo controller body.

[0019] Preferably, mounting plates are fixedly mounted on both sides of the bottom of the servo controller body.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] The utility model starts a semiconductor refrigeration plate, wherein the bottom of the semiconductor refrigeration plate is a cooling surface and is located in a heat preservation frame to cool the heat preservation frame, and starts a first fan to suck external air into the heat preservation frame, and the air cooled by the semiconductor refrigeration plate enters a cooling curve, wherein the cooling curve is a copper tube, and cold air enters the interior to cool the cooling curve, and the cold air is transferred to the interior of the protective cover, and starts a second fan to allow external air to enter the protective cover through a filter, and first the air passes through the cooling curve, and the air is cooled by the cooling curve and enters the protective cover, and the cold air circulates in the protective cover, takes away the heat, and guides the cold air attached to the cooling curve to the other side of the protective cover, and there is no need to cover the entire interior of the protective cover with cooling curves, thereby saving resources and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0023] Figure 2 It is a three-dimensional exploded view of the structure of the utility model;

[0024] Figure 3 This is a three-dimensional bottom view of the protective cover of the utility model;

[0025] Figure 4 It is a three-dimensional diagram of the refrigeration component of the utility model;

[0026] Figure 5 It is a three-dimensional diagram of the cleaning component of the present utility model.

[0027] In the figure: 1. Protective cover; 2. Cooling curved pipe; 3. Refrigeration part; 31. Insulation frame; 32. First fan; 33. Air inlet end; 34. Semiconductor refrigeration plate; 35. Protective fence; 4. Air circulation part; 41. Filter; 42. Second fan; 5. Cleaning part; 51. Plate; 52. Slide rod; 53. Push block; 54. Cleaning brush part; 6. Mounting seat; 7. Plate part; 8. Side plate; 9. Limit bolt; 10. Heat dissipation fin plate; 11. Servo controller body; 12. Mounting hole; 13. Heat conduction plate; 14. Assembly plate. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-5 The utility model provides a technical solution: a heat dissipation device, comprising:

[0030] A protective cover 1, and a cooling curved pipe 2 arranged inside the protective cover 1;

[0031] One end of the cooling curved pipe 2 passes through one side of the protective cover 1 and is installed with a refrigeration component 3;

[0032] An air circulation member 4 is installed on the surface of the protective cover 1;

[0033] The refrigeration component 3 includes an insulation frame 31 connected to one end of the cooling curved pipe 2. A first fan 32 is fixedly installed inside the insulation frame 31. The first fan 32 is arranged at the air inlet end 33 of the cooling curved pipe 2. A semiconductor refrigeration plate 34 is embedded in the top of the insulation frame 31, and a protective fence 35 is embedded in one side of the insulation frame 31.

[0034] The air circulation member 4 includes a filter screen 41 embedded in one side of the protective cover 1. The filter screen 41 is arranged on a side close to the cooling curved pipe 2. Two second fans 42 are embedded in a side of the surface of the protective cover 1 away from the filter screen 41.

[0035] In this embodiment, the semiconductor refrigeration plate 34 is started, wherein the bottom of the semiconductor refrigeration plate 34 is a cooling surface and is located in the insulation frame 31 to cool the insulation frame 31, and the first fan 32 is started to suck external air into the insulation frame 31, and the air cooled by the semiconductor refrigeration plate 34 enters the cooling curve 2, wherein the cooling curve 2 is a copper tube, and the cold air enters the interior to cool the cooling curve 2, and the cold air is transferred to the inside of the protective cover 1, and the second fan 42 is started to let the external air pass through the filter 41 into the protective cover 1, first the air will pass through the cooling curve 2, the air will be cooled by the cooling curve 2, and enter the protective cover 1, the cold air circulates in the protective cover 1, takes away the heat, and guides the cold air near the cooling curve 2 to the other side of the protective cover 1, and there is no need to cover the entire cooling curve 2 in the protective cover 1, thereby saving resources and reducing costs.

[0036] A cleaning member 5 for removing dust from the surface of the filter screen 41 is installed on one side of the protective cover 1. The cleaning member 5 includes two plates 51 fixedly installed on one side of the protective cover 1. Two slide bars 52 are fixedly installed between the two plates 51. Push blocks 53 are slidably installed on the surfaces of the two slide bars 52. A cleaning brush 54 is installed on one side of the push block 53.

[0037] Specifically, after long-term use, dust adheres to the surface of the filter 41 and is blocked, making it difficult for air to circulate. The push block 53 can be pushed to drive the cleaning brush 54 on its surface to clean the dust adhered to the filter 41.

[0038] Two mounting seats 6 are fixedly mounted on the surface of the cooling curved pipe 2, and the tops of the two mounting seats 6 are fixedly mounted on the top of the inner wall of the protective cover 1 by bolts;

[0039] Furthermore, two mounting seats 6 are provided to reinforce the cooling curved pipe 2 inside the protective cover 1 to prevent the protective cover 1 from being loosely installed and easily falling off.

[0040] A paddle portion 7 is installed on the side of the push block 53 away from the cleaning brush portion 54, and one side of the cleaning brush portion 54 is in contact with the surface of the filter screen 41;

[0041] Specifically, a dial plate portion 7 is installed on one side of the push block 53 to facilitate the push adjustment of the push block 53 .

[0042] Side plates 8 are fixedly installed on both sides of the bottom of the protective cover 1, and limit bolts 9 are slidably installed inside the two side plates 8;

[0043] Furthermore, two side panels 8 are installed at the bottom of the protective cover 1, and limiting bolts 9 are slidably installed in the two side panels 8, so as to facilitate the installation and use of the servo controller.

[0044] The heat-generating surface on the top of the semiconductor cooling plate 34 is provided with a heat-dissipating fin plate 10, and the cooling curved pipe 2 is provided as a copper pipe;

[0045] Specifically, in order to ensure that the semiconductor cooling plate 34 can be in a normal working state, a heat dissipation fin plate 10 is installed on the heating surface of the top of the semiconductor cooling plate 34 for cooling, wherein the cooling curved pipe 2 is a copper pipe, which is a material with excellent thermal conductivity, and its thermal conductivity coefficient is much higher than other commonly used metals, such as steel and aluminum. This enables the copper pipe to quickly and effectively transfer heat in the cooling system, achieving an efficient cooling effect.

[0046] A servo controller includes a heat dissipation device. A servo controller body 11 is arranged at the bottom of a protective cover 1. Both sides of the servo controller body 11 are provided with mounting holes 12. The inside of the mounting hole 12 is threadedly mounted with the surface of a limit bolt 9.

[0047] A heat conducting plate 13 is embedded in the top of the servo controller body 11;

[0048] It should be noted that a heat conducting plate 13 is embedded in the top of the servo controller body 11. The heat conducting plate 13 transfers heat from one area to another through the high thermal conductivity of its material, thereby achieving heat balance and energy transfer. This efficient thermal conductivity makes the servo controller body 11 more effectively cooled.

[0049] In order to facilitate the installation of the servo controller body 11 on other components, mounting plates 14 are fixedly mounted on both sides of the bottom of the servo controller body 11 .

[0050] The device starts the semiconductor refrigeration plate 34, wherein the bottom of the semiconductor refrigeration plate 34 is a cooling surface and is located in the insulation frame 31 to cool the insulation frame 31, and starts the first fan 32 to suck external air into the insulation frame 31, and the air cooled by the semiconductor refrigeration plate 34 enters the cooling curve 2, wherein the cooling curve 2 is a copper tube, and the cold air enters the interior to cool the cooling curve 2, and the cold air is transferred to the inside of the protective cover 1, and the second fan 42 is started to let the external air enter the protective cover 1 through the filter 41, first the air will pass through the cooling curve 2, the air will be cooled by the cooling curve 2, and enter the protective cover 1, the cold air circulates in the protective cover 1, takes away the heat, and guides the cold air near the cooling curve 2 to the other side of the protective cover 1, and there is no need to cover the entire cooling curve 2 in the protective cover 1, thereby saving resources and reducing costs.

[0051] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that: include: A protective cover (1), and a cooling curved pipe (2) arranged inside the protective cover (1); One end of the cooling curved pipe (2) passes through one side of the protective cover (1) and is equipped with a refrigeration component (3); An air circulation member (4) is installed on the surface of the protective cover (1); The refrigeration component (3) includes an insulation frame (31) connected to one end of the cooling curved pipe (2), a first fan (32) is fixedly installed inside the insulation frame (31), and the first fan (32) is arranged at the air inlet end (33) of the cooling curved pipe (2), a semiconductor refrigeration plate (34) is embedded in the top of the insulation frame (31), and a protective fence (35) is embedded in one side of the insulation frame (31).

2. A heat dissipation device according to claim 1, characterized in that: The air circulation member (4) comprises a filter screen (41) embedded in one side of the protective cover (1); the filter screen (41) is arranged on a side close to the cooling curved pipe (2); and two second fans (42) are embedded in a side of the surface of the protective cover (1) away from the filter screen (41).

3. A heat dissipation device according to claim 2, characterized in that: A cleaning member (5) for removing dust from the surface of the filter screen (41) is installed on one side of the protective cover (1), and the cleaning member (5) comprises two plate bodies (51) fixedly installed on one side of the protective cover (1), two sliding rods (52) are fixedly installed between the two plate bodies (51), and push blocks (53) are slidably installed on the surfaces of the two sliding rods (52), and a cleaning brush portion (54) is installed on one side of the push blocks (53).

4. A heat dissipation device according to claim 1, characterized in that: Two mounting seats (6) are fixedly mounted on the surface of the cooling curved pipe (2), and the tops of the two mounting seats (6) are fixedly mounted on the top of the inner wall of the protective cover (1) by means of bolts.

5. A heat dissipation device according to claim 3, characterized in that: A paddle portion (7) is installed on the side of the push block (53) surface away from the cleaning brush portion (54), and one side of the cleaning brush portion (54) is in contact with the surface of the filter screen (41).

6. The heat dissipation device according to claim 1, characterized in that: Side plates (8) are fixedly mounted on both sides of the bottom of the protective cover (1), and limiting bolts (9) are slidably mounted inside the two side plates (8).

7. The heat dissipation device according to claim 1, characterized in that: A heat dissipation fin plate (10) is installed on the heating surface at the top of the semiconductor refrigeration plate (34), and the cooling curved pipe (2) is configured as a copper pipe.

8. A servo controller, characterized in that: It comprises the heat dissipation device described in any one of claims 1 to 7, wherein a servo controller body (11) is provided at the bottom of the protective cover (1), mounting holes (12) are provided on both sides of the servo controller body (11), and the inside of the mounting hole (12) is threadedly mounted with the surface of the limit bolt (9).

9. A servo controller according to claim 8, characterized in that: A heat conducting plate (13) is embedded in the top of the servo controller body (11).

10. A servo controller according to claim 8, characterized in that: Mounting plates (14) are fixedly mounted on both sides of the bottom of the servo controller body (11).

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