Electroplating device for semiconductor device processing

Abstract

The utility model belongs to the technical field of electroplating devices, and particularly relates to an electroplating device for processing semiconductor parts, which comprises an electroplating tank, an electrode column is arranged at the bottom of the inner side of the electroplating tank, a motor is fixedly mounted at the bottom of the electroplating tank, and an output shaft of the motor penetrates through the electroplating tank and is connected with the electroplating tank through a sealing bearing. And the tail end of the output shaft is fixedly connected with a rotating shaft. According to the utility model, the rotating shaft driven by the motor is arranged below the electroplating tank, the special-shaped rod is arranged on the rotating shaft, the storage net disc driven by the hydraulic cylinder to lift is arranged above the electroplating tank, the storage net disc is used for containing a semiconductor workpiece needing to be electroplated, and the inclined plane ring is arranged below the storage net disc, so that the semiconductor workpiece can be electroplated. In this way, through the interaction between the special-shaped rod and the slope ring, the storage net disc can vibrate up and down, and therefore electroplating dead angles caused by relative stacking of semiconductor workpieces are prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to an electroplating device for processing semiconductor parts. Background Art

[0002] Semiconductor diodes refer to two-terminal electronic devices that utilize semiconductor characteristics. In order to improve their performance in various aspects, they will be electroplated to improve their corrosion resistance, anti-oxidation and other characteristics. For example, the invention patent with announcement number CN110592634A discloses a semiconductor diode electroplating processing system, including an electroplating pool, the inner bottom wall tube of the electroplating pool is fixedly installed with conductive nails, the surface of the electroplating pool is fixedly connected with a support plate, and the two support plates are symmetrically distributed with the axis of the electroplating pool as the center; the semiconductor diode electroplating processing system is provided with an electric telescopic rod, a first servo motor and a second servo motor, which are all electrically connected to the programmable PLC controller through wires. During electroplating, the programmable PLC controller automatically controls the electroplating time. When the electroplating is completed, the programmable PLC controller automatically controls the second servo motor to reverse, drive the threaded tube to move upward, drive the electroplating box to separate from the electroplating pool, and automatically control the first servo motor and the electric telescopic rod to stop working, thereby solving the problem that the operator needs to wait beside the electroplating machine all the time, causing a waste of human resources, and achieving the effect of saving human resources and improving work efficiency.

[0003] The existing semiconductor electroplating device needs to be electroplated in batches when in use. Since the semiconductor diode is small in size, a certain number of diodes will be electroplated at the same time during a single electroplating. This easily leads to stacking between semiconductor diodes, resulting in electroplating dead corners. In addition, a large number of bubbles are often generated during the electroplating process. These bubbles will cover the surface of the electroplated object, affecting the electroplating quality and production efficiency. Therefore, improvements are needed. Utility Model Content

[0004] The utility model aims to provide an electroplating device for semiconductor parts processing, which solves the problems that the existing semiconductor electroplating device is prone to electroplating dead corners during use and the bubbles generated by electroplating will affect the electroplating quality and production efficiency.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electroplating device for semiconductor parts processing, comprising an electroplating pool, an electrode column is arranged at the inner bottom of the electroplating pool, a motor is fixedly installed at the bottom of the electroplating pool, the output shaft of the motor passes through the electroplating pool and is connected to the electroplating pool through a sealed bearing, the end of the output shaft is fixedly connected to a rotating shaft, the middle section of the shaft body of the rotating shaft is fixedly connected to a stirring blade, the upper section of the shaft body of the rotating shaft is fixedly connected to a special-shaped rod, a bracket is welded on the right side of the electroplating pool, a hydraulic cylinder is fixedly installed on the top of the bracket, the piston rod of the hydraulic cylinder passes through the bracket and is slidably connected to the bracket, the end of the piston rod is fixedly connected to a connecting rod, the outer side of the rod body of the connecting rod is slidably sleeved with a sliding sleeve, the bottom of the sliding sleeve is fixedly connected to a storage net disk, and the storage net disk is slidably connected to the inner side of the electroplating pool, the bottom of the storage net disk is fixedly connected to a bevel ring, and the bevel ring conflicts with the special-shaped rod.

[0006] Preferably, a sewage pipe is fixedly connected to the bottom of the electroplating tank and located on the right side of the motor. The arrangement of the sewage pipe facilitates the replacement of the electroplating solution.

[0007] Preferably, support legs are welded at the four corners of the bottom of the electroplating pool, and the support legs are polygonal prisms. The support legs are arranged to provide support for the whole.

[0008] Preferably, a limiting ring is fixedly connected to the bottom of the connecting rod, and the limiting ring is slidably connected to the inner side of the sliding sleeve. The setting of the limiting ring has a limiting effect on the relative sliding of the sliding sleeve on the connecting rod.

[0009] Preferably, the inner wall of the electroplating pool is fixedly connected with a support ring, the upper end of the support ring is fixedly connected with a sleeve, the inner side of the sleeve is slidably connected with a slide bar, the top of the slide bar is fixedly connected with a gasket, and the gasket is slidably connected to the inner side of the electroplating pool, the gasket is in contact with the storage net plate, and a spring is arranged on the inner side of the sleeve. The arrangement of the support ring, sleeve, slide bar and gasket can provide auxiliary support for the storage net plate when it is lowered.

[0010] Preferably, one end of the spring is fixedly connected to the slide bar, and the other end of the spring is fixedly connected to the inner surface of the sleeve. By setting the spring, the elastic force can act on the gasket through the slide bar.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] 1. The utility model arranges a rotating shaft driven by a motor under the electroplating pool, and then arranges a special-shaped rod on the rotating shaft, and then arranges a storage net tray driven by a hydraulic cylinder to be lifted and lowered above the electroplating pool. The storage net tray is used to hold semiconductor workpieces to be electroplated, and then an inclined ring is arranged under the storage net tray. In this way, the storage net tray can vibrate up and down through the interaction between the special-shaped rod and the inclined ring, thereby preventing the semiconductor workpieces from being stacked relative to each other and causing electroplating dead corners.

[0013] 2. The utility model sets a stirring blade in the middle section of the shaft, and then the stirring blade can rotate with the shaft, so that the electroplating solution and the electroplating defoaming agent can be quickly mixed, and then the electroplating solution and the electroplating defoaming agent are surged when the storage net plate is raised and lowered, thereby reducing the generation of bubbles during the electroplating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0015] Figure 2 For the utility model Figure 1 A front cross-sectional view of

[0016] Figure 3 For the utility model Figure 2 A magnified view of the structure of part A;

[0017] Figure 4 For the utility model Figure 2 A three-dimensional diagram of the local structure.

[0018] In the figure: 1. electroplating tank; 2. electrode column; 3. motor; 4. rotating shaft; 5. stirring blade; 6. special-shaped rod; 7. bracket; 8. hydraulic cylinder; 9. connecting rod; 10. sliding sleeve; 11. limiting ring; 12. storage net plate; 13. inclined ring; 14. supporting ring; 15. sleeve; 16. sliding rod; 17. spring; 18. gasket; 19. sewage pipe; 20. supporting leg. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-2, an electroplating device for semiconductor parts processing, including an electroplating pool 1, an electrode column 2 is arranged at the inner bottom of the electroplating pool 1, a motor 3 is fixedly installed at the bottom of the electroplating pool 1, the output shaft of the motor 3 passes through the electroplating pool 1 and is connected to the electroplating pool 1 through a sealed bearing, the end of the output shaft is fixedly connected to a rotating shaft 4, the middle section of the shaft body of the rotating shaft 4 is fixedly connected to a stirring blade 5, the upper section of the shaft body of the rotating shaft 4 is fixedly connected to a special-shaped rod 6, and the bottom of the electroplating pool 1 and the right side of the motor 3 are fixedly connected to a drain pipe 19. The setting of the drain pipe 19 facilitates the replacement of the electroplating solution. Support legs 20 are welded to the four corners of the bottom of the electroplating pool 1, and the support legs 20 are polygonal prisms. The setting of the support legs 20 has a supporting effect on the whole.

[0021] See also Figure 1-2 A bracket 7 is welded on the right side of the electroplating tank 1, and a hydraulic cylinder 8 is fixedly installed on the top of the bracket 7. The piston rod of the hydraulic cylinder 8 passes through the bracket 7 and is slidably connected to the bracket 7. The end of the piston rod is fixedly connected to a connecting rod 9. A sliding sleeve 10 is slidably sleeved on the outer side of the rod body of the connecting rod 9. A limiting ring 11 is fixedly connected to the bottom of the connecting rod 9, and the limiting ring 11 is slidably connected to the inner side of the sliding sleeve 10. The setting of the limiting ring 11 has a limiting effect on the relative sliding of the sliding sleeve 10 on the connecting rod 9. A storage net plate 12 is fixedly connected to the bottom of the sliding sleeve 10, and the storage net plate 12 is slidably connected to the inner side of the electroplating tank 1. A bevel ring 13 is fixedly connected to the bottom of the storage net plate 12, and the bevel ring 13 conflicts with the special-shaped rod 6.

[0022] See also Figure 2 , Figure 3 , Figure 4 The inner wall of the electroplating pool 1 is fixedly connected with a support ring 14, the upper end of the support ring 14 is fixedly connected with a sleeve 15, the inner side of the sleeve 15 is slidably connected with a slide bar 16, the top of the slide bar 16 is fixedly connected with a gasket 18, and the gasket 18 is slidably connected to the inner side of the electroplating pool 1, the gasket 18 is in contact with the storage net plate 12, and a spring 17 is arranged on the inner side of the sleeve 15. Through the arrangement of the support ring 14, the sleeve 15, the slide bar 16 and the gasket 18, the storage net plate 12 has an auxiliary support function when it falls. One end of the spring 17 is fixedly connected with the slide bar 16, and the other end of the spring 17 is fixedly connected to the inner surface of the sleeve 15. Through the arrangement of the spring 17, the elastic force can be applied to the gasket 18 through the slide bar 16.

[0023] The specific implementation process of the utility model is as follows: when in use, first, the electroplating solution and the electroplating defoaming agent are put into the electroplating tank 1, and then the motor 3 is started, the motor 3 will drive the rotating shaft 4 to rotate, and the rotating shaft 4 will drive the stirring blade 5 to rotate, and then the electroplating solution and the electroplating defoaming agent are quickly mixed to reduce the generation of bubbles during the electroplating process, and then the semiconductor workpiece to be electroplated is placed in the storage net plate 12, and then the hydraulic cylinder 8 pushes the storage net plate 12 towards each other, so that the storage net plate 12 enters the electroplating tank 1, and the storage net plate 12 hits the gasket 18, and the bevel ring 13 at the bottom of the storage net plate 12 hits the special-shaped rod 6, so that the motor 3 drives the special-shaped rod 6 to rotate, so that the special-shaped rod 6 makes a circular motion on the surface of the bevel ring 13, thereby realizing the lifting and vibration of the storage net plate 12, and the semiconductor workpieces in the storage net plate 12 are staggered with each other during the vibration process, thereby avoiding stacking to produce electroplating dead corners.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electroplating device for semiconductor processing, comprising an electroplating pool (1), characterized in that: An electrode column (2) is arranged at the bottom of the inner side of the electroplating tank (1), a motor (3) is fixedly installed at the bottom of the electroplating tank (1), an output shaft of the motor (3) passes through the electroplating tank (1) and is connected to the electroplating tank (1) via a sealed bearing, a rotating shaft (4) is fixedly connected to the end of the output shaft, a stirring blade (5) is fixedly connected to the middle section of the shaft body of the rotating shaft (4), a special-shaped rod (6) is fixedly connected to the upper section of the shaft body of the rotating shaft (4), a bracket (7) is welded on the right side of the electroplating tank (1), and the top of the bracket (7) is fixedly connected to the rotating shaft (4). A hydraulic cylinder (8) is fixedly installed, the piston rod of the hydraulic cylinder (8) passes through the bracket (7) and is slidably connected to the bracket (7), the end of the piston rod is fixedly connected to a connecting rod (9), the outer side of the rod body of the connecting rod (9) is slidably sleeved with a sliding sleeve (10), the bottom of the sliding sleeve (10) is fixedly connected to a storage net plate (12), and the storage net plate (12) is slidably connected to the inner side of the electroplating tank (1), and the bottom of the storage net plate (12) is fixedly connected to a bevel ring (13), and the bevel ring (13) contacts the special-shaped rod (6).

2. The electroplating device for semiconductor processing according to claim 1, characterized in that: A sewage pipe (19) is fixedly connected to the bottom of the electroplating tank (1) and located on the right side of the motor (3).

3. The electroplating device for semiconductor processing according to claim 1, characterized in that: Support legs (20) are welded at the four corners of the bottom of the electroplating pool (1), and the support legs (20) are polygonal prisms.

4. The electroplating device for semiconductor processing according to claim 1, characterized in that: The bottom of the connecting rod (9) is fixedly connected to a limiting ring (11), and the limiting ring (11) is slidably connected to the inner side of the sliding sleeve (10).

5. The electroplating device for semiconductor processing according to claim 1, characterized in that: The inner wall of the electroplating pool (1) is fixedly connected to a support ring (14), the upper end of the support ring (14) is fixedly connected to a sleeve (15), the inner side of the sleeve (15) is slidably connected to a slide rod (16), the top of the slide rod (16) is fixedly connected to a gasket (18), and the gasket (18) is slidably connected to the inner side of the electroplating pool (1), the gasket (18) is in contact with the storage net plate (12), and a spring (17) is provided on the inner side of the sleeve (15).

6. The electroplating device for semiconductor processing according to claim 5, characterized in that: One end of the spring (17) is fixedly connected to the slide rod (16), and the other end of the spring (17) is fixedly connected to the inner surface of the sleeve (15).

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