Chip testing machine and chip cooling device thereof

Abstract

The utility model discloses a chip testing machine and a chip cooling device thereof, belongs to the technical field of chip testing, and aims to solve the problem of poor stability in the chip cooling process, the chip testing machine comprises a supporting seat, the left side and the right side of the supporting seat are fixedly connected with mounting plates, the mounting plates are fixedly connected with fixed plates, the fixed plates are provided with movable grooves, and the movable grooves are fixedly connected with the supporting seat. A movable groove is formed in the supporting seat, a movable seat is arranged in the movable groove in a sliding mode, a fastener is arranged on the movable seat and located on the outer side of the movable groove, an adjusting mechanism is arranged on the movable seat, a sensor is installed on the adjusting mechanism, an air channel is formed in the supporting seat, and a cooling mechanism is arranged on the upper portion of the air channel and located on the top of the supporting seat. According to the utility model, through the arrangement of the cooling mechanism, not only can the cooling work of the chip be realized through air cooling, but also the cooling effect of the chip can be further improved through contact between the bottom of the chip and silicone grease, the chip can be kept stable in the cooling process, and the subsequent test work is prevented from being influenced by movement.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and in particular relates to a chip testing machine and a chip cooling device thereof. Background Art

[0002] With the continuous development and maturity of chip technology, the application of chips involves all walks of life and all fields. The use environment of chips has become more complex, and higher requirements have been placed on the various performance of chips. Among them, the stable electrical parameter performance of high-temperature resistant chips in high-temperature environments is a basic requirement that electronic industries such as automotive electronics and 5G communications pay more attention to. High-temperature resistant chips are developed and produced in large quantities in packaging factories, and then the testing and sorting equipment is required to have high-temperature testing functions. The high-temperature test sorting machine is used to perform performance testing, classification sorting, and packaging recycling of high-temperature chips before shipment.

[0003] The prior art discloses a chip testing machine and a chip cooling device thereof with a patent announcement number of CN220206137U, which includes a mounting block and an air cooling mechanism, wherein the mounting block is provided with a chip receiving groove to receive the chip through the chip receiving groove; the air cooling mechanism is used to generate wind at the chip receiving groove to cool the chip. According to the technical solution of the utility model, when the air cooling mechanism is started, wind can be generated at the chip receiving groove, and the chip is placed in the chip receiving groove and then exchanges heat with the surrounding air, thereby achieving a cooling effect; in addition, the height of the through-beam photoelectric sensor is adjustable, so that it is convenient to adjust it on site, so that the chip receiving groove is located within the detection range of the sensor, but there are still the following deficiencies in actual use: from a practical point of view, the device realizes the cooling effect of the chip through air cooling, and since there is air circulation during the air cooling process, the faster the air flow rate, the more obvious the cooling effect, and at the same time, the chip is more unstable on the support table, and is prone to movement, thereby affecting the subsequent work of the manipulator to clamp it and may cause failure, resulting in reduced work efficiency.

[0004] Therefore, a chip testing machine and a chip cooling device thereof are needed to solve the problem of poor stability in the chip cooling process in the prior art. Utility Model Content

[0005] The purpose of the utility model is to provide a chip testing machine and a chip cooling device thereof to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip cooling device, including a support seat, a mounting plate fixedly connected to the left and right sides of the support seat, a fixing plate fixedly connected to the mounting plate, a movable groove is opened on the fixing plate, a movable seat is slidably arranged in the movable groove, a fastener is arranged on the movable seat at the outer side of the movable groove, an adjustment mechanism is arranged on the movable seat, a sensor is installed on the adjustment mechanism, an air duct is arranged in the support seat, and a cooling mechanism is arranged on the upper part of the air duct at the top of the support seat.

[0007] It should be noted in the solution that two fixing plates are symmetrically arranged on the mounting plate, a through hole is opened on the mounting plate between the two fixing plates, and the movable seat is arranged on the fixing plate through the through hole.

[0008] It is further worth explaining that the adjustment mechanism includes a slide groove, which is opened at the top of the movable seat, and a slider is slidably arranged in the slide groove. A positioning plate is fixedly connected to the top of the slider and connected to the sensor, and an electric telescopic rod is fixedly connected to the other side of the positioning plate and installed on the top of the movable seat.

[0009] It should be further explained that the cooling mechanism includes a mounting block, which is fixedly mounted on the top of the support seat and is provided with a through-opening corresponding to the air duct, the top of the mounting block is fixedly connected with fixing seats on all sides, a placing table is fixedly connected between the fixing seats at the upper part of the through-opening, a through-opening is opened on the placing table, a cooling groove is opened on the top of the placing table near the periphery and is arranged on the outside of the through-opening, a connecting port is arranged in the cooling groove, and the bottom of the connecting port is fixedly connected to a connecting pipe at the bottom of the placing table and is connected in the mounting block.

[0010] As a preferred embodiment, a mounting groove is opened in the top of the fixing seat, a clamping block is slidably arranged in the mounting groove, an electromagnetic block is fixedly installed in the fixing seat on one side of the clamping block in the mounting groove, and a connecting piece is fixedly connected to the bottom of the electromagnetic block and installed in the fixing seat.

[0011] As a preferred implementation, the connecting pipe is connected to the silicone grease filling device via a mounting block.

[0012] As a preferred embodiment, a plurality of through grooves are formed on the outer surface of the clamp block, and the plurality of through grooves are arranged at intervals on the outer side of the clamp block.

[0013] As a preferred implementation, the electromagnetic block is electrically connected to the main control terminal via a connector, and a magnet matching the electromagnetic block is disposed on a side of the clamping block close to the electromagnetic block.

[0014] The utility model also provides the following technical solution: a chip testing machine, which may include any one of the chip cooling devices described above.

[0015] Compared with the prior art, the chip testing machine and chip cooling device provided by the utility model have at least the following beneficial effects:

[0016] (1) The cooling mechanism can not only cool the chip by air cooling, but also further improve the cooling effect by contacting the bottom of the chip with silicone grease. It can also keep the chip stable during the cooling process to prevent movement that affects subsequent testing.

[0017] (2) The sensor can be easily adjusted by means of the adjustment mechanism. Not only can the height be adjusted by the fixed plate and the movable seat, but the distance can also be adjusted, thereby further improving the sensing efficiency of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2 It is a schematic diagram of the internal cutaway structure of the utility model;

[0020] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0021] Figure 4 It is a schematic diagram of the disassembled structure of the cooling mechanism of the utility model.

[0022] In the figure: 1. support seat; 2. mounting plate; 3. fixing plate; 301. movable groove; 4. movable seat; 401. fastener; 5. adjustment mechanism; 501. slide groove; 502. slider; 503. positioning plate; 504. electric telescopic rod; 6. sensor; 7. cooling mechanism; 701. mounting block; 702. fixing seat; 703. placing table; 704. through opening; 705. mounting groove; 706. clamping block; 7061. through groove; 707. connecting piece; 708. electromagnetic block; 709. cooling groove; 7010. connecting port; 7011. connecting pipe; 8. air duct. DETAILED DESCRIPTION

[0023] The present invention will be further described below in conjunction with the embodiments.

[0024] See also Figure 1-4The utility model provides a chip cooling device, including a support seat 1, a mounting plate 2 is fixedly connected to the left and right sides of the support seat 1, a fixing plate 3 is fixedly connected to the mounting plate 2, a movable groove 301 is opened on the fixing plate 3, a movable seat 4 is arranged in the movable groove 301, a fastener 401 is arranged on the movable seat 4 on the outer side of the movable groove 301, an adjusting mechanism 5 is arranged on the movable seat 4, a sensor 6 is installed on the adjusting mechanism 5, an air duct 8 is arranged in the support seat 1, and a cooling mechanism 7 is arranged on the top of the support seat 1 on the upper part of the air duct 8.

[0025] The adjustment mechanism 5 facilitates adaptive adjustment of the position of the sensor 6 to improve the working performance of the sensor 6. At the same time, the cooling mechanism 7 improves the stability of the chip after placement to avoid movement during air cooling and affecting subsequent testing work.

[0026] Further Figure 1 and Figure 2 As shown, it is worth explaining in detail that two fixing plates 3 are symmetrically arranged on the mounting plate 2, a through hole is opened on the mounting plate 2 between the two fixing plates 3, and the movable seat 4 is arranged on the fixing plate 3 through the through hole.

[0027] Further Figure 1 and Figure 2 As shown, it is worth specifically explaining that the adjustment mechanism 5 includes a slide groove 501, which is opened at the top of the movable seat 4, and a slider 502 is slidably arranged in the slide groove 501. A positioning plate 503 is fixedly connected to the top of the slider 502 and is connected to the sensor 6. The other side of the positioning plate 503 is fixedly connected to an electric telescopic rod 504 and installed on the top of the movable seat 4.

[0028] The electric telescopic rod 504 is used to adjust the distance of the sensor 6 so that the sensor 6 can sense whether there is a chip placed on the placement table 703, thereby improving the practicability of the device.

[0029] According to the above working process, it can be known that the sensor 6 can be easily adjusted by setting the adjustment mechanism 5, which can not only achieve height adjustment through the fixed plate 3 and the movable seat 4, but also adjust the distance thereof, thereby further improving the sensing efficiency of the sensor 6.

[0030] Further Figure 2 , Figure 3 and Figure 4As shown, it is worth specifically explaining that the cooling mechanism 7 includes a mounting block 701, the mounting block 701 is fixedly mounted on the top of the support seat 1 and is provided with a through opening corresponding to the air duct 8, the top of the mounting block 701 is fixedly connected with a fixing seat 702, a placing platform 703 is fixedly connected between the fixing seats 702 at the upper part of the through opening, a through opening 704 is opened on the placing platform 703, a cooling groove 709 is opened on the top of the placing platform 703 near the periphery and is arranged outside the through opening 704, a connecting port 7010 is arranged in the cooling groove 709, and a connecting pipe 7011 is fixedly connected to the bottom of the placing platform 703 at the bottom of the connecting port 7010 and is connected in the mounting block 701, and the fixing seat 70 A mounting groove 705 is provided in the top, a clamping block 706 is slidably provided in the mounting groove 705, an electromagnetic block 708 is fixedly installed in the fixing seat 702 on one side of the clamping block 706 in the mounting groove 705, a connecting piece 707 is fixedly connected to the bottom of the electromagnetic block 708 and is installed in the fixing seat 702, a connecting pipe 7011 is connected to the silicone grease filling device through the mounting block 701, a plurality of through grooves 7061 are provided on the outer surface of the clamping block 706, and the plurality of through grooves 7061 are arranged at intervals on the outer side of the clamping block 706, the electromagnetic block 708 is electrically connected to the main control terminal through the connecting piece 707, and a magnet matching with the electromagnetic block 708 is provided on the side of the clamping block 706 close to the electromagnetic block 708.

[0031] The main control terminal is used to realize the electromagnetic block 708 to repel the magnet on the clamp block 706, so that the clamp block 706 slides in the installation groove 705 to clamp the chip on all sides, so that the chip is stably placed on the upper part of the placement table 703. At the same time, the air is cooled through the opening 704 and the air duct 8, and the cooling silicone grease is injected into the cooling groove 709 under the transportation of the connecting pipe 7011, so that the silicone grease contacts the bottom of the chip, further improving the cooling efficiency of the chip.

[0032] The utility model also provides the following technical solution: a chip tester, which may include any of the above chip cooling devices, for implementing the chip cooling work and performing related testing work through the chip tester.

[0033] This scheme has the following working process: when this device is used, the chip is placed on the upper part of the placement table 703 through an external manipulator. At this time, the electromagnetic block 708 repels the magnet on the clamp block 706 through the main control terminal, so that the clamp block 706 slides in the installation groove 705 to clamp the chip on all sides, so that the chip is stably placed on the upper part of the placement table 703. At the same time, air cools it through the opening 704 and the air duct 8, and the cooling silicone grease is injected into the cooling groove 709 under the transportation of the connecting pipe 7011, so that the silicone grease contacts the bottom of the chip, further improving the cooling efficiency of the chip, and cooperating with the work of the electric telescopic rod 504 to adjust the distance of the sensor 6, so that the sensor 6 can sense whether there is a chip placed on the upper part of the placement table 703, thereby improving the practicality of the device.

[0034] In summary: through the setting of the cooling mechanism 7, not only can the chip be cooled by air cooling, but also the bottom of the chip can be in contact with the silicone grease to further improve its cooling effect, and the chip can be kept stable during the cooling process to prevent movement from affecting subsequent testing work; through the setting of the adjustment mechanism 5, it is convenient to adjust the sensor 6, not only the height adjustment can be achieved through the fixed plate 3 and the movable seat 4, but also the distance can be adjusted, further improving the sensing efficiency of the sensor 6.

Claims

1. A chip cooling device, comprising a support seat (1), characterized in that: The support seat (1) is fixedly connected to a mounting plate (2) on both sides, the mounting plate (2) is fixedly connected to a fixing plate (3), a movable groove (301) is provided on the fixing plate (3), a movable seat (4) is arranged in the movable groove (301), a fastener (401) is arranged on the movable seat (4) outside the movable groove (301), an adjustment mechanism (5) is arranged on the movable seat (4), a sensor (6) is installed on the adjustment mechanism (5), an air duct (8) is arranged in the support seat (1), and a cooling mechanism (7) is arranged on the upper part of the air duct (8) at the top of the support seat (1).

2. A chip cooling device according to claim 1, characterized in that: Two fixed plates (3) are symmetrically arranged on the mounting plate (2) in front and back, a through opening is opened on the mounting plate (2) between the two fixed plates (3), and the movable seat (4) is arranged on the fixed plate (3) through the through opening.

3. A chip cooling device according to claim 1, characterized in that: The adjustment mechanism (5) comprises a slide groove (501), wherein the slide groove (501) is opened at the top of the movable seat (4), a slider (502) is slidably arranged in the slide groove (501), a positioning plate (503) is fixedly connected to the top of the slider (502) and is connected to the sensor (6), and an electric telescopic rod (504) is fixedly connected to the other side of the positioning plate (503) and is installed on the top of the movable seat (4).

4. A chip cooling device according to claim 1, characterized in that: The cooling mechanism (7) comprises a mounting block (701), wherein the mounting block (701) is fixedly mounted on the top of the support seat (1) and is provided with a through opening corresponding to the air duct (8); the top of the mounting block (701) is fixedly connected with a fixing seat (702) on all sides; a placement platform (703) is fixedly connected between the fixing seats (702) at the upper part of the through opening; a through opening (704) is provided on the placement platform (703); a cooling groove (709) is provided on the top of the placement platform (703) near the periphery and is provided on the outside of the through opening (704); a connecting port (7010) is provided in the cooling groove (709); the bottom of the connecting port (7010) is fixedly connected with a connecting pipe (7011) at the bottom of the placement platform (703) and is connected in the mounting block (701).

5. A chip cooling device according to claim 4, characterized in that: The top of the fixing seat (702) is provided with a mounting groove (705), a clamping block (706) is slidably arranged in the mounting groove (705), an electromagnetic block (708) is fixedly installed in the fixing seat (702) on one side of the clamping block (706) in the mounting groove (705), and a connecting piece (707) is fixedly connected to the bottom of the electromagnetic block (708) and is installed in the fixing seat (702).

6. A chip cooling device according to claim 5, characterized in that: The connecting pipe (7011) is connected to the silicone grease filling device via the mounting block (701).

7. A chip cooling device according to claim 6, characterized in that: The outer surface of the clamping block (706) is provided with a plurality of through grooves (7061), and the plurality of through grooves (7061) are arranged at intervals on the outer side of the clamping block (706).

8. The chip cooling device according to claim 7, characterized in that: The electromagnetic block (708) is electrically connected to the main control terminal via a connecting piece (707), and a magnet matching the electromagnetic block (708) is provided on a side of the clamping block (706) close to the electromagnetic block (708).

9. A chip testing machine, characterized in that: A chip cooling device comprising any one of claims 1-8.

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