Computer water-cooling heat dissipation device

By designing a computer water-cooled heat dissipation device including a mounting frame, a fixing rod, an elastic snap, a limiting assembly and a slip ring, the problem of inconvenient disassembly of existing devices is solved, and the convenient installation and disassembly of the heat dissipation components is achieved, and the convenience and effect of use is improved.

CN222545705UActive Publication Date: 2025-02-28CHONGQING MATERNAL & CHILD HEALTH HOSPITAL (CHONGQING OBSTETRICS & GYNECOLOGY HOSPITAL CHONGQING INST OF GENETICS & REPRODUCTION)
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Patent Information

Application Number
CN202421404608.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-19
Publication Date
2025-02-28
Estimated Expiration
2034-06-19

AI Technical Summary

Technical Problem

The existing water-cooled heat dissipation device is not convenient for quick disassembly and assembly, resulting in difficulty in maintenance and replacement.

Method used

A computer water-cooled heat dissipation device is designed, using a structure such as mounting frame, fixing rod, elastic snap buckle, limit assembly and slip ring. Through the cooperation of the limit sleeve and spring, the limit fixation and convenient disassembly of the mounting plate are achieved.

Benefits of technology

It realizes convenient installation and disassembly of heat dissipation components, improving the convenience and effect of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a computer water cooling heat dissipation device which comprises an installation frame, fixing rods are fixedly connected to the corners of the top face of the installation frame, elastic buckles are connected to the upper ends of the fixing rods in a clamped mode, connecting rods are fixedly connected to the top faces of the fixing rods, and sliding rings are connected to the side faces of the connecting rods in a sliding mode. A fixing head is fixedly connected to the top face of the connecting rod, a limiting assembly is arranged on the fixing head, a mounting plate is slidably connected to the middle of the mounting frame, a heat conduction plate is fixedly connected to the bottom face of the mounting plate, a supporting frame is fixedly connected to the top face of the mounting plate, and a water cooling liquid box is fixedly connected to the top face of the supporting frame. A heat dissipation assembly is arranged on the side face of the water cooling liquid box. When the heat dissipation assembly is used, the fixing head is limited and fixed through the limiting assembly, and when the heat dissipation assembly needs to be disassembled, the elastic buckle is taken down from the fixing rod through the pull ring, and then the limiting assembly is taken down from the fixing head, so that the heat dissipation assembly is convenient to assemble and disassemble.
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Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a water cooling device for computers. Background Art

[0002] Computer CPU will generate a lot of heat during operation. If no heat dissipation treatment is performed, it will interfere with work. Generally, air cooling is used for heat dissipation. However, due to the influence of air thermal conductivity, it is easy to cause frequency reduction due to excessive temperature. Therefore, for users who pursue high performance, water cooling has become a better choice.

[0003] The existing water cooling device is mainly fixed inside the chassis by screws, which is not convenient for quick disassembly and assembly, thus causing great inconvenience to its maintenance and replacement. Utility Model Content

[0004] The purpose of the utility model is to provide a computer water cooling device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a computer water-cooling heat dissipation device, comprising a mounting frame, a fixing rod fixedly connected at a corner of the top surface of the mounting frame, an elastic buckle clamped at the upper end of the fixing rod, a connecting rod fixedly connected to the top surface of the fixing rod, a slip ring slidably connected to the side of the connecting rod, a fixing head fixedly connected to the top surface of the connecting rod, a limiting assembly is arranged on the fixing head, a mounting plate slidably connected to the middle part of the mounting frame, a heat conducting plate fixedly connected to the bottom surface of the mounting plate, a supporting frame fixedly connected to the top surface of the mounting plate, a water-cooling liquid tank fixedly connected to the top surface of the supporting frame, and a heat dissipation assembly is arranged on the side of the water-cooling liquid tank.

[0006] Preferably, the limit assembly includes a limit sleeve, which is sleeved on the fixed head, and two installation grooves are provided on the inner side of the limit sleeve. A spring is fixedly connected to one side of the installation groove, and the other end of the spring is fixedly connected to a limit block. The limit block is fixedly connected to a limit rod on the side close to the spring, and the limit rod passes through the limit sleeve at one end away from the limit block.

[0007] Preferably, the heat dissipation component includes a circulation pump, a liquid return pipe, and multiple cooling fans. The circulation pump is threadedly connected to the right side of the water-cooling liquid tank. The water outlet of the circulation pump is threadedly connected to the liquid outlet pipe. The bottom end of the liquid outlet pipe is threadedly connected to the right side of the heat conduction plate. The top end of the liquid return pipe is threadedly connected to the left side of the water-cooling liquid tank. The bottom end of the liquid return pipe is threadedly connected to the left side of the heat conduction plate. Multiple cooling fans are fixedly connected to the top surface of the water-cooling liquid tank.

[0008] Preferably, the elastic buckle is located between the limiting sleeve and the mounting plate, and a pull ring is fixedly connected to the side surface of the elastic buckle.

[0009] Preferably, a groove is provided on a side of the fixing head close to the connecting rod, and the groove matches the size of the slip ring.

[0010] Preferably, a flow groove is provided inside the heat conducting plate.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] When the utility model is in use, the limiting sleeve is sleeved on the fixing head, and the fixing head squeezes the limiting block into the installation groove, and then under the action of the spring, the limiting block pops out and abuts against the connecting rod, so as to limit and fix the installation plate. When disassembly is required, the elastic buckle is removed from the fixing rod by the pull ring, and the limiting sleeve is pressed downward, and the limiting block moves along the inclined surface of the slip ring until it pops out to the bottom of the slip ring, and the limiting sleeve is pulled up, and the limiting block drives the slip ring to move upward until the slip ring is hidden in the groove on the bottom surface of the fixing head, and the limiting block moves along the inclined surface under the slip ring into the installation groove, and the limiting sleeve is drawn out from the fixing head, so that the installation plate can be removed from the main board, so that the heat dissipation component is easy to install and disassemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model;

[0014] Figure 2 It is a front structural schematic diagram of the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the limit assembly of the utility model;

[0016] Figure 4 This is a schematic diagram of the fixed head structure of the utility model;

[0017] Figure 5 It is a schematic diagram of the structure of the heat conducting plate of the utility model.

[0018] In the figure: 1. mounting frame; 2. fixing rod; 3. elastic buckle; 4. connecting rod; 5. slip ring; 6. fixing head; 7. limiting assembly; 71. limiting sleeve; 72. mounting groove; 73. spring; 74. limiting block; 75. limiting rod; 8. mounting plate; 9. heat conducting plate; 10. supporting frame; 11. water cooling liquid tank; 12. heat dissipation assembly; 121. circulation pump; 122. liquid outlet pipe; 123. liquid return pipe; 124. cooling fan; 13. pull ring; 14. groove; 15. circulation slot. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-5 The utility model provides a technical solution: a computer water-cooling heat dissipation device, including a mounting frame 1, a fixing rod 2 welded at the corner of the top surface of the mounting frame 1, an elastic buckle 3 clamped on the upper end of the fixing rod 2, a connecting rod 4 welded on the top surface of the fixing rod 2, a slip ring 5 is slidably connected to the connecting rod 4, a fixing head 6 is welded on the top surface of the connecting rod 4, a limiting assembly 7 is installed on the fixing head 6, a mounting plate 8 is slidably connected to the middle part of the mounting frame 1, a heat conducting plate 9 is installed on the bottom surface of the mounting plate 8 by bolts, a support frame 10 is installed on the top surface of the mounting plate 8 by bolts, a water-cooling liquid tank 11 is installed on the top surface of the support frame 10 by bolts, and a heat dissipation assembly 12 is installed on the side of the water-cooling liquid tank 11.

[0021] The limiting assembly 7 includes a limiting sleeve 71, which is sleeved on the fixed head 6, two mounting grooves 72 are opened on the inner side of the limiting sleeve 71, a spring 73 is welded to one side inside the mounting groove 72, a limiting block 74 is welded to the other end of the spring 73, a limiting rod 75 is threadedly connected to the side of the limiting block 74 close to the spring 73, and the end of the limiting rod 75 away from the limiting block 74 passes through the limiting sleeve 71.

[0022] The heat dissipation assembly 12 includes a circulation pump 121, a liquid return pipe 123, and multiple cooling fans 124. The circulation pump 121 is threadedly connected to the right side of the water-cooling liquid tank 11, the liquid outlet pipe 122 is threadedly connected to the water outlet of the circulation pump 121, the bottom end of the liquid outlet pipe 122 is threadedly connected to the right side of the heat conduction plate 9, the top end of the liquid return pipe 123 is threadedly connected to the left side of the water-cooling liquid tank 11, the bottom end of the liquid return pipe 123 is threadedly connected to the left side of the heat conduction plate 9, and multiple cooling fans 124 are installed on the top surface of the water-cooling liquid tank 11 by bolts.

[0023] The elastic buckle 3 is located between the limiting sleeve 71 and the mounting plate 8 , and the pull ring 13 is welded to the side surface of the elastic buckle 3 .

[0024] The groove 14 is formed on a side of the fixing head 6 close to the connecting rod 4 , and the size of the groove 14 matches that of the slip ring 5 .

[0025] The flow groove 15 is opened inside the heat conducting plate 9 .

[0026] Working principle: When the utility model is in use, the mounting frame 1 is placed on the back of the motherboard, the fixing rod 2 passes through the mounting hole on the motherboard, the heat conducting plate 9 abuts against the surface of the CPU, the limiting sleeve 71 is put on the fixing head 6, the fixing head 6 squeezes the limiting block 74 into the mounting groove 72, and then under the action of the spring 73, the limiting block 74 pops out and abuts against the connecting rod 4, thereby limiting and fixing the mounting plate 8, and the heat conducting plate 9 conducts the heat on the CPU, and the circulating pump 121 draws the water-cooling liquid in the water-cooling liquid tank 11 into the liquid outlet pipe 122, and the water-cooling liquid enters the circulation groove 15 through the liquid outlet pipe 122, and the water-cooling liquid absorbs the heat on the heat conducting plate 9, and then enters the water-cooling liquid tank 11 through the return pipe 123, thereby completing the heat dissipation. During hot operation, the cooling fan 124 discharges the heat on the water-cooling liquid tank 11 to the outside. When disassembly is required, the elastic buckle 3 is removed from the fixing rod 2 through the pull ring 13, and the limiting sleeve 71 is pressed downward. The limiting block 74 moves along the inclined surface of the slip ring 5 until it pops out below the slip ring 5. The limiting sleeve 71 is pulled upward, and the limiting block 74 drives the slip ring 5 to move upward until the slip ring 5 is hidden in the groove 14 on the bottom surface of the fixing head 6. The limiting block 74 moves along the inclined surface below the slip ring 5 to the mounting groove 72, and the limiting sleeve 71 is pulled out from the fixing head 6, so that the mounting plate 8 can be removed from the main board, making it easy to install and disassemble the heat dissipation component 12. The utility model has the advantages of easy use and good use effect.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer water cooling device, comprising a mounting frame (1), characterized in that: A fixing rod (2) is fixedly connected at a corner of the top surface of the mounting frame (1), an elastic buckle (3) is clamped at the upper end of the fixing rod (2), a connecting rod (4) is fixedly connected to the top surface of the fixing rod (2), a slip ring (5) is slidably connected to the side of the connecting rod (4), a fixing head (6) is fixedly connected to the top surface of the connecting rod (4), a limiting component (7) is arranged on the fixing head (6), a mounting plate (8) is slidably connected to the middle part of the mounting frame (1), a heat conducting plate (9) is fixedly connected to the bottom surface of the mounting plate (8), a supporting frame (10) is fixedly connected to the top surface of the supporting frame (10), a water cooling liquid tank (11) is fixedly connected to the top surface of the supporting frame (10), and a heat dissipation component (12) is arranged on the side of the water cooling liquid tank (11).

2. A computer water cooling device according to claim 1, characterized in that: The limiting assembly (7) comprises a limiting sleeve (71), the limiting sleeve (71) being sleeved on the fixed head (6), the inner side of the limiting sleeve (71) being provided with two mounting grooves (72), one side of the mounting groove (72) being fixedly connected with a spring (73), the other end of the spring (73) being fixedly connected with a limiting block (74), the side of the limiting block (74) close to the spring (73) being fixedly connected with a limiting rod (75), the end of the limiting rod (75) away from the limiting block (74) passing through the limiting sleeve (71).

3. A computer water cooling device according to claim 1, characterized in that: The heat dissipation component (12) comprises a circulation pump (121), a liquid return pipe (123), and a plurality of heat dissipation fans (124); the circulation pump (121) is threadedly connected to the right side of the water-cooling liquid tank (11); the water outlet of the circulation pump (121) is threadedly connected to a liquid outlet pipe (122); the bottom end of the liquid outlet pipe (122) is threadedly connected to the right side of the heat conduction plate (9); the top end of the liquid return pipe (123) is threadedly connected to the left side of the water-cooling liquid tank (11); the bottom end of the liquid return pipe (123) is threadedly connected to the left side of the heat conduction plate (9); and the plurality of heat dissipation fans (124) are fixedly connected to the top surface of the water-cooling liquid tank (11).

4. A computer water cooling device according to claim 1, characterized in that: The elastic buckle (3) is located between the limiting sleeve (71) and the mounting plate (8), and a pull ring (13) is fixedly connected to the side of the elastic buckle (3).

5. A computer water cooling device according to claim 1, characterized in that: A groove (14) is provided on a side of the fixed head (6) close to the connecting rod (4), and the size of the groove (14) matches that of the slip ring (5).

6. A computer water cooling device according to claim 1, characterized in that: A circulation groove (15) is provided inside the heat conducting plate (9).