Assembling structure of modularized extensible photovoltaic silicon wafer production equipment

Abstract

The utility model discloses an assembly structure of modularized extensible photovoltaic silicon wafer production equipment, and relates to the technical field of photovoltaic silicon wafer processing. The silicon wafer placement box comprises a placement box body and a silicon wafer, the placement box body comprises two side plates, a limiting rod is arranged between the two side plates, the inner side faces of the limiting rod and a connecting rod are provided with a plurality of second grooves and first grooves respectively, the inner sides of the first grooves and the inner sides of the second grooves are provided with mounting plates in a clamped mode, and the mounting plates are connected with the limiting rod. According to the utility model, through the first groove, the second groove and the mounting plates, the gap between the two adjacent mounting plates is adjusted, and according to the specific cleaning steps and the size requirement of the silicon wafer, the flexibility not only enables the equipment to adapt to various processing environments, but also ensures that the silicon wafer can obtain the optimal processing effect in the cleaning process, and the cleaning efficiency is improved. And an effective solution can be provided for silicon wafers with different sizes or various cleaning steps.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic silicon wafer processing, in particular to an assembly structure of modular and expandable photovoltaic silicon wafer production equipment. Background Art

[0002] Photovoltaic silicon chips, also known as silicon wafers or photovoltaic silicon wafers, are the core raw materials of solar photovoltaic cells. They are located in the upstream link of the photovoltaic industry chain. They are formed by slicing, polishing, cleaning and other processes of silicon rods. Photovoltaic silicon chips are an important semiconductor material. By adding trace amounts of Group IIIA elements, such as boron, P-type silicon semiconductors can be formed; by adding trace amounts of Group VA elements, such as phosphorus, N-type silicon semiconductors can be formed. By combining N and P-type semiconductors together, crystalline silicon photovoltaic cells can be made, which can directly convert the sun's light energy into electrical energy.

[0003] In the current silicon wafer production and processing process, silicon wafers need to undergo fine slicing and grinding operations, and the cleaning process is particularly critical and directly related to the quality and performance of silicon wafers. This process usually adopts physical or chemical methods, such as ultrasonic cleaning, chemical immersion, plasma treatment, etc., to thoroughly remove organic matter, heavy metals and alkali metal ions and other impurities on the surface of the wafer. However, in the actual cleaning operation process, the placement box structure of the silicon wafer is often not flexible and practical. At present, the common placement box is mostly moved by a truss or a robotic arm to complete the cleaning operations of different steps. However, since silicon wafer cleaning involves multiple complex steps and different hardware conditions in different processing sites, this conventional non-adjustable placement box is stretched in practical applications. The main problem is that the spacing of the silicon wafers in the placement box is a fixed structure and cannot be flexibly adjusted according to the changes in the cleaning steps and the processing environment, resulting in the chemical cleaning liquid on the outside failing to contact and clean the surface of the silicon wafer well, which not only affects the cleaning effect, but also limits the versatility and practicality of the placement box in different scenarios. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a modular and expandable assembly structure of photovoltaic silicon wafer production equipment to solve the technical problem that the silicon wafers are placed inside a placement box, and the spacing between each silicon wafer is a non-adjustable structure, resulting in the traditional placement box structure being limited in the face of various processing environments and cleaning steps, affecting the cleaning effect and having poor versatility.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an assembly structure of a modular and expandable photovoltaic silicon wafer production equipment, including a placement box body and silicon wafers, the placement box body including two side panels, a limit rod is arranged between the two side panels, a connecting rod is arranged on the top of the side panel, and a bottom rod is arranged on the bottom end of the side panel, the inner side surfaces of the limit rod and the connecting rod are respectively provided with a plurality of second grooves and a first groove, the inner sides of the first groove and the second groove are engaged with a mounting plate, and the top surface of the bottom rod is provided with a slot.

[0006] By adopting the above technical solution, the installation operation of multiple mounting plates can be completed according to the gap between two adjacent mounting plates and the spacing requirements between two adjacent silicon wafers, ensuring the stability of the silicon wafers during the placement process and the accuracy of the spacing.

[0007] Furthermore, the slot is opposite to the mounting plate, and the mounting plate is plugged into the slot via an insert block.

[0008] By adopting the above technical solution, the mounting plate can be accurately aligned and inserted into the slot, thereby ensuring the stability of the mounting plate and the accuracy of the position. By the insertion of the plug block into the slot, the mounting plate is firmly fixed in place and will not move or fall off during cleaning or processing, thereby ensuring the safety and reliability of the equipment.

[0009] Furthermore, a plurality of the first grooves and the second grooves are linearly arranged at equal distances along the length line of the limiting rod.

[0010] By adopting the above technical solution, the position of the mounting plate in the placement box body can be precisely controlled, and the equidistantly arranged grooves provide fixed and repeatable positioning points for the mounting plate, so that the position of the mounting plate remains consistent each time it is installed, thereby ensuring the accuracy and consistency of silicon wafer placement.

[0011] Furthermore, the mounting plate is used to space adjacent silicon wafers, and the plurality of the first grooves and the second grooves are used to adjust the mounting position of the mounting plate.

[0012] By adopting the above technical solution, it is ensured that each silicon wafer has an independent and stable space in the placement box. This spacing structure prevents mutual contact and friction between the silicon wafers, thereby reducing possible damage during processing or transportation. Each silicon wafer can be evenly and fully processed, and the best effect can be achieved whether it is cleaning, drying or other processing steps.

[0013] Furthermore, the limiting rod is detachably connected to the storage box body through bolts, and the bolts are made of stainless steel.

[0014] By adopting the above technical solution, it means that in actual applications, the limit rod can be easily disassembled and installed as needed, which provides great flexibility and facilitates equipment maintenance, component replacement and configuration adjustment. When it is necessary to change the placement spacing of the silicon wafer or clean the equipment, the operator can quickly complete the disassembly and reinstallation of the limit rod, greatly improving work efficiency.

[0015] Furthermore, the limiting rod has two but not limited to two height position forms to adapt to the size change of the silicon wafer.

[0016] By adopting the above technical solution, this diversity enables the placement box to adapt to silicon wafers of different sizes. Whether it is a larger or smaller silicon wafer, its stability and safety in the placement box can be ensured by selecting a limit rod of appropriate height. This flexibility not only meets the photovoltaic industry's demand for a variety of silicon wafer sizes, but also improves the versatility and scope of use of the equipment.

[0017] Furthermore, a gap is formed between adjacent mounting plates, and the gap is used for external chemicals to flow into the interior of the placement box body.

[0018] By adopting the above technical solution, the gap provides a channel for external chemicals to enter the interior of the placement box body. In the cleaning process of silicon wafers, the uniform flow of chemicals is crucial, which directly affects the cleaning effect and the quality of silicon wafers. The existence of the gap ensures that the chemicals can flow smoothly through each silicon wafer, achieving comprehensive and uniform contact, thereby improving the cleaning efficiency.

[0019] Furthermore, two of the placement box bodies are provided, and a hoisting mechanism is provided between the two placement box bodies for moving the placement box bodies.

[0020] By adopting the above technical solution, convenient transportation between the placement box bodies is achieved, so that during the processing of photovoltaic silicon wafers, a placement box body can be quickly moved from one workstation to another, thereby improving production efficiency.

[0021] Furthermore, the hoisting mechanism includes a hoisting rod, and a hook is provided on the outer side of the hoisting rod, and the hook is in a U-shaped structure.

[0022] By adopting the above technical solution, the lifting operation is made simpler and more efficient. The lifting rod, as the main load-bearing component, has sufficient strength and stability to bear the weight of the placement box body and the silicon wafers inside it. The hook has a U-shaped structure and can easily engage with the corresponding part on the placement box body to achieve quick connection and fixation.

[0023] Furthermore, the top of the hook is connected to a hanging frame through a clamping block.

[0024] By adopting the above technical solution, the hoisting frame can be firmly combined with the hook to form a whole, thereby improving the stability and safety of the hoisting operation.

[0025] In summary, the utility model mainly has the following beneficial effects:

[0026] 1. The utility model adjusts the gap between two adjacent mounting plates through the first groove, the second groove and the mounting plate, and can flexibly set the interval between silicon wafers according to the specific cleaning steps and the size requirements of the silicon wafers. This flexibility not only enables the equipment to adapt to a variety of processing environments, but also ensures that the silicon wafers can obtain the best treatment effect during the cleaning process. Whether facing silicon wafers of different sizes or needing to perform a variety of cleaning steps, it can provide an effective solution. At the same time, adjusting the spacing between silicon wafers is also crucial to improving cleaning accuracy and efficiency. The appropriate spacing can ensure that the cleaning liquid can evenly and fully contact the surface of each silicon wafer, thereby completely removing stains and impurities, which not only improves the cleanliness of the silicon wafer, but also shortens the cleaning time, further improving the overall production efficiency.

[0027] 2. The utility model provides a lifting mechanism, which can efficiently move the placement box body from one position to another, greatly improving the production efficiency in the photovoltaic silicon wafer processing process. Through the coordinated use of the lifting rod and the hook, the operator can easily complete the lifting and transportation of the placement box body, reducing the labor intensity and time cost of manual handling. At the same time, the lifting mechanism also ensures the stability and safety of the placement box body during the movement. The firm connection between the lifting frame and the hook can prevent the placement box body from shaking or falling off during the lifting process, thereby avoiding the risk of damage to the silicon wafer or injury to personnel. Such stability and safety not only ensure the smooth progress of the production process, but also improve the product quality and production safety level. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0029] Figure 2 This is a schematic diagram of the structure of the main body of the placement box of the utility model;

[0030] Figure 3 This is a schematic diagram of the position structure of the first groove and the second groove of the utility model;

[0031] Figure 4 It is a structural schematic diagram of the mounting plate of the utility model.

[0032] In the figure: 1. Placement box body; 101. Side panel; 102. Limit rod; 103. Connecting rod; 104. Bottom rod; 105. First groove; 106. Second groove; 107. Mounting plate; 108. Insert block; 109. Slot; 2. Silicon wafer; 3. Lifting mechanism; 301. Lifting rod; 302. Hook; 303. Lifting frame; 4. Gap. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0034] The following describes an embodiment of the utility model based on its overall structure.

[0035] Embodiment 1:

[0036] Modular and scalable assembly structure of photovoltaic silicon wafer production equipment, such as Figure 1-Figure 4 As shown, the placing box body 1 and the silicon wafer 2 are included. The placing box body 1 includes two side panels 101. A limiting rod 102 is arranged between the two side panels 101. A connecting rod 103 is arranged on the top of the side panel 101. A bottom rod 104 is arranged on the bottom end of the side panel 101. The inner side surfaces of the limiting rod 102 and the connecting rod 103 are respectively provided with a plurality of second grooves 106 and a first groove 105. A mounting plate 107 is provided in engagement with the inner sides of the first groove 105 and the second groove 106. A slot 109 is provided on the top surface of the bottom rod 104. According to the gap between two adjacent mounting plates 107 and the spacing requirements between two adjacent silicon wafers 2, the installation operation of multiple mounting plates 107 can be completed, thereby ensuring the stability of the silicon wafer 2 during the placing process and the accuracy of the spacing. At the same time, by adjusting the placement spacing between the silicon wafers 2, it adapts to different cleaning steps and hardware limitations of the processing site. This flexibility not only improves the versatility of the placing box, enabling it to adapt to a variety of processing environments, but also improves the cleaning accuracy and efficiency by optimizing the spacing between the silicon wafers.

[0037] See also Figure 2 , Figure 3 , Figure 4, slot 109 is opposite to mounting plate 107, mounting plate 107 is plugged into slot 109 through plug block 108, so that mounting plate 107 can be accurately aligned and inserted into slot 109, thereby ensuring the stability of mounting plate 107 and the accuracy of position, through the plug-in block 108 and slot 109 plug-in, mounting plate 107 is firmly fixed in place, will not move or fall off during cleaning or processing, ensuring the safety and reliability of the equipment, at the same time, this connection method between slot 109 and plug block 108 also has the advantage of convenience and speed, the operator only needs to align the plug block 108 on the mounting plate 107 with the slot 109 and insert it to complete the installation of mounting plate 107.

[0038] See also Figure 2 , Figure 3 , Figure 4 A plurality of first grooves 105 and second grooves 106 are arranged equidistantly and linearly along the length line of the limiting rod 102, ensuring that the position of the mounting plate 107 in the placement box body 1 can be precisely controlled. The equidistantly arranged grooves provide a fixed and repeatable positioning point for the mounting plate 107, so that the position of the mounting plate 107 remains consistent each time it is installed, thereby ensuring the accuracy and consistency of the placement of the silicon wafer 2. At the same time, the equidistantly and linearly arranged grooves also enhance the structural stability of the placement box body 1. The engagement of the grooves with the mounting plate 107 increases the overall rigidity, so that the placement box can remain stable when subjected to external force or vibration.

[0039] See also Figure 2 , Figure 3 , Figure 4 The mounting plate 107 is used to space adjacent silicon wafers 2, and the plurality of first grooves 105 and second grooves 106 are used to adjust the mounting position of the mounting plate 107, ensuring that each silicon wafer 2 has an independent and stable space in the placement box. This spacing structure prevents mutual contact and friction between the silicon wafers 2, thereby reducing possible damage during processing or transportation. Each silicon wafer 2 can be evenly and fully processed, and the best effect can be achieved whether it is cleaning, drying or other processing steps. At the same time, the plurality of first grooves 105 and second grooves 106 make the mounting position of the mounting plate 107 flexibly adjustable, and the operator can select a suitable groove for installation according to the specific processing requirements or the size of the silicon wafer, thereby achieving precise control of the spacing between the mounting plates.

[0040] See also Figure 2 , Figure 3 , Figure 4The limit rod 102 is detachably connected to the placement box body 1 by bolts, and the bolts are made of stainless steel, which means that in actual applications, the limit rod 102 can be easily disassembled and installed as needed, providing great flexibility and facilitating equipment maintenance, replacement of parts and adjustment of configuration. When it is necessary to change the placement spacing of the silicon wafer 2 or to clean the equipment, the operator can quickly complete the disassembly and reinstallation of the limit rod 102, greatly improving work efficiency. At the same time, the material of the bolts is stainless steel because stainless steel has excellent corrosion resistance and mechanical strength. In the operating environment of the photovoltaic equipment, corrosive substances such as chemical cleaning fluids and water vapor may be encountered, and stainless steel bolts can effectively resist these corrosions, maintain the stability and safety of the connection, and avoid the occurrence of some side reactions.

[0041] See also Figure 2 , Figure 3 The limit rod 102 has two but not limited to two height position forms to adapt to the size changes of the silicon wafer 2. This diversity enables the placement box to adapt to silicon wafers 2 of different sizes. Whether it is a larger or smaller silicon wafer 2, its stability and safety in the placement box can be ensured by selecting a limit rod 102 of appropriate height. This flexibility not only meets the photovoltaic industry's demand for a variety of silicon wafer sizes, but also improves the versatility and scope of use of the equipment. At the same time, by adjusting the height of the limit rod 102, we can also optimize the spacing between silicon wafers 2 to adapt to different cleaning and processing requirements.

[0042] See also Figure 2 , Figure 4 A gap 4 is formed between adjacent mounting plates 107. The gap 4 is used for external chemicals to circulate with the inside of the placement box body 1. The gap 4 provides a channel for external chemicals to enter the inside of the placement box body 1. In the cleaning process of the silicon wafer 2, the uniform circulation of chemicals is very important, which directly affects the cleaning effect and the quality of the silicon wafer. The existence of the gap 4 ensures that the chemicals can flow smoothly through each silicon wafer 2 to achieve comprehensive and uniform contact, thereby improving the cleaning efficiency. At the same time, the gap 4 also helps to optimize the fluid dynamics characteristics inside the placement box body 1. By reasonably adjusting the size and distribution of the gap, the flow speed and direction of the chemicals in the placement box can be controlled to avoid the generation of eddy currents or dead corners, thereby further improving the cleaning effect.

[0043] Embodiment 2:

[0044] See also Figure 1 , Figure 2There are two placement box bodies 1, and a lifting mechanism 3 is provided between the two placement box bodies 1 for moving the placement box bodies 1, thereby realizing convenient movement between the placement box bodies 1, so that during the processing of photovoltaic silicon wafers, one placement box body 1 can be quickly moved from one workstation to another, thereby improving production efficiency. At the same time, the application of the lifting mechanism 3 also ensures the stability and safety of the placement box body 1 during the movement. Through the firm connection and precise control of the lifting mechanism 3, the risk of collision or damage to the silicon wafer during the movement can be avoided.

[0045] See also Figure 1 The lifting mechanism 3 includes a lifting rod 301, and a hook 302 is arranged on the outer side of the lifting rod 301. The hook 302 has a U-shaped structure, which makes the lifting operation simpler and more efficient. The lifting rod 301, as the main load-bearing component, has sufficient strength and stability to bear the weight of the placement box body 1 and the silicon wafers therein. The hook 302 has a U-shaped structure and can be easily engaged with the corresponding part on the placement box body 1 to achieve quick connection and fixation. At the same time, the U-shaped hook 302 also provides good stability and safety, and prevents it from sliding or falling off during the lifting process, thereby ensuring the smooth progress of the lifting operation and effectively protecting the silicon wafers from damage.

[0046] See also Figure 1 The top of the hook 302 is connected to the hanging frame 303 through a clamping block, so that the hanging frame 303 can be firmly combined with the hook 302 to form a whole, which improves the stability and safety of the hanging operation. At the same time, the clamping connection method facilitates the installation and disassembly of the hanging frame 303, making it easier and faster to operate when the hanging frame 303 needs to be replaced or repaired. This flexibility not only improves the practicability of the equipment, but also reduces maintenance costs.

[0047] The implementation principle of the utility model is as follows: first, the limiting rod 102 is installed on the inner side of the two side plates 101 by bolts, and then the mounting plate 107 is engaged with the connecting rod 103 and the limiting rod 102 through the first groove 105 and the second groove 106. At the same time, the plug block 108 is engaged with the slot 109 on the bottom rod 104 to complete the installation of a single mounting plate 107. Then, according to the required gap between two adjacent mounting plates 107 and the spacing between two adjacent silicon wafers 2, multiple mounting plates 107 are installed, which is conducive to adjusting the placement spacing between silicon wafers 2 to adapt to the cleaning operations of various steps and the hardware limitations of different processing sites, and improve the versatility of the placement box. By adjusting the spacing between two adjacent silicon wafers 2, it is intended to adapt to various processing environments and improve the cleaning accuracy and efficiency of silicon wafers 2.

[0048] The silicon wafer 2 is placed between two adjacent mounting plates 107 in sequence to complete the placement of the silicon wafer 2, and then the hook 302 and the lifting rod 301 are used to complete the locking installation, and the placement box body 1 and the silicon wafer 2 inside are moved by the lifting frame 303 on the top, and subsequent cleaning operations are performed to improve the ease of use of the placement box body 1.

[0049] Parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art, and will not be described in detail here.

[0050] Although an embodiment of the utility model has been shown and described, this specific embodiment is only an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. A modular and scalable assembly structure for photovoltaic silicon wafer production equipment, characterized by: The invention comprises a storage box body (1) and a silicon wafer (2), wherein the storage box body (1) comprises two side panels (101), a limiting rod (102) is arranged between the two side panels (101), a connecting rod (103) is arranged at the top of the side panel (101), a bottom rod (104) is arranged at the bottom end of the side panel (101), the inner side surfaces of the limiting rod (102) and the connecting rod (103) are respectively provided with a plurality of second grooves (106) and a first groove (105), the inner sides of the first groove (105) and the second groove (106) are engaged with a mounting plate (107), and the top surface of the bottom rod (104) is provided with a slot (109).

2. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: The slot (109) is located opposite to the mounting plate (107), and the mounting plate (107) is plugged into the slot (109) via an insert block (108).

3. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: The plurality of first grooves (105) and second grooves (106) are arranged linearly and equidistantly along the length line of the limiting rod (102).

4. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: The mounting plate (107) is used to space adjacent silicon wafers (2), and the plurality of the first grooves (105) and the second grooves (106) are used to adjust the mounting position of the mounting plate (107).

5. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: The limiting rod (102) is detachably connected to the storage box body (1) via bolts, and the bolts are made of stainless steel.

6. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: The limiting rod (102) has two, but not limited to, height position forms, so as to adapt to the size change of the silicon wafer (2).

7. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: A gap (4) is formed between adjacent mounting plates (107), and the gap (4) is used for external chemical agents to flow into the interior of the placement box body (1).

8. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 1, characterized in that: Two storage box main bodies (1) are provided, and a lifting mechanism (3) is provided between the two storage box main bodies (1) for moving the storage box main bodies (1).

9. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 8, characterized in that: The hoisting mechanism (3) comprises a hoisting rod (301), the outer side of the hoisting rod (301) is provided with a hook (302) for engagement, and the hook (302) is in a U-shaped structure.

10. The assembly structure of the modular and expandable photovoltaic silicon wafer production equipment according to claim 9, characterized in that: The top of the hook (302) is connected to a hanging frame (303) via a clamping block.

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