Silicon wafer feeding mechanism for ion implanter

Abstract

The utility model discloses a silicon wafer feeding mechanism for an ion implanter, which belongs to the technical field of ion implanters and is used for solving the problem that a sliding plate is easy to drive a silicon wafer to slide out together and the silicon wafer is impacted and damaged when a feeding device moves in case of emergency braking. Comprising a loading mechanism; the four rotating rods carry the baffles to rotate under the action of the rotating seats in sequence, the four baffles limit the four corners of the sliding plate respectively, then the fixing pins are rotated to enable the limiting discs in the fixing pins to slide in the second sliding grooves, at the moment, the fixing pins can be inserted into the fixing grooves under the action of the springs, and the positions of the baffles can be fixed at the moment; and at the moment, when emergency braking is encountered, the sliding plate does not move any more, and the problems that the sliding plate slides out of the second placement frame in the emergency braking process, the silicon wafers in the sliding plate collide with the ground or the surface of the second placement frame, and the silicon wafers are damaged are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of ion implanters, and in particular relates to a silicon wafer feeding mechanism for an ion implanter. Background Art

[0002] Ion beam implanters are one of the most critical doping equipment in semiconductor device manufacturing. Ion implantation is a technique for doping areas near the surface of a semiconductor, with the goal of changing the carrier concentration and conductivity type of the semiconductor. Ion implanters can meet requirements such as shallow junctions, low temperatures, and precise control, and have become an essential key piece of equipment in the integrated circuit manufacturing process.

[0003] For example, an adjustable height silicon wafer loading device for an ion implanter with the authorization publication number CN215578445U has a lifting device between the bracket and the bottom plate, which drives the bracket to rise or fall so that the inlet and outlet layers are at the same height as the silicon wafer inlet and outlet. When placing the sliding plate carrying the silicon wafers into the silicon wafer inlet and outlet, the operator only needs to push the sliding plate in the horizontal direction without moving the slide plate up and down, which is conducive to saving labor. Since the sliding plate and the outlet layer are in a sliding mode, when the entire loading device is moving, if emergency braking is encountered, the sliding plate is likely to drive the silicon wafer to slide out of the outlet layer, causing the silicon wafer to be hit and damaged. For this reason, we propose a silicon wafer loading mechanism for an ion implanter. Utility Model Content

[0004] The utility model aims to provide a silicon wafer feeding mechanism for an ion implanter to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a silicon wafer loading mechanism for an ion implanter, comprising a movable base, a servo electric cylinder is provided at the upper end of the movable base, a storage box is provided at the output end of the servo electric cylinder, a first placement rack is provided inside the storage box, a loading mechanism is provided on the upper surface of the storage box, the loading mechanism comprises a second placement rack, a support plate is provided on the upper surface of the second placement rack, a sliding rod is provided on the side of the support plate, and a sliding rod is also provided on the inner side wall of the first placement rack, a sliding plate is slidably connected to the circumferential surface of the sliding rod, a concave hole is provided inside the sliding plate, a rotating seat is provided on the upper surface of the second placement rack, a rotating rod is rotatably connected to the inside of the rotating seat, a baffle is provided on the circumferential surface of the rotating rod, a second slide groove is provided at one end of the baffle away from the rotating rod, a limiting groove is provided inside the second slide groove, a fixing pin is slidably connected to the inside of the second slide groove, a limiting disk is provided on the circumferential surface of the fixing pin, a spring is provided between the limiting disk and the second slide groove, and a fixing groove is provided inside the second placement rack.

[0006] Preferably, the rotating seat, rotating rod, baffle, fixing pin, limiting plate and spring are provided in four groups and are respectively located at the four corners of the upper surface of the second placement rack. The fixing pins are provided in four groups at the four corners of the upper surface of the second placement rack.

[0007] Preferably, a first slide groove is provided inside the storage box, the interior of the first slide groove is slidably connected to a limit plate, and a handle is provided on the side of the limit plate.

[0008] Compared with the prior art, the beneficial effects of the utility model are:

[0009] (1) A silicon wafer loading mechanism for an ion implanter. When the loading device carries the silicon wafers to a designated position, the four rotating rods carrying the baffles can be rotated in turn under the action of a rotating seat, so that the four baffles respectively support and limit the four corners of the sliding plate. Then, the fixing pin is rotated to make the limiting plate in the fixing pin slide in the second sliding groove. At this time, the fixing pin can be inserted into the fixing groove under the action of a spring. At this time, the position of the baffle can be fixed, thereby playing a role in stabilizing the sliding plate. At this time, when the loading device is loaded with silicon wafers and encounters an emergency brake, the sliding plate will not move again, thereby preventing the sliding plate from sliding out of the second placement rack during emergency braking, causing the silicon wafers in the sliding plate to collide with the ground or the surface of the second placement rack, thereby damaging the silicon wafers.

[0010] (2) The silicon wafer loading mechanism for an ion implanter can limit the sliding plate placed in the first placement rack by pushing the handle to completely push the limit plate into the first slide groove in the storage box, so as to prevent the sliding plate from being suddenly braked and sliding out of the first placement rack with the silicon wafer when the device is subsequently moved with the silicon wafer loaded, thereby causing the silicon wafer to collide with the ground and cause damage to the silicon wafer.

[0011] (3) When the loading device carries the silicon wafers to the designated position and the sliding plate loaded with the silicon wafers needs to be unloaded, the four fixing pins can be pulled upward in sequence so that the limit disk on the circumferential surface of the fixing pin is inserted into the limit groove. At this time, the position of the fixing pin will be fixed and disengaged from the fixing groove. At this time, the baffle plate can be rotated again to release the limit on the sliding plate inside the second placement rack. Then, the sliding plate can be manually pushed out of the second placement rack under the action of the sliding rod to unload the silicon wafers. When unloading the sliding plate in the first placement rack, the limit plate can be pulled outward to release the limit on the sliding plate in the first placement rack. Then, the limit plate and the silicon wafers can be unloaded, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0013] Figure 2It is a three-dimensional structural schematic diagram of the limiting plate of the utility model;

[0014] Figure 3 It is a three-dimensional structural schematic diagram of the material loading mechanism of the utility model;

[0015] Figure 4 This is a schematic diagram of the explosion structure of the baffle of the utility model;

[0016] Figure 5 It is a schematic diagram of the cross-sectional three-dimensional structure of the second placement rack of the utility model.

[0017] In the figure: 10, movable base; 11, servo electric cylinder; 12, storage box; 13, first placement rack; 14, first slide; 15, limit plate; 16, handle; 20, loading mechanism; 21, second placement rack; 22, support plate; 23, slide rod; 24, sliding plate; 25, rotating seat; 26, rotating rod; 27, baffle; 28, second slide; 29, limit slot; 210, fixing pin; 211, limit plate; 212, spring; 213, fixing slot. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-Figure 5 The utility model provides a silicon wafer loading mechanism for an ion implanter, comprising a movable base 10, a servo electric cylinder 11 is arranged at the upper end of the movable base 10, a storage box 12 is arranged at the output end of the servo electric cylinder 11, a first placement rack 13 is arranged inside the storage box 12, a loading mechanism 20 is arranged on the upper surface of the storage box 12, the loading mechanism 20 comprises a second placement rack 21, a support plate 22 is arranged on the upper surface of the second placement rack 21, a slide bar 23 is arranged on the side of the support plate 22, and a slide bar 23 is also arranged on the inner side wall of the first placement rack 13, a slide plate 24 is slidably connected to the circumferential surface of the slide bar 23, a concave hole is arranged inside the slide plate 24, wherein the concave hole is used to store silicon wafers, a first slide groove 14 is arranged inside the storage box 12, a limit plate 15 is slidably connected inside the first slide groove 14, and a handle 16 is arranged on the side of the limit plate 15.

[0020] It should be noted that the storage box 12 can be driven to move up and down by operating the servo electric cylinder 11, and the sliding plate 24 in the second placement rack 21 at the upper end of the storage box 12 is adjusted according to the height of the silicon wafer feed port of the ion implanter so that the sliding plate 24 loaded with silicon wafers can be slid into the silicon wafer feed port of the implanter for loading under the action of the sliding rod 23. At the same time, it is also convenient for pulling out the sliding plate 24 loaded with silicon wafers from the silicon wafer feed port of the implanter for unloading through the sliding rod 23 after the particle implantation is completed. In the second placement rack 21, the storage box 12 and the first placement rack 13 can be used as a storage place for the spare sliding plate 24 when the second placement rack 21 is full. When the ion implantation is completed, the limit plate 15 can be pushed completely into the first slide groove 14 in the storage box 12 by pushing the handle 16 to limit the sliding plate 24 placed in the first placement rack 13, so as to avoid the sliding plate 24 sliding out of the first placement rack 13 with the silicon wafer when the device is loaded with silicon wafers for movement later, causing the silicon wafer to collide with the ground and cause damage to the silicon wafer.

[0021] A rotating seat 25 is provided at the four corners of the upper surface of the second placement rack 21, and a rotating rod 26 is rotatably connected inside the rotating seat 25. A baffle 27 is provided on the circumferential surface of the rotating rod 26, and a second slide groove 28 is provided at the end of the baffle 27 away from the rotating rod 26. A limiting groove 29 is provided inside the second slide groove 28, and a fixing pin 210 is slidably connected inside the second slide groove 28. A limiting plate 211 is provided on the circumferential surface of the fixing pin 210, and a spring 212 is provided between the limiting plate 211 and the second slide groove 28, and a fixing groove 213 is provided inside the second placement rack 21.

[0022] It should be noted that, when the ion implantation is completed, the sliding plate 24 loaded with silicon wafers is put back into the second placement rack 21, and when the loading device needs to be used to carry the silicon wafers to the designated position, the four rotating rods 26 can be rotated in turn with the baffles 27 under the action of the rotating seat 25, so that the four baffles 27 respectively support and limit the four corners of the sliding plate 24, and then the fixing pin 210 is rotated to make the limiting plate 211 in the fixing pin 210 slide in the second slide groove 28. At this time, under the action of the spring 212, the fixing pin 210 can be inserted into the fixing groove 213, so that the position of the baffle 27 can be fixed, thereby playing the role of stabilizing the sliding plate 24. At this time, when the loading device is loaded with silicon wafers and encounters emergency braking again, the sliding plate 24 will not move again, thereby preventing the sliding plate 24 from sliding out of the second placement rack 21 during emergency braking, so that the silicon wafers in the sliding plate 24 The plate 213 collides with the ground or the surface of the second placement rack 21, causing damage to the silicon wafer. When the loading device carries the silicon wafer to the specified position and needs to unload the sliding plate 24 loaded with the silicon wafer, the four fixing pins 210 can be pulled upward in sequence to make the limiting plate 211 on the circumferential surface of the fixing pin 210 snap into the limiting groove 29. At this time, the position of the fixing pin 210 will be fixed and disengaged from the fixing groove 213. At this time, the baffle plate 27 can be rotated again to release the limit of the sliding plate 24 inside the second placement rack 21. Then, the sliding plate 24 can be manually pushed out of the second placement rack 21 under the action of the sliding rod 23 to unload it, and then the silicon wafer can be unloaded. When unloading the sliding plate 24 in the first placement rack 13, the limiting plate 15 on the sliding plate 24 in the first placement rack 13 can be released by pulling the limiting plate 15 outward, and then the limiting plate 15 and the silicon wafer can be unloaded.

[0023] The working principle and use process of the utility model are as follows: when the device is used, the storage box 12 can be driven to rise and fall by operating the servo electric cylinder 11, and the sliding plate 24 in the second placement rack 21 at the upper end of the storage box 12 is adjusted according to the height of the silicon wafer feed port of the ion implanter, so that the height of the silicon wafer feed port is flush, and at this time, the sliding plate 24 loaded with silicon wafers can be easily slid into the silicon wafer feed port of the implanter under the action of the slide bar 23 for loading, and it is also convenient for pulling out the sliding plate 24 loaded with silicon wafers from the silicon wafer feed port of the implanter after the particle injection is completed, and unloading the silicon wafers into the second placement rack 21 through the slide bar 23, wherein the storage The box 12 and the first placement rack 13 can be used as a storage place for the spare sliding plate 24 when the second placement rack 21 is full. When the ion implantation is completed, the limit plate 15 can be pushed completely into the first slide groove 14 in the storage box 12 by pushing the handle 16 to limit the sliding plate 24 placed in the first placement rack 13, so as to avoid the sliding plate 24 sliding out of the first placement rack 13 with the silicon wafer when the device is loaded with silicon wafers for subsequent movement, causing the silicon wafer to collide with the ground and cause damage to the silicon wafer. At the same time, after the ion implantation is completed, the four rotating rods 26 are rotated in turn with the baffle 27 under the action of the rotating seat 25. The four baffles 27 are respectively used to support and limit the four corners of the sliding plate 24, and then the fixing pin 210 is rotated to make the limiting plate 211 in the fixing pin 210 slide in the second slide groove 28. At this time, under the action of the spring 212, the fixing pin 210 can be inserted into the fixing groove 213, and the position of the baffle 27 can be fixed, thereby playing a role in stabilizing the position of the sliding plate 24. At this time, when the loading device is loaded with silicon wafers and encounters emergency braking again, the sliding plate 24 will not move again, thereby preventing the sliding plate 24 from sliding out of the second placement rack 21 during emergency braking, so that the silicon wafers in the sliding plate 24 are in contact with the ground or the second placement rack 21. The surface of the rack 21 collides with the disk, causing damage to the silicon wafer. When the loading device carries the silicon wafer to the specified position and needs to unload the sliding plate 24 loaded with the silicon wafer, the four fixing pins 210 can be pulled upward in sequence to make the limiting disk 211 on the circumferential surface of the fixing pin 210 snap into the limiting groove 29. At this time, the position of the fixing pin 210 will be fixed and disengaged from the fixing groove 213. At this time, rotating the baffle 27 can release the limiting of the sliding plate 24 inside the second placement rack 21, and then the limiting plate 15 can be pulled outward to release the limiting of the sliding plate 24 in the first placement rack 13, and finally the silicon wafer can be unloaded.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer loading mechanism for an ion implanter, comprising a movable base (10), a servo electric cylinder (11) being provided at the upper end of the movable base (10), a storage box (12) being provided at the output end of the servo electric cylinder (11), a first placement rack (13) being provided inside the storage box (12), a loading mechanism (20) being provided on the upper surface of the storage box (12), the loading mechanism (20) comprising a second placement rack (21), a support plate (22) being provided on the upper surface of the second placement rack (21), a sliding rod (23) being provided on the side surface of the support plate (22), and a sliding rod (23) being also provided on the inner side wall of the first placement rack (13), a sliding plate (24) being slidably connected to the circumferential surface of the sliding rod (23), a concave hole being provided inside the sliding plate (24), characterized in that: The upper surface of the second placement rack (21) is provided with a rotating seat (25), the interior of the rotating seat (25) is rotatably connected to a rotating rod (26), the circumferential surface of the rotating rod (26) is provided with a baffle (27), the end of the baffle (27) away from the rotating rod (26) is provided with a second slide groove (28), the interior of the second slide groove (28) is provided with a limiting groove (29), the interior of the second slide groove (28) is slidably connected to a fixing pin (210), the circumferential surface of the fixing pin (210) is provided with a limiting plate (211), a spring (212) is provided between the limiting plate (211) and the second slide groove (28), and the interior of the second placement rack (21) is provided with a fixing groove (213).

2. The silicon wafer feeding mechanism for an ion implanter according to claim 1, characterized in that: The rotating seat (25), the rotating rod (26), the baffle (27), the fixing pin (210), the limiting plate (211), and the spring (212) are provided in four groups and are respectively located at the four corners of the upper surface of the second placement rack (21). The fixing pin (210) is provided in four groups at the four corners of the upper surface of the second placement rack (21).

3. The silicon wafer feeding mechanism for an ion implanter according to claim 1, characterized in that: A first slide groove (14) is provided inside the storage box (12), and a limit plate (15) is slidably connected inside the first slide groove (14), and a handle (16) is provided on the side of the limit plate (15).

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