Carrying structure of semiconductor substrate

Abstract

The utility model relates to the technical field of semiconductor substrates, in particular to a semiconductor substrate carrying structure, which comprises a main body structure, a flange connecting plate, two reinforcing connecting blocks, two first fastener screws, two second fastener screws and a third fastener screw. The number of the first fastener screws is multiple, the number of the third fastener screws is four, the inner wall face and the left end of the body structure are each fixedly connected with a plurality of air inlet connectors, the upper end of the body structure is fixedly connected with a plurality of suction cups, and the middle of the left end of the body structure is fixedly connected with a connecting plate. According to the carrying structure of the semiconductor substrate, the air inlet connectors and the suckers are connected in a one-to-one mode, so that the difficulty of an airflow channel is effectively solved, overflowing of airflow is completely eradicated, the suction force of the suckers is increased, and an effective carrying method is provided for carrying the semiconductor substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor substrates, in particular to a conveying structure of semiconductor substrates. Background Art

[0002] In the semiconductor manufacturing process, semiconductor substrates need to be transported and transferred to complete various process steps. However, due to the particularity of semiconductor substrates, such as thinness, fragility, and sensitivity to static electricity, the traditional transport method has some problems. The existing semiconductor substrate transport structure is relatively simple. When in use, the distribution of the suction cups is prone to airflow overflow and poor adsorption strength, which affects the transport work. Therefore, we introduce a semiconductor substrate transport structure. Utility Model Content

[0003] The main purpose of the utility model is to provide a semiconductor substrate conveying structure, which can effectively solve the problems in the background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A semiconductor substrate handling structure comprises a main structure, a flange connection plate, a reinforcement connection block, a first fastener screw, a second fastener screw and a third fastener screw, wherein two of the reinforcement connection block and the second fastener screw are provided, a plurality of the first fastener screws are provided, and four of the third fastener screws are provided, a plurality of air inlet joints are fixedly connected to the inner wall surface and the left end of the main structure, a plurality of suction cups are fixedly connected to the upper end of the main structure, and a connection plate is fixedly connected to the middle of the left end of the main structure.

[0006] Preferably, two first fixing holes penetrating vertically are formed on the left portion of the upper end of the connecting plate, and a plurality of second fixing holes are formed on the left end of the connecting plate.

[0007] Preferably, two third fixing holes are opened at the left ends of the two reinforced connecting blocks, the left ends of the two reinforced connecting blocks are fixedly connected to the upper right end of the flange connecting plate, and the upper ends of the two reinforced connecting blocks are fixedly connected to the lower end of the connecting plate.

[0008] Preferably, outer surfaces of the two second fastener screws are respectively threadedly connected to the inner wall surfaces of the corresponding two first fixing holes and respectively extend to the upper ends of the corresponding two reinforced connection blocks.

[0009] Preferably, a plurality of fourth fixing holes passing through left and right are formed at the upper left end of the flange connecting plate, and two fifth fixing holes passing through left and right are formed at the front left end and the rear left end of the flange connecting plate.

[0010] Preferably, outer surfaces of a plurality of the first fastener screws are respectively threadedly connected to inner wall surfaces of a corresponding plurality of fourth fixing holes and respectively extend into a corresponding plurality of second fixing holes.

[0011] Preferably, outer surfaces of the four third fastener screws are respectively threadedly connected to inner wall surfaces of the corresponding four fifth fixing holes and respectively extend into the corresponding four third fixing holes.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. In the present invention, the size of the main structure is controlled to effectively solve the space limitation of the material box in semiconductor transportation;

[0014] 2. The combined use of several suction cups effectively solves the difficulty of small suction cups adsorbing large products;

[0015] 3. The one-to-one connection between the air inlet connector and the suction cup effectively solves the difficulty of the air flow channel, prevents the overflow of the air flow, and increases the suction force of the suction cup, thereby providing an effective transportation method for semiconductor substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor substrate handling structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the combined connection structure of an air inlet connector, a suction cup, a main structure, a reinforcing connection block, a connection plate, and a second fastener screw of a semiconductor substrate handling structure of the utility model;

[0018] Figure 3 This is a structural schematic diagram of a connecting plate of a semiconductor substrate transport structure of the utility model;

[0019] Figure 4 The utility model is a structural schematic diagram of a flange connecting plate of a semiconductor substrate conveying structure.

[0020] In the figure: 1. air inlet connector; 2. suction cup; 3. first fastener screw; 4. flange connecting plate; 5. main structure; 6. reinforcing connecting block; 7. connecting plate; 8. first fixing hole; 9. second fixing hole; 10. third fixing hole; 11. second fastener screw; 12. third fastener screw; 13. fourth fixing hole; 14. fifth fixing hole. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] See also Figure 1-4 , the utility model provides a technical solution:

[0025] A semiconductor substrate handling structure includes a main structure 5, a flange connecting plate 4, a reinforcing connecting block 6, a first fastener screw 3, a second fastener screw 11 and a third fastener screw 12, wherein two of the reinforcing connecting block 6 and the second fastener screw 11 are provided, a plurality of first fastener screws 3 are provided, and four third fastener screws 12 are provided, a plurality of air inlet joints 1 are fixedly connected to the inner wall surface and the left end of the main structure 5, a plurality of suction cups 2 are fixedly connected to the upper end of the main structure 5, and a connecting plate 7 is fixedly connected to the middle of the left end of the main structure 5.

[0026] In this embodiment, two first fixing holes 8 are opened on the left upper end of the connecting plate 7, and a plurality of second fixing holes 9 are opened on the left end of the connecting plate 7; two third fixing holes 10 are opened on the left ends of the two reinforcing connecting blocks 6, and the left ends of the two reinforcing connecting blocks 6 are fixedly connected to the upper right end of the flange connecting plate 4. The flange circular part of the flange connecting plate 4 can be connected to the terminal shaft of the handling robot, and the robot drives the entire handling mechanism to perform the handling action. The upper ends of the two reinforcing connecting blocks 6 are fixedly connected to the lower end of the connecting plate 7, and a plurality of air inlet joints 1 are connected in series through air pipes and joints, and pass through the circular holes of the flange adapter plate 4 to connect the air source through the pipeline package of the robot; the outer surfaces of the two second fastener screws 11 are respectively threadedly connected to the inner wall surfaces of the corresponding two first fixing holes 8 and They extend to the upper ends of the corresponding two reinforced connecting blocks 6 respectively; a plurality of fourth fixing holes 13 are opened on the upper left end of the flange connecting plate 4, and two fifth fixing holes 14 are opened on the left front and left rear ends of the flange connecting plate 4; the outer surfaces of a plurality of first fastener screws 3 are respectively threadedly connected with the inner wall surfaces of the corresponding plurality of fourth fixing holes 13 and respectively extend to the corresponding plurality of second fixing holes 9, and the connection and fixation of the connecting plate 7 and the flange connecting plate 4 are realized by the plurality of first fastener screws 3, and the flange connecting plate 4 and the main structure 5 are connected by the connection of the connecting plate 7; the outer surfaces of the four third fastener screws 12 are respectively threadedly connected with the inner wall surfaces of the corresponding four fifth fixing holes 14 and respectively extend to the corresponding four third fixing holes 10.

[0027] It should be noted that the utility model is a semiconductor substrate transport structure. During use, when the semiconductor substrate transport structure is used, the air inlet connector 1 is first connected to the air source, and the gas provided by the air source enters the main structure 5 through the air inlet connector 1. Then, by controlling the pressure of the air source, the suction cup 2 can generate negative pressure, thereby adsorbing the semiconductor substrate. After adsorbing the semiconductor substrate, the entire transport structure is moved to a specified position by a transport robot. During the movement, the strengthening of the connecting block 6 and the second fastener screw 11 can enhance the connection strength between the connecting plate 7 and the flange connecting plate 4 to ensure stability during the transport process. When the semiconductor substrate needs to be placed at the target position, the suction cup 2 can release the negative pressure by controlling the pressure of the air source, thereby putting down the semiconductor substrate.

[0028] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor substrate handling structure, comprising a main structure (5), a flange connection plate (4), a reinforcing connection block (6), a first fastener screw (3), a second fastener screw (11) and a third fastener screw (12), characterized in that: The reinforcing connection block (6) and the second fastener screw (11) are both provided with two, the first fastener screw (3) is provided with a plurality, the third fastener screw (12) is provided with four, the inner wall surface and the left end of the main structure (5) are both fixedly connected with a plurality of air inlet joints (1), the upper end of the main structure (5) is fixedly connected with a plurality of suction cups (2), and the middle part of the left end of the main structure (5) is fixedly connected with a connecting plate (7).

2. A semiconductor substrate handling structure according to claim 1, characterized in that: The left portion of the upper end of the connecting plate (7) is provided with two first fixing holes (8) penetrating vertically, and the left end of the connecting plate (7) is provided with a plurality of second fixing holes (9).

3. The semiconductor substrate transport structure according to claim 1, characterized in that: The left ends of the two reinforcing connection blocks (6) are each provided with two third fixing holes (10); the left ends of the two reinforcing connection blocks (6) are each fixedly connected to the upper right end of the flange connection plate (4); and the upper ends of the two reinforcing connection blocks (6) are each fixedly connected to the lower end of the connection plate (7).

4. The semiconductor substrate transport structure according to claim 2, characterized in that: The outer surfaces of the two second fastener screws (11) are respectively threadedly connected to the inner wall surfaces of the corresponding two first fixing holes (8) and respectively extend to the upper ends of the corresponding two reinforcement connection blocks (6).

5. The semiconductor substrate transport structure according to claim 3, characterized in that: The upper left end of the flange connecting plate (4) is provided with a plurality of fourth fixing holes (13) passing therethrough, and the front left end and the rear left end of the flange connecting plate (4) are both provided with two fifth fixing holes (14) passing therethrough.

6. The semiconductor substrate transport structure according to claim 5, characterized in that: The outer surfaces of the plurality of first fastener screws (3) are respectively threadedly connected to the inner wall surfaces of the corresponding plurality of fourth fixing holes (13) and respectively extend into the corresponding plurality of second fixing holes (9).

7. The semiconductor substrate transport structure according to claim 5, characterized in that: The outer surfaces of the four third fastener screws (12) are respectively threadedly connected to the inner wall surfaces of the corresponding four fifth fixing holes (14) and respectively extend into the corresponding four third fixing holes (10).

Images