Array liquid cooling type high-power semiconductor laser

Abstract

The utility model discloses an array liquid cooling type high-power semiconductor laser, and relates to the technical field of semiconductor lasers. The laser device comprises a laser device main body, a top cover and a power supply port, a cooling assembly is arranged on the bottom surface of the top cover, the cooling assembly comprises a cooling liquid plate, the cooling liquid plate is provided with a pressing block, and the pressing block is used for limiting and pressing a connecting wire at a positive electrode end and a negative electrode end, so that the connecting wire is prevented from being damaged, and the service life of the laser device is prolonged. According to the utility model, the condition that the circuit falls off in the use process is effectively prevented, so that the connection stability of the power line is enhanced, specifically, the pressing block limits and presses the connection circuit through physical pressure, and when the pressing block is inserted into the empty slot, the pressing block applies certain pressure to the connection line at the positive electrode end and the negative electrode end, so that the connection line is tightly fixed in place; the pressure ensures the tight contact between the connecting line and the semiconductor group, reduces the risk of poor contact or looseness, and reduces the risk of faults such as line falling in the use process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser technology, specifically to an array liquid-cooled high-power semiconductor laser. Background Technology

[0002] High-power semiconductor lasers are lasers with high photoelectric conversion efficiency, small size, and long lifespan. They are widely used in medical, industrial, and military fields. In the field of lidar, high-power semiconductor lasers are an important component.

[0003] During prolonged use, the semiconductor in existing lasers generates a large amount of heat. To ensure safety, lasers are typically encased in an opaque design. This can lead to excessive heat buildup in the internal wiring, causing connections to become loose or even detach, resulting in safety incidents and reducing the overall safety of the laser. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide an array liquid-cooled high-power semiconductor laser to solve the technical problem of poor connection caused by excessive heat in the internal connection lines of the laser.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an array liquid-cooled high-power semiconductor laser, comprising a laser body, a top cover, and a power port. A cooling assembly is provided on the bottom surface of the top cover, the cooling assembly comprising a coolant plate, and a pressure block is provided on the coolant plate. A semiconductor laser group is provided inside the laser body, the semiconductor laser group comprising a first semiconductor group and a second semiconductor group, a slot being formed between the first semiconductor group and the second semiconductor group, and positive and negative terminals being provided on opposite sides of the first semiconductor group and the second semiconductor group.

[0006] By adopting the above technical solution, the connection lines of the array liquid-cooled high-power semiconductor laser are stably fixed in place through the limiting and pressing action of the pressure block, thereby ensuring the normal transmission of current and the normal operation of the laser. This stability enhances the reliability and service life of the laser.

[0007] Furthermore, both the first semiconductor group and the second semiconductor group are composed of multiple individual semiconductor laser arrays.

[0008] By adopting the above technical solution, multiple individual semiconductor laser arrays are combined together, and the first semiconductor group and the second semiconductor group can work simultaneously, thereby achieving higher power output. This design enables the array laser to have stronger beam capability and higher energy density, improving the quality and characteristics of the beam.

[0009] Furthermore, the pressure block is inserted into the empty slot, and the coolant plate and the pressure block form a "T" shape.

[0010] By adopting the above technical solution, the "T"-shaped coolant plate and pressure block design increases the contact area, which helps to optimize the heat conduction path. This design enables the coolant to absorb the heat generated by the semiconductor assembly more efficiently and carry it away, thereby improving the cooling effect and heat dissipation efficiency.

[0011] Furthermore, both the coolant plate and the pressure block are equipped with coolant pipes inside, and an insulating layer is adhered to the outside of the coolant plate and the pressure block.

[0012] By adopting the above technical solution, the presence of the coolant pipe allows the coolant to flow directly through the coolant plate and the pressure block, making close contact with the semiconductor assembly, thereby more effectively absorbing and carrying away the generated heat. This design enhances the cooling effect and helps maintain the semiconductor assembly within a suitable operating temperature range.

[0013] Furthermore, a liquid storage box is provided on the top surface of the top cover, and the liquid storage box is connected to the coolant plate through an inlet pipe and an outlet pipe.

[0014] By adopting the above technical solution, the liquid storage box, as a storage and supply device for coolant, can ensure that the laser always has sufficient coolant during operation. It is connected to the coolant plate through the inlet and outlet pipes, forming a closed-loop coolant circulation system, thereby ensuring the continuous supply and circulation of coolant.

[0015] Furthermore, multiple heat dissipation fins are provided on both sides of the liquid storage box, and the multiple heat dissipation fins are arranged linearly at equal intervals along the length line of the liquid storage box.

[0016] By adopting the above technical solution, the presence of heat dissipation fins greatly increases the heat dissipation area of ​​the liquid storage box. Compared with the smooth surface of the liquid storage box, the heat dissipation fins provide more heat dissipation paths, enabling heat to be dissipated into the surrounding environment more quickly, ensuring uniform heat distribution and efficient conduction.

[0017] Furthermore, a liquid pump is installed on the liquid storage box, and the liquid pump is electrically connected to an external power source via a controller.

[0018] By adopting the above technical solution, the installation of the liquid pump enables the coolant to circulate between the reservoir and the coolant plate. The liquid pump generates a pressure difference to drive the flow of coolant, ensuring the continuous supply and circulation of coolant, thereby effectively absorbing and transferring the heat generated by the semiconductor assembly and ensuring that the coolant continues to flow in the parts that need cooling.

[0019] Furthermore, a heat insulation layer is provided between the liquid storage box and the top cover.

[0020] By adopting the above technical solution, the insulation layer has low thermal conductivity, which can reduce the heat conduction between the liquid storage box and the top cover. This reduces the heat accumulation generated by the top cover due to contact with the high-temperature liquid storage box, lowers the temperature of the top cover, and helps protect other components from heat damage.

[0021] In summary, the present invention has the following main advantages:

[0022] 1. This utility model uses a pressing block to limit and press the connection wires at the positive and negative ends, effectively preventing the wires from coming loose during use, thereby enhancing the connection stability of the power cord. Specifically, the pressing block limits and presses the connection wires through physical pressure. When the pressing block is inserted into the slot, it applies a certain pressure to the connection wires at the positive and negative ends, making them tightly fixed in place. This pressure ensures close contact between the connection wires and the semiconductor assembly, reducing the risk of poor contact or loosening, enhancing the reliability and service life of the laser, and reducing the risk of faults such as wire coming loose during use.

[0023] 2. By setting an insulating layer, this utility model can effectively isolate conductors, prevent electrical short circuits between different potentials, ensure that current flows along a predetermined path, thereby maintaining the normal operation of the equipment. The insulating layer is beneficial for insulating and isolating the positive and negative terminals from the coolant plate and the pressure block, improving the safety of laser use, and increasing the energy efficiency and working efficiency of the laser. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the main body of the laser of this utility model;

[0026] Figure 3 This utility model Figure 2 Enlarged structural diagram at point A;

[0027] Figure 4 This is a schematic diagram of the structure of the top cover of this utility model.

[0028] In the diagram: 1. Laser body; 2. Top cover; 3. Semiconductor laser assembly; 301. First semiconductor assembly; 302. Second semiconductor assembly; 303. Empty slot; 304. Positive terminal; 305. Negative terminal; 4. Cooling assembly; 401. Coolant plate; 402. Pressing block; 403. Insulating layer; 404. Liquid storage box; 405. Heat dissipation fins; 406. Liquid inlet pipe; 407. Liquid outlet pipe; 408. Liquid pump; 409. Heat insulation layer; 5. Power port. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] The embodiments of this utility model will be described below based on its overall structure.

[0031] Example 1:

[0032] Array-cooled high-power semiconductor lasers, such as Figures 1-4 As shown, the laser includes a main body 1, a top cover 2, and a power port 5. A cooling assembly 4 is provided on the bottom surface of the top cover 2. The cooling assembly 4 includes a coolant plate 401 and a pressing block 402 on the coolant plate 401. A semiconductor laser group 3 is provided inside the main body 1. The semiconductor laser group 3 includes a first semiconductor group 301 and a second semiconductor group 302. A slot 303 is formed between the first semiconductor group 301 and the second semiconductor group 302. Positive terminals 304 and negative terminals 305 are provided on opposite sides of the first semiconductor group 301 and the second semiconductor group 302. Through the limiting and pressing action of the pressing block 402, the connection lines of the array liquid-cooled high-power semiconductor laser are stably fixed in place, thereby ensuring the normal transmission of current and the normal operation of the laser. This stability enhances the reliability and service life of the laser and reduces the risk of faults such as line detachment during use.

[0033] See Figure 2 , Figure 3 The first semiconductor group 301 and the second semiconductor group 302 are both composed of multiple individual semiconductor laser arrays. By combining multiple individual semiconductor laser arrays together, the first semiconductor group 301 and the second semiconductor group 302 can work simultaneously, thereby achieving higher power output. This design enables the array laser to have stronger beam capability and higher energy density, improves beam quality and characteristics, and by optimizing the array arrangement and phase control, a narrower beam divergence angle, better beam uniformity and higher beam stability can be obtained.

[0034] See Figure 3 , Figure 4 The pressure block 402 is inserted into the slot 303. The coolant plate 401 and the pressure block 402 are in a "T" shape. The "T" shape design of the coolant plate 401 and the pressure block 402 increases the contact area, which helps to optimize the heat conduction path. This design allows the coolant to absorb the heat generated by the semiconductor assembly more efficiently and carry it away, thereby improving the cooling effect, improving heat dissipation efficiency, helping to reduce the operating temperature of the semiconductor assembly, maintain its stability and extend its service life.

[0035] Example 2:

[0036] See Figure 3 , Figure 4 Coolant pipes are provided inside both the coolant plate 401 and the pressure block 402, and an insulating layer 403 is adhered to the outside of the coolant plate 401 and the pressure block 402. The presence of the coolant pipes allows the coolant to flow directly through the coolant plate 401 and the pressure block 402, making close contact with the semiconductor assembly, thereby more effectively absorbing and carrying away the generated heat. This design enhances the cooling effect and helps maintain the semiconductor assembly within a suitable operating temperature range. The insulating layer 403 helps to insulate the positive terminal 304 and the negative terminal 305 from the coolant plate 401 and the pressure block 402, improving the safety of laser operation.

[0037] See Figure 4 The top surface of the top cover 2 is provided with a liquid storage box 404. The liquid storage box 404 is connected to the coolant plate 401 through the liquid inlet pipe 406 and the liquid outlet pipe 407. As a coolant storage and supply device, the liquid storage box 404 can ensure that the laser always has sufficient coolant during operation. The connection between the liquid inlet pipe 406 and the liquid outlet pipe 407 and the coolant plate 401 forms a closed-loop coolant circulation system, thereby ensuring the continuous supply and circulation of coolant, reducing the possibility of coolant leakage and waste, which helps to maintain the stable operation of the laser and extend its service life.

[0038] See Figure 1 Multiple heat dissipation fins 405 are provided on both sides of the liquid storage box 404. The multiple heat dissipation fins 405 are arranged linearly at equal intervals along the length of the liquid storage box 404. The presence of heat dissipation fins 405 greatly increases the heat dissipation area of ​​the liquid storage box 404. Compared with the smooth surface of the liquid storage box 404, the heat dissipation fins 405 provide more heat dissipation paths, so that heat can be dissipated into the surrounding environment more quickly, ensuring uniform heat distribution and efficient conduction. Each heat dissipation fin 405 can effectively absorb and transfer heat, thereby improving the overall heat dissipation efficiency.

[0039] See Figure 1A liquid pump 408 is installed on the liquid reservoir 404. The liquid pump 408 is electrically connected to an external power supply through a controller. The installation of the liquid pump 408 enables the coolant to circulate between the liquid reservoir 404 and the coolant plate 401. The liquid pump 408 generates a pressure difference to drive the flow of coolant, ensuring the continuous supply and circulation of coolant. This effectively absorbs and transfers the heat generated by the semiconductor assembly, ensuring that the coolant continues to flow in the parts that need cooling, thereby improving the cooling effect on the semiconductor assembly and maintaining it within a suitable operating temperature range.

[0040] See Figure 1 A heat insulation layer 409 is provided between the liquid storage box 404 and the top cover 2. The heat insulation layer 409 has low thermal conductivity, which can reduce the heat conduction between the liquid storage box 404 and the top cover 2. This reduces the heat accumulation generated by the top cover 2 due to contact with the high temperature liquid storage box 404, lowers the temperature of the top cover 2, helps protect other components from heat damage, reduces heat accumulation and heat conduction, reduces the risk of damage to the top cover 2 and other components, thereby reducing the frequency and complexity of maintenance.

[0041] The implementation principle of this utility model is as follows: First, the external power supply line is connected to the positive terminal 304 and negative terminal 305 of the first semiconductor group 301 and the second semiconductor group 302 in sequence. Then, the top cover 2 is gradually moved closer to the laser body 1, while the pressing block 402 is vertically opposite to the slot 303, and the pressing block 402 is gradually inserted into the slot 303. At the same time, the pressing block 402 is used to limit and press the connection line of the positive terminal 304 and the negative terminal 305, and improve the connection firmness of the external power supply line to prevent the line from falling off during the use of the laser.

[0042] By using the coolant plate 401 and the pressing block 402 to press against the surfaces of the first semiconductor group 301 and the second semiconductor group 302, the effect of double-sided liquid cooling of the first semiconductor group 301 and the second semiconductor group 302 can be achieved, thereby improving the liquid cooling effect.

[0043] When using the laser, firstly, an external power supply is connected through power port 5, causing the first semiconductor group 301 and the second semiconductor group 302 to start working according to the controller settings. At the same time, the liquid pump 408 pumps the coolant inside the liquid storage box 404, causing the coolant to flow through the coolant plate 401, the pressure block 402 and the liquid storage box 404 to absorb the heat generated by the first semiconductor group 301 and the second semiconductor group 302. Then, the collected heat is diffused into the air through the heat dissipation fins 405, achieving the effect of liquid cooling of the first semiconductor group 301 and the second semiconductor group 302.

[0044] All parts not covered in this utility model are the same as or can be implemented using existing technologies, and will not be described in detail here.

[0045] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. Array liquid-cooled high-power semiconductor laser, characterized by: The laser device comprises a laser body (1), a top cover (2) and a power port (5); a cooling assembly (4) is arranged on the bottom surface of the top cover (2); the cooling assembly (4) comprises a cooling liquid plate (401); a pressing block (402) is arranged on the cooling liquid plate (401); a semiconductor laser group (3) is arranged inside the laser body (1); the semiconductor laser group (3) comprises a first semiconductor group (301) and a second semiconductor group (302); an empty groove (303) is formed between the first semiconductor group (301) and the second semiconductor group (302); and a positive terminal (304) and a negative terminal (305) are arranged on opposite sides of the first semiconductor group (301) and the second semiconductor group (302).

2. The array liquid-cooled high-power semiconductor laser according to claim 1, characterized in that: The first semiconductor group (301) and the second semiconductor group (302) are both composed of a plurality of single semiconductor laser arrays.

3. The array liquid-cooled high-power semiconductor laser according to claim 1, characterized in that: The pressing block (402) is inserted into the empty groove (303), and the cooling liquid plate (401) and the pressing block (402) are in a "T"-shaped structure.

4. The array liquid-cooled high-power semiconductor laser according to claim 1, characterized in that: The cooling liquid plate (401) and the pressing block (402) are both provided with cooling liquid pipes inside, and the outer sides of the cooling liquid plate (401) and the pressing block (402) are adhered with insulating layers (403).

5. The array liquid-cooled high-power semiconductor laser according to claim 1, characterized in that: A liquid storage box (404) is provided on the top surface of the top cover (2), and the liquid storage box (404) is connected to the cooling liquid plate (401) via a liquid inlet pipe (406) and a liquid outlet pipe (407).

6. The array liquid-cooled high-power semiconductor laser according to claim 5, characterized in that: A plurality of heat dissipation fins (405) are provided on both sides of the liquid storage box (404), and the plurality of heat dissipation fins (405) are linearly arranged at equal distances along the length line of the liquid storage box (404).

7. The array liquid-cooled high-power semiconductor laser according to claim 5, characterized in that: The liquid storage box (404) is equipped with a liquid pump (408), and the liquid pump (408) is electrically connected to an external power source through a controller.

8. The array liquid-cooled high-power semiconductor laser according to claim 5, characterized in that: A heat insulation layer (409) is provided between the liquid storage box (404) and the top cover (2).

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