Electronic device and power system

Abstract

The utility model provides an electronic device and an electric power system, and relates to the field of electrical technology. The electronic equipment comprises a shell structure, a setting structure and at least one plugging connection structure, a via hole is formed in the shell structure, the setting structure is correspondingly arranged at the via hole and exposed out of the shell structure, and the setting structure and the shell structure are attached to the setting side, in the hole depth direction, of the via hole to form an attaching face surrounding the via hole. The setting structure and the shell structure are arranged on the binding face, the inserting connection structure is arranged between the setting structure and the shell structure on the binding face, the inserting connection structure comprises a groove-shaped part and an inserting part which are arranged on the setting structure and the shell structure respectively, the groove-shaped part is connected with the inserting part in an inserting mode, and the groove-shaped part is arranged around the via hole. A sealing ring does not need to be adopted for sealing between the shell structure and the setting structure of the electronic equipment, and the heat dissipation requirement and the sealing reliability requirement of the electronic equipment can be met.

Description

Technical Field

[0001] The utility model relates to the field of electrical technology, in particular to an electronic device and a power system. Background Art

[0002] At present, in order to obtain good heat dissipation performance, some electronic devices such as inverters usually set some structures outside their shell structure. For example, an inductor component with large heat generation or a radiator component for heat dissipation is set outside the shell structure. These external structures usually pass through the vias on the shell structure and are connected to the components inside the shell structure, which is beneficial to ensure the heat dissipation performance of the entire device.

[0003] However, these external structures and shell structures have the risk of loose connection at the via holes due to processing and installation errors, which may lead to leakage and make it difficult to ensure the sealing requirements of electronic equipment. Utility Model Content

[0004] The utility model aims to solve the problem of how to take into account both the heat dissipation requirements and the sealing requirements of electronic equipment in the related art to a certain extent.

[0005] In order to solve at least one aspect of the above-mentioned problems to at least a certain extent, in a first aspect, the utility model provides an electronic device, comprising a shell structure, a setting structure and at least one plug-in connection structure; a via hole is provided on the shell structure, the setting structure is correspondingly arranged at the via hole and exposed from the shell structure, the setting structure and the shell structure are attached to each other at the setting side of the via hole along the hole depth direction and form a fitting surface surrounding the via hole, the plug-in connection structure is arranged between the setting structure and the shell structure at the fitting surface, the plug-in connection structure comprises a groove-like portion and a plug-in portion respectively arranged on the setting structure and the shell structure, the groove-like portion is plug-connected with the plug-in portion, and the groove-like portion is arranged around the via hole.

[0006] Optionally, in a direction perpendicular to the hole depth direction, the groove-shaped portion of at least one of the plug-in connection structures is spaced apart from an edge of the via hole.

[0007] Optionally, there are multiple plug-in connection structures, and the multiple plug-in connection structures are distributed in a direction perpendicular to the hole depth direction.

[0008] Optionally, at least two of the groove-shaped portions located at different plug-in connection structures are formed in the setting structure and the housing structure, respectively.

[0009] Optionally, the electronic device further comprises a circuit board unit, wherein the circuit board unit is disposed in the mounting cavity of the housing structure, and the setting structure passes through the via hole and is connected to the circuit board unit.

[0010] Optionally, at least one of all the set structures includes a heat sink component; and / or, at least one of all the set structures includes a heat generating component.

[0011] Optionally, when the setting structure and the shell structure are in contact with each other at the setting side of the via hole along the hole depth direction, the cross-sectional shape of the setting section of the setting structure passing through the via hole is consistent with the cross-sectional shape of the via hole.

[0012] Optionally, an anti-mistake portion is provided on the setting section, and the anti-mistake portion makes the cross-sectional shape of the setting section present a non-centrally symmetrical figure.

[0013] Optionally, a glue filling port and an exhaust port are provided on the shell structure; when the glue filling port is located in the area corresponding to the bonding surface, a first avoidance port is provided on the setting structure corresponding to the glue filling port; when the exhaust port is located in the area corresponding to the bonding surface, a second avoidance port is provided on the setting structure corresponding to the exhaust port;

[0014] And / or, the setting structure is connected to the housing structure by at least one of a snap connection and a fastener connection;

[0015] And / or, the electronic device is an inverter.

[0016] In a second aspect, the utility model provides a power system, comprising the electronic device as described in the first aspect above.

[0017] Compared with the related prior art, in the electronic device and power system of the utility model, a via is provided on the shell structure, and the setting structure is correspondingly provided at the via and exposed to the shell structure. The setting structure can be connected to the internal components of the installation cavity of the shell structure through the hole to meet the corresponding connection requirements, and the part of the setting structure exposed to the shell structure can exchange heat with the external environment to meet the heat dissipation requirements. At the same time, the setting structure and the shell structure are attached to the setting side of the via along the hole depth direction to form a fitting surface surrounding the via, and a plug-in connection structure is provided between the setting structure and the shell structure at the fitting surface, and the plug-in connection structure includes a groove-shaped portion and a plug-in portion respectively provided on the setting structure and the shell structure, the groove-shaped portion is plug-connected with the plug-in portion, and the groove-shaped portion is provided around the via. Thus, when the setting structure is connected to the shell structure, the two are plug-connected through the groove-shaped portion and the plug-in portion, and the two can form a relatively complete sealing surface at the fitting surface in the circumferential direction of the through hole (the sealing surface includes a portion formed on the fitting surface and a portion that is at an angle to the fitting surface), ensuring the sealing reliability of the connection between the two, and can also complicate the leakage path of the installation cavity of the shell structure through the hole, reducing the possibility of leakage. In particular, it can reduce the possibility of leakage of the sealant through the hole and the fitting surface of the two when pouring glue into the installation cavity of the shell structure, ensuring that the sealant poured into the installation cavity can be used more for sealing, such as for wrapping the circuit board unit in the installation cavity, and avoiding subsequent glue removal operations due to sealant leakage. In general, the utility model does not need to use a sealing ring to seal between the shell structure and the setting structure of the electronic device, can take into account the heat dissipation requirements and sealing reliability requirements of the electronic device, and is conducive to ensuring the performance of the electronic device and the production efficiency of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an electronic device in the first embodiment of the utility model;

[0019] Figure 2 for Figure 1 Sectional view at section AA;

[0020] Figure 3 for Figure 1 A schematic diagram of a state where the setting structure is separated from the shell structure;

[0021] Figure 4 for Figure 1 A schematic diagram of the structure of the electronic device after the setting structure is flipped rightward and opened;

[0022] Figure 5 It is a schematic structural diagram of an electronic device in the second embodiment of the present utility model.

[0023] Description of reference numerals:

[0024] 1-shell structure; 11-first shell; 12-second shell; 13-through hole; 14-setting plate; 15-installation cavity; 2-setting structure; 2A-heat sink assembly; 2B-heat generating assembly; 21-setting section; 211-foolproofing part; 3-plug-in connection structure; 31-groove-shaped part; 32-plug-in part; 3A-first plug-in connection structure; 31A-first groove-shaped part; 32A-first plug-in part; 3B-second plug-in connection structure; 31B-second groove-shaped part; 32B-second plug-in part; 301-first annular protrusion; 302-first annular groove; 4-glue filling port; 5-exhaust port; 6-first avoidance port; 7-second avoidance port; 8-first connecting hole; 9-second connecting hole; S-fitting surface. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In the description of this specification, the description with reference to the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.

[0028] The terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0029] In the accompanying drawings, the Z axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis (that is, the direction of the arrow of the Z axis) represents the up, and the negative direction of the Z axis represents the down; the X axis in the accompanying drawings represents the front and back position, and the positive direction of the X axis (that is, the direction of the arrow of the X axis) represents the front side, and the negative direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the horizontal direction and is designated as the left and right position, and the positive direction of the Y axis (that is, the direction of the arrow of the Y axis) represents the right side, and the negative direction of the Y axis represents the left side; it should be noted that the aforementioned Z axis, Y axis and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0030] At present, in order to obtain good heat dissipation performance, some electronic devices such as inverters usually set some structures outside their shell structure. For example, an inductor component with large heat generation or a radiator component for heat dissipation is set outside the shell structure. These external structures usually pass through the vias on the shell structure and are connected to the components inside the shell structure, which is beneficial to ensure the heat dissipation performance of the entire device.

[0031] However, these external structures and shell structures have the risk of loose connection at the via holes due to processing and installation errors, which may lead to leakage and make it difficult to ensure the sealing requirements of electronic equipment.

[0032] In some technologies, an elastic sealing ring is provided at the joint surface of the external structure and the shell structure, and the elastic sealing ring is used to achieve sealing at the joint surface. This arrangement increases the types of materials and assembly costs. The elastic sealing ring is also prone to rebound, which affects the consistency of the relative position between the external structure and the components inside the shell structure, thereby affecting the connection reliability of the external structure and the components inside the shell structure, such as affecting the contact thermal conductivity between the internal components and the heat sink assembly, thereby affecting the performance of the electronic device.

[0033] In particular, some electronic devices are filled with glue to improve heat dissipation and waterproof performance. When there is a possibility of leakage between the external structure and the shell structure, the injected sealant will leak from the joint surface between the external structure and the shell structure, thereby affecting the wrapping integrity of the sealant, which not only affects the performance of the electronic equipment, but also requires additional processing steps for the leaked sealant, affecting the production efficiency of the electronic equipment.

[0034] like Figures 1 to 4As shown, in the first aspect, the utility model provides an electronic device, the electronic device comprising a shell structure 1, a setting structure 2 and at least one plug-in connection structure 3; a through hole 13 is provided on the shell structure 1, the setting structure 2 is correspondingly arranged at the through hole 13 and exposed to the shell structure 1, the setting structure 2 and the shell structure 1 are attached to each other at the setting side of the through hole 13 along the hole depth direction and form a fitting surface S surrounding the through hole 13, a plug-in connection structure 3 is arranged between the setting structure 2 and the shell structure 1 at the fitting surface S, the plug-in connection structure 3 comprises a groove-shaped portion 31 and a plug-in portion 32 respectively arranged on the setting structure 2 and the shell structure 1, the groove-shaped portion 31 is plug-connected with the plug-in portion 32, and the groove-shaped portion 31 is arranged around the through hole 13.

[0035] In this embodiment, the housing structure 1 includes a first housing 11 and a second housing 12, the first housing 11 and the second housing 12 enclose an installation cavity 15, the main body of the electronic device, such as a circuit board unit of an inverter, is installed in the installation cavity 15, and a through hole 13 may be provided on one or more of the first housing 11 and the second housing 12. In this specification, the content of the utility model is described later by taking the setting plate 14 of the first housing 11, such as the bottom plate, as an example in which the through hole 13 is provided.

[0036] In this embodiment, the hole depth direction of the through hole 13 is the up-down direction, and the setting side may be the outside, that is, the outer surface of the shell structure 1 , such as the setting plate 14 , is attached to the setting structure 2 to form the attachment surface S.

[0037] Of course, in other embodiments, the setting side may be the inner side, that is, the inner surface of the shell structure 1, such as the setting plate 14, is bonded to the setting structure 2 to form the bonding surface S (not shown in this scheme).

[0038] In the same plug connection structure 3, the groove portion 31 can be provided in the housing structure 1, and correspondingly, the plug portion 32 can be provided in the setting structure 2. Exemplarily, the first groove portion 31A of the first plug connection structure 3A described later is provided on the outer surface of the setting plate 14 of the first housing 11, and the first plug portion 32A of the first plug connection structure 3A is provided in the setting structure 2.

[0039] In the same plug connection structure 3, the groove portion 31 can be provided in the setting structure 2. Exemplarily, the plug portion 32 can be provided in the housing structure 1, for example, the second groove portion 31B of the second plug connection structure 3B described later is provided in the setting structure 2, and the second plug portion 32B of the second plug connection structure 3B is provided on the outer surface of the setting plate 14 of the first housing 11.

[0040] In this way, the shell structure 1 is provided with a through hole 13, and the setting structure 2 is correspondingly arranged at the through hole 13 and exposed to the shell structure 1. The setting structure 2 can be connected to the internal components of the installation cavity 15 of the shell structure 1 through the hole 13 to meet the corresponding connection requirements. The part of the setting structure 2 exposed to the shell structure 1 can exchange heat with the external environment to meet the heat dissipation requirements. At the same time, the setting structure 2 and the shell structure 1 are attached to the setting side of the through hole 13 along the hole depth direction to form a fitting surface S surrounding the through hole 13. A plug-in connection structure 3 is arranged between the setting structure 2 and the shell structure 1 at the fitting surface S. The plug-in connection structure 3 includes a groove-shaped portion 31 and a plug-in portion 32 respectively arranged on the setting structure 2 and the shell structure 1. The groove-shaped portion 31 is plug-connected with the plug-in portion 32, and the groove-shaped portion 31 is arranged around the through hole 13. Thus, when the setting structure 2 is connected to the shell structure 1, the two are plugged and connected through the groove-shaped portion 31 and the plug-in portion 32, and the two can form a relatively complete sealing surface (the sealing surface includes a portion formed on the fitting surface S and a portion at an angle to the fitting surface S) at the circumference of the through hole 13, ensuring the sealing reliability of the connection between the two, and can also complicate the leakage path of the installation cavity 15 of the shell structure 1 through the hole 13, thereby reducing the possibility of leakage. In particular, when it is necessary to pour glue into the installation cavity 15 of the shell structure 1, the possibility of the sealant leaking through the hole 13 and the fitting surface S of the two when pouring glue into the installation cavity 15 of the shell structure 1 can be reduced, ensuring that the sealant poured into the installation cavity 15 can be used more for sealing, such as for wrapping the circuit board unit in the installation cavity 15, and avoiding the subsequent glue removal operation due to the leakage of the sealant. In general, the electronic device of the utility model can take into account the heat dissipation requirements and sealing reliability requirements of the electronic device, which is conducive to ensuring the performance of the electronic device and the production efficiency of the electronic device. Even without a sealing ring, the housing structure 1 and the setting structure 2 of the electronic device can be well sealed.

[0041] Optionally, in a direction perpendicular to the hole depth direction, the groove-shaped portion 31 of at least one plug-in connection structure 3 is spaced apart from an edge of the through hole 13 .

[0042] Specifically, the second groove portion 31B of the second plug-in connection structure 3B described later is spaced apart from the edge of the via 13 (the edge of the via 13 can be understood as the inner wall of the via 13), and correspondingly, the second plug-in portion 32B plug-connected to the second groove portion 31B is also spaced apart from the edge of the via 13.

[0043] In this way, the leakage path of the installation cavity 15 , for example, the sealant in the installation cavity 15 leaking through the hole 13 and the fitting surface S, can be made longer, thereby further reducing the possibility of leakage.

[0044] Optionally, there are multiple plug-in connection structures 3, and the multiple plug-in connection structures 3 are distributed in a direction perpendicular to the hole depth direction.

[0045] In this way, the provision of multiple plug-in connection structures 3 further complicates and lengthens the leakage path of the installation cavity 15 through the hole 13 and the fitting surface S, which can further reduce the possibility of leakage and improve the sealing performance of the electronic device.

[0046] Optionally, at least two groove-shaped portions 31 located at different plug-in connection structures 3 are formed in the setting structure 2 and the housing structure 1 , respectively.

[0047] like Figure 3 As shown, exemplarily, the setting side is the outer side, the setting plate body 14 is formed with a first annular protrusion 301 on the top surface at a position spaced from the edge of the through hole 13, the setting structure 2 is formed with a first annular groove 302 corresponding to the first annular protrusion 301, the first annular protrusion 301 and the area surrounded by the first annular protrusion 301 are used to form the groove 31 of the first plug-in connection structure 3A, that is, the first groove 31A, the setting structure 2 forms the plug-in portion 32 of the first plug-in connection structure 3A in the area surrounded by the inner circle of the first annular groove 302, that is, the first plug-in portion 32A. The first annular protrusion 301 is also used to form the plug-in portion 32 of the second plug-in connection structure 3B, that is, the second plug-in portion 32B, and the first annular groove 302 is also used to form the groove 31 of the second plug-in connection structure 3B, that is, the second groove 31B.

[0048] In this way, the leakage path of the installation cavity 15 can be complicated and the possibility of leakage can be reduced. For example, the first annular protrusion 301 can be used to form the first groove portion 31A and the second plug-in portion 32B, which can reduce the complexity of the multiple plug-in connection structures 3, and the structure is simple and practical.

[0049] In the above embodiment, optionally, at least one of all the setting structures 2 includes a heat sink assembly 2A;

[0050] like Figure 1 and Figure 4 As shown, it shows that the setting structure 2 is a heat sink component 2A ( Figure 5 It should be understood that the radiator assembly 2A can be configured as an integral structure or a split structure as required.

[0051] In this way, the heat dissipation of the electronic device can be carried out through the heat sink assembly 2A, and at the same time, the corresponding sealing requirements are maintained, which can take into account both the heat dissipation requirements and the sealing requirements of the electronic device.

[0052] In the above embodiment, optionally, at least one of all the setting structures 2 includes a heat generating component 2B.

[0053] The heat generating component 2B is a component that generates heat when working, such as an inductor component. The heat generating component 2B of the electronic device, such as the inductor component, is set to be partially exposed from the housing structure 1, so that the inductor component can be cooled. At the same time, the corresponding sealing requirements are maintained, and the heat dissipation requirements and sealing requirements of the electronic device can be taken into account.

[0054] It should be understood that in some embodiments, the number of the set structures 2 can be multiple, at least one of which includes a heat sink component 2A, and at least another one includes a heat generating component 2B.

[0055] Exemplarily, only the first housing 11 is correspondingly mounted with the radiator assembly 2A and the heat generating assembly 2B.

[0056] Exemplarily, only the second housing 12 is correspondingly mounted with the radiator assembly 2A and the heat generating assembly 2B.

[0057] like Figure 5 As shown, exemplarily, the first housing 11 is correspondingly mounted with at least one set structure 2 such as a radiator assembly 2A, and the second housing 12 is correspondingly mounted with at least one set structure 2 such as a heat generating assembly 2B.

[0058] The present invention will be described later by taking the example that only the first housing 11 is correspondingly mounted with the radiator assembly 2A.

[0059] Furthermore, the electronic device further comprises a circuit board unit, which is disposed in the mounting cavity 15 of the housing structure 1 , and the setting structure 2 is disposed through the through hole 13 and connected to the circuit board unit.

[0060] Specifically, the portion of the heat sink assembly 2A located in the mounting cavity 15 of the shell structure 1 fits with the circuit board or power device such as IGBT of the circuit board unit. The heat sink assembly 2A and the circuit board unit can be directly fixedly connected through a connector or indirectly fixedly connected through a transfer structure, so that the heat sink assembly 2A can dissipate heat for the circuit board unit.

[0061] The radiator assembly 2A may adopt a radiator with good thermal conductivity and heat dissipation performance, such as a metal radiator, while the shell structure 1 is usually a plastic shell, which will not be described in detail here.

[0062] refer to Figures 2 to 4 As shown, when the setting structure 2 and the shell structure 1 are fitted together at the setting side of the through hole 13 along the hole depth direction, the cross-sectional shape of the setting section 21 of the setting structure 2 passing through the through hole 13 (the cross-sectional shape is a plane perpendicular to the Z-axis direction in the figure) is consistent with the cross-sectional shape of the through hole 13.

[0063] Specifically, when the fitting surface S is located on the outside of the shell structure 1 , the setting section 21 is usually an inner section of the heat sink assembly 2A, and the end surface of the setting section 21 fits with the circuit board unit.

[0064] When the fitting surface S is located on the inner side of the shell structure 1, that is, when the radiator assembly 2A is penetrated from the inside to the outside in the through hole 13, the setting section 21 is usually the middle section of the radiator assembly 2A, and the inner end of the middle section is also connected to an inner section, and the cross-sectional area of ​​the inner section is larger than the cross-sectional area of ​​the middle section. The inner section is fitted with the setting plate 14 to form a fitting surface S (not shown in this scheme figure).

[0065] In this way, when the setting structure 2 is connected to the shell structure 1, the setting section 21 abuts against the inner wall of the through hole 13 in any direction within the cross section of the setting section 21, thereby limiting the relative displacement between the two. Combined with the connecting function of the plug-in connection structure 3, the relative position of the setting structure 2 and the shell structure 1 is more stable.

[0066] Furthermore, a fool-proofing portion 211 is provided on the setting section 21 , and the fool-proofing portion 211 makes the cross-sectional shape of the setting section 21 present a non-centrally symmetrical figure.

[0067] like Figure 4 As shown, exemplarily, the cross-sectional shape of the setting section 21 is rectangular as a whole, the fool-proof portion 211 is a recessed structure at a vertex of the rectangle, and the rectangle with the recessed structure constitutes a non-centrally symmetrical figure.

[0068] In this way, the setting structure 2 can only pass through the through hole 13 in a preset posture, thereby ensuring the positioning reliability of the setting structure 2 and the housing structure 1 .

[0069] like Figure 1 and Figure 4 As shown, optionally, a glue filling port 4 and an exhaust port 5 are provided on the shell structure 1 .

[0070] The locations of the glue filling port 4 and the exhaust port 5 are not limited, as long as they can respectively realize glue filling and exhaust during the glue filling process.

[0071] Furthermore, when the glue filling port 4 is located in the area corresponding to the bonding surface S, a first avoidance port 6 is provided on the setting structure 2 corresponding to the glue filling port 4 to avoid blocking the glue filling port 4.

[0072] Furthermore, when the exhaust port 5 is located in the area corresponding to the bonding surface S, a second avoidance port 7 is provided on the setting structure 2 corresponding to the exhaust port 5 , so as to avoid blocking the exhaust port 5 .

[0073] Optionally, the setting structure 2 is connected to the shell structure 1 by at least one of a snap connection and a fastener connection;

[0074] The fastener may be a threaded connector that passes through one of the setting structure 2 and the housing structure 1 and is threadedly connected to the other. Figure 4The threaded connection piece passes through the first connection hole 8 and is threadedly connected to the second connection hole 9.

[0075] In a second aspect, the utility model provides a power system, which includes the electronic device of the above embodiment. The electronic device may be a power electronic device such as an inverter.

[0076] The power system has all the beneficial effects of the electronic device, which will not be described in detail here.

[0077] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. An electronic device, characterized in that: The invention comprises a shell structure (1), a setting structure (2) and at least one plug-in connection structure (3); a through hole (13) is provided on the shell structure (1); the setting structure (2) is arranged corresponding to the through hole (13) and exposed from the shell structure (1); the setting structure (2) and the shell structure (1) are attached to each other at the setting side of the through hole (13) along the hole depth direction and form a fitting surface (S) surrounding the through hole (13); the plug-in connection structure (3) is arranged between the setting structure (2) and the shell structure (1) at the fitting surface (S); the plug-in connection structure (3) comprises a groove-shaped portion (31) and a plug-in portion (32) respectively arranged on the setting structure (2) and the shell structure (1); the groove-shaped portion (31) is plug-connected with the plug-in portion (32); and the groove-shaped portion (31) is arranged around the through hole (13).

2. The electronic device according to claim 1, wherein: In a direction perpendicular to the hole depth direction, the groove-shaped portion (31) of at least one of the plug-in connection structures (3) is spaced apart from the edge of the through hole (13).

3. The electronic device according to claim 1, wherein: The number of the plug-in connection structures (3) is multiple, and the multiple plug-in connection structures (3) are distributed in a direction perpendicular to the hole depth direction.

4. The electronic device according to claim 3, characterized in that: At least two of the groove-shaped portions (31) located at different plug-in connection structures (3) are respectively formed in the setting structure (2) and the housing structure (1).

5. The electronic device according to claim 1, wherein: The electronic device further comprises a circuit board unit, wherein the circuit board unit is arranged in the mounting cavity (15) of the housing structure (1), and the setting structure (2) is passed through the through hole (13) and connected to the circuit board unit.

6. The electronic device according to any one of claims 1 to 5, characterized in that: At least one of all the setting structures (2) includes a heat sink component (2A); and / or at least one of all the setting structures (2) includes a heat generating component (2B).

7. The electronic device according to any one of claims 1 to 5, characterized in that: When the setting structure (2) and the shell structure (1) are in contact with each other at the setting side of the through hole (13) along the hole depth direction, the cross-sectional shape of the setting section (21) of the setting structure (2) penetrating the through hole (13) is consistent with the cross-sectional shape of the through hole (13).

8. The electronic device according to claim 7, characterized in that: The setting section (21) is provided with an anti-mistake portion (211), and the anti-mistake portion (211) makes the cross-sectional shape of the setting section (21) present a non-centrally symmetrical figure.

9. The electronic device according to any one of claims 1 to 5, characterized in that: The shell structure (1) is provided with a glue filling port (4) and an exhaust port (5); when the glue filling port (4) is located in the area corresponding to the bonding surface (S), the setting structure (2) is provided with a first avoidance port (6) corresponding to the glue filling port (4); when the exhaust port (5) is located in the area corresponding to the bonding surface (S), the setting structure (2) is provided with a second avoidance port (7) corresponding to the exhaust port (5); And / or, the setting structure (2) is connected to the housing structure (1) by at least one of a snap connection and a fastener connection; And / or, the electronic device is an inverter.

10. A power system, characterized in that: The electronic device comprises the electronic device as claimed in any one of claims 1 to 9.

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