Integrated high computing power module with efficient heat dissipation structure

Abstract

The utility model relates to the technical field of high-computing-power modules, in particular to an integrated high-computing-power module with an efficient heat dissipation structure, which comprises a mounting circuit board, an electronic element fixedly mounted at the top of the mounting circuit board, and a chip fixedly mounted in the center of the top of the mounting circuit board. A bidirectional displacement assembly is fixedly connected to one side of the top of the mounting circuit board, a linkage stabilizing assembly is arranged on the other side of the top of the mounting circuit board, connecting plates are arranged on the bidirectional displacement assembly and the linkage stabilizing assembly, a fixed transverse plate is fixedly connected to one end of each connecting plate, and cooling fans are mounted at the bottom of the fixed transverse plate in a linear array manner; and the linkage stabilizing assembly and the bidirectional displacement assembly are each provided with a positioning assembly used for positioning the connecting plate, the multiple heat dissipation fans can move for heat dissipation through the bidirectional displacement assembly, heat dissipation is more uniform and efficient, and practicability is high.

Description

Technical Field

[0001] The utility model specifically relates to an integrated high-computing power module with an efficient heat dissipation structure, and belongs to the technical field of high-computing power modules. Background Art

[0002] During the operation of existing integrated high-computing power modules, the temperature of the chip will rise because the chip needs to continuously perform calculations, causing the temperature of the air outside the chip to rise, so the high-computing power module needs to be cooled.

[0003] The current application document with application number CN202222163658.7 discloses an integrated high-computing power module, including: a circuit board, the circuit board is designed as a rectangle, a plurality of electrical components are arranged at the edge position of the top of the circuit board, a chip is arranged at the center position of the circuit board, and a heat dissipation component is also arranged at the corner position of the top of the circuit board. The utility model can transport the heat generated by the chip operation to the outside, can reduce the temperature of the air above the circuit board, which is conducive to the long-term operation of the chip, and the low-temperature heat-conducting liquid in the condenser tube can absorb the heat of the outside air through the heat sink, can improve the cooling effect, and is conducive to the heat dissipation of the chip, and at the same time can make the heat-conducting liquid enter the condenser tube from the water outlet, and the heat-conducting liquid in the condenser tube can enter the container from the other end of the condenser tube, can circulate and replace the heat-conducting liquid in the condenser tube, can ensure the heat absorption effect of the heat-conducting liquid in the condenser tube, and can ensure the heat dissipation efficiency.

[0004] The heat dissipation fan in the above technical solution is fixedly connected and can only dissipate heat at a fixed position. The heat dissipation effect needs to be improved, and the heat dissipation fan is inconvenient to disassemble. Utility Model Content

[0005] The purpose of the present utility model is to provide an integrated high computing power module with an efficient heat dissipation structure in order to solve the above-mentioned problem, which can enable the heat dissipation fan to perform mobile heat dissipation, making the heat dissipation more uniform and efficient.

[0006] The utility model achieves the above-mentioned purpose through the following technical solutions: an integrated high-computing power module with an efficient heat dissipation structure, including an installation circuit board, an electronic component is fixedly installed on the top of the installation circuit board, a chip is fixedly installed at the center position of the top of the installation circuit board, a bidirectional displacement component is fixedly connected to one side of the top of the installation circuit board, a linkage stabilization component is arranged on the other side of the top of the installation circuit board, a connecting plate is arranged on the bidirectional displacement component and the linkage stabilization component, a fixed cross plate is fixedly connected to one end of the connecting plate, a heat dissipation fan is installed in a linear array on the bottom of the fixed cross plate, and a positioning component for positioning the connecting plate is arranged on the linkage stabilization component and the bidirectional displacement component.

[0007] Furthermore, in order to install the driving screw in the first strip plate, the bidirectional displacement assembly includes a first strip plate connected to one side of the top of the mounting circuit board, and a first groove is provided on the top of the first strip plate, and the driving screw is rotatably installed in the first groove.

[0008] Furthermore, in order to rotate the driving screw, the driving screw is threadedly connected to a driving plate, the driving plate is located in the first groove, a forward and reverse motor is installed on the outer wall of the first strip plate, and the output shaft of the forward and reverse motor is connected to one end of the driving screw.

[0009] Furthermore, in order to enable the linkage support plate to slide, the linkage stabilization component includes a second strip plate connected to the other side of the top of the mounting circuit board, a second groove is provided on the top of the second strip plate, a linkage support plate is slidably engaged in the second groove, the connecting plates are respectively provided on the top of the linkage support plate and the driving plate, and limiting holes are provided on the connecting plates.

[0010] Furthermore, in order to facilitate the use of the installation box, the positioning assembly includes installation boxes respectively fixedly mounted on the outer side walls of the linkage support plate and the driving plate.

[0011] Furthermore, in order to enable the slider to slide in the installation box, a spring is fixedly mounted on the inner wall of the installation box, a slider is mounted on one end of the spring, and the slider is slidably engaged in the installation box.

[0012] Furthermore, in order to drive the connecting rod to move through the positioning block, a connecting rod is fixedly installed on the top of the sliding block, one end of the connecting rod passes through the installation box, and a positioning block is installed on one end of the connecting rod.

[0013] Furthermore, in order to enable the positioning column to move synchronously when the positioning block moves, a positioning column is connected to the bottom of the positioning block, and the positioning column is arranged in the limiting hole.

[0014] Technical effects and advantages of the utility model:

[0015] The utility model is provided with a bidirectional displacement component and a positioning component. The bidirectional displacement component can drive the fixed horizontal plate and multiple heat dissipation fans to translate. The heat dissipation fans can dissipate heat evenly during translation, thereby improving the heat dissipation effect. The positioning component can conveniently limit the connection plate, the fixed horizontal plate and the heat dissipation fans. After the positioning component releases the fixation of the connection plate, the user can remove the heat dissipation fans. The utility model is simple and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the bidirectional displacement component in the utility model;

[0018] Figure 3 This is a schematic diagram of the installation structure of the heat dissipation fan in the utility model;

[0019] Figure 4 It is a structural schematic diagram of the positioning component in the utility model;

[0020] Figure 5 It is a structural schematic diagram of the linkage stabilizing assembly in the utility model;

[0021] In the figure: 1. Install the circuit board; 2. Electronic components; 3. Chip; 4. Bidirectional displacement assembly; 401. First strip plate; 402. Drive screw rod; 403. Drive plate; 404. Forward and reverse motor; 5. Linkage stabilization assembly; 501. Second strip plate; 502. Linkage support plate; 6. Connecting plate; 7. Fixed horizontal plate; 8. Cooling fan; 9. Positioning assembly; 901. Mounting box; 902. Spring; 903. Slider; 904. Connecting rod; 905. Positioning block; 906. Positioning column. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 5 As shown, an integrated high-computing power module with an efficient heat dissipation structure includes an installation circuit board 1, an electronic component 2 is fixedly installed on the top of the installation circuit board 1, a chip 3 is fixedly installed at the center position of the top of the installation circuit board 1, a two-way displacement component 4 is fixedly connected to one side of the top of the installation circuit board 1, and a linkage stabilization component 5 is arranged on the other side of the top of the installation circuit board 1, a connecting plate 6 is arranged on the two-way displacement component 4 and the linkage stabilization component 5, a fixed cross plate 7 is fixedly connected to one end of the connecting plate 6, a heat dissipation fan 8 is installed in a linear array on the bottom of the fixed cross plate 7, and a positioning component 9 for positioning the connecting plate 6 is arranged on the linkage stabilization component 5 and the two-way displacement component 4. When the positioning component 9 positions the connecting plate 6, the fixed cross plate 7 and the heat dissipation fan 8 can be positioned.

[0024] The bidirectional displacement component 4 includes a first strip plate 401 connected to one side of the top of the mounting circuit board 1, a first groove is provided on the top of the first strip plate 401, a driving screw rod 402 is rotatably installed in the first groove, the driving screw rod 402 is threadedly connected to a driving plate 403, the driving plate 403 is located in the first groove, a forward and reverse motor 404 is installed on the outer wall of the first strip plate 401, the output shaft of the forward and reverse motor 404 is connected to one end of the driving screw rod 402, the forward and reverse motor 404 can drive the driving plate 403 to move left or right, so that multiple cooling fans 8 can reciprocate on the mounting circuit board 1.

[0025] The linkage stabilization component 5 includes a second strip plate 501 connected to the other side of the top of the mounting circuit board 1, and a second groove is arranged on the top of the second strip plate 501, and a linkage support plate 502 is slidably engaged in the second groove, and the connecting plate 6 is respectively arranged on the top of the linkage support plate 502 and the driving plate 403, and a limiting hole is arranged on the connecting plate 6. The linkage support plate 502 can increase the stability of the heat dissipation fan 8 during displacement.

[0026] The positioning assembly 9 includes an installation box 901 fixedly mounted on the outer walls of the linkage support plate 502 and the driving plate 403 respectively, a spring 902 is fixedly mounted on the inner wall of the installation box 901, a slider 903 is mounted on one end of the spring 902, and the slider 903 is slidably engaged in the installation box 901, a connecting rod 904 is fixedly mounted on the top of the slider 903, one end of the connecting rod 904 passes through the installation box 901, a positioning block 905 is mounted on one end of the connecting rod 904, a positioning column 906 is connected to the bottom of the positioning block 905, and the positioning column 906 is arranged in a limiting hole, when the positioning block 905 moves upward, the connecting rod 904 and the slider 903 can be raised, at this time, the spring 902 will be stretched by the slider 903, when the external force is released, the spring 902 can reset the slider 903, the connecting rod 904 and other components.

[0027] When the utility model is in use, when the chip 3 performs high-intensity calculations, the user can make the cooling fan 8 work, and then the user can make the forward and reverse motor 404 work, thereby driving the driving screw 402 and the driving plate 403 to move, and then driving the connecting plate 6, the fixed horizontal plate 7 and multiple cooling fans 8 to translate. When the connecting plate 6 is displaced, the linkage support plate 502 can also be driven to move. The linkage support plate 502 can increase the stability of the fixed horizontal plate 7 and the cooling fan 8 when they are displaced. The cooling fan 8 can dissipate heat evenly when it translates, thereby improving the cooling effect. When the cooling fan 8 needs to be repaired or replaced, the user can pull the positioning block 905 upward, thereby driving the positioning column 906 to move upward. When the positioning block 905 moves upward, the slider 903 can be driven to rise in the installation box 901, and the spring 902 can be stretched when the slider 903 is displaced. When the positioning column 906 is separated from the limiting hole on the connecting plate 6, the user can remove the connecting plate 6, the fixed horizontal plate 7 and the cooling fan 8, and disassembly is convenient.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0029] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An integrated high-computing power module with an efficient heat dissipation structure, comprising a mounting circuit board (1), an electronic component (2) being fixedly mounted on the top of the mounting circuit board (1), and a chip (3) being fixedly mounted at the center of the top of the mounting circuit board (1), characterized in that: A bidirectional displacement component (4) is fixedly connected to one side of the top of the mounting circuit board (1), a linkage stabilization component (5) is arranged on the other side of the top of the mounting circuit board (1), a connecting plate (6) is arranged on both the bidirectional displacement component (4) and the linkage stabilization component (5), a fixed transverse plate (7) is fixedly connected to one end of the connecting plate (6), a heat dissipation fan (8) is installed in a linear array at the bottom of the fixed transverse plate (7), and a positioning component (9) for positioning the connecting plate (6) is arranged on both the linkage stabilization component (5) and the bidirectional displacement component (4).

2. The integrated high computing power module with efficient heat dissipation structure according to claim 1, characterized in that: The bidirectional displacement assembly (4) comprises a first strip plate (401) connected to one side of the top of the mounting circuit board (1), a first groove being provided at the top of the first strip plate (401), and a driving screw rod (402) being rotatably mounted in the first groove.

3. The integrated high computing power module with efficient heat dissipation structure according to claim 2, characterized in that: The driving screw (402) is threadedly connected to a driving plate (403), and the driving plate (403) is located in the first groove. A forward and reverse motor (404) is installed on the outer wall of the first strip plate (401), and the output shaft of the forward and reverse motor (404) is connected to one end of the driving screw (402).

4. The integrated high computing power module with efficient heat dissipation structure according to claim 3, characterized in that: The linkage stabilizing component (5) comprises a second strip plate (501) connected to the other side of the top of the mounting circuit board (1); a second groove is provided on the top of the second strip plate (501); a linkage support plate (502) is slidably engaged in the second groove; the connecting plate (6) is respectively provided on the top of the linkage support plate (502) and the driving plate (403); and a limiting hole is provided on the connecting plate (6).

5. The integrated high computing power module with efficient heat dissipation structure according to claim 4, characterized in that: The positioning assembly (9) comprises a mounting box (901) which is respectively fixedly mounted on the outer side walls of the linkage support plate (502) and the drive plate (403).

6. The integrated high computing power module with efficient heat dissipation structure according to claim 5, characterized in that: A spring (902) is fixedly mounted on the inner side wall of the installation box (901), a slider (903) is mounted on one end of the spring (902), and the slider (903) is slidably engaged in the installation box (901).

7. The integrated high computing power module with efficient heat dissipation structure according to claim 6, characterized in that: A connecting rod (904) is fixedly mounted on the top of the sliding block (903), one end of the connecting rod (904) passes through the mounting box (901), and a positioning block (905) is mounted on one end of the connecting rod (904).

8. The integrated high computing power module with efficient heat dissipation structure according to claim 7, characterized in that: The bottom of the positioning block (905) is connected to a positioning column (906), and the positioning column (906) is arranged in the limiting hole.

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