Driving control panel with heat dissipation structure

Abstract

The utility model relates to the technical field of drive control boards, and discloses a drive control board with a heat dissipation structure, which comprises a circuit board, an insulating heat-conducting plate is mounted at the top of the circuit board, heat dissipation fins are fixedly arranged at the top of the insulating heat-conducting plate, a circuit layer is arranged at the top of the circuit board, and a heat dissipation layer is arranged at the bottom of the circuit board. And the top of the circuit layer is movably connected with the bottom of the insulating heat-conducting plate. According to the driving control panel with the heat dissipation structure, the mounting groove, the first through groove and the second through groove are used for placing the circuit layer, the driving chip and the electronic module respectively, the mounting height of the driving chip and the electronic module on the circuit board is reduced, and the tops of the circuit layer, the driving chip and the electronic module are all in direct contact with the bottom of the insulating heat conduction plate; heat generated by operation of the circuit layer, the driving chip and the electronic module is quickly transferred to the insulating heat-conducting plate, and is in contact with external air for heat exchange through the cooling fins on the insulating heat-conducting plate, so that the heat-conducting and heat-dissipating efficiency of the driving control panel is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of drive control boards, in particular to a drive control board with a heat dissipation structure. Background Art

[0002] Chinese patent CN217426720U provides a new type of radiator structure, which exchanges heat with the outside air through the heat dissipation teeth to take away heat, and the heat generated by the drive control board is conducted to the heat dissipation component. The heat dissipation component exchanges heat with the air through convection, and finally transfers the heat to the air, so that the temperature of the drive control board is stabilized within a reasonable range. It has the characteristics of light weight, strong heat dissipation capacity, easy disassembly and maintenance, simple and compact structure, high surface heat transfer system, small temperature gradient, and good temperature uniformity, which effectively reduces the temperature of the heat source.

[0003] The heat conduction of the modules on the existing drive control board is mostly indirect, that is, the heat sink is installed on the drive control board. Although this method can dissipate heat for the entire drive control board, the heat generated by the module operation cannot be directly transferred to the heat sink. In addition, there are many modules installed on the drive control board, and the heights of each module after installation are different, so the heat of each module cannot be directly conducted. At the same time, the heat transfer effect of the circuit layer in the drive control board is not good, and the heat conduction and heat dissipation efficiency is low. Therefore, it is necessary to design a drive control board with a heat dissipation structure with good thermal conductivity. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the utility model provides a drive control board with a heat dissipation structure, which has the advantages of covering heat transfer, reducing the module installation height and higher thermal conductivity and heat dissipation efficiency. It solves the problem that the existing heat sink can only dissipate heat for the drive control board as a whole, the heat generated by the module operation cannot be directly transferred to the heat sink, and there are a large number of modules installed on the drive control board, and the heights of the modules after installation are different, so the heat of each module cannot be directly conducted. At the same time, the heat transfer effect of the circuit layer in the drive control board is not good, and the thermal conductivity and heat dissipation efficiency is low.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a driving control board with a heat dissipation structure, comprising a circuit board, an insulating heat-conducting plate is installed on the top of the circuit board, a heat dissipation fin is fixedly arranged on the top of the insulating heat-conducting plate, a circuit layer is arranged on the top of the circuit board, the top of the circuit layer is movably connected to the bottom of the insulating heat-conducting plate, the bottom of the insulating heat-conducting plate is movably connected to a driving chip and an electronic module, pins are fixedly arranged on the left and right sides of the driving chip and the electronic module, a soldering pad is installed on the bottom of the circuit layer, and the other end of the pin is welded to the bottom of the soldering pad.

[0008] Preferably, a mounting groove is opened on the top of the circuit board, and the circuit layer is fixedly arranged inside the mounting groove. A mounting groove adapted to the shape of the circuit layer is etched above the circuit board so that the circuit layer is placed in the mounting groove, and the top of the circuit layer is in direct contact with the insulating heat conductive plate, thereby improving the heat conduction efficiency of the circuit layer.

[0009] Preferably, a first through groove is opened at the bottom of the circuit board, and the side surface of the driving chip is adapted to the inside of the first through groove. The first through groove is laser etched above the circuit board for placing and installing the driving chip, thereby reducing the installation height of the driving chip on the circuit board, and the top of the driving chip is in direct contact with the insulating heat conductive plate, thereby improving the heat conduction efficiency of the driving chip during operation.

[0010] Preferably, a second through groove is provided at the bottom of the circuit board, and the side surface of the electronic module is adapted to the interior of the second through groove. A third through groove is provided at the bottom of the circuit board, and the second through groove is laser etched above the circuit board for placing and installing the electronic module, thereby reducing the installation height of the electronic module on the circuit board, and the top of the electronic module is in direct contact with the insulating heat conductive plate, thereby improving the heat conduction efficiency of the electronic module during operation.

[0011] Preferably, a through hole is provided at the bottom of the circuit board, the through hole is connected to the inner bottom wall of the mounting groove, the side surface of the soldering pad is adapted to the interior of the through hole, and the through hole is laser etched on the inner bottom wall of the mounting groove. When the circuit layer is fixedly placed in the mounting groove, tin liquid is introduced into the through hole at the bottom of the circuit board to form a tin soldering pad, and the pins of the driving chip and the electronic module are respectively welded to the corresponding soldering pads, so that the driving chip in the first through groove and the electronic module in the second through groove are installed and fixed.

[0012] Preferably, a frame-shaped sealing strip is fixedly provided at the edge of the bottom of the insulating heat-conducting plate, and a frame-shaped groove is opened at the edge of the top of the circuit board. The frame-shaped sealing strip is adapted to the interior of the frame-shaped groove. The packaging sealing of the circuit layer on the circuit board is improved by the cooperation between the frame-shaped sealing strip and the frame-shaped groove.

[0013] Preferably, screws are fixedly provided on the left and right sides of the top of the circuit board, and connecting blocks are movably sleeved on the side surfaces of the two screws. The opposite sides of the two connecting blocks are respectively fixedly connected to the bottom of the left and right sides of the insulating heat conducting plate. Three screws are provided on the left and right sides of the top of the circuit board. The three connecting blocks on the left and right sides of the insulating heat conducting plate are respectively plugged into and matched with the corresponding screws, so that the insulating heat conducting plate encapsulates the top of the circuit board.

[0014] Preferably, a nut is threadedly connected to the upper surface of the screw, and the bottom of the nut is abutted against the top of the connecting block. After the insulating heat conductive plate is placed on the circuit board, the circuit board and the insulating heat conductive plate are installed and fixed by screwing the nuts over the screws on both sides.

[0015] Compared with the prior art, the utility model provides a drive control board with a heat dissipation structure, which has the following beneficial effects:

[0016] 1. The drive control board with a heat dissipation structure is provided with an insulating heat conductive plate, heat dissipation fins, a first through groove and a second through groove. The laser-etched mounting groove, the first through groove and the second through groove above the circuit board are respectively used for placing the circuit layer, the drive chip and the electronic module, thereby reducing the installation height of the drive chip and the electronic module on the circuit board. The tops of the circuit layer, the drive chip and the electronic module are directly in contact with the bottom of the insulating heat conductive plate, so that the heat generated by the operation of the circuit layer, the drive chip and the electronic module is quickly transferred to the insulating heat conductive plate, and the heat is exchanged with the outside air through the heat sink on the insulating heat conductive plate, thereby improving the heat conduction and heat dissipation efficiency of the drive control board.

[0017] 2. The drive control board with a heat dissipation structure is provided with a frame-shaped sealing strip, a frame-shaped groove, a screw, a connecting block and a nut. The left and right sides of the insulating heat-conducting plate are fixed on the circuit board by means of screw and nut cooperation. The circuit layer on the circuit board is encapsulated. The frame-shaped sealing strip cooperates with the inside of the frame-shaped groove to improve the sealing above the circuit board, thereby facilitating the packaging and heat dissipation of the drive control board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a cross-sectional view of the drive control board structure with a heat dissipation structure of the utility model;

[0019] Figure 2 For this utility model Figure 1 A magnified view of the structure at center;

[0020] Figure 3 For this utility model Figure 1 A magnified view of the structure at B in the middle;

[0021] Figure 4 This is a schematic diagram of the top structure of the circuit board of the utility model;

[0022] Figure 5 This is a schematic diagram of the bottom structure of the circuit board of the utility model;

[0023] Figure 6 This is a bottom view of the insulating heat-conducting plate structure of the utility model.

[0024] Among them: 1. Circuit board; 2. Insulated heat-conducting plate; 3. Heat dissipation fins; 4. Circuit layer; 5. Driver chip; 6. Electronic module; 7. Pins; 8. Pad; 9. First through groove; 10. Second through groove; 11. Through hole; 12. Frame-shaped sealing strip; 13. Frame-shaped groove; 14. Screw; 15. Connecting block; 16. Nut. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-6 , a drive control board with a heat dissipation structure. The main function of the driver board is to receive instructions from the main board or external devices and convert them into control signals to control and drive the work of other hardware devices. The driver board mainly undertakes the following functions: Interface conversion: The driver board acts as a bridge between different hardware devices. It can convert the electrical signals of the main board or other devices into interface signals suitable for the controlled devices, thereby achieving coordinated work between various devices; Control signal generation: The driver board generates corresponding control signals based on the received instructions and parameters to drive the hardware devices to perform specific operations. For example, it can control the speed and direction of the motor, control the brightness and color of the display, etc.; Data transmission: The driver board is responsible for data transmission between the main board and other hardware devices. It can receive, process and send data, Ensure the correct flow of information; Power management: The driver board can also manage the power supply of each hardware module to ensure the stability and safety of its operation; In summary, the driver board plays an important role in connecting, controlling and driving hardware devices in the electronic system, so that the system can operate normally and realize various functions; Including circuit board 1, the circuit on the driver board includes a power supply part, a signal processing part, a driver chip, an output interface and a DTC. The driver board is a circuit board, which is usually used to control and drive motors, lights and other mechanical devices in various electronic devices. It mainly uses circuit controllers to perform power conversion and output control to realize the action or operation of the device. The driver board has a wide range of functions and can be used in a variety of devices, such as printers, digital cameras, televisions, audio equipment, stage lighting, robots, etc.

[0027] An insulating heat-conducting plate 2 is installed on the top of the circuit board 1. Screws 14 are fixedly arranged on the left and right sides of the top of the circuit board 1. The side surfaces of the two screws 14 are movably sleeved with connecting blocks 15. The opposite sides of the two connecting blocks 15 are respectively fixedly connected to the bottom of the left and right sides of the insulating heat-conducting plate 2. Nuts 16 are threadedly connected to the upper surfaces of the screws 14. The bottom of the nut 16 abuts against the top of the connecting block 15. A frame-shaped sealing strip 12 is fixedly arranged at the edge of the bottom of the insulating heat-conducting plate 2. A frame-shaped groove 13 is opened at the edge of the top of the circuit board 1. The frame-shaped sealing strip 12 is adapted to the inside of the frame-shaped groove 13. The frame-shaped sealing strip 12, the frame-shaped groove 13, the screws 14, the connecting blocks 15 and the nuts 16 are arranged. The left and right sides of the insulating heat-conducting plate 2 It is installed and fixed on the circuit board 1 by means of screw and nut cooperation, and the circuit layer 4 on the circuit board 1 is encapsulated. The frame-shaped sealing strip 12 cooperates with the inside of the frame-shaped groove 13 to improve the sealing above the circuit board 1, thereby facilitating the packaging and heat dissipation of the drive control board. The top of the insulating heat-conducting plate 2 is fixedly provided with a heat dissipation fin 3, and the top of the circuit board 1 is provided with a circuit layer 4. The top of the circuit board 1 is provided with a mounting groove, and the circuit layer 4 is fixedly arranged inside the mounting groove. The top of the circuit board 1 is movably connected with the bottom of the insulating heat-conducting plate 2. An mounting groove that is adapted to the shape of the circuit layer 4 is etched above the circuit board 1, so that the circuit layer 4 is placed in the mounting groove, and the top of the circuit layer 4 is in direct contact with the insulating heat-conducting plate 2, thereby improving the heat conduction efficiency of the circuit layer 4.

[0028] The bottom of the insulating heat-conducting plate 2 is movably connected with a driving chip 5 and an electronic module 6. A first through-slot 9 is provided at the bottom of the circuit board 1. The side surface of the driving chip 5 is adapted to the inside of the first through-slot 9. The first through-slot 9 is laser-etched above the circuit board 1 for placing and installing the driving chip 5, thereby reducing the installation height of the driving chip 5 on the circuit board 1. The top of the driving chip 5 is in direct contact with the insulating heat-conducting plate 2, thereby improving the heat conduction efficiency of the driving chip 5. A second through-slot 10 is provided at the bottom of the circuit board 1. The second through-slot 10 is laser-etched above the circuit board 1 for electronic The module 6 is placed and installed, and the installation height of the electronic module 6 on the circuit board 1 is reduced, and the top of the electronic module 6 is in direct contact with the insulating heat-conducting plate 2, which improves the heat conduction efficiency of the electronic module 6. The side surface of the electronic module 6 is adapted to the inside of the second through groove 10. Through grooves of different sizes can be laser-etched on the circuit board 1 for placing modules of different sizes. An insulating heat-conducting plate 2, a heat dissipation fin 3, a first through groove 9 and a second through groove 10 are provided. The laser-etched installation groove, the first through groove 9 and the second through groove 10 on the circuit board 1 are respectively used for the circuit layer 4 and the drive core The placement of the chip 5 and the electronic module 6 reduces the installation height of the driver chip 5 and the electronic module 6 on the circuit board 1, and the tops of the circuit layer 4, the driver chip 5 and the electronic module 6 are in direct contact with the bottom of the insulating heat-conducting plate 2, so that the heat generated by the operation of the circuit layer 4, the driver chip 5 and the electronic module 6 is quickly transferred to the insulating heat-conducting plate 2, and the heat is exchanged with the outside air through the heat dissipation fins 3 on the insulating heat-conducting plate 2, thereby improving the heat conduction and heat dissipation efficiency of the drive control board. The left and right sides of the driver chip 5 and the electronic module 6 are fixedly provided with pins 7, and the bottom of the circuit layer 4 is provided with a A soldering pad 8 is installed, and a through hole 11 is opened at the bottom of the circuit board 1. The through hole 11 is connected to the inner bottom wall of the installation groove, the side surface of the soldering pad 8 is adapted to the inside of the through hole 11, the other end of the pin 7 is welded to the bottom end of the soldering pad 8, and the through hole 11 is laser etched on the bottom wall of the installation groove. When the circuit layer 4 is fixedly placed in the installation groove, tin liquid is introduced into the through hole 11 at the bottom of the circuit board 1 to form a tin soldering pad 8, and the pins 7 of the driving chip 5 and the electronic module 6 are respectively welded to the corresponding soldering pads 8, so that the driving chip 5 in the first through groove 9 and the electronic module 6 in the second through groove 10 are installed and fixed.

[0029] When in use, according to the surface morphology of the circuit layer 4, the driving chip 5 and the electronic module 6, the mounting groove, the first through groove 9 and the second through groove 10 are laser etched on the top of the circuit board 1, and then a certain number of through holes 11 are laser etched on the bottom of the circuit board 1. The top of each through hole 11 is connected to the inside of the mounting groove, and the left and right sides of the top of the circuit board 1 are integrally formed with screws 14 to complete the processing operation of the circuit board 1; the circuit layer 4 is placed in the mounting groove above the circuit board 1 and fixed, and tin liquid is introduced into the through hole 11 below the circuit board 1 and solidified to form a tin plate below the circuit layer 4, and then The driving chip 5 and the electronic module 6 are placed in the first through groove 9 and the second through groove 10 of the circuit board 1. The pins 7 of the driving chip 5 and the electronic module 6 are respectively welded to the corresponding pads 8 to install and fix the driving chip 5 in the first through groove 9 and the electronic module 6 in the second through groove 10. Then, the connecting blocks 15 on the left and right sides of the insulating heat-conducting plate 2 are respectively matched with the screws 14 on the left and right sides of the circuit board 1, and are tightened and fixed with nuts 16 to install the insulating heat-conducting plate 2 above the circuit board 1. The frame-shaped sealing strip 12 is matched with the inside of the frame-shaped groove 13 to make the top of the circuit board 1 sealed. The drive control board with a heat dissipation structure is used for placing the circuit layer 4, the drive chip 5 and the electronic module 6 respectively through the laser-etched installation groove, the first through groove 9 and the second through groove 10 on the circuit board 1, thereby reducing the installation height of the drive chip 5 and the electronic module 6 on the circuit board 1, and the tops of the circuit layer 4, the drive chip 5 and the electronic module 6 are directly in contact with the bottom of the insulating heat-conducting plate 2, so that the heat generated by the operation of the circuit layer 4, the drive chip 5 and the electronic module 6 is quickly transferred to the insulating heat-conducting plate 2, and the insulating heat-conducting plate 2 can collect the heat of all modules on the circuit board 1, and exchange heat with the outside air through the heat dissipation fins 3 on the insulating heat-conducting plate 2, replacing the indirect heat dissipation method, thereby improving the thermal conductivity efficiency of the circuit layer 4, the drive chip 5 and each electronic module 6 in the circuit board 1, thereby facilitating the rapid heat dissipation of the drive control board.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A drive control board with a heat dissipation structure, comprising a circuit board (1), characterized in that: An insulating heat-conducting plate (2) is installed on the top of the circuit board (1), a heat-dissipating fin (3) is fixedly arranged on the top of the insulating heat-conducting plate (2), a circuit layer (4) is arranged on the top of the circuit board (1), the top of the circuit layer (4) is movably connected to the bottom of the insulating heat-conducting plate (2), a driving chip (5) and an electronic module (6) are movably connected to the bottom of the insulating heat-conducting plate (2), pins (7) are fixedly arranged on the left and right sides of the driving chip (5) and the electronic module (6), a soldering pad (8) is installed on the bottom of the circuit layer (4), and the other end of the pin (7) is soldered to the bottom of the soldering pad (8).

2. The drive control board with a heat dissipation structure according to claim 1, characterized in that: A mounting groove is provided on the top of the circuit board (1), and the circuit layer (4) is fixedly arranged inside the mounting groove.

3. The drive control board with a heat dissipation structure according to claim 1, characterized in that: A first through slot (9) is provided at the bottom of the circuit board (1), and the side surface of the driving chip (5) is adapted to the interior of the first through slot (9).

4. The drive control board with a heat dissipation structure according to claim 1, characterized in that: A second through slot (10) is provided at the bottom of the circuit board (1), and the side surface of the electronic module (6) is adapted to the interior of the second through slot (10).

5. The drive control board with a heat dissipation structure according to claim 2, characterized in that: A through hole (11) is provided at the bottom of the circuit board (1), the through hole (11) is connected to the inner bottom wall of the mounting groove, and the side surface of the solder pad (8) is adapted to the interior of the through hole (11).

6. The drive control board with a heat dissipation structure according to claim 1, characterized in that: A frame-shaped sealing strip (12) is fixedly arranged at the edge of the bottom of the insulating heat-conducting plate (2), a frame-shaped groove (13) is opened at the edge of the top of the circuit board (1), and the frame-shaped sealing strip (12) is adapted to the inside of the frame-shaped groove (13).

7. The drive control board with a heat dissipation structure according to claim 1, characterized in that: Screw rods (14) are fixedly provided on both left and right sides of the top of the circuit board (1), and connecting blocks (15) are movably sleeved on the side surfaces of the two screw rods (14), and the opposite sides of the two connecting blocks (15) are fixedly connected to the bottom of the left and right sides of the insulating heat conducting plate (2) respectively.

8. The drive control board with a heat dissipation structure according to claim 7, characterized in that: The upper surface of the screw rod (14) is threadedly connected with a nut (16), and the bottom of the nut (16) is abutted against the top of the connecting block (15).

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