Electronic equipment radiator

Abstract

The utility model discloses an electronic equipment radiator, which comprises a shell, a semiconductor radiator, a power supply assembly, a fan, a heat-conducting fin and a radiator, the semiconductor radiator, the power supply assembly, the fan, the heat-conducting fin and the radiator are all arranged on the shell, and the semiconductor radiator is arranged on the left side of the shell. The semiconductor radiator transmits heat of the electronic equipment to the radiator through the heat conducting sheet, the power supply assembly is electrically connected with the fan and is used for supplying energy to the fan, and the fan is used for radiating heat of the radiator. Graphene is used as a heat conduction material, the heat conduction effect is good, the graphene is cheaper than aluminum sheets and heat conduction gel, and the cost of enterprises is reduced; the wearing of the radiator is greatly facilitated through the single shell, and the burden of the hand is relieved; the shell is thin and can be used together with wireless charging during use, the problem of insufficient endurance of the mobile phone is solved, and the endurance of the mobile phone is enhanced.

Description

Technical Field

[0001] The utility model belongs to the field of electronic equipment accessories, in particular to an electronic equipment radiator. Background Art

[0002] The performance of chips on the market is getting stronger and stronger, but at the same time, the battery life of power components and the heating of electronic devices have become problems in the use of electronic devices. Radiators are becoming more and more popular, but the current electronic equipment radiators are becoming more and more bloated. If you use a radiator, you will not be able to use the wireless charging function at the same time, and when you electronically clamp the radiator, it will increase the burden on your hands and easily deform your fingers. In addition, the thermal conductive sheet of the current radiator is generally aluminum sheet or thermal conductive gel, which has poor thermal conductivity and greatly increases the cost of the enterprise. Therefore, an electronic equipment radiator was invented. Utility Model Content

[0003] The purpose of the utility model is to provide an electronic device radiator, aiming to solve the problems existing in the background technology. To achieve the above purpose, the technical solution adopted by the utility model is:

[0004] A heat sink for an electronic device comprises a shell, a semiconductor heat sink, a power supply component, a fan, a heat conductive sheet and a heat sink. The semiconductor heat sink, the power supply component, the fan, the heat conductive sheet and the heat sink are all mounted on the shell. A semiconductor heat sink is arranged on the left side of the shell. The semiconductor heat sink transfers the heat of the electronic device to the heat sink through the heat conductive sheet. The power supply component is electrically connected to the fan. The power supply component is used to supply energy to the fan. The fan is used to dissipate heat from the heat sink. The semiconductor heat sink, the power supply component, the fan, the heat conductive sheet and the heat sink can be reasonably arranged according to the manufacturer's production.

[0005] Preferably, the semiconductor heat sink is a TEC semiconductor heat sink.

[0006] Preferably, the heat conducting sheet is made of a superconducting material, the superconducting material is aluminum, stainless steel, copper or graphene, and the thermal conductivity of the superconducting material is 100 to 23000 w / (m·k).

[0007] Preferably, the housing is made of heat dissipation material.

[0008] Preferably, the power supply component is a battery or a charging port.

[0009] The beneficial effects of the utility model are as follows: graphene is used as a thermal conductive material, which has good thermal conductivity and is cheaper than aluminum sheets and thermal conductive gels, thus reducing the cost of the enterprise; a single shell greatly facilitates the wearing of the radiator and reduces the burden on the hands; the patented shell is thin and can be used together with wireless charging when in use, which can address the problem of insufficient battery life of mobile phones and enhance the battery life of mobile phones. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 An overall schematic diagram provided for an embodiment of the utility model;

[0011] Figure 2 The present invention is a schematic diagram of the overall structure of the embodiment of the present invention.

[0012] Among them, the reference numerals in the figure are:

[0013] 1. Shell; 2. Semiconductor heat sink; 3. Power supply component; 4. Fan; 5. Heat sink; 6. Heat conductive sheet; 7. Circuit board. DETAILED DESCRIPTION

[0014] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0015] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a centered element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method. The terms "upper end", "lower end", "left side", "right side", "front end", "rear end" and similar expressions used herein are positional relationships with reference to the accompanying drawings.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0017] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0018] like Figures 1-2As shown, an embodiment of the utility model provides an electronic device radiator, including a shell 1, a semiconductor radiator 2, a power supply component 3, a fan 4, a heat conductive sheet 6 and a radiator 5. The semiconductor radiator 2, the power supply component 3, the fan 4, the heat conductive sheet 6 and the radiator 5 are all installed on the shell 1. The semiconductor radiator 2 is arranged on the left side of the shell 1. The semiconductor radiator 2 transfers the heat of the electronic device to the radiator 5 through the heat conductive sheet 6. The power supply component 3 is electrically connected to the fan 4. The power supply component 3 is used to supply energy to the fan 4, and the fan 4 is used to dissipate heat from the radiator 5.

[0019] In the embodiment, the semiconductor heat sink 2 is a TEC semiconductor heat sink 2 .

[0020] In the embodiment, the heat conducting sheet 6 is made of a superconducting material, and the superconducting material is aluminum, stainless steel, copper or graphene, and the thermal conductivity of the superconducting material is 100 to 23000 w / (m·k).

[0021] In the embodiment, the housing 1 is made of heat dissipation material.

[0022] In the embodiment, the power supply component 3 is a battery or a charging port.

[0023] The above implementation modes are only used to illustrate the present invention, but not to limit the present invention. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, all equivalent technical solutions also belong to the scope of the present invention. The scope of patent protection of the present invention should be limited by the claims.

Claims

1. An electronic equipment radiator, characterized in that: It includes a shell, a semiconductor radiator, a power supply component, a fan, a heat conductive sheet, a circuit board and a radiator. The semiconductor radiator, power supply component, fan, heat conductive sheet, circuit board and radiator are all installed on the shell. The semiconductor radiator is arranged on the left side of the shell. The semiconductor radiator transfers the heat of the electronic device to the radiator through the heat conductive sheet. The power supply component is electrically connected to the fan, semiconductor radiator, circuit board and radiator. The power supply component is used to supply energy to the fan, semiconductor radiator, circuit board and radiator. The circuit board is used to control the fan, semiconductor radiator and radiator. The fan is used to dissipate heat from the radiator.

2. The electronic device radiator according to claim 1, characterized in that: The semiconductor heat sink is a TEC semiconductor heat sink.

3. The electronic equipment radiator according to claim 2, characterized in that: The heat conducting sheet is made of superconducting material, and the superconducting material is aluminum, stainless steel, copper or graphene, and the thermal conductivity of the superconducting material is 100-23000w / (m·k).

4. The electronic equipment radiator according to claim 3, characterized in that: The shell is made of heat dissipation material.

5. The electronic equipment radiator according to claim 3, characterized in that: The power supply component is a battery or a charging port.

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