Grid line processing system of battery piece
The laser subsystem pre-etching of the grid lines of the photovoltaic cell and increasing the thickness, combined with screen printing technology, the problem of difficulty in preparing narrower grid lines in the prior art is solved, and a higher photoelectric conversion efficiency is achieved.
Patent Information
- Application Number
- CN202420393407.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-02-28
AI Technical Summary
The prior art is difficult to prepare narrower photovoltaic cell gate lines without reducing conductivity.
The gate line shape is pre-etched using a laser subsystem, and the thickness of the electrode gate line is increased by multiple wavelength lasers and corresponding optical path transmission components. The gate line material is set in the laser processing position in combination with screen printing technology.
It is possible to prepare narrower gate lines without reducing conductivity, and improve the photoelectric conversion efficiency.
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Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of photovoltaic technology, and in particular to a grid line processing system for a cell. Background Art
[0002] The grid lines of photovoltaic cells are a grid of thin wires on the surface of the cell, usually made of conductive materials. Photovoltaic cells generate current when exposed to light, and the function of the grid lines is to collect this current and transmit it to the edge of the cell for connection to external circuits. For photovoltaic cells, the narrower the grid lines, the less light is blocked, allowing more light to reach the active layer of the cell, improving the cell's photoelectric conversion efficiency.
[0003] The grid lines of photovoltaic cells are usually prepared by screen printing. However, the screen printing process in the prior art is difficult to prepare narrower grid lines without reducing the conductive performance. Utility Model Content
[0004] The present application provides a battery cell grid line processing system for preparing narrower grid lines without reducing the conductive performance.
[0005] The cell grid line processing system includes a laser subsystem and a screen printing subsystem; wherein,
[0006] The laser subsystem includes a laser that outputs lasers of multiple wavelengths, and an optical path transmission component corresponding to each wavelength of laser; wherein the optical path component corresponding to any wavelength of laser is used to transmit the laser of the wavelength to the battery cell to be processed for laser processing;
[0007] The screen printing subsystem is used to perform screen printing at the laser processing corresponding position on the battery cell to be processed after the battery cell to be processed is laser processed, so as to set the grid line material at the laser processing corresponding position.
[0008] In the above technical solution, by setting up a laser subsystem, the shape of the grid line can be pre-etched on the battery cell, and by setting up a laser that can emit lasers of multiple wavelengths in conjunction with corresponding optical components, the thickness of the electrode grid line can be increased, thereby achieving the preparation of narrower grid lines without reducing the conductive performance.
[0009] In a possible implementation, the laser is used to output lasers of different wavelengths in sequence according to a preset processing sequence, and the output lasers of different wavelengths perform laser grooving processing on the same processing position of the battery cell to be processed through corresponding optical path transmission components.
[0010] In a possible implementation, the laser is used to output a first laser and a second laser in sequence; a processing width of the first laser is greater than a processing width of the second laser, and a processing depth of the first laser is less than a processing depth of the second laser.
[0011] In a possible implementation manner, the spot type of the first laser acting on the battery cell to be processed is a flat-top spot, and the spot type of the second laser acting on the battery cell to be processed is a Gaussian spot.
[0012] In a possible implementation, the laser subsystem further includes a beam splitter prism, which is used to split laser beams of different wavelengths emitted by the laser into corresponding optical path transmission components.
[0013] In a possible embodiment, the optical path transmission component includes a first optical path transmission component and a second optical path transmission component, and the first optical path transmission component is used to shape the initial laser output by the laser, and the shaped laser after the shaping process can be transmitted to the processing position of the battery cell to be processed through the second optical path transmission component.
[0014] In a possible implementation, the first optical path transmission component includes an aperture, a beam expander, and a beam shaper. The initial laser passes through the aperture, the beam expander, and the beam shaper in sequence to obtain a Gaussian beam or a flat-top beam.
[0015] In a possible implementation manner, the second optical path transmission component includes a beam splitting diffraction optical element, a galvanometer, and a field lens;
[0016] The shaped laser after the shaping process passes through the beam splitting and diffraction optical element, the galvanometer, and the field lens in sequence, and can reach the battery sheet to be processed and perform laser processing in a set grid line shape.
[0017] In a possible implementation, the screen printing subsystem includes a scraper, a screen printing frame, a screen, and a supporting component; wherein,
[0018] The scraper is used to slide on the screen in a preset printing direction to print the grid line material at the position corresponding to the laser processing through the holes on the screen;
[0019] The screen printing frame is used to fix the screen;
[0020] The supporting component is used to support other components in the screen printing subsystem.
[0021] In a possible implementation, a grid line material storage container is disposed inside the scraper, and the grid line material storage container has an opening corresponding to the bottom of the scraper, and the grid line material falls onto the screen through the opening during the sliding of the scraper.
[0022] In a possible implementation, the screen printing frame is provided with a locking device and a quick release device, the locking device is used to fix the screen, and the quick release device is used to remove the screen.
[0023] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and are used together with the specification to illustrate the technical solutions of the present disclosure. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can also be obtained based on these drawings without creative work.
[0025] Figure 1 This is an overall flow chart of the grid line processing system of the battery cell in the embodiment of the present application;
[0026] Figure 2 This is a schematic diagram of the laser subsystem workflow in the embodiment of the present application;
[0027] Figure 3 This is one of the optical path transmission schematic diagrams in the embodiment of the present application;
[0028] Figure 4 This is the second schematic diagram of optical path transmission in the embodiment of the present application;
[0029] Figure 5 This is a schematic diagram of the second optical path transmission component in an embodiment of the present application;
[0030] Figure 6 This is a schematic diagram of the whole-plate processing in the embodiment of this application;
[0031] Figure 7 This is a schematic diagram of the splicing process in the embodiment of the present application;
[0032] Figure 8 Schematic diagram of the screen printing subsystem in the embodiment of the present application. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the present disclosure clearer, the technical scheme in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the present disclosure for protection, but merely represents the selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present disclosure.
[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0035] The term "and / or" herein only describes an association relationship, indicating that three relationships may exist. For example, A and / or B may represent the following three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C may represent including any one or more elements selected from the set consisting of A, B, and C.
[0036] Photovoltaic cells are an important part of new energy technology, which directly converts sunlight into electrical energy. Photovoltaic cells use the photoelectric effect. When sunlight (i.e. photons) shines on the semiconductor material of the photovoltaic cell, it excites electrons to jump from the valence band to the conduction band, thereby generating current. The grid line of a photovoltaic cell is a grid of fine wires on the surface of the cell, usually made of conductive material. Photovoltaic cells generate current under light, and the function of the grid line is to collect this current and transmit it to the edge of the cell for connection to the external circuit. The grid line of a photovoltaic cell is usually prepared by screen printing. The specific preparation process includes: first, a fine grid line pattern is engraved on the pre-treated cell using a laser, and then a conductive paste is deposited using screen printing technology to form a complete grid line. Finally, the printed cell is degreased, sintered, and other treatments are performed.
[0037] For photovoltaic cells, the narrower the grid lines are, the less light is blocked, allowing more light to reach the active layer of the cell, improving the cell's photoelectric conversion efficiency. However, the existing screen printing process is difficult to prepare narrower grid lines without reducing the conductive performance.
[0038] To this end, the present application provides a grid line processing system for a cell (hereinafter referred to as the grid line processing system) for preparing narrower grid lines without reducing the conductive performance. The grid line processing system in the embodiment of the present application is specifically described below in conjunction with the accompanying drawings.
[0039] refer to Figure 1 , Figure 1 The overall flow chart of the grid line processing system of the cell in the embodiment of the present application, the grid line processing system of the cell 3 includes a laser subsystem 1 and a screen printing subsystem 2, wherein the laser subsystem 1 is used to perform laser processing on the cell 3 before screen printing, so as to form a groove for accommodating the grid line on the surface of the cell 3. The screen printing subsystem 2 is used to perform screen printing on the cell 3 after laser processing, so as to set the display material at the position corresponding to the laser processing, that is, the groove formed by the laser processing.
[0040] Among them, reference Figure 2 , Figure 2 This is a schematic diagram of the working process of the laser subsystem in an embodiment of the present application. The laser subsystem 1 includes a laser 11 that outputs lasers of multiple wavelengths, and an optical path transmission component 12 corresponding to each laser, and the optical path component corresponding to any wavelength laser is used to transmit the laser of that wavelength to the battery cell 3 to be processed for laser processing.
[0041] In the embodiment of the present application, lasers of different wavelengths can be emitted by the laser 11, and then the battery cells 3 can be sequentially etched using beams of multiple wavelengths, thereby obtaining deeper grooves than traditional laser etching, and deeper grooves can accommodate thicker gate lines.
[0042] On the battery cell 3, the gate line can be regarded as a wire, and the electrical conductivity of the gate line can be reflected by the resistance of the gate line. It can be known from physical knowledge that for a wire of unit length made of the same material under the same environment, the larger the cross-sectional area, the smaller the wire resistance, that is, the larger the cross-sectional area of the gate line, the stronger the electrical conductivity of the gate line. The gate line processing system provided in the embodiment of the present application can etch deeper grooves, and under the same cross-sectional area, the deeper the depth of the groove, the narrower the width. And then it can be achieved without changing the electrical conductivity of the gate line to achieve the narrowing of the gate line width.
[0043] The screen printing subsystem 2 is used to perform screen printing at the laser processing corresponding position on the to-be-processed battery cell 3 after the laser processing of the to-be-processed battery cell 3. The process of screen printing is to set the grid line material at the laser processing corresponding position, that is, to fill the grid line material into the grooves etched by the laser on the surface of the battery cell 3, and finally form a uniform and complete grid line. The grid line material may include but is not limited to silver, copper, aluminum or other metal materials with high conductivity.
[0044] In the above technical solution, by setting up a laser subsystem 1, the shape of the grid line can be pre-etched on the battery cell 3, and by setting up a laser 11 that can emit lasers of multiple wavelengths in conjunction with corresponding optical components, the thickness of the electrode grid line can be increased, thereby achieving the preparation of narrower grid lines without reducing the conductive performance.
[0045] As an optional implementation, the laser 11 can be used to output lasers of different wavelengths in sequence according to a preset processing sequence, and the output lasers of different wavelengths can be used to perform laser grooving on the same processing position of the battery cell 3 to be processed through the corresponding optical path transmission component 12. Specifically, the laser 11 can first output a laser beam with a wavelength of A, which can be transmitted to the battery cell 3 through the optical path transmission component 12 corresponding to the laser beam with a wavelength of A, and a groove can be etched on the battery cell 3; then, the laser 11 switches to output another laser beam with a wavelength of B, which can be transmitted to the battery cell 3 through the optical path transmission component 12 corresponding to the laser beam with a wavelength of B, and continue to etch in the groove that has been etched by the laser beam with a wavelength of A, so as to increase the depth of the groove, thereby realizing the preparation of a narrower gate line without reducing the conductive performance.
[0046] refer to Figure 3 , Figure 3 This is one of the optical path transmission schematics in the embodiment of the present application. Optionally, in a specific implementation, the laser 11 is used to sequentially output a first laser and a second laser, and the wavelengths of the first laser and the second laser are different. The first laser and the second laser are both used to perform laser processing on the battery cell 3, that is, to etch grooves on the surface of the battery cell 3. Among them, the processing width of the first laser is greater than the processing width of the second laser, and the processing depth of the first laser is less than the processing depth of the second laser.
[0047] During laser processing, the laser 11 first outputs a first laser, and under the transmission of the optical path transmission component 12 corresponding to the first laser, the first laser can reach the surface of the cell 3 and etch a relatively wide and relatively shallow groove on the surface of the cell 3; then the laser 11 outputs a second laser, and under the transmission of the optical path transmission component 12 corresponding to the second laser, the second laser can reach the groove etched by the first laser, and etch a relatively narrow but relatively deep groove in the groove etched by the first laser. After two etchings, a combined groove for accommodating the gate line can be engraved on the surface of the cell 3, and the gate line prepared in the combined groove can have a narrow width without reducing the conductive performance.
[0048] When the first laser and the second laser are transmitted, optionally, Figure 3As shown, the laser subsystem 1 further includes a beam splitter 13 , which is used to split the laser beams of different wavelengths emitted by the laser 11 into corresponding optical path transmission components 12 .
[0049] As an example, when the laser 11 emits a first laser and a second laser of two different wavelengths, the optical path transmission component 12 includes a portion corresponding to the first laser and a portion corresponding to the second laser. The beam splitter 13 is located downstream of the laser 11 and between the optical path transmission component 12 corresponding to the first laser and the optical path transmission component 12 corresponding to the second laser. After the laser 11 emits a laser, the laser can be divided into two paths after passing through the beam splitter 13, one path reaching the optical path transmission component 12 corresponding to the first laser, and the other path reaching the optical path transmission component 12 corresponding to the second laser.
[0050] As an optional implementation, for the first laser and the second laser mentioned above, the spot type of the first laser acting on the battery cell 3 to be processed is a flat-top spot, and the spot type of the second laser acting on the battery cell 3 to be processed is a Gaussian spot. In the specific implementation, the first laser and the second laser are shaped during the transmission process through the corresponding optical path transmission component 12, so that the state of the first laser before reaching the battery cell 3 is a flat-top beam, and the state of the second laser before reaching the battery cell 3 is a Gaussian beam. The first laser, which is a flat-top beam, etches the battery cell 3 with a flat-top spot when etching the battery cell 3 for the first time, and the light intensity of the flat-top spot is evenly distributed in the entire spot area, which means that during the etching process, the material removal rate is more consistent, which helps to achieve a more uniform etching depth and edge quality, and is conducive to controlling the size and position accuracy of the grid line. The second laser, which is a Gaussian beam, etches with a Gaussian spot when performing a second etching on the groove etched by the first laser. In the Gaussian spot, most of the energy is concentrated in the center of the spot, which is more suitable for deep etching in the second etching.
[0051] The above-mentioned etching is performed sequentially using the first laser and the second laser, and the first laser is a flat-top beam and the second laser is a Gaussian beam. When etching the battery cell 3, the flat-top beam can accurately destroy the oxide layer on the surface of the battery cell 3 and keep the edge of the groove with high precision, while the Gaussian beam can quickly etch again in the groove etched by the flat-top beam, so that the groove has a greater depth, thereby increasing the thickness of the gate line, and achieving a narrower width of the gate line without reducing the conductive performance.
[0052] The optical path transmission component 12 in the embodiment of the present application is described in detail below. Figure 3The optical path transmission component 12 provided in the embodiment of the present application includes a first optical path transmission component 121 and a second optical path transmission component 122, wherein the first optical path transmission component 121 and the second optical path transmission component 122 are arranged along the optical path transmission direction, and compared with the first optical path transmission component 121, the second optical path transmission component 122 is located at a relatively downstream position in the optical path transmission direction. Specifically, the first optical path transmission component 121 is used to shape the initial laser shown by the laser 11, and the shaped laser after the shaping process can be transmitted to the processing position of the battery cell 3 to be processed through the second optical path transmission component 122. After shaping the initial laser, the energy distribution of the laser in the target area of laser etching can be made more uniform, and the laser improves the utilization efficiency of the laser; and the shaped laser can provide a more precise light spot, which is conducive to improving the accuracy of laser etching processing.
[0053] It should be understood that when the optical path transmission component 12 includes parts corresponding to lasers of multiple wavelengths, the optical path transmission component 12 corresponding to any wavelength of laser light includes a first optical path transmission component 121 and a second optical path transmission component 122. Figure 3 As shown in the figure, the optical path transmission component 12 has a part corresponding to the first laser and a part corresponding to the second laser. Then the part corresponding to the first laser in the optical path transmission component 12 includes a first optical path transmission component 121 and a second optical path transmission component 122, and the part corresponding to the second laser in the optical path transmission component 12 also includes a first optical path transmission component 121 and a second optical path transmission component 122.
[0054] As an optional implementation, continue to refer to Figure 3 The first optical path transmission component 121 includes an aperture 1211, a beam expander 1213 and a beam shaper 1214. Specifically, the aperture 1211, the beam expander 1213 and the beam shaper 1214 are sequentially arranged in the optical path along the direction of optical path propagation. The initial laser can reach the aperture 1211 after passing through the beam splitter 13, and then pass through the aperture 1211, the beam expander 1213 and the beam shaper 1214 in sequence to reach a Gaussian beam or a flat-top beam.
[0055] By setting the aperture 1211, the amount of light entering the first optical path transmission component 121 can be conveniently controlled, especially for Figure 3 When the optical path transmission component 12 shown includes two first optical path transmission components 121 corresponding to the first laser and the second laser respectively, the two apertures 1211 in the two first optical path transmission components 121 can cooperate to achieve shaping of the first laser and the second laser respectively, and the operation is convenient and quick.
[0056] In order to allow the first laser and the second laser to etch the same position of the battery cell 3, this can be achieved by deflecting the laser subsystem 1 as a whole, or by changing the transmission direction of the light flow.
[0057] For reference Figure 3 and Figure 4 , Figure 4 Optionally, when the first optical path transmission component 121 is provided, the first optical path transmission component 121 may further include a reflector 1212, which may change the direction of optical path propagation, thereby facilitating the first laser and the second laser to process the same position on the cell.
[0058] Specifically, when setting the reflector 1212, the Figure 3 As shown, the beam splitter 13 splits the light beam by 180 degrees, and a reflector 1212 is arranged between the aperture 1211 and the beam expander 1213 in each first optical path transmission component 121. Each reflector 1212 can deflect the light by 90 degrees, so that the first laser and the second laser have the same propagation direction after being reflected by the corresponding reflector 1212, thereby saving the space occupied by the optical device. Of course, when the reflector 1212 is arranged, it can also be as follows Figure 4 As shown, the beam splitter prism 14 separates the light beam by 90 degrees, and a reflector 1212 is arranged between the aperture 1211 and the beam expander 1213 in a first optical path transmission component 121. The reflector can deflect the light by 90 degrees. It can also make one of the first laser and the second laser have the same propagation direction as the other after passing through the reflector 1212. It should be understood that in some other possible implementations, the beam splitter prism 14 may also reflect light at other angles, and the number and deflection angle of the reflector 1212 can be set according to actual conditions, which will not be repeated here.
[0059] The beam expander 1213 and the beam shaper 1214 cooperate to convert the initial laser into a Gaussian beam or a flat-top beam. Figure 3 In the example shown, the first laser can be converted into a flat-top beam after passing through the first optical path transmission component 121 corresponding to the first laser, and the second laser can be converted into a Gaussian beam after passing through the first optical path transmission component 121 corresponding to the second laser.
[0060] By setting the beam expander 1213, the area in which the laser beam can be processed can be increased, thereby improving the efficiency of laser processing. Optionally, the beam expander 1213 can be a Galilean 1x-4x type or a 2x-10x type. The Galilean 1x-4x or 2x-10x type beam expander 1213 has no internal focus and will not cause the air inside the lens to heat up, which can greatly reduce the wavefront error and is suitable for high-power processing applications.
[0061] The shaper 1214 can shape the laser beam into a Gaussian beam or a flat-top beam. Optionally, when the shaper 1214 is specifically set, an aspherical lens group can be used to shape the beam. The shaping method using an aspherical lens group has the advantages of long propagation distance and stable output light spot with uniform light intensity distribution.
[0062] As an optional implementation, refer to Figure 5 , Figure 5 Schematic diagram of the second optical path transmission component in the embodiment of the present application, the second optical path transmission component 122 includes a beam splitting diffraction optical element 1221, a galvanometer 1222 and a field lens 1223. In the optical path propagation direction, the second optical path transmission component 122 is located between the first optical path transmission component 121 and the battery cell 3 to be processed, and the beam splitting diffraction optical element 1221, the galvanometer 1222 and the field lens 1223 are arranged in sequence along the optical path propagation direction.
[0063] Specifically, the beam splitting diffractive optical element 1221 refers to a diffractive optical element with a beam splitting function, which can split an incident light beam into multiple light beams, and each of the split light beams can be etched. The laser beam split by the beam splitting diffractive optical element will be emitted at a specific separation angle, which can be determined according to actual production needs, and the separation angle is extremely accurate. In a specific example, the error is less than 0.03mRad. Through the beam splitting of the beam splitting diffractive optical element 1221, multiple grooves can be etched simultaneously, thereby improving the efficiency of laser processing.
[0064] The galvanometer 1222 is a small mirror that can move quickly to scan or depict a light beam. It is usually mounted on a fixed axis and can be driven mechanically or electrically along one or more axes to achieve scanning of the light beam in a two-dimensional space. During the laser etching process, the galvanometer 1222 can make the Gaussian spot or the flat-top spot scan along the shape of the grid line, and then etch a groove in the shape of the grid line. The field lens 1223 is an optical element for controlling and adjusting the focusing position of the light beam. The field lens 1223 is located on the focal plane of the galvanometer 1222 scanning system, and is used to focus the light beam from the galvanometer 1222 to a specific point. In an embodiment of the present application, the field lens 1223 is used to focus the light beam from the galvanometer 1222 to the surface of the battery cell 3 for laser etching operations.
[0065] In a specific example, the incident wavelength range selected by the galvanometer 1222 is 320nm-1080nm, the processing speed is 0.1m / s-60m / s, and the beam incident aperture of the galvanometer 1222 is 10mm-20mm; the field lens 1223 focuses the laser beam, and the field lens 1223 is an F-θ flat field lens or a telecentric field lens, and the selected focal length range is 100mm-385mm, which can be used to process grooves corresponding to commonly used standard lines (60um), sub-fine lines (40um), and ultra-fine lines (30um and below).
[0066] refer to Figure 6 , Figure 6 This is a schematic diagram of the whole-plate processing in the embodiment of the present application. For grid line widths within the range of standard lines and sub-fine lines, a one-time covering of the entire plate processing method can be preferably adopted to shorten the single-piece processing time while ensuring the range of processing accuracy.
[0067] refer to Figure 7 , Figure 7 This is a schematic diagram of the splicing processing in the embodiment of the present application. When the grid line width is in the ultra-fine line range, multiple splicing processing methods can be adopted. The platform achieves multiple splicing by rotating. The rotation splicing method drives the servo motor to drive the platform to rotate by directly driving the motor. The rotation process has only one degree of freedom, and the error is smaller. The angle and accuracy are easier to control, which improves the processing accuracy.
[0068] Combine the following Figure 8 , specifically introduce the screen printing subsystem 2, Figure 8 Schematic diagram of the screen printing subsystem in the embodiment of the present application.
[0069] As an optional embodiment, the screen printing subsystem 2 includes a scraper 21, a screen frame 22, a screen 23 and a support component 24, wherein the support component 24 is used to provide support for the screen printing subsystem 2 as a whole, including providing support for the battery cell 3 during screen printing. Specifically, the part of the support component 24 used to support the battery cell 3 is constructed as a support table, and the battery cell 3 can be placed on the support table to facilitate subsequent screen printing operations. The screen frame 22 is fixed above the support table, and the screen frame 22 opens the screen 23 and covers the support table and the top of the battery cell 3. During screen printing, the grid line material is in a slurry state, and the screen 23 has holes. The scraper 21 is located on the side of the screen 23 away from the battery cell 3, and slides and scrapes the screen 23 on the screen 23 according to the preset printing direction. The grid line material can be printed from the hole at the position corresponding to the laser processing, that is, the grid line material passes through the hole into the groove pre-etched by the laser.
[0070] By using screen printing, the grid line material can be deposited quickly and evenly into the grooves opened by the laser, improving production efficiency and product quality.
[0071] Optionally, a grid line material storage container is provided inside the scraper 21, and the grid line material storage container has an opening corresponding to the bottom of the scraper 21, and the grid line material falls onto the screen 23 through the opening during the sliding process of the scraper 21. By integrating the grid line material storage container on the scraper 21, on the one hand, the consistency of adding the grid line material and the movement of the scraper 21 can be improved, and material waste can be reduced; on the other hand, the structure of the screen printing subsystem 2 is compact, saving space.
[0072] Optionally, the screen printing frame 22 is provided with a locking device and a quick release device, the locking device is used to fix the screen 23, and the quick release device is used to remove the screen 23. Wherein, the locking device and the quick release device can be common thread locking, spring locking and other methods. By setting the locking mechanism, the stability of the screen printing frame 22 supporting the fixed screen 23 can be improved. By setting the quick release device, the screen frame with the screen 23 can be easily removed for laser etching operations and the screen frame with the screen 23 can be installed for screen printing operations. In addition, by the quick release method, it is also convenient to replace the screen 23 of different mesh numbers when producing grid lines of different widths, saving time for replacing the screen 23 and improving production efficiency.
[0073] Optionally, an observation window may be provided on the screen printing frame 22 to facilitate observation of the states of the scraper 21 and the screen 23 during screen printing.
[0074] For reference Figure 1 , Figure 2 , Figure 3 and Figure 8 The working process of the grid line processing system provided in the embodiment of the present application is as follows: the laser 11 emits a first laser, and the first laser passes through a first optical path transmission component 121 corresponding to the first laser and a second optical path transmission component 122 corresponding to the first laser, and etches for the first time in the state of a flat-top beam; then, the laser 11 emits a second laser, and the second laser passes through the first optical path transmission component 121 corresponding to the second laser and a second optical path transmission component 122 corresponding to the second laser, and etches for the second time in the state of a Gaussian beam; the processed battery cell 3 is placed on a support table, and the scraper 21 drives the grid line material to print on the battery cell 3; and then after degreasing and sintering treatment, the grid line is made on the battery cell 3.
[0075] In the above process, by setting up a laser subsystem, the shape of the grid line can be pre-etched on the battery cell, and by setting up a laser that can emit lasers of multiple wavelengths in conjunction with corresponding optical components, the thickness of the electrode grid line can be increased, thereby achieving the preparation of narrower grid lines without reducing the conductive performance.
[0076] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present disclosure, which are used to illustrate the technical solutions of the present disclosure, rather than to limit them. The protection scope of the present disclosure is not limited thereto. Although the present disclosure is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present disclosure, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A grid line processing system for a battery cell, characterized in that: It includes a laser subsystem and a screen printing subsystem; wherein, The laser subsystem includes a laser that outputs lasers of multiple wavelengths, and an optical path transmission component corresponding to each wavelength of laser; wherein the optical path component corresponding to any wavelength of laser is used to transmit the laser of the wavelength to the battery cell to be processed for laser processing; The screen printing subsystem is used to perform screen printing at the laser processing corresponding position on the battery cell to be processed after the laser processing is performed on the battery cell to be processed, so as to set the grid line material at the laser processing corresponding position.
2. The grid line processing system according to claim 1, characterized in that: The laser is used to output lasers of different wavelengths in sequence according to a preset processing sequence, and the output lasers of different wavelengths perform laser grooving processing on the same processing position of the battery sheet to be processed through the corresponding optical path transmission components.
3. The grid line processing system according to claim 2, characterized in that: The laser is used to output a first laser and a second laser in sequence; a processing width of the first laser is greater than a processing width of the second laser, and a processing depth of the first laser is less than a processing depth of the second laser.
4. The grid line processing system according to claim 3, characterized in that: The spot type of the first laser acting on the battery cell to be processed is a flat-top spot, and the spot type of the second laser acting on the battery cell to be processed is a Gaussian spot.
5. The grid line processing system according to any one of claims 1 to 4, characterized in that: The laser subsystem further comprises a beam splitter prism, which is used to split the laser beams of different wavelengths emitted by the laser into corresponding optical path transmission components.
6. The grid line processing system according to claim 5, characterized in that: The optical path transmission component includes a first optical path transmission component and a second optical path transmission component. The first optical path transmission component is used to shape the initial laser output by the laser. The shaped laser after the shaping process can be transmitted to the processing position of the battery cell to be processed through the second optical path transmission component.
7. The grid line processing system according to claim 6, characterized in that: The first optical path transmission component includes an aperture, a beam expander and a beam shaper. The initial laser passes through the aperture, the reflector, the beam expander and the beam shaper in sequence to obtain a Gaussian beam or a flat-top beam.
8. The grid line processing system according to claim 6, characterized in that: The second optical path transmission component includes a beam splitting diffraction optical element, a galvanometer, and a field lens; The shaped laser after the shaping process passes through the beam splitting and diffraction optical element, the galvanometer, and the field lens in sequence, and can reach the battery sheet to be processed and perform laser processing in a set grid line shape.
9. The grid line processing system according to claim 1, characterized in that: The screen printing subsystem includes a scraper, a screen printing frame, a screen, and a supporting component; wherein, The scraper is used to slide on the screen in a preset printing direction to print the grid line material at the position corresponding to the laser processing through the holes on the screen; The screen printing frame is used to fix the screen; The supporting component is used to support other components in the screen printing subsystem.
10. The grid line processing system according to claim 9, characterized in that: A grid line material storage container is arranged inside the scraper, and the grid line material storage container has an opening corresponding to the bottom of the scraper. The grid line material falls onto the screen through the opening during the sliding process of the scraper.
11. The grid line processing system according to claim 9, characterized in that: The screen printing frame is provided with a locking device and a quick release device, wherein the locking device is used to fix the screen, and the quick release device is used to remove the screen.
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CN119952267A