LED support

Abstract

The utility model belongs to the technical field of LEDs, and discloses an LED support which comprises a support body and at least one chip packaged in the support body, a bowl cup is arranged in the support body, a first bonding pad, a second bonding pad and a third bonding pad are arranged on the bottom face of the bowl cup, the second bonding pad is arranged between the first bonding pad and the third bonding pad, and the first bonding pad and the second bonding pad are arranged on the bottom face of the bowl cup. The first bonding pad, the second bonding pad and the third bonding pad extend out of the support body, and insulating layers are arranged among the first bonding pad, the second bonding pad and the third bonding pad. According to the utility model, the first bonding pad, the second bonding pad and the third bonding pad are arranged, and the first bonding pad, the second bonding pad and the third bonding pad respectively extend out of the bracket body, so that the product strength is enhanced, and at least one chip is packaged in the bracket body, so that the product brightness is improved, the power loss is reduced, and the customer requirements are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of LEDs and relates to an LED bracket. Background Art

[0002] With the advancement of technology, product manufacturing is becoming more and more precise and miniaturized. As for the LED industry, the requirements for LED brackets are getting higher and higher. The product design is becoming more and more compact, the size requires high precision, the power requires high, the strength requires high, and energy saving is also required. However, the performance and strength of the product cannot be reduced due to miniaturization. Due to some design defects in the existing LED brackets, the LED brackets on the market cannot meet the requirements of high power and high strength.

[0003] Based on this, the art urgently needs an LED bracket to solve the above technical problems. Utility Model Content

[0004] In view of this, the purpose of the present invention is to solve the above problems and provide an LED bracket.

[0005] In order to solve the above technical problems, the utility model provides an LED bracket, comprising: a bracket body and at least one chip encapsulated in the bracket body, a bowl cup is provided in the bracket body, a first solder pad, a second solder pad and a third solder pad are provided on the bottom surface of the bowl cup, the second solder pad is provided between the first solder pad and the third solder pad, the first solder pad, the second solder pad and the third solder pad extend out through the bracket body respectively, and an insulating layer is provided between the first solder pad, the second solder pad and the third solder pad.

[0006] As a further improvement of the present invention, one of the first welding pad and the third welding pad is a positive electrode welding pad, and the other is a negative electrode welding pad, and the second welding pad is connected to the first welding pad or the third welding pad.

[0007] As a further improvement of the present invention, a first extension portion is provided on the first welding pad, and the first extension portion at least extends out of the midpoint of the bracket body.

[0008] As a further improvement of the present invention, a second extension portion is provided on the third welding pad, and the second extension portion at least extends out of the midpoint of the bracket body.

[0009] As a further improvement of the present invention, the first extension portion and the second extension portion are equal in length.

[0010] As a further improvement of the present invention, the second pad is provided with a bending portion that matches the first extension portion and the second extension portion.

[0011] As a further improvement of the present invention, the chip includes a first chip, a second chip and a third chip, the first chip electrically connects the first pad and the second pad, the second chip electrically connects the first pad and the third pad, and the third chip electrically connects the second pad and the third pad.

[0012] As a further improvement of the present invention, the first chip and the third chip are the same in shape and size, and the second chip is arranged between the first chip and the third chip.

[0013] As a further improvement of the present invention, the connection points between the first pad, the second pad and the third pad and the insulating layer are all step-shaped.

[0014] As a further improvement of the present invention, the bowl is in the shape of an inverted cone, and the angle between the opposite side walls of the bowl is 108-110°.

[0015] The technical effect of the utility model is: compared with the prior art, the utility model provides an LED bracket, which enhances the product strength by setting a first soldering pad, a second soldering pad and a third soldering pad, and the first soldering pad, the second soldering pad and the third soldering pad respectively extend through the bracket body, and by encapsulating at least one chip in the bracket body, the product brightness is improved, the power loss is reduced, and customer needs are met. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only part of the embodiments of the utility model, rather than all of the embodiments. For ordinary technicians in this field, without paying creative work, other drawings obtained based on these drawings all fall within the scope of protection of the utility model.

[0017] Figure 1 This is a three-dimensional diagram of an LED bracket without a chip provided by an embodiment of the utility model;

[0018] Figure 2 This is a three-dimensional diagram of an LED bracket with a chip provided by an embodiment of the utility model;

[0019] Figure 3 It is a three-dimensional diagram of a soldering pad of an LED bracket provided in an embodiment of the utility model.

[0020] Among them, 10 is chip 10, 11 is the first chip 11, 12 is the second chip 12, 13 is the third chip 13, 20 is the pad 20, 21 is the first pad 21, 211 is the first extension part 211, 22 is the second pad 22, 221 is the bending part 221, 23 is the third pad 23, 231 is the second extension part 231, 30 is the bracket body 30, 31 is the bowl 31, 311 is the side wall 311, 40 is the insulating layer 40. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] In order to make the description of the disclosed content more detailed and complete, the following is an illustrative description of the implementation method and specific examples of the utility model; however, this is not the only form of implementing or using the specific examples of the utility model. The implementation method covers the features of multiple specific examples and the method steps and their sequence for constructing and operating these specific examples. However, other specific examples can also be used to achieve the same or equal functions and step sequences. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0024] It should be understood that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0025] In the description of the present invention, the terms "front", "rear", "top", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0026] Please refer to Figure 1-Figure 3 An embodiment of the utility model provides an LED bracket to solve the problem that LED cannot meet high power and high intensity requirements.

[0027] For details, please refer to Figure 1 A three-dimensional diagram of an LED bracket without a chip provided by an embodiment of the utility model, Figure 2 A three-dimensional diagram of an LED bracket with a chip provided in an embodiment of the utility model, the utility model provides an LED bracket, comprising: a bracket body 30 and at least one chip 10 encapsulated in the bracket body 30, the bracket body 30 is provided with a bowl cup 31, and a first soldering pad 21, a second soldering pad 22 and a third soldering pad 23 are provided on the bottom surface of the bowl cup 31, the second soldering pad 22 is provided between the first soldering pad 21 and the third soldering pad 23, the first soldering pad 21, the second soldering pad 22 and the third soldering pad 23 extend out from the bracket body 30 respectively, and an insulating layer 40 is provided between the first soldering pad 21, the second soldering pad 22 and the third soldering pad 23. The chip 10 is connected with the first pad 21, the second pad 22 and the third pad 23 to achieve conduction. The design of the multi-chip 10 can not only increase the brightness of the product, but also reduce the power loss. Preferably, the bowl cup 31 and the insulating layer 40 are designed as an integrated molding. The bowl cup 31 and the insulating layer 40 are made of SMC (Sheet Molding Compound) material. Compared with the traditional PCT (Poly 1,4-cyclohexylenedimethylene terephthalate) or PPA (Polyphthalamide) material, the aging resistance of the product is greatly improved and the service life of the product is extended. By setting the first pad 21, the second pad 22 and the third pad 23, and the first pad 21, the second pad 22 and the third pad 23 are respectively extended through the bracket body 30, the product strength is enhanced, and by encapsulating at least one chip 10 in the bracket body 30, the product brightness is improved, the power loss is reduced, and the customer needs are met.

[0028] As a further improvement of the present invention, one of the first pad 21 and the third pad 23 is a positive pad, and the other is a negative pad, and the second pad 22 is connected to the first pad 21 or the third pad 23. By setting one of the first pad 21 and the third pad 23 as a positive pad and the other as a negative pad, the positive and negative electrodes are connected and conducted, and by setting the second pad 22 to connect the first pad 21 or the third pad 23, the connection distance between the chip 10 and the positive pad and the negative pad is shortened, the connection difficulty of the chip 10 connecting the positive pad and the negative pad to achieve line conduction is simplified, the line loss is reduced, and the product performance is improved.

[0029] As a further improvement of the present invention, see Figure 3 , a first extension portion 211 is provided on the first pad 21, and the first extension portion 211 at least extends out of the midpoint of the bracket body 30. A second extension portion 231 is provided on the third pad 23, and the second extension portion 231 at least extends out of the midpoint of the bracket body 30. By providing the first extension portion 211 on the first pad 21, and the first extension portion 211 at least extends out of the midpoint of the bracket body 30. The second extension portion 231 is provided on the third pad 23, and the second extension portion 231 at least extends out of the midpoint of the bracket body 30. The product strength is enhanced, the weak strength of the middle part of the product in the prior art is effectively avoided, and the product performance is improved.

[0030] As a further improvement of the present invention, the first extension portion 211 is equal in length to the second extension portion 231. By setting the first extension portion 211 and the second extension portion 231 to be equal in length, the stress on both sides of the middle of the product is balanced, further enhancing the strength of the product.

[0031] As a further improvement of the present invention, the second pad 22 is provided with a bent portion 221 that matches the first extension portion 211 and the second extension portion 231. It can be understood that the second pad 22 spans the left and right ends of the product and penetrates the product. By providing the bent portion 221 that matches the first extension portion 211 and the second extension portion 231 on the second pad 22, the strength of the product is further enhanced.

[0032] As a further improvement of the utility model, the chip 10 includes a first chip 11, a second chip 12 and a third chip 13. The first chip 11 is electrically connected to the first pad 21 and the second pad 22, the second chip 12 is electrically connected to the first pad 21 and the third pad 23, and the third chip 13 is electrically connected to the second pad 22 and the third pad 23. It should be noted that the size and shape of the chip 10 are not limited in the utility model, as long as it can be connected and conducted with the pad 20. The first chip 11, the second chip 12 and the third chip 13 can be connected to the solder board through solder balls by flip chips or connected to the solder board through leads by upright chips. Preferably, the first chip 11, the second chip 12 and the third chip 13 are connected to the solder board through solder balls by flip chips, so that the product has better heat dissipation performance, higher luminous efficiency, and improved product reliability.

[0033] As a further improvement of the present invention, the first chip 11 and the third chip 13 have the same shape and size, and the second chip 12 is arranged between the first chip 11 and the third chip 13. By setting the first chip 11 and the third chip 13 to have the same shape and size, the stress balance on both sides of the product is ensured, and the strength of the product is ensured. The second chip 12 is arranged between the first chip 11 and the third chip 13, which ensures the strength of the center of the product and further improves the product performance.

[0034] As a further improvement of the present invention, the first pad 21, the second pad 22, the third pad 23 and the insulating layer 40 are all connected in a step-like shape. By setting the first pad 21, the second pad 22, the third pad 23 and the insulating layer 40 to be connected in a step-like shape, the connection strength between the first pad 21, the second pad 22, the third pad 23 and the insulating layer 40 is enhanced, and the precision of the product is effectively improved.

[0035] As a further improvement of the present invention, the bowl cup 31 is in the shape of an inverted cone, and the angle between the opposite side walls 311 of the bowl cup 31 is 108-110°. By setting the bowl cup 31 in the shape of an inverted cone, and the angle between the opposite side walls 311 of the bowl cup 31 is 108-110°, as much light as possible can be reflected, thereby improving the light extraction efficiency and the luminous efficiency of the chip 10.

[0036] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The above embodiments only express the preferred implementation of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED bracket, characterized in that: include: A bracket body and at least one chip encapsulated in the bracket body, a bowl cup is provided in the bracket body, a first solder pad, a second solder pad and a third solder pad are provided on the bottom surface of the bowl cup, the second solder pad is provided between the first solder pad and the third solder pad, the first solder pad, the second solder pad and the third solder pad extend out through the bracket body respectively, and an insulating layer is provided between the first solder pad, the second solder pad and the third solder pad.

2. The LED bracket according to claim 1, characterized in that: One of the first pad and the third pad is a positive pad, the other is a negative pad, and the second pad is connected to the first pad or the third pad.

3. The LED bracket according to claim 2, characterized in that: A first extension portion is disposed on the first soldering pad, and the first extension portion at least extends out of the midpoint of the bracket body.

4. The LED bracket according to claim 3, characterized in that: The third solder pad is provided with a second extension portion, and the second extension portion at least extends out of the midpoint of the bracket body.

5. The LED bracket according to claim 4, characterized in that: The first extension portion and the second extension portion have the same length.

6. The LED bracket according to claim 5, characterized in that: The second pad is provided with a bending portion matched with the first extension portion and the second extension portion.

7. The LED bracket according to claim 1, characterized in that: The chip includes a first chip, a second chip and a third chip, the first chip electrically connects the first pad and the second pad, the second chip electrically connects the first pad and the third pad, and the third chip electrically connects the second pad and the third pad.

8. The LED bracket according to claim 7, characterized in that: The first chip and the third chip have the same shape and size, and the second chip is arranged between the first chip and the third chip.

9. The LED bracket according to claim 1, characterized in that: The connection points between the first pad, the second pad and the third pad and the insulating layer are all step-shaped.

10. The LED bracket according to claim 1, characterized in that: The bowl is in the shape of an inverted cone, and the angles between the opposite side walls of the bowl are 108-110 degrees.

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