Polishing pad trimmer and chemical mechanical polishing equipment

Abstract

The utility model relates to a polishing pad trimmer and chemical mechanical polishing equipment, an adjusting assembly is arranged at one end of a swing arm, and the adjusting assembly comprises an airtight cavity; the trimming disc is arranged on the side, away from the swing arm, of the adjusting assembly. The adjusting assembly drives the finishing disc to move in the direction close to or away from the adjusting assembly through deformation of the airtight cavity. The pressure detection device is embedded in the airtight chamber and is used for detecting an internal gas pressure value of the airtight chamber; the controller is used for receiving the internal gas pressure value of the airtight cavity and controlling the working state of the grinding pad trimmer. The change condition of the dressing pressure of the dressing disc can be accurately measured in real time, the situation that the grinding pad is damaged due to the fact that the pressure is abnormal is avoided, wafer products are further prevented from being damaged, and the labor cost of detection is reduced.

Description

Technical Field

[0001] The present application relates to the field of chemical mechanical polishing equipment, and in particular to a polishing pad dresser and chemical mechanical polishing equipment. Background Art

[0002] Chemical Mechanical Planarization (CMP) is a key process for achieving wafer surface flatness in the integrated circuit manufacturing process. The main working principle of CMP is that under certain pressure and the presence of abrasive liquid, the polished wafer moves relative to the polishing pad. With the help of the highly organic combination of the mechanical polishing action of nano-abrasives and the chemical action of various chemical reagents, the polished wafer surface can achieve the requirements of high flatness, low surface roughness and low defects. After CMP, byproducts such as particles solidified from the polishing liquid will remain on the polishing pad. These residual byproducts will affect the subsequent wafer polishing process and thus affect the wafer yield. For this reason, a pad conditioner (PC) is required to regularly condition the surface of the polishing pad. The pad conditioner is usually integrated into the CMP equipment. When the polishing pad does not need to be trimmed, there is a certain distance between the trimming disk used to trim the surface of the polishing pad in the PC and the polishing pad. When the polishing pad needs to be trimmed, the trimming disk is lowered to make the trimming disk contact the polishing pad, and the trimming disk is driven to rotate to clean the polishing pad.

[0003] However, in actual applications, when the polishing pad dresser is dressing the polishing pad, the pressure of the dressing disc on the polishing pad is difficult to detect in real time. If the pressure is offset, it will affect the dressing effect of the polishing pad, thereby affecting the polishing rate of the wafer in the subsequent polishing process, and further affecting the wafer yield. Therefore, there is an urgent need for an optimized polishing pad dresser that can detect the pressure of the dressing disc on the polishing pad in real time during the dressing process to avoid damage to the polishing pad. Utility Model Content

[0004] Based on this, it is necessary to provide a polishing pad dresser and chemical mechanical polishing equipment to address the problems in the above-mentioned background technology, which can detect in real time the pressure changes of the polishing pad exerted by the polishing dresser during the polishing pad dressing process, promptly discover abnormal pressure conditions, reduce the chance of polishing pad breakage, and avoid damage to wafer products.

[0005] To achieve the above-mentioned purpose and other purposes, according to various embodiments of the present application, the first aspect of the present application provides a grinding pad dresser, including a swing arm, an adjustment component, a dressing disk, a pressure detection device and a controller, wherein the adjustment component is arranged at one end of the swing arm, and the adjustment component includes an airtight chamber; the dressing disk is arranged on the side of the adjustment component away from the swing arm; the adjustment component drives the dressing disk to move in a direction close to or away from the adjustment component through the deformation of the airtight chamber; the pressure detection device is embedded in the airtight chamber, and is used to detect the internal gas pressure value of the airtight chamber; the controller is used to receive the internal gas pressure value of the airtight chamber and control the working state of the grinding pad dresser.

[0006] The grinding pad dresser in the above-mentioned embodiment detects the internal gas pressure value of the airtight chamber through the pressure detection device embedded in the airtight chamber of the grinding pad dresser, so that the controller receives the internal gas pressure value of the airtight chamber and controls the working state of the grinding pad dresser. It can measure the change of the pressure of the dressing disk on the grinding pad in real time and accurately, avoid the abnormal pressure causing damage to the grinding pad, and further avoid damage to the wafer product, thereby reducing the labor cost of detection.

[0007] In some embodiments, the adjustment assembly also includes a cylinder body, a support member, a central axis and an air film; the cylinder body is fixedly connected to the swing arm; the support member is arranged in the cylinder body, and the extension direction of the support member is parallel to the axial direction of the adjustment assembly; the end of the central axis close to the swing arm is slidably connected to the support member, and the end of the central axis away from the swing arm extends out of the cylinder body and is fixedly connected to the trimming disk, and the central axis is used to drive the trimming disk to move in a direction close to or away from the adjustment assembly; the air film is arranged in the cylinder body, is annular, and has an outer edge and an inner edge, the outer edge of the air film is fixedly connected to the inner wall of the cylinder body, and the inner edge of the air film is fixedly connected to the outer wall of the central axis; the air film, the cylinder body, the central axis and the support member together form an airtight chamber.

[0008] In some embodiments, an opening is provided on one side of the cylinder body close to the swing arm, and a rotating part is provided at the opening, and the rotating part is used to drive the supporting part to rotate around the axial direction of the adjusting component; the outer edge of the air film is fixedly connected to the rotating part, and the air film, the rotating part, the central axis and the supporting part together form an airtight chamber.

[0009] In some embodiments, an air inlet is provided on the rotating member; the air inlet is used to introduce or extract gas into the airtight chamber to drive the air film to expand or contract, thereby driving the central axis to move in a direction away from or close to the swing arm.

[0010] In some embodiments, the polishing pad dresser is further provided with an air pipe, wherein one end of the air pipe close to the adjustment component is connected to the air inlet, and the other end of the air pipe away from the adjustment component is connected to an external air source.

[0011] In some embodiments, the pressure sensing device includes an air pressure sensor.

[0012] In some embodiments, the air pressure sensor includes a shell, a pressure chip and a diaphragm; a hollow cavity is provided inside the shell, and a mounting portion is provided outside, and the mounting portion is used to fix the shell inside an airtight chamber; the pressure chip is encapsulated in the hollow cavity, and the diaphragm is located on the side of the pressure chip away from the mounting portion of the shell, and the diaphragm is used to seal the pressure chip and transmit the internal gas pressure value of the airtight chamber to the pressure chip.

[0013] In some embodiments, the pressure chip includes a diffused silicon pressure sensitive chip.

[0014] In some embodiments, the cavity also includes a buffer; the buffer is sealed in the cavity and located between the diffused silicon pressure-sensitive chip and the diaphragm, and is used to transmit the internal gas pressure value of the airtight chamber provided by the diaphragm to the pressure chip.

[0015] A second aspect of the present application provides a chemical mechanical polishing device, comprising the polishing pad dresser of any one of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of a working scene of a grinding dresser provided in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of a structure for measuring the pressure of a polishing pad dresser on a polishing pad based on a pressure measuring instrument provided in one embodiment of the present application;

[0019] Figure 3 A schematic top view of a damaged polishing pad provided in one embodiment of the present application;

[0020] Figure 4 A schematic cross-sectional view of the overall structure of a polishing pad dresser provided in one embodiment of the present application;

[0021] Figure 5 A schematic cross-sectional view of a partial structure of a polishing pad dresser provided in an embodiment of the present application;

[0022] Figure 6 Schematic diagram of the working principle of the grinding pad dresser provided in one embodiment of the present application.

[0023] Description of reference numerals:

[0024] 11. Swing arm; 111. Air pipe; 12. Adjustment assembly; 120. Central axis; 121. Cylinder; 122. Support member; 123. Rotating member; 1230. Air inlet; 127. Air film; 1270. Outer edge; 1271. Inner edge; 128. Airtight chamber; 13. Dressing disk; 14. Pressure detection device; 20. Grinding pad dresser; 23. Grinding pad; 231. Scratches; 31. Handle; 32. Pressure scale; 110. Converter; 1101. Proportional valve; 130. Controller; 140. Alarm; 141. Switch; 150. Display. DETAILED DESCRIPTION

[0025] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the application content of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0027] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0028] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connected" or "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0029] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0030] Chemical mechanical polishing (CMP) is very important in modern semiconductor manufacturing. Chemical mechanical polishing combines chemical etching and mechanical polishing to remove uneven surface materials and achieve atomic-level flatness. The polishing pads in chemical mechanical polishing equipment need to be replaced and maintained regularly. The newly replaced polishing pads, due to their high hardness, also need to go through a period of running-in to achieve the ideal surface texture and achieve the best polishing efficiency and uniformity. There are many variables that affect the polishing effect, including the composition of the polishing liquid, the etching rate, the type of abrasive particles, the material of the polishing pad, the hardness, the elastic modulus, the surface wear, and the temperature, pressure, speed and nonlinear fluid mechanics during polishing.

[0031] As an example, see Figure 1 When performing chemical mechanical polishing, the polishing liquid is continuously dripped onto the polishing pad 23, so that the polished wafer (not shown) moves relative to the polishing pad 23. The chemical components in the polishing liquid react slightly with the material to be removed from the wafer surface to remove it. During the polishing process, byproducts such as particles solidified from the polishing liquid will remain in the grooves on the surface of the polishing pad 23. These residual byproducts will affect the subsequent wafer polishing process, thereby affecting the wafer yield. For this reason, it is necessary to use a polishing pad dresser 20 to regularly dress the surface of the polishing pad 23 to prevent the polishing byproducts from filling the grooves of the polishing pad 23. The polishing pad dresser 20 is usually integrated on the CMP equipment, including a swing arm 11 and a dressing disk 13. When there is no need to dress the polishing pad 23, there is a certain distance between the dressing disk 13 and the surface of the polishing pad 23. When the polishing pad 23 needs to be dressed, the dressing disk 13 is lowered to make the dressing disk 13 contact with the surface of the polishing pad 23, and then the polishing pad dresser 20 applies pressure to make the dressing disk 13 and the polishing pad 23 move relative to each other, so as to physically remove the by-products on the polishing pad 23 and dress the polishing pad 23.

[0032] As an example, see Figure 1-Figure 3 The polishing pad dresser 20 in the chemical mechanical polishing equipment is used to dress and adjust the polishing pad 23 to make the surface of the polishing pad 23 rough and flat to promote uniform wafer polishing. The polishing pad dresser 20 dresses the surface of the polishing pad 23 through the dressing disk 13 thereon. During the process of the dressing disk 13 dressing the surface of the polishing pad 23, the dressing pressure of the dressing disk 13 on the polishing pad 23 (i.e., the interaction force between the two during the process of the dressing disk 13 dressing the surface of the polishing pad 23) is an important factor affecting the surface dressing effect of the polishing pad 23. Keeping the dressing pressure of the dressing disk 13 stable and controllable is conducive to achieving a better dressing effect.

[0033] At present, the dressing pressure feedback in chemical mechanical polishing equipment is provided by the cleaning system integrated in the polishing equipment, which is not the real dressing pressure, and it is impossible to detect the dressing pressure in real time and accurately. In addition, the commonly used dressing pressure detection methods refer to Figure 2 : Usually, when performing equipment maintenance, a maintenance engineer uses a pressure measuring instrument to connect the handle 31 of the pressure measuring instrument to the pressure scale 32. The pressure scale 32 senses the downward pressure of the dressing disk 13 of the grinding pad dresser 20 during operation, and transmits the pressure result to the handle 31 of the pressure measuring instrument, thereby realizing the measurement and calibration of the dressing pressure of the dressing disk 13. However, the pressure detected by this measurement method is not the actual dressing pressure of the dressing disk 13 on the grinding pad 23 during the dressing process, and also increases the labor cost. Therefore, when the dressing pressure of the dressing disk 13 on the grinding pad 23 is offset during the dressing process of the grinding pad 23, it is difficult for the prior art to obtain the abnormal pressure in time, which often causes scratches 231 on the grinding pad 23 (reference Figure 3 ), are damaged, further affecting the wafer product yield.

[0034] In some embodiments, please refer to Figure 4-Figure 6 The embodiment of the present application provides a grinding pad dresser 20, including a swing arm 11, an adjusting component 12, a dressing disk 13, a pressure detection device 14 and a controller 130, wherein the adjusting component 12 is arranged at one end of the swing arm 11, and the adjusting component 12 includes an airtight chamber 128; the dressing disk 13 is arranged on the side of the adjusting component 12 away from the swing arm 11; the adjusting component 12 drives the dressing disk 13 to move in a direction close to or away from the adjusting component 12 through the deformation of the airtight chamber 128; the pressure detection device 14 is embedded in the airtight chamber 128, and is used to detect the internal gas pressure value of the airtight chamber 128; the controller 130 is used to receive the internal gas pressure value of the airtight chamber 128, and control the working state of the grinding pad dresser 20.

[0035] In some embodiments, the adjustment component 12 drives the trimming disk 13 to move in the direction close to or away from the adjustment component 12 through the deformation of the airtight chamber 128. In other words, the displacement change of the trimming disk 13 in the direction close to or away from the adjustment component 12 will also cause the deformation of the airtight chamber 128, thereby changing the internal gas pressure value of the airtight chamber 128. Therefore, in this embodiment, the internal gas pressure value of the airtight chamber 128 is detected by the pressure detection device 14 embedded in the airtight chamber 128 of the polishing pad dresser 20, so that the controller 130 receives the internal gas pressure value of the airtight chamber 128 and controls the working state of the polishing pad dresser 20, so as to achieve accurate measurement and timely adjustment of the dressing pressure value of the trimming disk 13 of the polishing pad dresser 20, avoid interference of human factors on the measurement, achieve real-time detection and accurate measurement, avoid damage to the polishing pad 23 caused by abnormal trimming pressure, thereby avoiding damage to the wafer product and reducing the labor cost of detection.

[0036] In some embodiments, please refer to Figure 4-Figure 5 The adjustment assembly 12 also includes a cylinder 121, a support 122, a central axis 120 and an air film 127; the cylinder 121 is fixedly connected to the swing arm 11; the support 122 is arranged in the cylinder 121, and the extension direction of the support 122 is parallel to the axial direction of the adjustment assembly 12 (for example, the extension direction of the axis x); an end 1201 of the central axis 120 close to the swing arm 11 is slidably connected to the support 122, and an end 1202 of the central axis 120 away from the swing arm 11 extends out of the cylinder 121 and is fixedly connected to the trimming disk 13 The central axis 120 is used to drive the trimming disk 13 to move in a direction close to or away from the adjustment component 12 (for example, the z direction); the air film 127 is arranged in the cylinder body 121, is annular, and has an outer edge 1270 and an inner edge 1271. The outer edge 1270 of the air film 127 is fixedly connected to the inner wall of the cylinder body 121, and the inner edge 1271 of the air film 127 is fixedly connected to the outer wall of the central axis 120; the air film 127, the cylinder body 121, the central axis 120 and the support member 122 together form an airtight chamber 128.

[0037] In some embodiments, please refer to Figure 4-Figure 5 An opening is provided on one side of the cylinder body 121 close to the swing arm 11, and a rotating member 123 is provided at the opening. The rotating member 123 is used to drive the supporting member 122 to rotate around the axial direction of the adjusting component 12 (for example, the extension direction of the axis x); the outer edge 1270 of the air film 127 is fixedly connected to the rotating member 123, and the air film 127, the rotating member 123, the central axis 120 and the supporting member 122 together form an airtight chamber 128.

[0038] For example, please continue to refer to Figure 4-Figure 5 A motor (not shown) may be provided on the swing arm 11 , and the rotation of the motor may be used to drive the rotating member 123 to rotate synchronously, so as to reduce the wiring complexity of the pressure detection device 14 .

[0039] In some embodiments, please refer to Figure 4-Figure 5 An air inlet 1230 is provided on the rotating member 123; the air inlet 1230 is used to introduce or extract gas into the airtight chamber 128 to drive the air film 127 to expand or contract, thereby driving the central axis 120 to move in a direction away from or close to the swing arm 11 (for example, in the z direction).

[0040] In some embodiments, please refer to Figure 4-Figure 5 The polishing pad dresser 20 is further provided with an air pipe 111 , one end of the air pipe 111 close to the adjustment component 12 is connected to the air inlet 1230 , and the other end away from the adjustment component 12 is connected to an external air source (not shown).

[0041] In some embodiments, please refer to Figure 4-Figure 6The polishing pad dresser includes a pressure detection device 14 and a converter 110. The pressure detection device 14 is embedded in the airtight chamber 128 of the polishing pad dresser 20 and is used to detect the internal gas pressure value of the airtight chamber 128. As mentioned above, the expansion or contraction of the air film 127 will drive the central axis 120 to move in a direction away from or close to the swing arm 11, thereby driving the dressing disk 13 to move in a direction close to or away from the swing arm 11, thereby changing the pressure between the polishing pad 23 and the dressing disk 13 (refer to Figure 4 ). When the dressing disc 13 is in the process of dressing the grinding pad 23, the dressing pressure of the dressing disc 13 is generally kept constant. Once the dressing pressure changes, the dressing disc 13 will be displaced in the direction close to or away from the swing arm 11, which will in turn cause the expansion or contraction of the air film 127, thereby affecting the internal gas pressure value of the airtight chamber 128; the pressure detection device 14 is sealed in the airtight chamber 128 and connected to the converter 110. The dressing pressure of the dressing disc 13 and the internal gas pressure value of the airtight chamber 128 have a target relationship, such as a linear relationship. The pressure detection device 14 converts the internal gas pressure value of the airtight chamber 128 into a detection pressure value corresponding to the dressing pressure of the dressing disc 13 through the target relationship. Therefore, the embodiment of the utility model can obtain a detection pressure value that is more accurate than the traditional detection method and corresponds to the actual dressing pressure value, and realize real-time monitoring of the dressing pressure, avoid interference of human factors on the measurement, reduce the probability of damage to the grinding pad 23, and reduce the labor cost of detection.

[0042] As an example, please refer to Figure 4-Figure 6 The grinding pad dresser also includes a controller 130 and an alarm 140. The controller 130 is connected to the converter 110 and is used to generate an alarm command when the detected pressure value is outside the preset pressure range. For example, the preset pressure range is the target pressure value ±0.3 pounds, and the target pressure value is the dressing pressure value of the dressing disk 13 under normal working conditions. When the detected pressure value obtained by the converter 110 exceeds the above-mentioned predicted pressure range, an alarm command is automatically generated. The alarm 140 is connected to the controller 130 and is used to receive the alarm command and execute the corresponding alarm action. The alarm action is set to shutdown, for example. With such a setting, the abnormal dressing pressure of the dressing disk 13 can be discovered in time, the grinding equipment can be controlled to stop working, and the probability of damage to the grinding pad 23 or the wafer product can be reduced.

[0043] In some embodiments, please refer to Figure 6The detected pressure value output by the converter 110 is transmitted to the controller 130, and a pressure graph can be formed. The pressure graph can be a straight line graph, a dot graph or a chart to visualize the detection result. Further, the polishing pad dresser also includes a display 150, which is connected to the converter 110 and is used to receive and display the detected pressure value and / or the pressure graph formed by the converter 110. Such a setting is conducive to assisting the operator of the polishing pad dresser to detect the dressing pressure of the dressing disc 13 in real time and to find abnormal pressure in time.

[0044] As an example, please refer to Figure 6 The alarm includes a switch 141, which is connected to the controller 130 and is connected in series between the grinding pad dresser and the power supply. The switch 141 is used to receive an alarm command, disconnect the electrical connection path between the grinding pad dresser and the power supply to avoid damage to the grinding pad, and check the grinding pad dresser in time.

[0045] As an example, please refer to Figure 6 The converter 110 includes a proportional valve 1101, which is connected to the pressure detection device 14 and is used to receive the internal gas pressure value of the airtight chamber and generate a detection pressure value. The proportional valve 1101 may be an electrical proportional valve.

[0046] As an example, the pressure detection device 14 includes an air pressure sensor, which is embedded in the airtight chamber of the polishing pad dresser and is used to detect the internal gas pressure value of the airtight chamber.

[0047] In some embodiments, the air pressure sensor includes a shell, a pressure chip and a diaphragm; the shell is provided with a hollow cavity inside and a mounting portion outside, and the mounting portion is used to fix the shell inside an airtight chamber; the pressure chip is encapsulated in the hollow cavity, and the diaphragm is located on the side of the pressure chip away from the mounting portion of the shell, and the diaphragm is used to seal the pressure chip and transmit the internal gas pressure value of the airtight chamber to the pressure chip, thereby realizing accurate measurement of the trimming pressure.

[0048] In some embodiments, the pressure chip includes a diffused silicon pressure-sensitive chip. The air pressure sensor prepared from the diffused silicon pressure-sensitive chip can measure a small range of pressure and has the advantages of high sensitivity and high-precision measurement.

[0049] In some embodiments, the connection between the air pressure sensor and the airtight chamber is sealed by a sealing ring to ensure the accuracy of pressure measurement.

[0050] In some embodiments, the cavity also includes a buffer; the buffer is sealed in the cavity and located between the diffused silicon pressure-sensitive chip and the diaphragm, and is used to transmit the internal gas pressure value of the airtight chamber provided by the diaphragm to the pressure chip.

[0051] In some embodiments, the housing of the air pressure sensor may be a 316L stainless steel housing, the diaphragm may be a stainless steel diaphragm or a ceramic diaphragm, and the buffer may include silicone oil. The diffused silicon pressure-sensitive chip is encapsulated in the 316L stainless steel housing, and the external pressure is transmitted to the pressure-sensitive chip through the stainless steel diaphragm and the internally sealed silicone oil. The pressure-sensitive chip may not directly contact the measured medium, forming a fully solid-state structure for pressure measurement, thereby achieving accurate pressure measurement.

[0052] Another aspect of the present invention provides a chemical mechanical polishing device, comprising the polishing pad dresser of any one of the above embodiments.

[0053] For example, when the grinding pad dresser in the chemical mechanical grinding equipment is dressing the grinding pad of the chemical mechanical grinding equipment, a pressure detection device is set in the airtight chamber of the grinding pad dresser to detect the internal gas pressure value of the airtight chamber, and the gas pressure value is received by a converter connected to the pressure detection device to generate a detection pressure value corresponding to the pressure value between the dressing disk and the grinding pad; when the detection pressure value is outside the preset pressure range, an alarm command is generated by the controller in the grinding pad dresser, and the alarm command is received by the alarm in the grinding pad dresser to perform the corresponding alarm action, so as to timely detect the abnormal dressing pressure of the dressing disk and control the grinding equipment to stop working; the detection pressure value is received and displayed by the display in the grinding pad dresser, so as to realize real-time detection of the dressing pressure, ensure the timeliness of discovering the abnormal dressing pressure, realize accurate measurement, eliminate human interference in the measurement, avoid damage to the grinding pad due to abnormal pressure, thereby avoid damage to the wafer product and reduce the labor cost of detection.

[0054] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0055] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A grinding pad dresser, characterized in that: include: Swing arm; An adjustment assembly, disposed at one end of the swing arm, the adjustment assembly comprising an airtight chamber; A trimming disk is arranged on a side of the adjusting component away from the swing arm; the adjusting component drives the trimming disk to move in a direction close to or away from the adjusting component through the deformation of the airtight chamber; A pressure detection device, embedded in the airtight chamber, for detecting the internal gas pressure value of the airtight chamber; The controller is used to receive the internal gas pressure value of the airtight chamber and control the working state of the grinding pad dresser.

2. The polishing pad dresser according to claim 1, characterized in that: The adjustment assembly also includes a cylinder, a support, a central axis and an air film; The cylinder body is fixedly connected to the swing arm; The support member is disposed in the cylinder body, and the extension direction of the support member is parallel to the axial direction of the adjustment assembly; One end of the central shaft close to the swing arm is slidably connected to the support member, and one end of the central shaft away from the swing arm extends out of the cylinder body and is fixedly connected to the trimming disk. The central shaft is used to drive the trimming disk to move in a direction close to or away from the adjustment component. The air film is arranged in the cylinder body, is annular, and has an outer edge and an inner edge. The outer edge of the air film is fixedly connected to the inner wall of the cylinder body, and the inner edge of the air film is fixedly connected to the outer wall of the central shaft. The air film, the cylinder body, the central axis and the support member together form an airtight chamber.

3. The polishing pad dresser according to claim 2, characterized in that: An opening is provided on one side of the cylinder body close to the swing arm, and a rotating member is provided at the opening, and the rotating member is used to drive the supporting member to rotate around the axis direction of the adjusting assembly; The outer edge of the air film is fixedly connected to the rotating member, and the air film, the rotating member, the central axis and the supporting member together form an airtight chamber.

4. The polishing pad dresser according to claim 3, characterized in that: The rotating member is provided with an air inlet; The air inlet is used to introduce or extract gas into the airtight chamber to drive the air film to expand or contract, thereby driving the central axis to move in a direction away from or close to the swing arm.

5. The polishing pad dresser according to claim 4, characterized in that: An air pipe is also provided, wherein one end of the air pipe close to the regulating component is connected to the air inlet, and one end of the air pipe away from the regulating component is connected to an external air source.

6. The polishing pad dresser according to claim 1, characterized in that: The pressure detection device includes an air pressure sensor.

7. The polishing pad dresser according to claim 6, characterized in that: The air pressure sensor comprises a housing, a pressure chip and a diaphragm; The shell is provided with a hollow cavity inside and a mounting portion outside, and the mounting portion is used to fix the shell inside the airtight chamber; The pressure chip is encapsulated in the cavity, and the diaphragm is located on the side of the pressure chip away from the mounting portion of the shell. The diaphragm is used to seal the pressure chip and transmit the internal gas pressure value of the airtight chamber to the pressure chip.

8. The polishing pad dresser according to claim 7, characterized in that: The pressure chip comprises a diffused silicon pressure sensitive chip.

9. The polishing pad dresser according to claim 8, characterized in that: The cavity also includes a buffer solution; The buffer is sealed in the cavity and located between the diffused silicon pressure-sensitive chip and the diaphragm, and is used for transmitting the internal gas pressure value of the airtight chamber provided by the diaphragm to the pressure chip.

10. A chemical mechanical polishing device, characterized in that: It comprises the polishing pad dresser as described in any one of claims 1 to 9.

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