Continuous copper plating device

Abstract

The utility model is suitable for the technical field of circuit board processing, and provides a continuous copper plating device, which comprises a base, a copper plating device and a copper plating device, the electroplating tank is arranged on the base; the two limiting grooves are formed in the base; the transverse adjusting mechanism is arranged on the base and used for adjusting the transverse distance between the multiple supporting mechanisms. The plurality of longitudinal adjusting mechanisms are arranged on the transverse adjusting mechanism and are used for adjusting the longitudinal spacing of the plurality of supporting mechanisms; and a plurality of supporting mechanisms arranged on the plurality of longitudinal adjusting mechanisms, wherein the plurality of supporting mechanisms are used for supporting the circuit board. According to the continuous copper plating device, continuous copper plating can be conducted on the circuit board, the continuous copper plating device is suitable for circuit boards of different sizes, the time and labor are saved in the copper plating process, and the copper plating efficiency is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board processing, and particularly relates to a continuous copper plating device. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. During the processing of circuit boards, copper plating is required.

[0003] However, existing copper plating devices often do not have a continuous automatic clamping immersion copper plating function, so workers are required to place the circuit board to be processed on the clamping device, and then immerse the circuit board in the electroplating tank through the clamping device. After the electroplating is completed, the electroplated circuit board is lifted out of the electroplating tank, and then the workers remove the electroplated circuit board from the clamping device. The entire copper plating process is time-consuming and labor-intensive, and the copper plating efficiency is low. Utility Model Content

[0004] The utility model provides a continuous copper plating device, aiming to solve the problems raised in the above background technology that the existing copper plating devices often lack a continuous automatic clamping immersion copper plating function, the copper plating process is relatively time-consuming and labor-intensive, and the copper plating efficiency is low.

[0005] To solve the above problems, the utility model is implemented as follows: a continuous copper plating device, comprising: a base with an L-shaped backplane fixedly installed on the top; an electroplating pool arranged on the base; two limit grooves opened on the base; a lateral adjustment mechanism arranged on the base, the lateral adjustment mechanism is used to adjust the lateral spacing of multiple supporting mechanisms; multiple longitudinal adjustment mechanisms are arranged on the lateral adjustment mechanism, and the multiple longitudinal adjustment mechanisms are used to adjust the longitudinal spacing of multiple supporting mechanisms; multiple supporting mechanisms are arranged on the multiple longitudinal adjustment mechanisms, and the multiple supporting mechanisms are used to support circuit boards; a displacement mechanism is arranged on the top inner wall of the L-shaped backplane, and the displacement mechanism is used to control the lateral and vertical movement of the clamping and fixing mechanism; a clamping and fixing mechanism is arranged on the displacement mechanism, and the clamping and fixing mechanism is used to clamp and fix the circuit board.

[0006] Preferably, the lateral adjustment mechanism includes: a first screw rod rotatably mounted on the inner wall of the base and having multiple sections of external threads with opposite rotation directions; a plurality of first limit rods fixedly mounted on the inner wall of the base; and a plurality of first sliding plates threadedly sleeved on the first screw rod and respectively slidably connected to the inner walls of both sides of the plurality of limit grooves and the plurality of first limit rods.

[0007] Preferably, the longitudinal adjustment mechanism includes: a U-shaped plate fixedly mounted on the first sliding plate; a second screw rotatably mounted on the U-shaped plate and provided with two sections of external threads with opposite rotation directions; a servo motor fixedly mounted on one side of the U-shaped plate and connected to the second screw; a plurality of second limit rods fixedly mounted on the inner wall of the U-shaped plate; and two second sliding plates threadedly mounted on the second screw and slidably connected to the plurality of second limit rods.

[0008] Preferably, the support mechanism comprises: a vertical rod fixedly mounted on the second sliding plate; and a plurality of support plates fixedly mounted on the vertical rod.

[0009] Preferably, the displacement mechanism comprises: an electric slide rail fixedly mounted on the inner wall at the top of the L-shaped back plate; and an electric cylinder fixedly mounted on an output block of the electric slide rail.

[0010] Preferably, the clamping and fixing mechanism includes: a U-shaped frame fixedly mounted on the output rod of the electric cylinder; a dual-axis motor fixedly mounted on the inner wall of the U-shaped frame; two third screws respectively fixedly mounted on both ends of the output shaft of the dual-axis motor and rotatably connected to the inner walls on both sides of the U-shaped frame; a plurality of third limiting rods fixedly mounted on the inner wall of the U-shaped frame; two third sliding plates threadedly sleeved on the third screws and slidably connected to the plurality of third limiting rods; two clamping plates respectively fixedly mounted on the bottom of the two third sliding plates; and a plurality of strip grooves respectively opened on the sides of the two clamping plates close to each other.

[0011] Preferably, a hand wheel is fixedly mounted on one end of the first screw rod, and a controller is arranged on the top of the L-shaped back plate.

[0012] Compared with the related art, the continuous copper plating device provided by the utility model has the following beneficial effects:

[0013] Compared with the prior art, the continuous copper plating device provided by the present solution has a base as the basis of the entire device, and an L-shaped back plate is fixedly installed on the top of the base, which provides a stable support for subsequent mechanisms and components. The electroplating pool arranged on the base is the core area of ​​the copper plating operation, where the circuit board is copper plated. The lateral adjustment mechanism is used to adjust the lateral spacing between multiple support mechanisms to adapt to circuit boards of different sizes, thereby improving the versatility and flexibility of the device. Multiple longitudinal adjustment mechanisms are installed on the lateral adjustment mechanism to adjust the longitudinal spacing between multiple support mechanisms to adapt to circuit boards of different sizes. Multiple support mechanisms are used to support circuit boards in layers, which is convenient for the clamping and fixing mechanism to clamp multiple circuit boards at one time for copper plating. The displacement mechanism installed on the top inner wall of the L-shaped back plate can control the movement of the clamping and fixing mechanism in the lateral and vertical directions, providing precise position adjustment capability for the clamping and fixing of the circuit board. The clamping and fixing mechanism cooperates with the displacement mechanism to realize the clamping and fixing of multiple circuit boards and the up, down, left and right movement, thereby continuously copper plating the circuit board.

[0014] In summary, the continuous copper plating device of this patent, through its unique structure and design, realizes efficient and precise copper plating treatment of circuit boards, improves production efficiency and product quality, and has significant beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of a continuous copper plating device provided by the utility model;

[0016] Figure 2 for Figure 1 A schematic diagram of the side appearance structure of the longitudinal adjustment mechanism and the supporting mechanism;

[0017] Figure 3 for Figure 1 An enlarged structural diagram of part A shown in FIG.

[0018] Figure 4 for Figure 1 Schematic diagram of the enlarged structure of part B shown in FIG.

[0019] Figure numerals: 1. base; 2. L-shaped back plate; 3. electroplating tank; 4. limit groove; 5. first screw; 6. first limit rod; 7. first sliding plate; 8. U-shaped plate; 9. second screw; 10. servo motor; 11. second limit rod; 12. second sliding plate; 13. vertical rod; 14. support plate; 15. electric slide rail; 16. electric cylinder; 17. U-shaped frame; 18. dual-axis motor; 19. third screw; 20. third limit rod; 21. third sliding plate; 22. clamping plate; 23. strip groove; 24. handwheel. DETAILED DESCRIPTION

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" in the specification and claims of the present application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned figures are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] The utility model embodiment provides a continuous copper plating device, such as Figure 1-4 As shown, the continuous copper plating device includes: a base 1 with an L-shaped back plate 2 fixedly mounted on the top; an electroplating pool 3 arranged on the base 1; two limit slots 4 provided on the base 1; a lateral adjustment mechanism arranged on the base 1, the lateral adjustment mechanism is used to adjust the lateral spacing of multiple supporting mechanisms; multiple longitudinal adjustment mechanisms are arranged on the lateral adjustment mechanism, and the multiple longitudinal adjustment mechanisms are used to adjust the longitudinal spacing of multiple supporting mechanisms; multiple supporting mechanisms are arranged on the multiple longitudinal adjustment mechanisms, and the multiple supporting mechanisms are used to support circuit boards; a displacement mechanism is arranged on the top inner wall of the L-shaped back plate 2, and the displacement mechanism is used to control the lateral and vertical movement of the clamping and fixing mechanism; a clamping and fixing mechanism is arranged on the displacement mechanism, and the clamping and fixing mechanism is used to clamp and fix the circuit board.

[0023] In this embodiment, the base 1 serves as the basis of the entire device, and an L-shaped back plate 2 is fixedly installed on the top of the base 1, which provides a stable support for subsequent mechanisms and components. The electroplating pool 3 arranged on the base 1 is the core area of ​​the copper plating operation, where the circuit board is copper plated. The lateral adjustment mechanism is used to adjust the lateral spacing between multiple support mechanisms to adapt to circuit boards of different sizes, thereby improving the versatility and flexibility of the device. Multiple longitudinal adjustment mechanisms are installed on the lateral adjustment mechanism to adjust the longitudinal spacing between multiple support mechanisms to adapt to circuit boards of different sizes. Multiple support mechanisms are used to support circuit boards in layers, which is convenient for the clamping and fixing mechanism to clamp multiple circuit boards at one time for copper plating. The displacement mechanism installed on the top inner wall of the L-shaped back plate 2 can control the movement of the clamping and fixing mechanism in the lateral and vertical directions, providing precise position adjustment capability for the clamping and fixing of the circuit board. The clamping and fixing mechanism cooperates with the displacement mechanism to realize the clamping and fixing of multiple circuit boards and the up, down, left and right movement, thereby continuously copper plating the circuit boards.

[0024] In summary, the continuous copper plating device of this patent, through its unique structure and design, realizes efficient and precise copper plating treatment of circuit boards, improves production efficiency and product quality, and has significant beneficial effects.

[0025] In a further preferred embodiment of the utility model, the lateral adjustment mechanism includes: a first screw rod 5 rotatably mounted on the inner wall of the base 1 and having multiple sections of external threads with opposite rotation directions; a plurality of first limiting rods 6 fixedly mounted on the inner wall of the base 1; and a plurality of first sliding plates 7 threadedly sleeved on the first screw rod 5 and respectively slidably connected to the inner walls of both sides of the plurality of limiting grooves 4 and the plurality of first limiting rods 6.

[0026] In this embodiment, the first screw rod 5 is rotated by the hand wheel 24 to drive the multiple first sliding plates 7 to move closer to or away from each other, thereby adjusting the lateral positions of the multiple support mechanisms, so that the multiple support plates can provide layered support for circuit boards of different sizes.

[0027] In a further preferred embodiment of the utility model, the longitudinal adjustment mechanism includes: a U-shaped plate 8 fixedly mounted on the first sliding plate 7; a second screw 9 rotatably mounted on the U-shaped plate 8 and provided with two sections of external threads with opposite rotation directions; a servo motor 10 fixedly mounted on one side of the U-shaped plate 8 and connected to the second screw 9; a plurality of second limit rods 11 fixedly mounted on the inner wall of the U-shaped plate 8; and two second sliding plates 12 threadedly sleeved on the second screw 9 and slidably connected to the plurality of second limit rods 11.

[0028] In this embodiment, the servo motor 10 drives the second screw 9 to rotate, which can drive the two second sliding plates 12 to move closer to or away from each other, thereby adjusting the longitudinal positions of multiple support mechanisms, so that the multiple support plates can support circuit boards of different sizes in layers.

[0029] In a further preferred embodiment of the present invention, the support mechanism comprises: a vertical rod 13 fixedly mounted on the second sliding plate 12 ; and a plurality of support plates 14 fixedly mounted on the vertical rod 13 .

[0030] In this embodiment, multiple circuit boards can be supported in layers by multiple support plates 14 on multiple vertical rods 13 .

[0031] In a further preferred embodiment of the present invention, the displacement mechanism comprises: an electric slide rail 15 fixedly mounted on the top inner wall of the L-shaped back plate 2 ; and an electric cylinder 16 fixedly mounted on the output block of the electric slide rail 15 .

[0032] In this embodiment, the electric slide rail 15 can drive the clamping and fixing mechanism and the multiple circuit boards thereon to move horizontally, and the electric cylinder 16 can drive the clamping and fixing mechanism and the multiple circuit boards thereon to move up and down, so that the multiple circuit boards on the multiple support plates 14 on one side of the displacement plating pool 3 can be removed and extended into the plating pool 3 for electroplating, and then the multiple circuit boards after electroplating are placed on the multiple support plates 14 on the other side of the plating pool 3, so as to continuously copper plate the circuit boards.

[0033] In a further preferred embodiment of the utility model, the clamping and fixing mechanism includes: a U-shaped frame 17 fixedly mounted on the output rod of the electric cylinder 16; a dual-axis motor 18 fixedly mounted on the inner wall of the U-shaped frame 17; two third screws 19 respectively fixedly mounted on both ends of the output shaft of the dual-axis motor 18 and rotatably connected to the inner walls on both sides of the U-shaped frame 17; a plurality of third limiting rods 20 fixedly mounted on the inner wall of the U-shaped frame 17; two third sliding plates 21 threadedly sleeved on the third screws 19 and slidably connected to the plurality of third limiting rods 20; two clamping plates 22 respectively fixedly mounted on the bottom of the two third sliding plates 21; and a plurality of strip grooves 23 respectively opened on the sides of the two clamping plates 22 close to each other.

[0034] In this embodiment, the two third screws 19 are driven to rotate by the dual-axis motor 18, and the rotation of the two third screws 19 drives the two clamping plates 22 to approach each other, and multiple circuit boards are clamped and fixed by the two clamping plates 22 approaching each other and the multiple strip grooves 23 thereon.

[0035] In a further preferred embodiment of the present invention, a hand wheel 24 is fixedly mounted on one end of the first screw rod 5 , and a controller is disposed on the top of the L-shaped back plate 2 .

[0036] In this embodiment, the first screw rod 5 can be driven to rotate by the hand wheel 24, and the device can be operated and controlled by the controller.

[0037] In summary, compared with the related technologies, the present device can not only continuously copper plate the circuit board, but is also suitable for circuit boards of different sizes. The copper plating process is more time-saving and labor-saving, and the copper plating efficiency is higher.

[0038] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0039] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A continuous copper plating device, characterized in that: include: A base with an L-shaped back panel fixed on the top; An electroplating tank disposed on the base; Two limiting grooves are provided on the base; A lateral adjustment mechanism is provided on the base, and is used to adjust the lateral spacing between the plurality of support mechanisms; A plurality of longitudinal adjustment mechanisms are arranged on the transverse adjustment mechanism, and the plurality of longitudinal adjustment mechanisms are used to adjust the longitudinal spacing of the plurality of support mechanisms; A plurality of supporting mechanisms are arranged on the plurality of longitudinal adjustment mechanisms, and the plurality of supporting mechanisms are used to support the circuit board; A displacement mechanism disposed on the inner wall of the top of the L-shaped back plate, the displacement mechanism being used to control the lateral and vertical movement of the clamping and fixing mechanism; A clamping and fixing mechanism is arranged on the displacement mechanism, and the clamping and fixing mechanism is used to clamp and fix the circuit board.

2. The continuous copper plating device according to claim 1, characterized in that: The lateral adjustment mechanism comprises: A first screw which is rotatably mounted on the inner wall of the base and has a plurality of sections of external threads with opposite rotation directions; A plurality of first limiting rods fixedly mounted on the inner wall of the base; A plurality of first sliding plates are threadedly sleeved on the first screw rod and are respectively slidably connected to the inner walls on both sides of the plurality of limiting grooves and the plurality of first limiting rods.

3. The continuous copper plating device according to claim 2, characterized in that: The longitudinal adjustment mechanism comprises: A U-shaped plate fixedly mounted on the first sliding plate; A second screw which is rotatably mounted on the U-shaped plate and has two sections of external threads with opposite rotation directions; A servo motor fixedly mounted on one side of the U-shaped plate and connected to the second screw; A plurality of second limiting rods fixedly mounted on the inner wall of the U-shaped plate; Two second sliding plates are threadedly sleeved on the second screw rod and slidably connected to the plurality of second limiting rods.

4. The continuous copper plating device according to claim 3, characterized in that: The supporting mechanism comprises: A vertical rod fixedly mounted on the second sliding plate; A plurality of support plates are fixedly mounted on the vertical rods.

5. The continuous copper plating device according to claim 1, characterized in that: The displacement mechanism comprises: An electric slide rail fixedly mounted on the top inner wall of the L-shaped back panel; An electric cylinder is fixedly mounted on the output block of the electric slide rail.

6. The continuous copper plating device according to claim 5, characterized in that: The clamping and fixing mechanism comprises: A U-shaped frame fixedly mounted on the output rod of the electric cylinder; A dual-axis motor fixedly mounted on the inner wall of the U-shaped frame; Two third screws respectively fixedly mounted on both ends of the output shaft of the dual-axis motor and rotatably connected to the inner walls of both sides of the U-shaped frame; A plurality of third limiting rods fixedly mounted on the inner wall of the U-shaped frame; two third sliding plates threadably sleeved on the third screw rod and slidably connected to the plurality of third limiting rods; Two clamping plates respectively fixedly mounted on the bottom of the two third sliding plates; A plurality of strip-shaped grooves are respectively arranged on the sides of the two clamping plates close to each other.

7. The continuous copper plating device according to claim 2, characterized in that: A hand wheel is fixedly mounted on one end of the first screw rod, and a controller is arranged on the top of the L-shaped back plate.

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