Temperature equalizing device with heat pipe

Abstract

The utility model relates to a temperature equalizing device with heat pipes. The temperature equalizing device comprises a temperature equalizing plate and at least one heat pipe, the uniform temperature plate comprises a lower plate piece and an upper plate piece which are overlapped and covered up and down, a hollow shape is formed between the lower plate piece and the upper plate piece, a capillary layer is arranged in the lower plate piece, and at least one through hole is formed in the upper plate piece; the heat pipe comprises a pipe body penetrating through the through hole and a capillary structure arranged on the pipe body, one end of the pipe body is provided with a closed end located outside the vapor chamber, the other end of the pipe body is provided with an open end located in the vapor chamber, the capillary structure is provided with an extension part and an expansion part, the extension part is attached to the interior of the pipe body, and the expansion part expands outwards from the open end of the pipe body in the radial direction; the opening end of the pipe body of the heat pipe abuts against the capillary layer in the vapor chamber through the expansion part of the capillary tissue, so that the expansion part is located between the opening end of the pipe body and the capillary layer.

Description

Technical Field

[0001] The present application relates to a heat conduction component, and more particularly to a temperature equalizing device with a heat pipe that connects a heat pipe with a temperature equalizing plate. Background Art

[0002] At present, when using a heat exchanger such as a heat spreader and a heat pipe for integrated heat dissipation or temperature equalization, the purpose of rapid heat conduction is achieved mainly by connecting the heat spreader and the heat pipe internally to each other and performing a vapor-liquid phase change of the sealed working fluid inside. During the process of the vapor-liquid phase change and its circulation of the working fluid, when the working fluid changes from the vapor phase to the liquid phase due to cooling, the working fluid that has returned to the liquid state needs to flow back through structures such as capillary tissues, so as to achieve the aforementioned circulation effect.

[0003] However, in the existing heat exchanger that integrates the above-mentioned temperature averaging plate and heat pipe, in order to maintain the setting of the heat pipe, the tube body is usually pressed against the shell or capillary structure in the temperature averaging plate after extending into the temperature averaging plate. Therefore, the contact area between the capillary structure inside the heat pipe and the capillary structure in the temperature averaging plate is extremely small, making it difficult to provide a better reflux effect.

[0004] In view of this, in order to improve and solve the above-mentioned deficiencies, the applicant has devoted himself to research and applied scientific theories, and finally proposed an application with a reasonable design that effectively improves the above-mentioned deficiencies. Utility Model Content

[0005] The main purpose of the present application is to provide a temperature equalizing device with a heat pipe, which can increase the contact area between the temperature equalizing plate and the capillaries inside the heat pipe, and maintain the connection between the temperature equalizing plate and the inside of the heat pipe to ensure that the liquid working fluid can have a good reflux effect.

[0006] In order to achieve the above-mentioned purpose, the present application provides a temperature equalizing device with a heat pipe, including a temperature equalizing plate and at least one heat pipe; the temperature equalizing plate includes a lower plate and an upper plate, which are overlapped and covered with each other, and a hollow shape is formed between the lower plate and the upper plate, a capillary layer is provided in the lower plate, and at least one through-hole is provided on the upper plate; the heat pipe includes a tube body passing through the through-hole, and a capillary structure provided in the tube body, one end of the tube body has a closed end located outside the temperature equalizing plate, and the other end has an open end located inside the temperature equalizing plate, and the capillary structure has an extension part and an expansion part, the extension part is attached to the tube body, and the expansion part is radially expanded outward from the open end of the tube body; wherein the open end of the tube body of the heat pipe is in contact with the capillary layer in the temperature equalizing plate with the expansion part of the capillary structure, so that the expansion part is between the open end of the tube body and the capillary layer.

[0007] In one embodiment, at least one of the lower plate and the upper plate is formed into a concave shape, so that a hollow shape is formed between the lower plate and the upper plate.

[0008] In one embodiment, the capillary layer is formed by metal mesh, powder sintering or grooves.

[0009] In one embodiment, the heat pipe body is provided with a first through hole portion near its open end, and a second through hole portion corresponding to the first through hole portion is provided on the capillary structure, and the interior of the tube body and the interior of the temperature equalizing plate are interconnected through the first through hole portion and the second through hole portion.

[0010] In one embodiment, the first through hole portion is a notch formed by a partial depression at the open end, and the second through hole portion is also a corresponding notch.

[0011] In one embodiment, the first through hole portion is a broken hole adjacent to the opening end, and the second through hole portion is also a corresponding broken hole.

[0012] In one embodiment, the lower edge of the open end of the heat pipe body abuts against the expansion portion of the capillary structure, and the expansion portion extends from the lower edge of the open end, and a second through hole is provided on the expansion portion and communicates with the open end.

[0013] In one embodiment, the capillary structure is formed by metal mesh, powder sintering, or a combination of the foregoing materials.

[0014] In one embodiment, the extension portion and the expansion portion are integrally formed.

[0015] In one embodiment, the extension portion and the expansion portion are in contact with each other and connected.

[0016] In one embodiment, the extension portion and the expansion portion are made of the same or different capillary materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional appearance schematic diagram of this application.

[0018] Figure 2 This is a three-dimensional exploded schematic diagram of the present application.

[0019] Figure 3 This is a three-dimensional exploded schematic diagram of the heat pipe of this application.

[0020] Figure 4 It is a cross-sectional schematic diagram of the internal structure of this application.

[0021] Figure 5 Based on Figure 4 An enlarged schematic diagram of the boxed portion.

[0022] Figure 6 for Figure 5 A schematic diagram of another embodiment.

[0023] Figure 7for Figure 5 A schematic diagram of yet another embodiment.

[0024] Figure 8 for Figure 5 A schematic diagram of yet another embodiment.

[0025] Fig. 9 for Figure 8 A partial stereoscopic view of yet another embodiment of .

[0026] Description of reference numerals:

[0027] 1: Temperature balancing plate;

[0028] 10: lower plate;

[0029] 100: capillary layer;

[0030] 11: Upper plate;

[0031] 110: perforation;

[0032] 2: Heat pipe;

[0033] 20: Pipe body;

[0034] 200: closed end;

[0035] 201: open end;

[0036] 201a: lower edge;

[0037] 202: first through hole portion;

[0038] 21: capillary tissue;

[0039] 210: extension;

[0040] 211: expansion department;

[0041] 212: Second through hole portion. DETAILED DESCRIPTION

[0042] In order to further disclose the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the attached drawings are only provided for reference and illustration and are not intended to limit the present application.

[0043] See also Figure 1 and Figure 2 , are respectively a three-dimensional appearance schematic diagram and a three-dimensional exploded schematic diagram of the present application. The present application provides a temperature equalization device with a heat pipe, comprising a temperature equalization plate 1, and at least one heat pipe 2 vertically arranged on the temperature equalization plate 1; wherein:

[0044] The temperature plate 1 comprises a lower plate 10 and an upper plate 11 which are overlapped in an upper and lower manner, and a hollow shape is formed between the lower plate 10 and the upper plate 11. Figure 4 or Figure 5 As shown, as long as one of the lower plate 10 and the upper plate 11 is formed into a concave shape, the interior of the plate 10 and the upper plate 11 can be formed into the hollow shape after the plate 10 and the upper plate 11 are covered. For example, in the present application, the lower plate 10 is formed into the concave shape, and the upper plate 11 is flat. Of course, the opposite arrangement can also be made, or the lower plate 10 and the upper plate 11 are both formed into the concave shape and covered with each other. In addition, Figure 4 or Figure 5 As shown, the temperature homogenizing plate 1 is provided with a capillary layer 100 at least in the lower plate 10 , and the capillary layer 100 can be formed by a metal mesh, powder sintering or grooves.

[0045] like Figure 3 As shown, each of the heat pipes 2 includes a tube body 20 and a capillary structure 21 disposed in the tube body 20. The capillary structure 21 may also be formed of a metal mesh, powder sintering, or a combination of the above materials. One end of the tube body 20 has a closed end 200 located outside the temperature equalizing plate 1, and the other end is an open end 201 located inside the temperature equalizing plate 1. The capillary structure 21 has at least one extension portion 210 and an expansion portion 211 that are in contact with each other and connected, or are integrally formed. The extension portion 210 is attached to the tube body 20, and the expansion portion 211 is radially expanded outward from the open end 201 of the tube body 20. When the extension portion 210 and the expansion portion 211 are made of the same capillary material, the extension portion 210 and the expansion portion 211 may be integrally formed (i.e., Figure 5 or Figure 6 When the capillary materials are different (ie, "different"), the extension portion 210 and the expansion portion 211 may be connected to each other in contact (ie, as shown); Figure 7 shown).

[0046] Please see again Figure 2 As shown, at least one through hole 110 is provided on the upper plate 11 of the above-mentioned temperature equalizing plate 1, and the through hole 110 is used for the above-mentioned heat pipe 2 to be inserted and fixed, and is set according to the number of heat pipes 2 to be configured, or according to the number of positions where the heat pipes 2 penetrate the temperature equalizing plate 1 (i.e., the number of opening ends 201); for example, in the embodiment given in the present application, the number of heat pipes 2 configured on the temperature equalizing plate 1 is "three", so the number of the through holes 110 also corresponds to "three".

[0047] like Figure 4 and Figure 5As shown, the tube body 20 of each heat pipe 2 extends into the interior of the temperature averaging plate 1 through the corresponding through hole 110 with its open end 201, so that the expansion portion 211 of the capillary structure 21 abuts against the capillary layer 100 in the temperature averaging plate 1, so that the expansion portion 211 can be between the open end 201 of the tube body 20 and the capillary layer 100, and the extension portion 210 of the capillary structure 21 can overlap and contact with the capillary layer 100 through the expansion portion 211. In particular, each heat pipe 2 can be The expansion portion 211 of the capillary structure 21 is pressed onto the capillary layer 100 by the open end 201 of the tube body 20, so that the radially expanded expansion portion 211 can contact the capillary layer 100 with a larger contact area. In this way, the capillary transmission between the capillary layer 100 and the capillary structure 21 can be stably maintained and uninterrupted to ensure a good reflux effect of the liquid working fluid, and each heat pipe 2 is vertically arranged on the temperature equalizing plate 1.

[0048] Furthermore, the tube body 20 of each heat pipe is provided with a first through hole portion 202 near its open end 201, and a second through hole portion 212 corresponding to the first through hole portion 202 is provided on the capillary structure 21, so that the interior of the tube body 20 and the interior of the temperature equalizing plate 1 can be connected to each other through the first through hole portion 202 and the second through hole portion 212. Figure 5 As shown, in one embodiment of the present application, the first through hole portion 202 can be a notch formed by a partial depression of the opening end 201, and the second through hole portion 212 is also a corresponding notch; and as shown in FIG. Figure 6 As shown, in another embodiment of the present application, the first through hole portion 202 is a broken hole near the opening end 201, and the second through hole portion 212 is also a corresponding broken hole. In this way, the interior of the temperature vapor chamber 1 and the interior of each heat pipe 2 can be maintained in a connected state through the first through hole portion 202 and the second through hole portion 212. Figure 8 and Fig. 9 As shown, in another embodiment of the present application, the lower edge 201a of the open end 201 of the tube body 20 can also be in contact with the expansion portion 211 of the capillary tissue 21, so that the expansion portion 211 can extend from the lower edge 201a of the open end 201, and the second through hole portion 212 is provided on the expansion portion 211 to connect with the open end 201. In this way, the open end 201 of the tube body 20 does not need to be provided with the aforementioned first through hole portion 202, and at the same time, the expansion portion 211 of the capillary tissue 21 can still be provided between the open end 201 of the tube body 20 and the capillary layer 100.

[0049] Therefore, by means of the above-mentioned structural composition, the temperature-averaging device with heat pipe of the present application can be obtained.

[0050] However, the above description is only a preferred feasible embodiment of the present application, and does not limit the patent scope of the present application. Therefore, all equivalent structural changes made using the contents of the present application specification and drawings are also included in the scope of the present application and are hereby stated.

Claims

1. A temperature equalizing device with a heat pipe, characterized in that: include: A temperature-averaging plate, comprising a lower plate and an upper plate, which are stacked and covered with each other, and a hollow space is formed between the lower plate and the upper plate, a capillary layer is provided in the lower plate, and at least one through hole is provided on the upper plate; and At least one heat pipe, comprising a tube body passing through the perforation, and a capillary structure provided on the tube body, wherein one end of the tube body has a closed end located outside the temperature averaging plate, and the other end has an open end located inside the temperature averaging plate, and the capillary structure has an extension portion and an expansion portion, wherein the extension portion is attached to the tube body, and the expansion portion expands radially outward from the open end of the tube body; The open end of the heat pipe body is in contact with the capillary layer in the temperature equalizing plate through the expansion part of the capillary structure, so that the expansion part is located between the open end of the heat pipe body and the capillary layer.

2. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: At least one of the lower plate and the upper plate is formed in a concave shape, so that the hollow shape is formed between the lower plate and the upper plate.

3. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The capillary layer is formed by metal mesh, powder sintering or grooves.

4. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The heat pipe body is provided with a first through hole portion near its open end, and a second through hole portion corresponding to the first through hole portion is provided on the capillary structure, and the interior of the tube body and the interior of the temperature equalizing plate are connected to each other through the first through hole portion and the second through hole portion.

5. The temperature equalizing device with a heat pipe according to claim 4, characterized in that: The first through hole portion is a notch formed by a partial depression of the opening end, and the second through hole portion is also a corresponding notch.

6. The temperature equalizing device with a heat pipe according to claim 4, characterized in that: The first through hole portion is a broken hole adjacent to the opening end, and the second through hole portion is also a corresponding broken hole.

7. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The lower edge of the open end of the heat pipe body abuts against the expansion part of the capillary structure, and the expansion part extends from the lower edge of the open end. A second through hole is provided on the expansion part and communicates with the open end.

8. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The capillary structure is composed of metal mesh, powder sintering, or a combination of the above materials.

9. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The extension portion and the expansion portion are integrally formed.

10. The temperature equalizing device with a heat pipe according to claim 1, characterized in that: The extending portion and the expanding portion are in contact with each other and connected.

11. The temperature equalizing device with a heat pipe according to claim 9 or 10, characterized in that: The extension portion and the expansion portion are made of the same or different capillary materials.

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