Ultrasonic assembly and electronic equipment

Abstract

The embodiment of the utility model discloses an ultrasonic assembly and electronic equipment, the ultrasonic assembly comprises an ultrasonic device, a circuit board and an elastic cushion block, and the ultrasonic device is installed on the circuit board and electrically connected with the circuit board. The elastic cushion block is installed on the circuit board, the circuit board and the ultrasonic device are located on the same side of the elastic cushion block, and the elastic cushion block is provided with a first through hole corresponding to the ultrasonic device. The ultrasonic device can be assembled on the electronic equipment through the elastic cushion block, the manufacturing precision of the elastic cushion block can be higher than that of a bent support, and therefore the assembling precision of the ultrasonic device in the electronic equipment can be improved. The elastic cushion block has elasticity, so that the elastic cushion block can be in close contact with a circuit board and other devices due to extrusion deformation when the elastic cushion block is assembled with the circuit board and other devices, thereby reducing a gap between the elastic cushion block and the assembled devices (such as the circuit board and a frame), and reducing ultrasonic loss.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an ultrasonic component and electronic equipment. Background Art

[0002] With the development of electronic technology, electronic devices such as smart tablets, TVs, and smart screens are increasingly used in daily life. In order to avoid power consumption caused by electronic devices being always on, electronic devices are usually turned off when not in use. When they need to be turned on, they need to be manually clicked on or voice woken up, resulting in a poor user experience.

[0003] In this regard, the related art proposes to set an ultrasonic device on the electronic device, and when the user enters the detection range of the ultrasonic device, the electronic device can be automatically turned on, reducing the user's operation process. However, in the related art, the ultrasonic device is connected to a bent bracket and assembled to the electronic device through the bent bracket. There is a problem of poor assembly accuracy of the ultrasonic device due to the low manufacturing tolerance when the bracket is bent. Utility Model Content

[0004] The embodiments of the present application provide an ultrasonic component and an electronic device, which are used to improve the problem in the related art that an ultrasonic device is connected to a bent bracket and assembled to the electronic device through the bent bracket, and that the assembly accuracy of the ultrasonic device is poor due to the low manufacturing tolerance when the bracket is bent.

[0005] In a first aspect, an embodiment of the present application provides an ultrasonic component, including an ultrasonic device, a circuit board, and an elastic pad, wherein the ultrasonic device is mounted on the circuit board and electrically connected to the circuit board. The elastic pad is used to mount the circuit board, the circuit board and the ultrasonic device are located on the same side of the elastic pad, and the elastic pad is provided with a first through hole corresponding to the ultrasonic device.

[0006] The ultrasonic assembly of the embodiment of the present application connects the ultrasonic device with the elastic pad, so that the ultrasonic device can be assembled in the electronic device through the elastic pad, wherein the manufacturing accuracy of the elastic pad can be higher than that of the bent bracket, thereby facilitating the improvement of the assembly accuracy of the ultrasonic device in the electronic device. The elastic pad is elastic, so that the elastic pad can be in close contact with the circuit board and other devices due to extrusion deformation when assembled with the circuit board and other devices, thereby reducing the gap between the elastic pad and the assembled device (such as the circuit board, the frame), and reducing the ultrasonic loss.

[0007] In some embodiments, the elastic pad includes at least one of a silicone pad and a rubber pad.

[0008] Based on the above embodiments, the silicone pads and rubber pads are low in cost and widely available, which is beneficial to reducing the manufacturing cost of the ultrasonic component.

[0009] In some embodiments, the ultrasonic device is located on a side of the circuit board away from the elastic pad, and the circuit board is provided with a second through hole corresponding to the ultrasonic device, and the second through hole is connected to the first through hole.

[0010] Based on the above embodiment, the ultrasonic device is arranged on the side of the circuit board away from the elastic pad, that is, the ultrasonic device and the elastic pad are respectively located on the opposite sides of the circuit board. Compared with arranging the ultrasonic device on the side of the circuit board close to the elastic pad and providing a mounting groove corresponding to the ultrasonic device on the elastic pad, the structure of the elastic pad can be simplified, the design is more convenient, and it is beneficial to improve the concealment of the ultrasonic device after the ultrasonic device is installed in the electronic device via the elastic pad.

[0011] In some embodiments, the first through hole includes a first hole segment, and a cross-section of the first hole segment gradually increases from one end close to the circuit board to the other end.

[0012] Based on the above embodiments, the propagation distance of the ultrasonic wave can be increased and the detection performance of the ultrasonic component can be improved.

[0013] In some embodiments, the first through hole also includes a second hole segment, which is connected to the first hole segment, and the second hole segment is closer to the circuit board than the first hole segment. The cross-section of the second hole segment remains unchanged from one end close to the circuit board to the other end.

[0014] Based on the above embodiment, when the ultrasonic signal enters the elastic pad, it first enters the second hole segment and then enters the first hole segment, wherein the first hole segment is used to increase the propagation distance of the ultrasonic wave. Compared with the first hole segment extending directly to the surface of the elastic pad close to the circuit board, the second hole segment can make the first through hole smoother on the side close to the circuit board, less likely to form sharp corners, and less likely to produce burrs such as burrs and flashes during the mold production process of the elastic pad, which is conducive to improving the production yield of the elastic pad.

[0015] In some of these embodiments, the first hole segment is a trumpet-shaped hole.

[0016] In some embodiments, the circuit board is provided with one of the first positioning portion and the first positioning hole, the elastic pad is provided with the other of the first positioning portion and the first positioning hole, and the first positioning portion is embedded in the first positioning hole.

[0017] Based on the above embodiment, the provision of the first positioning portion and the first positioning hole can pre-position the assembly position of the circuit board and the elastic pad when assembling the circuit board and the elastic pad, thereby improving the assembly accuracy of the circuit board and the elastic pad.

[0018] Some of the embodiments further include a first adhesive layer connected between the circuit board and the elastic pad.

[0019] Based on the above embodiment, the connection between the circuit board and the elastic pad is achieved through the first adhesive layer, which is more convenient to assemble than the screw connection method, and is conducive to improving the assembly efficiency of the ultrasonic component. In addition, the first adhesive layer can block the gap between the circuit board and the elastic pad, reduce the gap between the circuit board and the elastic pad, and reduce the loss caused by the excessive gap on the ultrasonic transmission path.

[0020] Some of the embodiments further include a dustproof member, which is located between the circuit board and the elastic pad and covers the first through hole.

[0021] Based on the above embodiments, the provision of the dustproof piece can prevent external dust and other impurities from reaching the ultrasonic device, thereby preventing the ultrasonic device from being affected.

[0022] In a second aspect, an embodiment of the present application provides an electronic device, comprising the above-mentioned ultrasonic component and a frame, wherein the ultrasonic component is located in the frame, an elastic pad is installed on the side of the frame away from the circuit board, and the frame is provided with a third through hole connected to the first through hole.

[0023] The electronic device of the embodiment of the present application sets the ultrasonic component in the frame, so that the frame can protect the ultrasonic component, and the setting of the third through hole on the frame is conducive to the normal transmission of ultrasonic waves and will not affect the detection performance of the ultrasonic component.

[0024] In some embodiments, the elastic pad is provided with one of the second positioning portion and the second positioning hole, the frame is provided with the other of the second positioning portion and the second positioning hole, and the second positioning portion is embedded in the second positioning hole.

[0025] Based on the above embodiment, the provision of the second positioning portion and the second positioning hole can pre-position the assembly position of the frame and the elastic pad in the ultrasonic component when assembling the frame and the ultrasonic component, thereby improving the assembly accuracy of the frame and the ultrasonic component.

[0026] Some of the embodiments further include a second adhesive layer connected between the elastic pad and the frame.

[0027] Based on the above embodiment, the connection between the elastic pad and the frame is achieved through the second adhesive layer, which is more convenient to assemble than the screw connection method, which is conducive to improving the assembly efficiency of the ultrasonic component. In addition, the second adhesive layer can block the gap between the elastic pad and the frame, reduce the gap between the elastic pad and the frame, and reduce the loss caused by the excessive gap on the ultrasonic transmission path. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 is a schematic diagram of the three-dimensional structure of an ultrasonic component provided in an embodiment of the present application;

[0030] Figure 2 yes Figure 1 A schematic diagram of the structure of the ultrasonic component as seen from above is shown;

[0031] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure in the AA direction;

[0032] Figure 4 yes Figure 1 A schematic diagram of the exploded structure of the ultrasonic component is shown;

[0033] Figure 5 is a schematic diagram of a partial three-dimensional structure of an electronic device provided in an embodiment of the present application;

[0034] Figure 6 yes Figure 5 A schematic diagram of the structure of the electronic device shown is viewed from above;

[0035] Figure 7 yes Figure 6 Schematic diagram of the cross-sectional structure in the middle BB direction;

[0036] Figure 8 yes Figure 5 Schematic diagram of the exploded structure of an electronic device is shown.

[0037] Description of reference numerals:

[0038] 1. Electronic equipment;

[0039] 10. Ultrasonic component; 11. Ultrasonic device; 12. Circuit board; 121. Second through hole; 122. First positioning hole; 13. Elastic pad; 131. First through hole; 1311. First hole section; 1312. Second hole section; 132. First positioning portion; 133. Second positioning hole; 134. Stopper; 15. Dustproof member;

[0040] 20. Frame; 21. Third through hole; 22. Second positioning portion. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions and advantages of the present application more clear, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0042] When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0043] With the development of electronic technology, electronic devices such as smart tablets, TVs, and smart screens are increasingly used in daily life. In order to avoid power consumption caused by electronic devices being always on, electronic devices are usually turned off when not in use. When they need to be turned on, they need to be manually clicked on or voice woken up, resulting in a poor user experience.

[0044] In this regard, the related art proposes to set an ultrasonic device on the electronic device, and when the user enters the detection range of the ultrasonic device, the electronic device can be automatically turned on, reducing the user's operation process. However, in the related art, the ultrasonic device is connected to a bent bracket and assembled to the electronic device through the bent bracket. There is a problem of poor assembly accuracy of the ultrasonic device due to the low manufacturing tolerance when the bracket is bent.

[0045] In the embodiment of the present application, the ultrasonic device is connected to the elastic pad, and can be assembled in the electronic device through the elastic pad, wherein the manufacturing accuracy of the elastic pad can be higher than that of the bracket, thereby facilitating the improvement of the assembly accuracy of the ultrasonic device in the electronic device. The elastic pad 13 is elastic, and can be in close contact with the circuit board 12 and other devices due to extrusion deformation when assembled with the circuit board 12 and other devices, thereby reducing the gap between the elastic pad 13 and the assembled devices (such as the circuit board 12 and the frame 20), and reducing the ultrasonic loss.

[0046] Specifically, see Figures 1 to 4The embodiment of the present application provides an ultrasonic assembly 10, which includes an ultrasonic device 11, a circuit board 12, and an elastic pad 13. The ultrasonic device 11 is mounted on the circuit board 12 and is electrically connected to the circuit board 12. The elastic pad 13 is used to mount the circuit board 12. The circuit board 12 and the ultrasonic device 11 are located on the same side of the elastic pad 13. The elastic pad 13 is provided with a first through hole 131 corresponding to the ultrasonic device 11.

[0047] The ultrasonic device 11 is connected to the elastic pad 13, so that the ultrasonic device 11 can be assembled in the electronic device 1 through the elastic pad 13, wherein the manufacturing accuracy of the elastic pad 13 can be higher than that of the bent bracket, thereby facilitating the improvement of the assembly accuracy of the ultrasonic device 11 in the electronic device 1. The elastic pad 13 is elastic, and can be in close contact with the circuit board 12 and other devices due to extrusion deformation when assembled with the circuit board 12 and other devices, thereby reducing the gap between the elastic pad 13 and the assembled devices (such as the circuit board 12 and the frame 20), and reducing the ultrasonic loss.

[0048] The elastic pad 13 may be any pad with elasticity. For example, the elastic pad 13 includes at least one of a silicone pad and a rubber pad. The silicone pad and the rubber pad are low in cost and widely available, which is beneficial to reducing the manufacturing cost of the ultrasonic component 10 .

[0049] The first through hole 131 includes a first hole segment 1311, and the cross section of the first hole segment 1311 gradually increases from one end close to the circuit board 12 to the other end, so as to increase the propagation distance of the ultrasonic wave and improve the detection performance of the ultrasonic component 10. The first hole segment 1311 may be a horn-shaped hole, etc., which is not limited. The shape of the first hole segment 1311 can be determined by the simulation experiment results recorded in the relevant technology, and will not be described in detail.

[0050] It should be noted that when the ultrasonic component 10 is used in the electronic device 1, it is mainly used to detect whether the user enters the detection range of the ultrasonic device 11, that is, to detect the user's approach or distance (lateral field of view), rather than to detect the user's height (longitudinal field of view) and other factors. Figure 2 and Figure 3 In the direction from one end close to the circuit board 12 to the other end, the maximum lateral dimension of each cross section of the first hole segment 1311 is smaller than its maximum longitudinal dimension, so that the ultrasonic wave after gain through the first hole segment 1311 has a sufficient field of view detection range in the lateral direction, and the detection result is more reliable.

[0051] In some exemplary solutions, the first hole segment 1311 may extend directly to the surface of the elastic pad 13 close to the circuit board 12, that is, the ultrasonic signal will directly enter the first hole segment 1311 when entering the elastic pad 13, which is conducive to shortening the thickness of the elastic pad 13. In other exemplary solutions, the first through hole 131 may also include a second hole segment 1312, the second hole segment 1312 is connected to the first hole segment 1311, the second hole segment 1312 is closer to the circuit board 12 than the first hole segment 1311, and the cross-section of the second hole segment 1312 remains unchanged from one end close to the circuit board 12 to the other end, that is, the ultrasonic signal first enters the second hole segment 1312 when entering the elastic pad 13, and then enters the first hole segment 1311, wherein the first hole segment 1311 is used to increase the propagation distance of the ultrasonic wave. Compared with the first hole segment 1311 directly extending to the surface of the elastic pad 13 close to the circuit board 12, the second hole segment 1312 can make the first through hole 131 smoother on the side close to the circuit board 12, less likely to form sharp corners, and less likely to produce burrs such as burrs and flashes during the mold production process of the elastic pad 13, which is beneficial to improving the production yield of the elastic pad 13. Among them, the second hole segment 1312 can be a columnar hole, etc., which is not limited to this. The shape of the second hole segment 1312 can be determined by the model of the ultrasonic device 11 recorded in the relevant technology, and no further description is given to this.

[0052] The ultrasonic device 11 can be arranged on the side of the circuit board 12 close to the elastic pad 13, and a mounting groove corresponding to the ultrasonic device 11 is arranged on the elastic pad 13 (not shown in the figure). The ultrasonic device 11 can also be located on the side of the circuit board 12 away from the elastic pad 13, and the circuit board 12 is provided with a second through hole 121 corresponding to the ultrasonic device 11, and the second through hole 121 is connected to the first through hole 131. Among them, if the ultrasonic device 11 is arranged on the side of the circuit board 12 away from the elastic pad 13, that is, the ultrasonic device 11 and the elastic pad 13 are respectively located on the opposite sides of the circuit board 12, the structure of the mounting groove on the elastic pad 13 can be simplified, the design is more convenient, and it is conducive to improving the concealment of the ultrasonic device 11 after the ultrasonic device 11 is installed in the electronic device 1 through the elastic pad 13.

[0053] The circuit board 12 is provided with one of the first positioning portion 132 and the first positioning hole 122, and the elastic pad 13 is provided with the other of the first positioning portion 132 and the first positioning hole 122, and the first positioning portion 132 is embedded in the first positioning hole 122. The provision of the first positioning portion 132 and the first positioning hole 122 can pre-position the assembly position of the circuit board 12 and the elastic pad 13 when assembling the circuit board 12 and the elastic pad 13, thereby improving the assembly accuracy of the circuit board 12 and the elastic pad 13.

[0054] The circuit board 12 is provided with one of the first positioning portion 132 and the first positioning hole 122, and the elastic pad 13 is provided with the other of the first positioning portion 132 and the first positioning hole 122. It can be that: the circuit board 12 is provided with the first positioning portion 132, and the elastic pad 13 is provided with the first positioning hole 122; it can also be that: the circuit board 12 is provided with the first positioning hole 122, and the elastic pad 13 is provided with the first positioning portion 132. In the embodiment of the present application, the circuit board 12 is provided with the first positioning hole 122, and the elastic pad 13 is provided with the first positioning portion 132. By providing the positioning hole on the circuit board 12, molding is more convenient than providing the positioning portion.

[0055] It should be noted that the number of the first positioning portions 132 can be one or more, the number of the first positioning holes 122 is equal to the number of the first positioning portions 132, and each positioning portion 132 is correspondingly embedded in each positioning hole 122. If the number of the first positioning portions 132 and the first positioning holes 122 is more than one, it is beneficial to improve the stability of the first positioning portions 132 and the first positioning holes 122 in pre-positioning the circuit board 12 and the elastic pad 13.

[0056] The elastic pad 13 is provided with a stopper 134, which is located on the side of the circuit board 12 and abuts against the side wall of the circuit board 12. The setting of the stopper 134 can also pre-position the assembly position between the circuit board 12 and the elastic pad 13, and because the stopper 134 abuts against the side wall of the circuit board 12, there is no need to adjust the structure of the circuit board 12, which is more convenient to manufacture.

[0057] It is understandable that the ultrasonic component 10 may be provided with the first positioning portion 132 , the first positioning hole 122 and the stopper 134 at the same time, or only the first positioning portion 132 and the first positioning hole 122 , or only the stopper 134 , which is not limited thereto.

[0058] The ultrasonic component 10 also includes a first adhesive layer (not shown in the figure), which is connected between the circuit board 12 and the elastic pad 13. The connection between the circuit board 12 and the elastic pad 13 is achieved through the first adhesive layer, which is more convenient to assemble than the screw connection method, which is conducive to improving the assembly efficiency of the ultrasonic component 10. In addition, the first adhesive layer can block the gap between the circuit board 12 and the elastic pad 13, reduce the gap between the circuit board 12 and the elastic pad 13, and reduce the loss caused by the excessive gap on the ultrasonic transmission path.

[0059] Among them, the first adhesive layer can be a double-sided adhesive layer, and the first adhesive layer can be first bonded to the elastic pad 13. A release paper can be provided on the side of the first adhesive layer facing away from the elastic pad 13. When the elastic pad 13 is assembled with the circuit board 12, the release paper on the first adhesive layer can be torn off and bonded to the circuit board 12.

[0060] The elastic pad 13 is designed to be elastic, so that when the elastic pad 13 is bonded to the circuit board 12, it can be squeezed and deformed by external force and closely bonded to the circuit board 12, thereby eliminating the gap between the elastic pad 13 and the circuit board 12 and reducing the loss of ultrasonic waves.

[0061] The ultrasonic component 10 also includes a dustproof member 15, which is located between the circuit board 12 and the elastic pad 13 and covers the first through hole 131. The provision of the dustproof member 15 can prevent external dust and other impurities from reaching the ultrasonic device 11, thereby preventing the ultrasonic device 11 from being affected. The dustproof member 15 can be a dustproof film, a dustproof cloth, etc., which is not limited. It is understandable that the dustproof member 15 can also be provided on the side of the elastic pad 13 away from the circuit board 12 and covers the first through hole 131. Compared with providing the dustproof member 15 on the side of the elastic pad 13 away from the circuit board 12, providing the dustproof member 15 between the circuit board 12 and the elastic pad 13 has less impact on the frequency of the ultrasonic wave and less impact on the detection performance of the ultrasonic component 10.

[0062] In a second aspect, an embodiment of the present application provides an electronic device 1, which includes the above-mentioned ultrasonic component 10 and a device body. The electronic device 1 can be any device having an ultrasonic component 10; for example, the electronic device 1 can be a display device having a display function such as a smart tablet, a TV, a smart screen, etc., which is not limited in the embodiment of the present application.

[0063] The device body may include a frame 20, the ultrasonic component 10 is located in the frame 20, the elastic pad 13 is installed on the frame 20 at a side away from the circuit board 12, and the frame 20 is provided with a third through hole 21 connected to the first through hole 131. The ultrasonic component 10 is arranged in the frame 20, and the frame 20 can protect the ultrasonic component 10, and the arrangement of the third through hole 21 on the frame 20 is conducive to the normal transmission of ultrasonic waves and will not affect the detection performance of the ultrasonic component 10. Among them, the projection of the third through hole 21 on the elastic pad 13 is located on the periphery of the first through hole 131, and will not block the first through hole 131.

[0064] In some embodiments, the elastic pad 13 is provided with one of the second positioning portion 22 and the second positioning hole 133, the frame 20 is provided with the other of the second positioning portion 22 and the second positioning hole 133, and the second positioning portion 22 is embedded in the second positioning hole 133. The provision of the second positioning portion 22 and the second positioning hole 133 can pre-position the assembly position of the elastic pad 13 in the frame 20 and the ultrasonic component 10 when the frame 20 and the ultrasonic component 10 are assembled, thereby improving the assembly accuracy of the frame 20 and the ultrasonic component 10.

[0065] The elastic pad 13 is provided with one of the second positioning portion 22 and the second positioning hole 133, and the frame 20 is provided with the other of the second positioning portion 22 and the second positioning hole 133. It can be that: the elastic pad 13 is provided with the second positioning portion 22, and the frame 20 is provided with the second positioning hole 133; it can also be that: the elastic pad 13 is provided with the second positioning hole 133, and the frame 20 is provided with the second positioning portion 22. In the embodiment of the present application, the elastic pad 13 is provided with the second positioning hole 133, and the frame 20 is provided with the second positioning portion 22. By providing the positioning portion on the frame 20, compared with providing the positioning hole, the positioning portion can be located inside the frame 20, and will not affect the appearance of the frame 20.

[0066] It should be noted that the number of the second positioning portions 22 can be one or more, the number of the second positioning holes 133 is equal to the number of the second positioning portions 22, and each positioning portion 132 is correspondingly embedded in each positioning hole 122. If the number of the second positioning portions 22 and the second positioning holes 133 is more than one, it is beneficial to improve the stability of the pre-positioning of the second positioning portions 22 and the second positioning holes 133 on the frame 20 and the elastic pad 13.

[0067] The ultrasonic component 10 also includes a second adhesive layer (not shown in the figure), which is connected between the elastic pad 13 and the frame 20. The connection between the elastic pad 13 and the frame 20 is achieved through the second adhesive layer, which is more convenient to assemble than the screw connection method, which is conducive to improving the assembly efficiency of the ultrasonic component 10. In addition, the second adhesive layer can block the gap between the elastic pad 13 and the frame 20, reduce the gap between the elastic pad 13 and the frame 20, and reduce the loss caused by the excessive gap on the ultrasonic transmission path.

[0068] Among them, the second adhesive layer can be a double-sided adhesive layer, the second adhesive layer can be first bonded to the elastic pad 13, and a release paper can be provided on the side of the second adhesive layer facing away from the elastic pad 13. When the ultrasonic component 10 is assembled with the frame 20, the release paper on the second adhesive layer can be torn off and bonded to the frame 20.

[0069] The elastic pad 13 is designed to be elastic, so that when the elastic pad 13 is bonded to the frame 20, it can be squeezed and deformed by external force and closely bonded to the frame 20, eliminating the gap between the elastic pad 13 and the frame 20 and reducing the loss of ultrasonic waves.

[0070] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" refers to at least two, for example, two, three, four, etc. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects associated before and after are in an "or" relationship.

[0071] The above disclosure is only the preferred embodiment of the present application, which certainly cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An ultrasonic component (10), characterized in that: include: Ultrasonic device (11); A circuit board (12), the ultrasonic device (11) being mounted on the circuit board (12) and being electrically connected to the circuit board (12); An elastic pad (13), the elastic pad (13) being used for mounting the circuit board (12), the circuit board (12) and the ultrasonic device (11) being located on the same side of the elastic pad (13), and the elastic pad (13) being provided with a first through hole (131) corresponding to the ultrasonic device (11).

2. The ultrasonic component (10) according to claim 1, characterized in that: The elastic pad (13) comprises at least one of a silicone pad and a rubber pad; And / or, the ultrasonic device (11) is located on a side of the circuit board (12) away from the elastic pad (13), the circuit board (12) is provided with a second through hole (121) corresponding to the ultrasonic device (11), and the second through hole (121) is connected to the first through hole (131).

3. The ultrasonic component (10) according to claim 1, characterized in that: The first through hole (131) comprises: The first hole section (1311) has a cross section that gradually increases from one end close to the circuit board (12) to the other end.

4. The ultrasonic component (10) according to claim 3, characterized in that: The first through hole (131) further comprises a second hole segment (1312), the second hole segment (1312) being connected to the first hole segment (1311), the second hole segment (1312) being closer to the circuit board (12) than the first hole segment (1311), and the cross section of the second hole segment (1312) remains unchanged from one end close to the circuit board (12) to the other end; And / or, the first hole section (1311) is a trumpet-shaped hole.

5. The ultrasonic component (10) according to claim 1, characterized in that: The circuit board (12) is provided with one of a first positioning portion (132) and a first positioning hole (122), the elastic pad (13) is provided with the other of the first positioning portion (132) and the first positioning hole (122), and the first positioning portion (132) is embedded in the first positioning hole (122).

6. The ultrasonic component (10) according to claim 1, characterized in that Also includes: A first adhesive layer, wherein the first adhesive layer is connected between the circuit board (12) and the elastic pad (13).

7. The ultrasonic component (10) according to claim 1, characterized in that Also includes: A dustproof piece (15), the dustproof piece (15) is located between the circuit board (12) and the elastic pad (13) and covers the first through hole (131).

8. An electronic device (1), characterized in that: include: The ultrasonic component (10) according to any one of claims 1 to 7; A frame (20), wherein the ultrasonic component (10) is located in the frame (20), the elastic pad (13) is installed on the frame (20) at a side away from the circuit board (12), and the frame (20) is provided with a third through hole (21) connected to the first through hole (131).

9. The electronic device (1) according to claim 8, characterized in that: The elastic pad (13) is provided with one of a second positioning portion (22) and a second positioning hole (133), the frame (20) is provided with the other of the second positioning portion (22) and the second positioning hole (133), and the second positioning portion (22) is embedded in the second positioning hole (133).

10. The electronic device (1) according to claim 8, characterized in that Also includes: A second adhesive layer, wherein the second adhesive layer is connected between the elastic pad (13) and the frame (20).

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