Large-host high-power radiator

By installing semiconductor composite boards in high-power radiators of large hosts and using thermoelectric effects to cool down, the problems of existing radiators in the thermal performance of plane fans and the service life of heat dissipation fins are solved, achieving more efficient heat dissipation effects and longer service life.

CN222562009UActive Publication Date: 2025-03-04DONGGUAN WEISHAN ELECTROMECHANICAL TECH CO LTD
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Patent Information

Application Number
CN202421329393.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-03-04
Estimated Expiration
2034-06-12

AI Technical Summary

Technical Problem

The existing heat-tube computer radiators have shortcomings in the thermal performance of the plane fans, and the heat dissipation ability of the heat dissipation fins decreases after long-term use, which affects the service life of the overall device.

Method used

A high-power radiator for large hosts is designed. By installing a semiconductor composite board on the top of the heat dissipation fins, the heat dissipation fins are cooled by thermoelectric effect, and the heat dissipation effect is enhanced through structures such as protective box, positioning pole, air duct and screen plate.

Benefits of technology

It effectively enhances the cooling capacity of the heat dissipation fins, extends the service life of the heat dissipation fins, and improves the heat dissipation efficiency of the overall radiator.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of radiators, and discloses a large-host high-power radiator which comprises a protection box, a positioning vertical rod is fixedly installed at the bottom of the protection box, radiating fins are movably installed on the outer side of the positioning vertical rod, a semiconductor composition board is movably installed on the tops of the radiating fins, and the semiconductor composition board is fixedly installed on the bottom of the protection box. A cover box is fixedly installed on the outer side of the semiconductor composition board, and air outlet fans are fixedly installed at the four corners of the top face of the cover box. Through the arrangement of the protection box, the heat dissipation fins can be protected to a certain degree, through the arrangement of the positioning vertical rods, the heat dissipation fins can be fixed conveniently, the heat dissipation fins can increase the contact area when hot air flows, and therefore energy consumption is formed on the hot air, the hot air is cooled, and the service life of the hot air is prolonged. A semiconductor composition board is installed on the tops of the heat dissipation fins, the composition board is formed by combining an N-type semiconductor and a P-type semiconductor according to a certain mode, and when the composition board is powered on, a thermoelectric effect can be generated.
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Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and more specifically, to a high-power radiator for a large host. Background Art

[0002] Radiator is a general term for a series of devices used to conduct and release heat. Radiators mainly include heating radiators and computer radiators. Computer radiators can be divided into several types according to their uses and installation methods. Heat pipe computer radiators use a combination of heat pipes and cooling fins, but different structural designs lead to different cooling effects. Generally, heat pipe computer radiators use U-shaped heat pipes that are directly inserted into the cooling fins. This cooling structure has good vertical cooling effects, but does not have flat fan performance. Even with a large air volume cooling fan, a good cooling effect cannot be achieved.

[0003] For example, a radiator with publication number CN213659387U specifically refers to a low-air-volume, high-power radiator. Although the device can improve the heat dissipation performance to a certain extent, in actual use, the above device only uses a fan to dissipate heat on the fins. When all the fins are heated, the heat dissipation capacity of the cooling fins will decrease. The above device lacks the ability to cool the cooling fins, which will affect the service life of the overall device to a certain extent.

[0004] Therefore, in view of the above problems, a high-power radiator for a large host is proposed. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a high-power radiator for a large host, which has the advantage of cooling the fins themselves.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-power radiator for a large main engine, comprising a protective box, a positioning upright fixedly installed at the bottom of the protective box, a cooling fin movably installed on the outer side of the positioning upright, a semiconductor combination board movably installed on the top of the cooling fin, a cover box fixedly installed on the outer side of the semiconductor combination board, exhaust fans fixedly installed at the four corners of the top surface of the cover box, and air outlets are provided on both sides of the cover box.

[0007] As a preferred technical solution of the utility model, an air duct is fixedly installed on the back of the protection box, and a sieve plate is fixedly installed on the surface of the air duct.

[0008] As a preferred technical solution of the utility model, a connecting plate is fixedly connected to the front side of the protection box, and a fixing frame is fixedly installed on the inner side of the connecting plate.

[0009] As a preferred technical solution of the utility model, a transparent cover is movably installed on the outer side of the fixed frame, and fixing screws are threadedly installed between the transparent cover and the fixed frame.

[0010] As a preferred technical solution of the utility model, a cross brace is fixedly installed on the inner side of the fixed frame, a driving motor is fixedly installed on the surface of the cross brace, and a fan is movably installed on the top of the driving motor.

[0011] As a preferred technical solution of the utility model, convection holes are provided on both sides of the protection box, and extension plates are fixedly installed on the bottom of both sides of the protection box, and fixing holes are provided on the surface of the extension plates.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0013] The heat dissipation factor is the same as the heat dissipation factor, which is why the heat dissipation factor is so important that it can be used in combination with other components in the heat dissipation module.

[0014] 2. The utility model facilitates the discharge of cooled air through the provision of air ducts and screen plates, facilitates the enhancement of the installation strength of the fixing frame through the provision of connecting plates, facilitates the installation of the driving motor and the fan through the provision of the fixing frame, prevents external pollutants from entering the fan through the provision of the transparent cover, facilitates the enhancement of the installation strength of the transparent cover through the provision of fixing screws, facilitates the enhancement of the installation strength of the driving motor through the provision of cross braces, and facilitates the installation of the overall radiator through the provision of extension plates and fixing holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a frontal perspective schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a three-dimensional back view of the overall structure of the utility model;

[0017] Figure 3This is a three-dimensional schematic diagram of the cutaway structure of the protection box of the utility model;

[0018] Figure 4 This is an enlarged three-dimensional schematic diagram of the cross-section of the fixed frame structure of the utility model;

[0019] Figure 5 It is an enlarged perspective schematic diagram of the cross-section of the cover box structure of the utility model.

[0020] In the figure: 1. Protection box; 2. Positioning pole; 3. Heat dissipation fins; 4. Semiconductor assembly board; 5. Cover box; 6. Exhaust fan; 7. Air outlet; 8. Air duct; 9. Screen plate; 10. Connecting plate; 11. Fixing frame; 12. Transparent cover; 13. Fixing screws; 14. Cross brace; 15. Drive motor; 16. Fan; 17. Convection hole; 18. Extension plate; 19. Fixing hole. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figures 1 to 5 As shown, the utility model provides a large host high-power radiator, including a protection box 1, a positioning pole 2 is fixedly installed at the bottom of the protection box 1, a heat dissipation fin 3 is movably installed on the outer side of the positioning pole 2, a semiconductor combination board 4 is movably installed on the top of the heat dissipation fin 3, a cover box 5 is fixedly installed on the outer side of the semiconductor combination board 4, an exhaust fan 6 is fixedly installed at the four corners of the top surface of the cover box 5, and an air outlet 7 is opened on both sides of the cover box 5; the heat dissipation fin 3 can increase the contact area of ​​the hot air when it flows, thereby consuming the energy of the hot air, thereby cooling it down, and the top of the heat dissipation fin 3 is installed There is a semiconductor combination board 4, which is composed of N-type semiconductors and P-type semiconductors combined in a certain way. When it is energized, a thermoelectric effect will be generated, that is, the semiconductor material on the cold side absorbs heat, thereby reducing the temperature of this side, and at the same time, the semiconductor material on the hot side releases heat, causing the temperature of this side to rise. When the driving motor 15 and the fan 16 guide the hot air generated by the large host into the heat dissipation fins 3, the temperature of the heat dissipation fin 3 side will rise. Under the influence of the thermoelectric effect, the semiconductor combination board 4 will transfer the heat on this side to the other side, thereby cooling the heat dissipation fins 3.

[0023] The back of the protection box 1 is fixedly mounted with an air duct 8 , and the surface of the air duct 8 is fixedly mounted with a sieve plate 9 .

[0024] The cooled air can be easily discharged through the air duct 8 and the sieve plate 9.

[0025] A connecting plate 10 is fixedly connected to the front of the protection box 1 , and a fixing frame 11 is fixedly installed on the inner side of the connecting plate 10 .

[0026] The connection plate 10 facilitates the installation strength of the fixing frame 11 , and the fixing frame 11 facilitates the user to install the driving motor 15 and the fan 16 .

[0027] A transparent cover 12 is movably mounted on the outer side of the fixing frame 11 , and fixing screws 13 are threadedly mounted between the transparent cover 12 and the fixing frame 11 .

[0028] The transparent cover 12 can prevent external pollutants from entering the fan 16 , and the fixing screws 13 can facilitate enhancing the installation strength of the transparent cover 12 .

[0029] A cross brace 14 is fixedly mounted on the inner side of the fixing frame 11 , a driving motor 15 is fixedly mounted on the surface of the cross brace 14 , and a fan 16 is movably mounted on the top of the driving motor 15 .

[0030] The cross brace 14 facilitates enhancing the installation strength of the drive motor 15 .

[0031] Convection holes 17 are provided on both sides of the protection box 1 , and extension plates 18 are fixedly installed on the bottom of both sides of the protection box 1 , and fixing holes 19 are provided on the surface of the extension plates 18 .

[0032] The extension plate 18 and the fixing holes 19 facilitate the installation of the integral heat sink.

[0033] The working principle and use process of the utility model: when the device is used, first install the device in a suitable position through the extension plate 18 and the fixing hole 19, so that its transparent cover 12 faces the main heat source of the main machine, and attracts hot air to the heat dissipation fins 3 by driving the motor 15 and the fan 16 to separate the hot air from the main machine. When the hot air passes through the heat dissipation fins 3, the energy is consumed by the multi-layer heat dissipation fins 3 to cool down, and is discharged from the air duct 8. However, the long-term use of the heat dissipation fins 3 will also cause the temperature to rise, thereby reducing the heat dissipation capacity of the heat dissipation fins 3 themselves. The device adds a semiconductor combination plate 4 on the top of the traditional heat dissipation fins 3, and the heat dissipation fins 3 are locally cooled through the principle of thermoelectric effect, thereby greatly extending the overall heating time of the heat dissipation fins 3 and enhancing the service life of the overall device.

Claims

1. A high-power radiator for a large host, comprising a protective box (1), characterized in that: A positioning pole (2) is fixedly mounted on the bottom of the protection box (1), a heat sink fin (3) is movably mounted on the outer side of the positioning pole (2), a semiconductor assembly board (4) is movably mounted on the top of the heat sink fin (3), a cover box (5) is fixedly mounted on the outer side of the semiconductor assembly board (4), exhaust fans (6) are fixedly mounted on the four corners of the top surface of the cover box (5), and air outlets (7) are provided on both sides of the cover box (5).

2. A high-power radiator for a large host according to claim 1, characterized in that: An air duct (8) is fixedly mounted on the back of the protection box (1), and a sieve plate (9) is fixedly mounted on the surface of the air duct (8).

3. A high-power radiator for a large host according to claim 1, characterized in that: A connecting plate (10) is fixedly connected to the front of the protection box (1), and a fixing frame (11) is fixedly installed on the inner side of the connecting plate (10).

4. A high-power radiator for a large host according to claim 3, characterized in that: A transparent cover (12) is movably mounted on the outer side of the fixed frame (11), and a fixing screw (13) is threadedly mounted between the transparent cover (12) and the fixed frame (11).

5. A high-power radiator for a large host according to claim 3, characterized in that: A cross brace (14) is fixedly mounted on the inner side of the fixed frame (11), a drive motor (15) is fixedly mounted on the surface of the cross brace (14), and a fan (16) is movably mounted on the top of the drive motor (15).

6. A high-power radiator for a large host according to claim 1, characterized in that: Convection holes (17) are provided on both sides of the protection box (1), extension plates (18) are fixedly mounted on the bottoms of both sides of the protection box (1), and fixing holes (19) are provided on the surfaces of the extension plates (18).

Citation Information

Patent Citations

  • Low-air-volume high-power radiator

    CN213659387U