Monocrystalline silicon wafer cleaning device

Abstract

The utility model relates to the technical field of cleaning devices, and discloses a monocrystalline silicon wafer cleaning device which comprises a mounting box, two first mounting plates are fixedly connected to the lower portion of the interior of the mounting box at equal intervals, first mounting holes are formed in one sides of the two first mounting plates, first rolling shafts are movably connected into the two first mounting holes in a sleeved mode, and the first rolling shafts are movably connected with second rolling shafts in a sleeved mode. A first conveying belt is wound on the outer surface of the circumference of the first rolling shaft, a second rolling shaft is wound on the inner side of the first conveying belt, the two ends of the second rolling shaft are movably sleeved with second mounting plates, and the lower portions of the two second mounting plates are fixedly connected with the interior of a mounting box; and an arc-shaped first guide plate is fixedly connected between the two second mounting plates, and one side of the first guide plate abuts against the surface of the first conveying belt. According to the monocrystalline silicon wafer cleaning device, the monocrystalline silicon wafer can be turned over and cleaned conveniently, the cleaning efficiency is improved, secondary cleaning is facilitated, and the cleaning effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning devices, in particular to a single crystal silicon wafer cleaning device. Background Art

[0002] In the chip manufacturing industry, silicon wafer cutting is a relatively basic processing, and various single crystal silicon fragments will inevitably appear in the cutting process. These fragments will affect the subsequent processing and bring additional errors to the remaining steps, which is not conducive to subsequent precision.

[0003] The existing cleaning device has certain drawbacks when in use. First, the existing cleaning device is not convenient for turning over the single crystal silicon wafer, which affects the cleaning efficiency. Second, the existing cleaning device is not convenient for secondary cleaning, which affects the cleaning effect. Therefore, a single crystal silicon wafer cleaning device is proposed. Utility Model Content

[0004] The main purpose of the utility model is to provide a single crystal silicon wafer cleaning device, which solves the problem that the existing cleaning device is inconvenient to turn over the single crystal silicon wafer, affecting the cleaning efficiency, and the existing cleaning device is inconvenient to perform secondary cleaning, affecting the cleaning effect.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A single crystal silicon wafer cleaning device comprises an installation box, wherein two first installation plates are equidistantly fixedly connected to the lower part of the interior of the installation box, a first installation hole is provided on one side of the two first installation plates, a first roller is movably sleeved in the two first installation holes, a first conveyor belt is wound around the circumferential outer surface of the first roller, a second roller is wound around the inner side of the first conveyor belt, a second installation plate is movably sleeved at both ends of the second roller, the lower parts of the two second installation plates are fixedly connected to the interior of the installation box, an arc-shaped first guide plate is fixedly connected between the two second installation plates, and one side of the first guide plate abuts against the surface of the first conveyor belt, an arc-shaped second guide plate is fixedly connected between the two second installation plates and fixedly connected to the outer side of the first guide plate, two third installation plates are equidistantly fixedly connected to the lower part of the interior of the installation box, a second installation hole is provided on one side of the two third installation plates, a third roller is movably sleeved in the two second installation holes, a second conveyor belt is wound around the circumferential outer surface of the third roller, and the second conveyor belt is arranged below the second guide plate.

[0007] Furthermore, a fourth roller is wrapped around the inner side of the second conveyor belt, and fourth mounting plates are movably sleeved on both ends of the fourth roller, and the lower parts of the two fourth mounting plates are fixedly connected to the inside of the mounting box, one end of the first roller is fixedly connected to the first motor, and a first fixing plate is fixedly connected to the lower part of the first motor, and the inner side of the first fixing plate is fixedly connected to the adjacent first mounting plate, one end of the fourth roller is fixedly connected to the second motor, and a second fixing plate is fixedly connected to the lower part of the second motor, and the inner side of the second fixing plate is fixedly connected to the adjacent fourth mounting plate.

[0008] Furthermore, a water tank is fixedly connected to the top of the installation box, a first connecting hole is opened on the top of the installation box, a first water pipe is fixedly connected to the bottom of the water tank, the first water pipe passes through the first connecting hole, a first nozzle is fixedly connected to the bottom of the first water pipe, and the first nozzle is arranged directly above the first conveyor belt, a second connecting hole is opened on the top of the installation box, a second water pipe is fixedly connected to the bottom of the water tank, the second water pipe passes through the second connecting hole, a second nozzle is fixedly connected to the bottom of the second water pipe, and the second nozzle is arranged directly above the second conveyor belt.

[0009] Furthermore, a collecting box is abutted on one side of the second conveyor belt, and fifth mounting plates are fixedly connected on both sides of the collecting box, and the lower parts of the two fifth mounting plates are fixedly connected to the interior of the mounting box, third mounting holes are provided on the outer sides of the two fifth mounting plates, and first cleaning brush rollers are connected through the two third mounting holes, fourth mounting holes are provided on the outer sides of the two fifth mounting plates below the third mounting holes, and second cleaning brush rollers are connected through the two fourth mounting holes, and a cleaning groove is provided in the middle of the collecting box, the first cleaning brush roller is arranged above the cleaning groove, and the second cleaning brush roller is arranged below the cleaning groove.

[0010] Furthermore, one end of the first cleaning brush roller is fixedly connected to a first gear, the outer side of the first gear is fixedly connected to a third motor, the upper part of the third motor is fixedly connected to a third fixing plate, one side of the third fixing plate is fixedly connected to an adjacent fifth mounting plate, the lower part of the first gear is toothed with a second gear, and the inner side of the second gear is fixedly connected to a second cleaning brush roller.

[0011] Furthermore, four legs are equidistantly fixedly connected to the bottom of the installation box, a discharge pipe is fixedly connected to the bottom of the installation box, and an operation panel is fixedly connected to one side of the installation box.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. The utility model facilitates turning over and cleaning the monocrystalline silicon wafer by arranging the first guide plate and the second guide plate, thereby improving the cleaning efficiency. The monocrystalline silicon wafer is placed on the first conveyor belt, and the first motor is started. The first motor drives the first conveyor belt to move on the first roller and the second roller through the first roller, and the first conveyor belt drives the monocrystalline silicon wafer to move between the first guide plate and the second guide plate. The monocrystalline silicon wafer is turned over by being guided by the first guide plate and the second guide plate. At the same time, the monocrystalline silicon wafer is sprayed by the first nozzle on the first conveyor belt for cleaning, and the turned monocrystalline silicon wafer falls on the surface of the second conveyor belt due to gravity. The second motor is started, and the second motor drives the fourth roller to rotate. The fourth roller drives the second conveyor belt to move on the surfaces of the third roller and the fourth roller. The second conveyor belt drives the monocrystalline silicon wafer to move, and the monocrystalline silicon wafer is sprayed by the second nozzle on the second conveyor belt for cleaning. Such an arrangement facilitates turning over and cleaning the monocrystalline silicon wafer, thereby improving the cleaning efficiency.

[0014] 2. The utility model facilitates secondary cleaning and improves the cleaning effect by arranging the first cleaning brush roller and the second cleaning brush roller. The single crystal silicon wafer is driven by the second conveyor belt and falls on the collection box. The third motor is started, and the third motor drives the first gear to rotate. The first gear drives the first cleaning brush roller to rotate. At the same time, the first gear drives the second cleaning brush roller to rotate through the second gear. The first cleaning brush roller and the second cleaning brush roller clean the single crystal silicon wafer passing through the cleaning groove on the collection box during the rotation. Such an arrangement facilitates secondary cleaning and improves the cleaning effect.

[0015] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a single crystal silicon wafer cleaning device from a first angle according to the utility model.

[0017] Figure 2 This is a schematic diagram of the overall structure of a single crystal silicon wafer cleaning device from a second angle according to the utility model.

[0018] Figure 3 This is a schematic diagram of the overall structure of a single crystal silicon wafer cleaning device according to the utility model from a third angle.

[0019] Figure 4 The utility model is a partial structural schematic diagram of an installation box of a single crystal silicon wafer cleaning device.

[0020] Figure 5 It is a partial structural schematic diagram of a first conveyor belt of a single crystal silicon wafer cleaning device of the utility model.

[0021] Figure 6The utility model is a partial structural schematic diagram of a collection box of a single crystal silicon wafer cleaning device.

[0022] In the figure: 1. support leg; 2. installation box; 3. operation panel; 4. water tank; 5. discharge pipe; 6. first nozzle; 7. first motor; 8. first roller; 9. first conveyor belt; 10. second roller; 11. second nozzle; 12. second motor; 13. third roller; 14. second conveyor belt; 15. fourth roller; 16. third motor; 17. first gear; 18. second gear; 19. first cleaning brush roller; 20. second cleaning brush roller; 21. collection box; 22. first guide plate; 23. second guide plate. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0024] like Figure 1-Figure 5As shown, a single crystal silicon wafer cleaning device comprises a mounting box 2, two first mounting plates are fixedly connected at equal distances at the lower part of the mounting box 2, a first mounting hole is opened on one side of the two first mounting plates, a first roller 8 is movably sleeved in the two first mounting holes, a first conveyor belt 9 is wound around the outer circumference of the first roller 8, a second roller 10 is wound around the inner side of the first conveyor belt 9, second mounting plates are movably sleeved at both ends of the second roller 10, the lower parts of the two second mounting plates are fixedly connected to the inside of the mounting box 2, and a The first guide plate 22 is arc-shaped, and one side of the first guide plate 22 abuts against the surface of the first conveyor belt 9. The two second mounting plates are fixedly connected to the outer side of the first guide plate 22 with an arc-shaped second guide plate 23 fixedly connected. Two third mounting plates are equidistantly fixedly connected to the lower part of the interior of the mounting box 2. Second mounting holes are provided on one side of the two third mounting plates. Third rollers 13 are movably sleeved in the two second mounting holes. The second conveyor belt 14 is wound on the circumferential outer surface of the third roller 13, and the second conveyor belt 14 is arranged below the second guide plate 23. Through such an arrangement, the single crystal silicon wafer is placed on the first conveyor belt 9, and the first motor 7 is started. The first motor 7 drives the first conveyor belt 9 to move on the first roller 8 and the second roller 10 through the first roller 8. The first conveyor belt 9 drives the single crystal silicon wafer to move between the first guide plate 22 and the second guide plate 23. The single crystal silicon wafer is guided by the first guide plate 22 and the second guide plate 23 to achieve flipping. At the same time, the single crystal silicon wafer is sprayed by the first nozzle 6 on the first conveyor belt 9 for cleaning. The flipped single crystal silicon wafer falls on the surface of the second conveyor belt 14 due to gravity. The second motor 12 is started, and the second motor 12 drives the fourth roller 15 to rotate, and the fourth roller 15 drives the second conveyor belt 14 to move on the surface of the third roller 13 and the fourth roller 15, and the second conveyor belt 14 drives the single crystal silicon wafer to move, and the single crystal silicon wafer is sprayed by the second nozzle 11 on the second conveyor belt 14 for cleaning. Through such an arrangement, it is convenient to turn the single crystal silicon wafer over for cleaning, thereby improving the cleaning efficiency. In the actual production process, the spacing between the first guide plate 22 and the second guide plate 23 can be set according to the size of the single crystal silicon wafer that actually needs to be turned over.

[0025] like Figure 1-Figure 5As shown, a fourth roller 15 is wound around the inner side of the second conveyor belt 14, and fourth mounting plates are movably sleeved on both ends of the fourth roller 15, and the lower parts of the two fourth mounting plates are fixedly connected to the interior of the mounting box 2, one end of the first roller 8 is fixedly connected to the first motor 7, and the lower part of the first motor 7 is fixedly connected to the first fixed plate, and the inner side of the first fixed plate is fixedly connected to the adjacent first mounting plate, one end of the fourth roller 15 is fixedly connected to the second motor 12, and the lower part of the second motor 12 is fixedly connected to the second fixed plate, and the inner side of the second fixed plate is fixedly connected to the adjacent fourth mounting plate. Through such an arrangement, the first motor 7 can drive the first roller 8 to rotate, and the second motor 12 can drive the fourth roller 15 to rotate.

[0026] like Figure 1-Figure 4 As shown, a water tank 4 is fixedly connected to the top of the installation box 2, a first connecting hole is opened on the top of the installation box 2, a first water pipe is fixedly connected to the bottom of the water tank 4, the first water pipe passes through the first connecting hole, a first nozzle 6 is fixedly connected to the bottom of the first water pipe, and the first nozzle 6 is arranged directly above the first conveyor belt 9, a second connecting hole is opened on the top of the installation box 2, a second water pipe is fixedly connected to the bottom of the water tank 4, the second water pipe passes through the second connecting hole, a second nozzle 11 is fixedly connected to the bottom of the second water pipe, and the second nozzle 11 is arranged directly above the second conveyor belt 14. Through such an arrangement, the water in the water tank 4 is sprayed out from the first nozzle 6 through the first water pipe, and the water in the water tank 4 is sprayed out from the second nozzle 11 through the second water pipe.

[0027] like Figure 1-Figure 6 As shown, one side of the second conveyor belt 14 is abutted against a collecting box 21, and both sides of the collecting box 21 are fixedly connected with fifth mounting plates, and the lower parts of the two fifth mounting plates are fixedly connected to the interior of the mounting box 2, and the outer sides of the two fifth mounting plates are provided with third mounting holes, and the first cleaning brush roller 19 is connected through the two third mounting holes, and the outer sides of the two fifth mounting plates are provided with fourth mounting holes below the third mounting holes, and the second cleaning brush roller 20 is connected through the two fourth mounting holes, and a cleaning groove is provided in the middle of the collecting box 21, and the first cleaning brush roller 19 is arranged above the cleaning groove, and the second cleaning brush roller 20 is arranged below the cleaning groove. Through such an arrangement, the single crystal silicon wafers on the collecting box 21 slide into the bottom of the collecting box 21 through the cleaning groove under the action of gravity.

[0028] like Figure 1-Figure 6As shown, one end of the first cleaning brush roller 19 is fixedly connected to the first gear 17, the outer side of the first gear 17 is fixedly connected to the third motor 16, the upper part of the third motor 16 is fixedly connected to the third fixed plate, one side of the third fixed plate is fixedly connected to the adjacent fifth mounting plate, the lower part of the first gear 17 is geared with the second gear 18, the inner side of the second gear 18 is fixedly connected to the second cleaning brush roller 20, through such an arrangement, the single crystal silicon wafer falls on the collecting box 21 after being driven by the second conveyor belt 14, the third motor 16 is started, the third motor 16 drives the first gear 17 to rotate, the first gear 17 drives the first cleaning brush roller 19 to rotate, and at the same time, the first gear 17 drives the second cleaning brush roller 20 to rotate through the second gear 18, the first cleaning brush roller 19 and the second cleaning brush roller 20 clean the single crystal silicon wafer passing through the cleaning groove on the collecting box 21 during the rotation, through such an arrangement, secondary cleaning is convenient and the cleaning effect is improved.

[0029] like Figure 1-Figure 3 As shown, four legs 1 are fixedly connected at equal intervals at the bottom of the installation box 2, a discharge pipe 5 is fixedly connected at the bottom of the installation box 2, and an operation panel 3 is fixedly connected to one side of the installation box 2. Through such an arrangement, waste water generated by cleaning single crystal silicon wafers in the installation box 2 is discharged through the discharge pipe 5, and the electrical appliances in the installation box 2 can be controlled through the operation panel 3.

[0030] It should be noted that, when in use, the support leg 1 is placed on a horizontal plane, and cleaning water is added to the water tank 4. The water in the water tank 4 is sprayed out from the first nozzle 6 through the first water pipe, and the water in the water tank 4 is sprayed out from the second nozzle 11 through the second water pipe. The monocrystalline silicon wafer is placed on the first conveyor belt 9, and the first motor 7 is started. The first motor 7 drives the first conveyor belt 9 to move on the first roller 8 and the second roller 10 through the first roller 8. The first conveyor belt 9 drives the monocrystalline silicon wafer to move between the first guide plate 22 and the second guide plate 23. The monocrystalline silicon wafer passes through The first guide plate 22 and the second guide plate 23 guide the turning over, and at the same time, the single crystal silicon wafer is sprayed by the first nozzle 6 on the first conveyor belt 9 for cleaning. The turned single crystal silicon wafer falls on the surface of the second conveyor belt 14 due to gravity, and the second motor 12 is started. The second motor 12 drives the fourth roller 15 to rotate, and the fourth roller 15 drives the second conveyor belt 14 to move on the surface of the third roller 13 and the fourth roller 15. The second conveyor belt 14 drives the single crystal silicon wafer to move, and the single crystal silicon wafer is sprayed by the second nozzle 11 on the second conveyor belt 14 for cleaning;

[0031] The single crystal silicon wafers are driven by the second conveyor belt 14 and fall onto the collecting box 21, and the third motor 16 is started. The third motor 16 drives the first gear 17 to rotate, and the first gear 17 drives the first cleaning brush roller 19 to rotate. At the same time, the first gear 17 drives the second cleaning brush roller 20 to rotate through the second gear 18. The first cleaning brush roller 19 and the second cleaning brush roller 20 clean the single crystal silicon wafers passing through the cleaning groove on the collecting box 21 during rotation. The cleaned single crystal silicon wafers slide to the bottom of the collecting box 21 due to gravity, and the waste water generated during the cleaning process is discharged from the discharge pipe 5.

[0032] The utility model provides a single crystal silicon wafer cleaning device which solves the problem that the existing cleaning device is inconvenient to turn over the single crystal silicon wafer, which affects the cleaning efficiency, and the existing cleaning device is inconvenient to perform secondary cleaning, which affects the cleaning effect. The utility model is more practical.

[0033] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A single crystal silicon wafer cleaning device, characterized in that: The invention comprises an installation box (2), wherein two first installation plates are fixedly connected at equal distances to the lower part of the interior of the installation box (2), a first installation hole is opened on one side of the two first installation plates, a first roller (8) is movably sleeved in the two first installation holes, a first conveyor belt (9) is wound around the circumferential outer surface of the first roller (8), a second roller (10) is wound around the inner side of the first conveyor belt (9), a second installation plate is movably sleeved at both ends of the second roller (10), the lower parts of the two second installation plates are fixedly connected to the interior of the installation box (2), and an arc-shaped first guide plate ( 22), and one side of the first guide plate (22) abuts against the surface of the first conveyor belt (9), the two second mounting plates are fixedly connected between the first guide plate (22), and an arc-shaped second guide plate (23) is fixedly connected to the outer side of the first guide plate (22), and two third mounting plates are equidistantly fixedly connected to the lower part of the interior of the mounting box (2), one side of the two third mounting plates is provided with a second mounting hole, and a third roller (13) is movably sleeved in the two second mounting holes, and a second conveyor belt (14) is wound around the circumferential outer surface of the third roller (13), and the second conveyor belt (14) is arranged below the second guide plate (23).

2. The single crystal silicon wafer cleaning device according to claim 1, characterized in that: A fourth roller (15) is wound around the inner side of the second conveyor belt (14), and fourth mounting plates are movably sleeved at both ends of the fourth roller (15), and the lower sides of the two fourth mounting plates are fixedly connected to the inside of the mounting box (2), one end of the first roller (8) is fixedly connected to the first motor (7), and the lower side of the first motor (7) is fixedly connected to the first fixed plate, and the inner side of the first fixed plate is fixedly connected to the adjacent first mounting plate, one end of the fourth roller (15) is fixedly connected to the second motor (12), and the lower side of the second motor (12) is fixedly connected to the second fixed plate, and the inner side of the second fixed plate is fixedly connected to the adjacent fourth mounting plate.

3. The single crystal silicon wafer cleaning device according to claim 2, characterized in that: A water tank (4) is fixedly connected to the top of the installation box (2), a first connection hole is provided at the top of the installation box (2), a first water pipe is fixedly connected to the bottom of the water tank (4), the first water pipe passes through the first connection hole, a first nozzle (6) is fixedly connected to the bottom of the first water pipe, and the first nozzle (6) is arranged directly above the first conveyor belt (9), a second connection hole is provided at the top of the installation box (2), a second water pipe is fixedly connected to the bottom of the water tank (4), the second water pipe passes through the second connection hole, a second nozzle (11) is fixedly connected to the bottom of the second water pipe, and the second nozzle (11) is arranged directly above the second conveyor belt (14).

4. The single crystal silicon wafer cleaning device according to claim 3, characterized in that: One side of the second conveyor belt (14) is in contact with a collecting box (21), and both sides of the collecting box (21) are fixedly connected with fifth mounting plates, and the lower parts of the two fifth mounting plates are fixedly connected to the inside of the mounting box (2), and the outer sides of the two fifth mounting plates are provided with third mounting holes, and the first cleaning brush rollers (19) are connected through the two third mounting holes, and the outer sides of the two fifth mounting plates are provided with fourth mounting holes below the third mounting holes, and the second cleaning brush rollers (20) are connected through the two fourth mounting holes, and a cleaning groove is provided in the middle of the collecting box (21), and the first cleaning brush roller (19) is arranged above the cleaning groove, and the second cleaning brush roller (20) is arranged below the cleaning groove.

5. The single crystal silicon wafer cleaning device according to claim 4, characterized in that: One end of the first cleaning brush roller (19) is fixedly connected to a first gear (17), the outer side of the first gear (17) is fixedly connected to a third motor (16), the upper side of the third motor (16) is fixedly connected to a third fixing plate, one side of the third fixing plate is fixedly connected to an adjacent fifth mounting plate, the lower side of the first gear (17) is gear-connected to a second gear (18), and the inner side of the second gear (18) is fixedly connected to a second cleaning brush roller (20).

6. The single crystal silicon wafer cleaning device according to claim 1, characterized in that: Four legs (1) are fixedly connected at equal intervals below the installation box (2), a discharge pipe (5) is fixedly connected below the installation box (2), and an operation panel (3) is fixedly connected to one side of the installation box (2).

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