High-power COB light bar

Abstract

A high-power COB light bar comprises a substrate and a plurality of LED chips, the substrate is a ceramic substrate, the LED chips are linearly arranged and bonded to the glaze surface of the ceramic substrate respectively, the LED chips are connected in series through gold threads to form at least one LED chip queue, one end of the LED chip queue is connected with a positive electrode wire, the other end of the LED chip queue is connected with a negative electrode wire, and the other end of the LED chip queue is connected with a negative electrode wire. The positive wire is connected with the positive wire connector, the negative wire is connected with the negative wire connector, and the LED chip queue is embedded on the ceramic substrate by adopting fluorescent glue. The COB light bar solves the problem that heat dissipation is difficult, the driving power per unit area of the COB light bar is larger than 12000 W / m < 2 >, and the COB light bar can be used for a high-power illumination light source of 40 W or above.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting equipment, in particular to a high-power COB light strip. Background Art

[0002] COB light strips are made by integrating several LED chips together, concentrating light onto a smaller area for more uniform illumination and achieving linear, high-power lighting. They are primarily used for plant lighting and high-density, high-power light sources. However, the packaging structure of COB light strips is more complex than that of LED light strips, making heat dissipation more difficult.

[0003] At present, COB light strips mainly use heat dissipation substrates made of MCPCB, CEM, and FR-4 materials. Among them, FR-4 is a glass fiber reinforced epoxy resin substrate, and CEM is an organic glass fiber reinforcement material composed of glass fiber and epoxy resin. Light strips using CEM and FR-4 substrates need to be coated with a reflective layer, and the thermal conductivity of the materials is low, resulting in a low driving power per unit area; MCPCB mostly uses aluminum substrates, which usually need to be coated with an insulating layer. The insulating layer uses organic glue, but the heat dissipation performance of organic glue is poor, resulting in a thermal conductivity of the light strip of less than 3W / K*m; therefore, light strips using MCPCB, CEM, and FR-4 substrates cannot achieve high-power driving with small cross-sections, and the driving power per unit area of ​​the light strip is less than 4000W / m 2 If high-power driving is used, the chip may burn out due to insufficient heat dissipation of the light source. How to solve the heat dissipation of high-power linear light strips has long been a difficult problem to solve. Summary of the Invention

[0004] The purpose of this utility model is to provide a high-power COB light bar to address the shortcomings of the existing technology. The COB light bar solves the problem of difficult heat dissipation, and the driving power per unit area of ​​the light bar is greater than 12000 W / m 2 , can be used for high-power lighting sources above 40W.

[0005] The purpose of this utility model is achieved in this way:

[0006] A high-power COB light strip includes a substrate and several LED chips. The substrate is a ceramic substrate. The LED chips are linearly arranged and respectively bonded to the glaze surface of the ceramic substrate. The LED chips are connected in series via gold wires to form at least one LED chip queue. One end of the LED chip queue is connected to a positive wire and the other end is connected to a negative wire. The positive wire is connected to a positive connector, and the negative wire is connected to a negative connector. The LED chip queue is embedded in the ceramic substrate using fluorescent glue.

[0007] The LED chip can be a blue light chip.

[0008] The cross section of the fluorescent glue is semicircular.

[0009] The fluorescent glue is a solidified silica gel mixed with fluorescent powder.

[0010] The LED chip is bonded to the ceramic substrate by using a die-bonding adhesive.

[0011] The positive electrode wire and the negative electrode wire are respectively fixed on the ceramic substrate by sintering with silver paste.

[0012] A layer of glass glaze is sintered on the surface of the silver paste.

[0013] The positive electrode connector and the negative electrode connector are respectively bonded to the ceramic substrate.

[0014] The power of COB light strip is greater than 40W.

[0015] The beneficial effects of the utility model are:

[0016] 1. The different colors of light emitted by the LED chip of the present invention will excite the phosphor in the fluorescent glue to produce a specific spectrum; the cross-section of the fluorescent glue is a convex elliptical shape, which can make the angle of light emission larger and the light evenly dispersed; and the fluorescent glue is used to protect the LED chip and gold wire.

[0017] 2. The COB light strip of this utility model adopts a ceramic substrate. The glaze of the ceramic substrate is milky white, which can directly reflect light with its high reflectivity without the need for a reflective layer. The thermal conductivity of the ceramic is greater than 20 W / K*m, and the heat dissipation performance is good, so that the driving power per unit area of ​​the COB light strip is greater than 12000 W / m 2 , the power of COB light strip is greater than 40 W, and it is mainly used for plant lighting and high-density and high-power light sources. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0019] Figure 2 for Figure 1 Cross-sectional view at AA in the middle;

[0020] Figure 3 for Figure 1 Cross-sectional view at the middle BB.

[0021] Explanation of the reference numerals: ceramic substrate 1, glaze 1a, LED chip 2, LED chip array 2a, fluorescent glue 3, die-bonding glue 4, positive electrode connector 5a, negative electrode connector 5b, gold wire 6, negative electrode wire 7a, positive electrode wire 7b. DETAILED DESCRIPTION

[0022] The following is a further description with reference to the accompanying drawings and specific implementations.

[0023] See also Figures 1 to 3 An embodiment of a high-power COB light strip includes a ceramic substrate 1 and several blue light chips. The size of the ceramic substrate 1 is 15*280mm.

[0024] Several blue light chips are arranged linearly and bonded to the glaze surface 1a of the ceramic substrate 1 via bonding glue 4. The several blue light chips are connected in series via gold wire 6 to form eight groups of LED chip queues 2a. One end of the LED chip queue 2a is connected to the positive wire 7b, and the other end is connected to the negative wire 7a. The positive wire 7b is connected to the positive connector 5a, and the negative wire 7a is connected to the negative connector 5b. The positive connector 5a and the negative connector 5b are respectively bonded to the ceramic substrate. The positive wire 7b and the negative wire 7a are respectively fixed to the ceramic substrate 1 by sintering silver paste. A layer of glass glaze is sintered on the surface of the silver paste to protect the circuit from contamination.

[0025] The LED chip queue 2a is embedded in the ceramic substrate 1 with fluorescent glue 3. The fluorescent glue 3 is a cured silicone mixed with fluorescent powder, which is used to excite the fluorescent powder with the blue light emitted by the blue light chip to produce a specific spectrum; the cross-section of the fluorescent glue 3 is a convex elliptical shape, which is used to emit blue light at a larger angle and evenly scatter light, and the fluorescent glue 3 is used to protect the blue light chip and the gold wire 6.

[0026] The 15*280mm COB light strip can achieve a power drive of 40~100W.

[0027] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications made to the present invention by those skilled in the art without departing from the spirit of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A high-power COB light strip, comprising a substrate and a plurality of LED chips (2), characterized in that: The substrate is a ceramic substrate (1); a plurality of LED chips (2) are linearly arranged and respectively bonded to the glaze surface (1a) of the ceramic substrate (1); the plurality of LED chips (2) are connected in series via a gold wire (6) to form at least one group of LED chip queues (2a); one end of the LED chip queue (2a) is connected to a negative electrode wire (7a); the other end is connected to a positive electrode wire (7b); the positive electrode wire (7b) is connected to a positive electrode connector (5a); the negative electrode wire (7a) is connected to a negative electrode connector (5b); and the LED chip queue (2a) is embedded in the ceramic substrate (1) using fluorescent glue (3).

2. The high-power COB light bar according to claim 1, characterized in that: The LED chip (2) may be a blue light chip.

3. The high-power COB light bar according to claim 1, characterized in that: The cross-section of the fluorescent glue (3) is convex elliptical.

4. The high-power COB light strip according to claim 1, characterized in that: The fluorescent glue (3) is a solidified silica gel mixed with fluorescent powder.

5. The high-power COB light strip according to claim 1, characterized in that: The LED chip (2) is bonded to the ceramic substrate (1) via a crystal bonding adhesive (4).

6. The high-power COB light strip according to claim 1, characterized in that: The positive electrode wire (7b) and the negative electrode wire (7a) are respectively fixed on the ceramic substrate (1) by sintering with silver paste.

7. The high-power COB light strip according to claim 6, characterized in that: A layer of glass glaze is sintered on the surface of the silver paste.

8. The high-power COB light bar according to claim 1, characterized in that: The positive electrode connector (5a) and the negative electrode connector (5b) are respectively bonded to the ceramic substrate (1).

9. The high-power COB light bar according to claim 1, characterized in that: The power of COB light strip is greater than 40W.

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