Butterfly laser backlight aluminum nitride thermal layer improved structure

By designing the gold-plated tin zone and L-type lead gold layer of pre-soldered solder on the backlight aluminum nitride thermal layer of the butterfly laser, the problem of chip fixation operation and high short circuit risk is solved, and efficient and reliable solder fixation is achieved, reducing the failure rate.

CN222563224UActive Publication Date: 2025-03-04XIAMEN BELLE INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202420508545.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-15
Publication Date
2025-03-04
Estimated Expiration
2034-03-15

AI Technical Summary

Technical Problem

The backlit aluminum nitride thermal layer of the existing butterfly laser has problems such as operating troubles, low efficiency, unstable fixation, high short circuit risk and high failure rate in terms of chip fixation.

Method used

An improved butterfly laser backlit aluminum nitride thermal layer structure including a gold-plated tin region of pre-set solder and an L-type lead gold layer is designed to fix the chip by soldering, and a soldered gold-plated layer is added to the bottom for easy soldering and fixing.

Benefits of technology

It realizes direct welding and fixing of chips and products, is simple to operate and high efficiency, is firm and reliable, reduces the risk of short circuit, improves safety factor and use reliability, and reduces the failure rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an improved structure of a butterfly laser backlight aluminum nitride thermal layer, which comprises a body with a cuboid structure, one side of the front end face of the body is provided with a gold and tin plating area with preset welding flux, and the gold and tin plating area fixes a chip in a welding mode. A side lead gold layer is arranged at the right bottom corner of the upper end face of the body, an L-shaped other side lead gold layer is arranged on the left side and extends to the upper right corner, and a welding gold plating layer facilitating welding and fixing is arranged on the bottom end face of the body. The front end surface is provided with the gold-plated tin area and the bottom surface is additionally provided with the gold-plated layer, the chip and the product are directly welded and fixed, the operation is simple, the efficiency is high, time and labor are saved, the fixation is firm and reliable, the lead gold layer adopts an L-shaped design, pin routing does not need to cross the gold layer, the short circuit risk is small, the safety coefficient is high, the failure rate is low, and the use requirements are effectively met.
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Description

Technical Field

[0001] The utility model belongs to the field of communication, and particularly relates to an improved structure of a butterfly laser backlight aluminum nitride thermal layer with high chip welding efficiency, low short circuit risk, low failure rate, simple operation and high efficiency. Background Art

[0002] Three views of the aluminum nitride thermal layer of the butterfly laser backlight (such as Figure 5 As shown), from top to bottom they are upward view, main view and downward view. From the main view, no gold-plated tin area is set, and the chip can only be fixed by glue. The operation is cumbersome and inefficient, and the fixation is not firm enough. From the downward view, the wiring area is on the left and on the right. When the pins are defined on the same side, they need to cross the gold layer, which can easily cause a short circuit, making it unsafe to use and having a high failure rate. From the upward view, no gold-plated area is preset, and the product can only be fixed by glue. The fixation is not firm, and it is time-consuming and labor-intensive, and cannot effectively meet the use requirements.

[0003] The technical problem to be solved by the utility model is to provide an improved structure of a butterfly laser backlight aluminum nitride thermal layer, which can directly weld and fix chips and products, has simple operation and high efficiency, saves time and effort, is firmly and reliably fixed, does not require pins to cross the gold layer, has a low risk of short circuit, has a high safety factor, and has a low failure rate, and effectively meets the requirements of use. Utility Model Content

[0004] In order to solve the problems of the above-mentioned prior art that the front end surface is not provided with a gold-plated tin area, the chip can only be fixed by glue, the operation is cumbersome and inefficient, the fixation is not firm enough, the wiring area is on the left and the right, when the pins are defined on the same side, they need to cross the gold layer, which is easy to cause short circuits, unsafe to use, high failure rate, no preset gold-plated area on the bottom surface, the product can only be fixed by glue, the fixation is not firm, it is time-consuming and labor-intensive, and it cannot effectively meet the use requirements, the utility model adopts the following technical solutions:

[0005] The utility model provides an improved structure of aluminum nitride thermal layer for backlight of butterfly laser, comprising a main body of rectangular structure, a gold-plated tin area with pre-set solder is arranged on one side of the front end face of the main body, the gold-plated tin area fixes the chip by welding, a lead gold layer on one side is arranged at the bottom corner on the right side of the upper end face of the main body, an L-shaped lead gold layer on the other side is arranged on the left side and extends to the upper right corner, and a welding gold-plated layer is arranged on the bottom end face of the main body for facilitating welding and fixing.

[0006] The beneficial effects of the utility model are: a gold-plated tin area is set on the front end surface and a gold-plated layer is added to the bottom surface, the chip and the product are directly welded and fixed, the operation is simple and efficient, time-saving and labor-saving, the fixation is firm and reliable, the lead gold layer adopts an L-shaped design, the pin wiring does not need to cross the gold layer, the short circuit risk is small, the safety factor is high, the failure rate is low, and the use requirements are effectively met. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 The figure is a three-dimensional structural schematic diagram of an embodiment of the utility model.

[0008] Figure 2 It is a schematic diagram of the main structure of the utility model.

[0009] Figure 3 It is a schematic diagram of the top structure of the utility model.

[0010] Figure 4 It is a schematic diagram of the structure of the utility model when viewed from above.

[0011] Figure 5 This is a schematic diagram of the structure of a traditional product. DETAILED DESCRIPTION

[0012] The preferred embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0013] See also Figure 1 , an improved structure of aluminum nitride thermal layer for butterfly laser backlight, comprising a main body 1 of rectangular structure, a front end surface of the main body 1 is provided with a gold-plated tin area 11 (such as Figure 2 As shown), the gold-plated tin area 11 fixes the chip by welding, and the welding fixation operation is simple, efficient, and firm. The upper end face of the main body 1 is provided with a lead gold layer 12 on one side at the bottom corner on the right side, and an L-shaped lead gold layer 13 on the other side is provided on the left side and extends to the upper right corner (as shown Figure 3 As shown), an L-shaped lead gold layer structure is adopted. No matter the pins are defined as the same side or the opposite side, there is no situation where the gold layer on the other side is crossed, the short circuit risk is small, and the safety factor is high. The bottom end surface of the body 1 is provided with a welding gold-plated layer 14 (as shown) which is convenient for welding and fixing Figure 4 The product can be fixed directly by welding without the use of glue, which is simple and efficient.

[0014] The beneficial effects of the utility model are: a gold-plated tin area is set on the front end surface and a gold-plated layer is added to the bottom surface, the chip and the product are directly welded and fixed, the operation is simple and efficient, time-saving and labor-saving, the fixation is firm and reliable, the lead gold layer adopts an L-shaped design, the pin wiring does not need to cross the gold layer, the short circuit risk is small, the safety factor is high, the failure rate is low, and the use requirements are effectively met.

[0015] The above embodiments and drawings do not limit the product form and style of the present utility model. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present utility model.

Claims

1. An improved structure of aluminum nitride thermal layer for butterfly laser backlight, characterized in that: The invention comprises a body (1) of a rectangular parallelepiped structure, wherein a gold-plated tin area (11) with a pre-set solder is provided on one side of the front end surface of the body (1), and the gold-plated tin area (11) fixes a chip by welding. A lead gold layer (12) is provided on one side of the right bottom corner of the upper end surface of the body (1), and an L-shaped lead gold layer (13) is provided on the left side and extending to the upper right corner. A welding gold-plated layer (14) is provided on the bottom end surface of the body (1) to facilitate welding and fixing.