Printed circuit backlight plate

Abstract

The utility model discloses a printed circuit backlight plate which is characterized by comprising a lower layer substrate, a lower layer circuit, lower layer glue, an upper layer circuit, an upper layer substrate and an upper layer shading plate which are sequentially arranged from bottom to top, the blind hole is formed by punching and sequentially penetrates through the upper-layer shading layer, the upper-layer substrate, the upper-layer circuit and the lower-layer glue from top to bottom; and the LED lamps are embedded in the blind holes and are connected with the lower-layer circuit and the upper-layer circuit at the same time. According to the utility model, a process of etching a circuit on a PCB (Printed Circuit Board) and inlaying a light-emitting diode in an existing backlight plate is changed into a process of printing the circuit on two layers of PET (Polyethylene Terephthalate) or PI (Polyimide) base materials, shading, combining glue and then punching and installing a lamp, so that the production process level of the backlight plate with a new process structure is relatively simple compared with the etching process of the PCB; therefore, the technological process of the backlight plate is simplified, the manufacturing cost is reduced, and the thickness of the backlight plate is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of buttons, in particular to a printed circuit backlight plate. Background Art

[0002] Used for home appliance buttons, computer buttons and devices with various button functions, the backlight panel can be designed so that the key letters can be clearly seen even without turning on the lights at night. At the same time, it greatly improves the visual effect of the device and makes the button device more artistic.

[0003] Usually, this type of keyboard is made by etching circuits on a PCB board and embedding light-emitting diodes into the keyboard slot. When the keyboard is typed, the computer receives the command to control the light signal connected to the light-emitting diodes to emit light. However, this type of backlight panel has a complex process, a high production cost, and is relatively thicker. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a printed circuit backlight plate, characterized in that it includes a lower substrate, a lower circuit, a lower glue, an upper circuit, an upper substrate and an upper light shielding layer arranged in sequence from bottom to top;

[0005] A blind hole, which is punched and passes through the upper light shielding layer, the upper substrate, the upper circuit layer and the lower glue layer from top to bottom in sequence;

[0006] An LED lamp is embedded in the blind hole and simultaneously connects the lower layer circuit and the upper layer circuit.

[0007] Wherein, the blind hole is also filled with curing glue for fixing the LED lamp.

[0008] Wherein, the material of the lower substrate and the upper substrate is PET or PI.

[0009] Through the above technical scheme, the utility model changes the existing backlight panel process of etching circuits and embedding light-emitting diodes on a PCB board into a process of printing an upper circuit on an upper PET or PI substrate and printing a light shield on the back, printing a lower circuit on a lower PET or PI substrate, then printing glue to combine, and finally punching out a blind hole in which an LED lamp can be embedded and then installing the lamp. The production process level of the backlight panel with the new process structure is relatively simple compared to the etching process of the PCB board, thereby simplifying the process flow of the backlight panel, reducing the production cost, and reducing the thickness of the backlight panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for describing the embodiments.

[0011] Figure 1This is a schematic diagram of the exploded structure of the backlight panel disclosed in the embodiment of the utility model;

[0012] Figure 2 A schematic diagram of the backlight assembly structure disclosed in the embodiment of the utility model;

[0013] Figure 3 It is a schematic diagram of a partial cross-sectional structure of the backlight panel after assembly disclosed in an embodiment of the utility model.

[0014] In the figure: 1. LED light; 2. Upper shading; 3. Upper substrate; 4. Upper circuit; 5. Lower glue; 6. Lower circuit; 7. Lower substrate; 8. Curing glue. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0016] refer to Figure 1-3 The utility model provides a printed circuit backlight plate, comprising a lower substrate 7, a lower circuit 6, a lower glue 5, an upper circuit 4, an upper substrate 3 and an upper light shielding 2 arranged in sequence from bottom to top, and the material of the lower substrate 7 and the upper substrate 3 is PET or PI;

[0017] Blind holes are punched and penetrate the upper light shielding layer 2, the upper substrate 3, the upper circuit 4 and the lower glue 5 from top to bottom;

[0018] The LED lamp 1 is embedded in the blind hole and simultaneously connects the lower layer circuit 6 and the upper layer circuit 4 , and the blind hole is also filled with curing glue for fixing the LED lamp 1 .

[0019] The utility model changes the existing backlight board process of etching circuits and embedding light-emitting diodes on a PCB board into a process of printing an upper circuit 4 on an upper substrate 3 made of PET or PI material and printing an upper light-shielding 2 on the reverse side, printing a lower circuit 6 on a lower substrate 7 made of PET or PI material, then printing a lower glue 5 and combining it with the upper substrate 3, and finally punching out a blind hole in which an LED lamp 1 can be embedded and then installing the lamp. The production process level of the backlight board with the new process structure is relatively simple compared with the etching process of the PCB board, thereby simplifying the process flow of the backlight board, reducing the production cost, and reducing the thickness of the backlight board.

[0020] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to the above embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A printed circuit backlight panel, characterized in that: It comprises a lower substrate (7), a lower circuit (6), a lower glue (5), an upper circuit (4), an upper substrate (3) and an upper light shield (2) which are arranged in sequence from bottom to top; A blind hole, which is punched and passes through the upper light shielding layer (2), the upper substrate (3), the upper circuit layer (4) and the lower glue layer (5) in sequence from top to bottom; An LED lamp (1), wherein the LED lamp (1) is embedded in the blind hole and simultaneously connects the lower layer circuit (6) and the upper layer circuit (4).

2. The printed circuit backlight panel according to claim 1, characterized in that: The blind hole is also filled with curing glue for fixing the LED lamp (1).

3. The printed circuit backlight panel according to claim 1, characterized in that: The material of the lower substrate (7) and the upper substrate (3) is PET or PI.

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