Printed circuit board capable of realizing inner layer interconnection

Abstract

The utility model provides a printed circuit board capable of realizing inner layer interconnection, and relates to the technical field of printed circuit boards, the printed circuit board comprises a bottom layer circuit board and a top layer circuit board, the left side and the right side of the top layer circuit board are both fixedly provided with a first shell, and a first limiting rod and a second limiting rod are arranged; after a worker presses down a top layer circuit board aligned with a bottom layer circuit board, a first limiting block at the bottom of a first limiting rod enters a second shell, the moving position of the first limiting block is limited through a second limiting block, and when the worker needs to detach the top layer circuit board from the bottom layer circuit board, the worker only needs to press down the first limiting rod, and then the worker can detach the top layer circuit board from the bottom layer circuit board. The first limiting rod moves downwards, at the moment, the movable block penetrates through the second limiting block, a worker can pull out the top-layer circuit board from the bottom-layer circuit board, at the moment, the second limiting block is separated from the movable block and the first limiting block, rapid disassembly and assembly between the circuit boards are achieved, operation is easy, and practicability is high.

Description

Technical Field

[0001] The utility model relates to a printed circuit board capable of inner layer interconnection, belonging to the technical field of printed circuit boards. Background Art

[0002] Printed circuit boards have developed from single-layer to double-layer, multi-layer and flexible boards, and are constantly developing towards high precision, high density and high reliability. Continuously reducing the size, reducing costs and improving performance will keep the printed circuit board strong in the development of future electronic products. The future development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, fine wire, small spacing, high reliability, multi-layer, high-speed transmission, light weight and thinness.

[0003] The existing patent publication number is CN219322656U, which discloses a printed circuit board that can be interconnected in the inner layer, including: a circuit board, a plug-in electrical connection slot, a plug-in electrical connector and a mounting base plate. The circuit board is composed of a bottom circuit board and a stacked circuit board. The bottom circuit board is equipped with a plug-in electrical connection slot, and the bottom of the stacked circuit board is equipped with a plug-in electrical connector. The plug-in electrical connection slot and the plug-in electrical connector are docked and interconnected. The mounting base plate is fixedly installed on the bottom surface of the bottom circuit board. The circuit board is electrically connected to the mounting base plate through the plug-in electrical connection slot and the plug-in electrical connector. When the circuit boards are stacked and docked with each other, the plug-in electrical connector is embedded in the plug-in electrical connection slot to realize the inner layer interconnection between the circuit boards. At the same time, the plug-in electrical connection slot and the mounting base plate lead out the electrical connection pole, which is electrically connected to the power supply through the electrical connection pole, thereby simplifying the difficulty of line layout, enabling the inner layer interconnection of the circuit board and the external electrical connection at the same time, optimizing the disassembly and maintenance methods and electrical connection methods.

[0004] In the existing printed circuit boards, bolts are used to fix two circuit boards when they are assembled together. This method is troublesome, time-consuming and labor-intensive in both disassembly and installation. Utility Model Content

[0005] The utility model aims to solve the problem that the existing printed circuit boards are fixed with bolts when two circuit boards are assembled with each other, and the method is troublesome, time-consuming and labor-intensive in both disassembly and installation, and proposes a printed circuit board capable of inner layer interconnection.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a printed circuit board with inner layer interconnection, including a bottom circuit board and a top circuit board, a first shell is fixedly installed on the left and right sides of the top circuit board, a second shell is fixedly installed on the left and right sides of the bottom circuit board, a first limit rod is provided inside the two first shells, a first limit block is fixedly installed at the bottom of the first limit rod, the first limit block is semicircular, a second limit rod is provided inside the two second shells, a second limit block is fixedly installed at one end of the second limit rod close to the first limit block, and the bottom of the second limit block is tightly attached to the top of the first limit block.

[0007] Preferably, the first shell inner cavity is fixedly installed with a first support plate and a second support plate in sequence from top to bottom, the first limit rod is inserted on the surface of the first support plate and the second support plate, and a first baffle is fixedly installed on the surface of the first limit rod, and the top of the first baffle is attached to the bottom of the first support plate.

[0008] Preferably, a second baffle is fixedly mounted on the surface of the first limiting rod, the top of the second baffle is attached to the bottom of the second support plate, a movable block is slidably arranged on the surface of the first limiting rod, a first telescopic spring is arranged between the bottom of the movable block and the top of the first limiting block, the first telescopic spring is sleeved on the outside of the first limiting rod, a second telescopic spring is arranged between the bottom of the first baffle and the top of the second support plate, and the second telescopic spring is sleeved on the outside of the first limiting rod.

[0009] Preferably, the second shell inner cavity is fixedly installed with a third support plate and a fourth support plate from left to right in sequence, the second limit rod is inserted into the surface of the third support plate and the fourth support plate, and the second limit rod surface is fixedly installed with a third baffle plate and a fourth baffle plate from left to right in sequence.

[0010] Preferably, a third telescopic spring is provided between the left side of the fourth baffle plate and the right side of the third support plate, and the third telescopic spring is sleeved outside the second limiting rod.

[0011] Preferably, a base is provided at the bottom of the bottom circuit board, and the bottom circuit board is fixedly installed on the top of the base by bolts. A cooling fan is fixedly installed on the left inner wall of the base cavity, a plurality of heat sinks are fixedly installed in the middle section of the base cavity, and a heat dissipation hole is opened on the right side of the base.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, by setting the first limit rod and the second limit rod, after the staff aligns the top circuit board with the bottom circuit board and presses it, the first limit block at the bottom of the first limit rod enters the second shell body and limits its movable position by the second limit block. When the staff needs to remove the top circuit board from the bottom circuit board, they only need to press the first limit rod, and the first limit rod moves downward. At this time, the movable block passes through the second limit block, and the staff can pull the top circuit board out of the bottom circuit board. At this time, the second limit block is separated from the movable block and the first limit block, thereby realizing rapid disassembly and installation between circuit boards, simple operation, and strong practicality.

[0014] 2. In the utility model, a base is provided under the bottom circuit board, a heat sink is provided inside the base, and the heat sink is located under the bottom circuit board. The heat of the circuit board can be transferred to the surface of the heat sink. By starting the cooling fan, the cooling fan dissipates the heat on the surface of the heat sink and diffuses the heat to the outside through the heat dissipation holes, thereby achieving rapid heat dissipation of the circuit board, extending the service life of the circuit board, and having strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the specific embodiments of the present invention and do not constitute a limitation to the present invention.

[0016] Figure 1 The utility model provides an overall schematic diagram of a printed circuit board capable of inner layer interconnection;

[0017] Figure 2 The utility model provides a schematic internal cross-sectional view of the overall structure of a printed circuit board capable of inner layer interconnection;

[0018] Figure 3 The utility model proposes a printed circuit board capable of inner layer interconnection Figure 2 The enlarged schematic diagram at A in the middle;

[0019] Figure 4 The utility model provides a schematic cross-sectional view of the interior of a second housing of a printed circuit board capable of inner layer interconnection;

[0020] Figure 5 The utility model provides an overall top view schematic diagram of a printed circuit board capable of inner layer interconnection.

[0021] Legend: 1. Bottom circuit board; 2. Top circuit board; 3. First shell; 4. Second shell; 5. First limit rod; 6. First limit block; 7. Second limit rod; 8. Second limit block; 9. First support plate; 10. Second support plate; 11. First baffle plate; 12. Second baffle plate; 13. Movable block; 14. First telescopic spring; 15. Second telescopic spring; 16. Third support plate; 17. Fourth support plate; 18. Third baffle plate; 19. Fourth baffle plate; 20. Third telescopic spring; 21. Base; 22. Cooling fan; 23. Heat sink; 24. Cooling hole. DETAILED DESCRIPTION

[0022] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0023] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0024] Example 1

[0025] like Figure 1-Figure 5 As shown, the utility model provides a technical solution: a printed circuit board with inner layer interconnection, including a bottom circuit board 1 and a top circuit board 2, a first shell 3 is fixedly installed on both sides of the top circuit board 2, a second shell 4 is fixedly installed on both sides of the bottom circuit board 1, a first limiting rod 5 is arranged inside the two first shells 3, a first limiting block 6 is fixedly installed at the bottom of the first limiting rod 5, and the first limiting block 6 is semicircular, a second limiting rod 7 is arranged inside the two second shells 4, a second limiting block 8 is fixedly installed at one end of the second limiting rod 7 close to the first limiting block 6, and the bottom of the second limiting block 8 is tightly attached to the top of the first limiting block 6.

[0026] The first support plate 9 and the second support plate 10 are fixedly installed in the inner cavity of the first shell 3 from top to bottom, the first limiting rod 5 is inserted on the surface of the first support plate 9 and the second support plate 10, and the first baffle plate 11 is fixedly installed on the surface of the first limiting rod 5, and the top of the first baffle plate 11 is attached to the bottom of the first support plate 9.

[0027] A second baffle plate 12 is fixedly mounted on the surface of the first limiting rod 5, and the top of the second baffle plate 12 is attached to the bottom of the second support plate 10. A movable block 13 is slidably arranged on the surface of the first limiting rod 5, and a first telescopic spring 14 is arranged between the bottom of the movable block 13 and the top of the first limiting block 6. The first telescopic spring 14 is sleeved on the outside of the first limiting rod 5, and a second telescopic spring 15 is arranged between the bottom of the first baffle plate 11 and the top of the second support plate 10. The second telescopic spring 15 is sleeved on the outside of the first limiting rod 5.

[0028] The inner cavity of the second shell 4 is fixedly installed with a third support plate 16 and a fourth support plate 17 from left to right in sequence, the second limiting rod 7 is inserted on the surface of the third support plate 16 and the fourth support plate 17, and the surface of the second limiting rod 7 is fixedly installed with a third baffle 18 and a fourth baffle 19 from left to right in sequence.

[0029] A third telescopic spring 20 is provided between the left side of the fourth baffle plate 19 and the right side of the third support plate 16 , and the third telescopic spring 20 is sleeved outside the second limiting rod 7 .

[0030] In this embodiment, after the staff aligns the top circuit board 2 with the bottom circuit board 1 and presses it, the first limit block 6 at the bottom of the first limit rod 5 enters the second shell 4 and limits its movable position through the second limit block 8. When the staff needs to remove the top circuit board 2 from the bottom circuit board 1, they only need to press the first limit rod 5, and the first limit rod 5 moves downward. At this time, the movable block 13 passes through the second limit block 8, and the staff can pull the top circuit board 2 out of the bottom circuit board 1. At this time, the second limit block 8 is separated from the movable block 13 and the first limit block 6. The movable block 13 is acted upon by the first telescopic spring 14 and is above the second limit block 8 before being pressed. The second limit block 8 is acted upon by the third telescopic spring 20 and will be pressed against the surface of the first limit block 6.

[0031] Example 2

[0032] like Figure 2-Figure 3 As shown, a base 21 is provided at the bottom of the bottom circuit board 1, and the bottom circuit board 1 is fixedly installed on the top of the base 21 by bolts. A cooling fan 22 is fixedly installed on the inner wall of the left side of the inner cavity of the base 21, and a plurality of heat sinks 23 are fixedly installed in the middle section of the inner cavity of the base 21. A heat dissipation hole 24 is opened on the right side of the base 21.

[0033] In this embodiment, a base 21 is provided under the bottom circuit board 1, a heat sink 23 is provided inside the base 21, and the heat sink 23 is located under the bottom circuit board 1. The heat of the circuit board can be transferred to the surface of the heat sink 23. By starting the cooling fan 22, the cooling fan 22 dissipates the heat on the surface of the heat sink 23 and diffuses the heat to the outside through the heat dissipation holes 24.

[0034] The working principle of this embodiment is as follows: when in use, the staff first aligns the top circuit board 2 with the bottom circuit board 1 and presses it. At this time, the first limit block 6 at the bottom of the first limit rod 5 enters the second shell 4 and limits its movable position through the second limit block 8. When the staff needs to remove the top circuit board 2 from the bottom circuit board 1, they only need to press the first limit rod 5, and the first limit rod 5 moves downward. At this time, the movable block 13 passes through the second limit block 8, and the staff can pull the top circuit board 2 out of the bottom circuit board 1. At this time, the second limit block 8 is separated from the movable block 13 and the first limit block 6, completing the disassembly between the top circuit board 2 and the bottom circuit board 1.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A printed circuit board capable of inner layer interconnection, characterized in that: The invention comprises a bottom circuit board (1) and a top circuit board (2), wherein a first shell (3) is fixedly mounted on both left and right sides of the top circuit board (2), and a second shell (4) is fixedly mounted on both left and right sides of the bottom circuit board (1), wherein first limit rods (5) are arranged inside the two first shells (3), and a first limit block (6) is fixedly mounted on the bottom of the first limit rod (5), and the first limit block (6) is semicircular, and second limit rods (7) are arranged inside the two second shells (4), and a second limit block (8) is fixedly mounted on one end of the second limit rod (7) close to the first limit block (6), and the bottom of the second limit block (8) is tightly attached to the top of the first limit block (6).

2. A printed circuit board capable of inner layer interconnection according to claim 1, characterized in that: The first housing (3) has a first support plate (9) and a second support plate (10) fixedly mounted in sequence from top to bottom in the inner cavity; the first limiting rod (5) is inserted on the surface of the first support plate (9) and the second support plate (10); a first baffle plate (11) is fixedly mounted on the surface of the first limiting rod (5); and the top of the first baffle plate (11) is in contact with the bottom of the first support plate (9).

3. A printed circuit board capable of inner layer interconnection according to claim 2, characterized in that: A second baffle (12) is fixedly mounted on the surface of the first limiting rod (5), the top of the second baffle (12) is in contact with the bottom of the second support plate (10), a movable block (13) is slidably arranged on the surface of the first limiting rod (5), a first telescopic spring (14) is arranged between the bottom of the movable block (13) and the top of the first limiting block (6), the first telescopic spring (14) is sleeved on the outside of the first limiting rod (5), a second telescopic spring (15) is arranged between the bottom of the first baffle (11) and the top of the second support plate (10), the second telescopic spring (15) is sleeved on the outside of the first limiting rod (5).

4. A printed circuit board capable of inner layer interconnection according to claim 1, characterized in that: A third support plate (16) and a fourth support plate (17) are fixedly mounted in sequence from left to right in the inner cavity of the second shell (4); the second limit rod (7) is inserted on the surface of the third support plate (16) and the fourth support plate (17); and a third baffle plate (18) and a fourth baffle plate (19) are fixedly mounted in sequence from left to right on the surface of the second limit rod (7).

5. A printed circuit board capable of inner layer interconnection according to claim 4, characterized in that: A third telescopic spring (20) is provided between the left side of the fourth baffle plate (19) and the right side of the third support plate (16), and the third telescopic spring (20) is sleeved outside the second limiting rod (7).

6. A printed circuit board capable of inner layer interconnection according to claim 1, characterized in that: A base (21) is provided at the bottom of the bottom circuit board (1); the bottom circuit board (1) is fixedly mounted on the top of the base (21) by means of bolts; a cooling fan (22) is fixedly mounted on the left inner wall of the inner cavity of the base (21); a plurality of cooling fins (23) are fixedly mounted in the middle section of the inner cavity of the base (21); and a cooling hole (24) is opened on the right side of the base (21).

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