Lead circuit board supporting mechanism for pressure sensor

Abstract

The utility model relates to the technical field of pressure sensors, in particular to a lead wire circuit board supporting mechanism for a pressure sensor, which comprises a conditioning signal circuit board, a lead wire circuit board and a lead wire board supporting seat, and the bottom side of the conditioning signal circuit board is provided with a pair of pins; the lead plate supporting seat is cylindrical, and a pair of slots is formed along the top of the lead plate supporting seat; after the pins are inserted into the slots, a lead plate mounting space which takes the top of the lead plate supporting seat as a supporting surface and takes the lead plate clamping grooves as limiting clamping is formed; the two sides of the lead circuit board are provided with mutually symmetrical pin through grooves, and the pin through grooves are used for the vertical penetration of the pins, so that the lead board clamping grooves can clamp the pins. The supporting mechanism is simple in structure and convenient to assemble or disassemble, the internal layout of the sensor can be simpler, the electric connection path of the port is shorter, and the assembling efficiency of the sensor can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure sensors, in particular to a lead circuit board supporting mechanism for pressure sensors. Background Art

[0002] Brake pressure sensors are used in ESC systems (electronic stability control systems) and are mainly installed on hydraulic control modules to monitor the pressure of brake fluid. Traditional pressure sensors involve several circuit boards with functional modules, and the core ones are signal conditioning circuit boards and lead circuit boards. The signal conditioning circuit board is mainly used to collect, process and output pressure signals; the lead circuit board is mainly used to transmit the bridge resistance differential signal generated by the strain gauge (instrument) to the signal conditioning circuit board; therefore, in the inner cavity of the sensor, a specific card slot needs to be set on the inner wall of the shell or a specific mechanism needs to be set in the shell to fix the two circuit boards for electrical connection between the two.

[0003] The traditional fixing method is to set specific slots in the sensor housing for the signal conditioning circuit board and the lead circuit board to be plugged in, and the two are parallel to each other after installation. This method is not only troublesome to assemble, but also causes space chaos in the sensor housing, which is not conducive to the wiring electrical connection between the two, but also to heat dissipation, assembly, and later disassembly and maintenance.

[0004] Therefore, a technology is urgently needed to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the above-mentioned problems of the prior art and provide a lead circuit board support mechanism for a pressure sensor, which is used to solve the technical problems of the prior art of respectively setting specific slots in the sensor housing for the signal conditioning circuit board and the lead circuit board to be plugged in, such as high manual dependence, low assembly efficiency, and not only being unfavorable for the timely electrical connection of the two, but also being unfavorable for heat dissipation, assembly, and later disassembly and maintenance.

[0006] The above objectives are achieved through the following technical solutions:

[0007] A lead circuit board support mechanism for a pressure sensor, comprising a conditioning signal circuit board, a lead circuit board and a lead board support seat, wherein a pair of pins are arranged on the bottom side of the conditioning signal circuit board, and a lead board clamping groove is formed between the two pins and the bottom side of the conditioning signal circuit board;

[0008] The lead plate support seat is cylindrical, and a pair of slots matching the pins are provided along the top of the support seat;

[0009] After the plug pin is plugged into the slot, a lead plate installation space is formed with the top of the lead plate support seat as a support surface and the lead plate clamping groove as a limit clamping;

[0010] Symmetrical pin through slots are provided on both sides of the lead circuit board. The pin through slots are used for vertical penetration of the pins so as to be clamped by the lead circuit board clamping slots.

[0011] Furthermore, the lead circuit board is circular and corresponds to the top of the lead board support seat.

[0012] Furthermore, the outer diameter of the lead circuit board is not less than the outer diameter of the lead board support seat.

[0013] Furthermore, a pair of lead board baffles facing inwards are arranged at the upper port of the lead board support seat, and the tops of the two lead board baffles constitute a lead circuit board supporting surface for supporting the bottom surface of the lead circuit board.

[0014] Furthermore, the height of the lead circuit board support surface is higher than the slot notch plane where the top notches of the two slots are located.

[0015] Furthermore, a curved chamfer is formed at a connection between the lead plate baffle and the upper port of the lead plate support seat.

[0016] Furthermore, a pin limiting groove is provided on the pin, and the pin limiting groove is used for limiting the insertion with the slot.

[0017] Furthermore, the pin limiting groove divides the pin into a pin plug-in portion and a pin extension portion. After the pin is plugged into the slot, the pin plug-in portion can be clamped by the slot, and the pin extension portion extends into the cavity of the lead plate support seat.

[0018] Furthermore, the pin inserting portion is partially inserted into the slot.

[0019] Furthermore, the top of the lead plate clamping groove does not contact the lead circuit board.

[0020] Beneficial Effects

[0021] The lead circuit board support mechanism for the pressure sensor provided by the utility model vertically connects the conditioning signal circuit board with the lead board support seat to form a lead board installation space that can support the bottom surface of the lead circuit board and limit the side and top. This not only facilitates the stable placement of the lead circuit board, but also ensures that it is on the lower side of the conditioning signal circuit board, and can better electrically connect with the strain gauge (instrument) located at the pressure port of the sensor and the conditioning signal circuit board in the inner cavity of the sensor, making the circuit path of the internal electrical connection shorter. The lead circuit board support mechanism for the pressure sensor provided by this scheme is not only simple in structure and easy to assemble or disassemble, but also can make the internal layout of the sensor simpler, the electrical connection path of the port shorter, and can effectively improve the assembly efficiency of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram from a first perspective of the lead circuit board support mechanism for the pressure sensor of the utility model;

[0023] Figure 2 This is a schematic diagram from a second viewing angle of the lead circuit board support mechanism for the pressure sensor of the utility model;

[0024] Figure 3 It is a schematic diagram of the lead circuit board support mechanism for the pressure sensor of the utility model from a third viewing angle;

[0025] Figure 4 This is an exploded view of the lead circuit board support mechanism for the pressure sensor described in the utility model.

[0026] Graphic marking:

[0027] 1- conditioning signal circuit board, 2- lead circuit board, 3- lead board support seat, 4- pin, 5- lead board clamping groove, 6- lead board installation space, 7- lead board baffle, 8- pin through groove, 9- slot, 10- pin plug-in part, 11- pin extension part, 12- arc chamfer, 13- pin limit groove, 14- lead circuit board support surface, 15- slot notch plane. DETAILED DESCRIPTION

[0028] The utility model is further described in detail below based on the accompanying drawings and embodiments. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] like Figures 1 to 4As shown, the present invention provides a lead circuit board support mechanism for a pressure sensor, comprising a conditioning signal circuit board 1, a lead circuit board 2 and a lead board support seat 3, a pair of pins 4 are arranged on the bottom side of the conditioning signal circuit board 1, and a lead board clamping groove 5 is formed between the two pins 4 and the bottom side of the conditioning signal circuit board 1;

[0030] The lead plate support seat 3 is cylindrical, and a pair of slots 9 matching the pins 4 are provided along the top thereof;

[0031] After the plug pin 4 is plugged into the slot 9, a lead plate installation space 6 is formed with the top of the lead plate support seat 3 as a support surface and the lead plate clamping groove 5 as a limit clamping;

[0032] Symmetrical pin through slots 8 are provided on both sides of the lead circuit board 2 , and the pin through slots 8 are used for vertical penetration of the pins 4 so as to be clamped by the lead circuit board clamping slots 5 .

[0033] Specifically, during installation, the lead circuit board 2 is first connected to the lead board support seat 3, and then the two pins 4 on the conditioning signal circuit board 1 are vertically inserted into the two slots 9 to achieve the purpose of rapid assembly.

[0034] Under the action of the lead board support seat 3 and the conditioning signal circuit board 1 with the pins 4, the bottom surface, side surface and top of the lead circuit board 2 are all confined within the lead board installation space 6.

[0035] As an optimization of the lead circuit board 2 described in this embodiment, the lead circuit board 2 is circular, corresponding to the top of the lead board support seat 3; and the outer diameter of the lead circuit board 2 is not less than the outer diameter of the lead board support seat 3, so that the top of the lead board support seat 3 can act on the bottom surface of the lead circuit board 2 to achieve stable support.

[0036] like Figure 3 As shown, in order to better support the bottom surface of the lead circuit board 2, this embodiment provides a pair of lead board baffles 7 facing inward at the upper port of the lead board support seat 3, and the tops of the two lead board baffles 7 constitute a lead circuit board supporting surface 14 for supporting the bottom surface of the lead circuit board 2.

[0037] It should be noted that the height of the lead circuit board support surface 14 in this embodiment is higher than the slot notch plane 15 where the top notches of the two slots 9 are located; this structure forms a breathable space between the bottom surface of the lead circuit board 2 and the slot notch plane 15, which is also conducive to the subsequent disassembly and maintenance of the components.

[0038] like Figure 4 As shown, as an optimization of the present structure, a curved chamfer 12 is formed at the connection between the lead plate baffle 7 and the upper port of the lead plate support seat 3. This structure can prevent damage to the lead circuit board 2 during assembly with the lead plate support seat 3.

[0039] like Figure 4 As shown, as an optimization of the pin 4 in this embodiment, a pin limiting groove 13 is provided on the pin 4, and the pin limiting groove 13 extends to the bottom end of the pin 4; the pin limiting groove 13 is used for plugging and limiting with the slot 9.

[0040] Specifically, the pin limiting groove 13 divides the pin 4 into a pin plug-in portion 10 and a pin extension portion 11. After the pin 4 is plugged into the slot 9, the pin plug-in portion 10 can be limited and clamped by the slot 9, and the pin extension portion 11 extends into the cavity of the lead plate support seat 3.

[0041] It should be noted that the pin inserting portion 10 is partially inserted into the slot 9 .

[0042] Specifically, in the present embodiment, only the outer portion of the bottom end of the pin plug-in portion 10 is plugged into the slot 9, and the top of the pin plug-in portion 10 is higher than the lead board support seat 3. This structure can ensure that the upper portion of the lead board clamping groove 5 is located above the lead board support seat 3, thereby limiting and clamping the two sides of the lead circuit board 2 installed on the top of the lead board support seat 3.

[0043] In this embodiment, the top of the lead plate clamping groove 5 does not contact the lead circuit board 2 .

[0044] Specifically, the two pins 4 are connected to the bottom edge of the conditioning signal circuit board 1 at an arc angle. The setting of the two arc angles makes the spacing between the upper parts of the lead plate clamping groove 5 smaller than the spacing between the two pin through grooves 8. This structure can effectively prevent the lead circuit board 2 from contacting the top of the lead plate clamping groove 5, thereby forming a space with a certain gap between the two. This space is beneficial to the subsequent electrical connection operation between the conditioning signal circuit board 1 and the lead circuit board 2, and can also serve as a heat dissipation and ventilation channel.

[0045] The above description is only for illustrating the implementation mode of the present invention and is not intended to limit the present invention. For those skilled in the art, any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A lead circuit board support mechanism for a pressure sensor, characterized in that: It comprises a signal conditioning circuit board (1), a lead circuit board (2) and a lead board support seat (3), wherein a pair of pins (4) are arranged on the bottom side of the signal conditioning circuit board (1), and a lead board clamping groove (5) is formed between the two pins (4) and the bottom side of the signal conditioning circuit board (1); The lead plate support seat (3) is cylindrical, and a pair of slots (9) matching the plug pins (4) are provided along the top thereof; After the plug pin (4) is plugged into the slot (9), a lead plate installation space (6) is formed with the top of the lead plate support seat (3) as a support surface and the lead plate clamping groove (5) as a limit clamping surface; Mutually symmetrical pin through slots (8) are provided on both sides of the lead circuit board (2), and the pin through slots (8) are used for the pins (4) to pass vertically therethrough so as to be clamped by the lead board clamping slots (5).

2. The lead circuit board support mechanism for a pressure sensor according to claim 1, characterized in that: The lead circuit board (2) is circular and corresponds to the top of the lead board support seat (3).

3. The lead circuit board support mechanism for a pressure sensor according to claim 2, characterized in that: The outer diameter of the lead circuit board (2) is not less than the outer diameter of the lead board support seat (3).

4. The lead circuit board support mechanism for a pressure sensor according to claim 2 or 3, characterized in that: A pair of lead plate baffles (7) facing inwards are arranged at the upper port of the lead plate support seat (3), and the tops of the two lead plate baffles (7) form a lead circuit board support surface (14) for supporting the bottom surface of the lead circuit board (2).

5. The lead circuit board support mechanism for a pressure sensor according to claim 4, characterized in that: The height of the lead circuit board support surface (14) is higher than the slot notch plane (15) where the top notches of the two slots (9) are located.

6. The lead circuit board support mechanism for a pressure sensor according to claim 4, characterized in that: A curved chamfer (12) is formed at the connection between the lead plate baffle (7) and the upper port of the lead plate support seat (3).

7. The lead circuit board support mechanism for a pressure sensor according to claim 1, characterized in that: The plug pin (4) is provided with a plug pin limiting groove (13), and the plug pin limiting groove (13) is used for limiting the insertion with the slot (9).

8. The lead circuit board support mechanism for a pressure sensor according to claim 7, characterized in that: The plug pin limiting groove (13) divides the plug pin (4) into a plug pin plug-in portion (10) and a plug pin extension portion (11); after the plug pin (4) is plugged into the slot (9), the plug pin plug-in portion (10) can be limited and clamped by the slot (9), and the plug pin extension portion (11) extends into the cavity of the lead plate support seat (3).

9. The lead circuit board support mechanism for a pressure sensor according to claim 8, characterized in that: The pin plug-in portion (10) is partially plugged into the slot (9).

10. The lead circuit board support mechanism for a pressure sensor according to claim 1, characterized in that: The top of the lead plate clamping groove (5) does not contact the lead circuit board (2).

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