Cabin main engine, cabin main engine cooling system and vehicle

Abstract

The utility model relates to the technical field of vehicle parts, and provides a cabin main engine, a cabin main engine heat dissipation system and a vehicle, the cabin main engine comprises an upper cover, a first circuit board, a middle frame, a second circuit board and a lower cover which are sequentially arranged from top to bottom, and the upper cover and the first circuit board are respectively connected to the upper end of the middle frame; the lower cover and the second circuit board are respectively connected to the lower end of the middle frame, the cabin host further comprises an antenna arranged on the middle frame, the antenna is electrically connected with the first circuit board, the middle frame is provided with a water cooling cavity, and the water cooling cavity is arranged adjacent to the second circuit board and is used for accommodating cooling liquid to dissipate heat of the second circuit board. Therefore, the water cooling cavity is formed in the middle frame and is adjacent to the second circuit board carrying an APU, other chips and the like, and the cooling liquid is filled in the water cooling cavity to cool the second circuit board, so that the cabin host can meet the cooling requirement of a high-computing-power chip, and stable operation of the cabin host is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle parts, and in particular to a cockpit host, a cockpit host cooling system and a vehicle. Background Art

[0002] With the increasing intelligence of automobiles, the in-vehicle smart cockpit has also developed rapidly, which has led to an increasing number of functions integrated into the smart cockpit host, further promoting the continuous iteration and upgrading of the underlying hardware platform of the smart cockpit host.

[0003] However, as the computing power of the cockpit host chip increases, the power consumption density of the chip itself is also increasing rapidly, making the cockpit host prone to high temperature due to increased heat generation, causing the host chip to frequently overheat and reduce frequency, which in turn causes the cockpit host to freeze and other phenomena. Utility Model Content

[0004] The problem solved by the utility model is: how to effectively dissipate the heat of a cockpit host to ensure the stable operation of the cockpit host.

[0005] To solve the above problems, the utility model provides a cockpit host, comprising an upper cover, a first circuit board, a middle frame, a second circuit board and a lower cover arranged in sequence from top to bottom, the upper cover and the first circuit board are respectively connected to the upper end of the middle frame, the lower cover and the second circuit board are respectively connected to the lower end of the middle frame, the cockpit host also includes an antenna arranged on the middle frame, the antenna is electrically connected to the first circuit board, and a water cooling cavity is provided on the middle frame, the water cooling cavity is arranged adjacent to the second circuit board, and is used to contain coolant to dissipate heat from the second circuit board.

[0006] Optionally, the cockpit host also includes a third circuit board, which is located between the upper cover and the middle frame and connected to the upper end of the middle frame. A first partition is provided on the middle frame, and the first circuit board and the third circuit board are respectively located on both sides of the first partition, and the third circuit board is arranged corresponding to the water cooling cavity.

[0007] Optionally, a first heat-conducting boss is provided between the second circuit board and the middle frame, a second heat-conducting boss is provided between the third circuit board and the middle frame, and the first heat-conducting boss and the second heat-conducting boss are respectively coated with heat-conducting glue for heat transfer.

[0008] Optionally, the middle frame includes a frame body and a water-cooling plate, the water-cooling plate is connected to the frame body and encloses the water-cooling cavity together with the frame body, a second partition is provided in the water-cooling cavity, the second partition divides the water-cooling cavity into a water inlet channel and a water outlet channel that are interconnected, and a water inlet and a water outlet are provided on the frame body, and the water inlet and the water outlet are respectively connected to the water inlet channel and the water outlet channel.

[0009] Optionally, the water cooling cavity is further provided with a spoiler rib, and the spoiler rib is arranged in the water inlet channel and / or the water outlet channel.

[0010] Optionally, the spoiler rib includes a first spoiler rib and a second spoiler rib, the first spoiler rib is arranged on the frame, the second spoiler rib is arranged on the water cooling plate, and the orthographic projections of the first spoiler rib and the second spoiler rib on the water cooling plate do not overlap.

[0011] Optionally, the spoiler ribs are parallel to the side walls of the corresponding parts of the water cooling chamber.

[0012] Optionally, the middle frame also includes a side panel, an opening is provided at one end of the frame, the side panel is detachably connected to the opening of the frame, and the interface end of the first circuit board and the interface end of the second circuit board are respectively located at the opening and are respectively connected to the side panel.

[0013] In order to solve the above problems, the utility model further provides a cockpit host heat dissipation system, comprising a temperature acquisition module, a thermal management water cooling system and the cockpit host as described above;

[0014] The temperature acquisition module is used to acquire the temperature of the target heating unit in the cockpit host in real time;

[0015] The cockpit host is used to send coolant flow request information to the thermal management water cooling system when the temperature collected by the temperature collection module meets the preset temperature range;

[0016] The thermal management water cooling system is used to deliver coolant at a flow rate corresponding to the preset temperature range to the cabin main engine according to the coolant flow request information.

[0017] In order to solve the above problems, the utility model also provides a vehicle, including the cockpit host as described above, or including the cockpit host cooling system as described above.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The cockpit host of the utility model can be installed and fixed in the cockpit host by arranging the first circuit board between the upper cover and the middle frame, and fixing it to the upper end of the middle frame with fasteners such as screws, and arranging the second circuit board between the lower cover and the middle frame, and fixing it to the lower end of the middle frame with fasteners such as screws. At the same time, by arranging a water cooling chamber in the middle frame, and arranging the water cooling chamber adjacent to the second circuit board equipped with, for example, APU and other chips, the water cooling chamber is filled with coolant to dissipate the heat of the second circuit board, so that the cockpit host can meet the heat dissipation requirements of high-computing power chips, thereby ensuring the stable operation of the cockpit host. Moreover, by arranging an antenna on the middle frame, wireless connection support is provided for user devices such as mobile phones, and the need for interconnection between the car machine and the mobile phone is realized, thereby improving the entertainment and safety of driving. In addition, arranging the antenna on the middle frame is not only convenient for layout, but also the middle frame with high structural strength can be used to support the antenna to ensure the stability of the antenna installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the exploded structure of the cockpit host in the embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the assembly structure of the cockpit host in the embodiment of the utility model;

[0022] Figure 3 It is a schematic cross-sectional structure diagram of the cockpit main engine at the cold water chamber in the embodiment of the utility model;

[0023] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure at AA in the middle;

[0024] Figure 5 This is a schematic diagram of the assembly structure of the cockpit host at the first circuit board and the third circuit board in the embodiment of the utility model;

[0025] Figure 6 This is a schematic diagram of the exploded structure of the middle frame in the embodiment of the utility model;

[0026] Figure 7 This is a schematic diagram of the bottom structure of the middle frame in an embodiment of the utility model;

[0027] Figure 8 It is a schematic structural diagram of the middle frame in the water cooling chamber in an embodiment of the utility model.

[0028] Description of reference numerals:

[0029] 1. Upper cover; 11. Heat dissipation grille; 2. First circuit board; 21. First connector; 3. Middle frame; 31. Frame; 311. Water inlet; 312. Water outlet; 313. Opening; 314. First through hole; 315. Second through hole; 32. Water cooling plate; 33. Side plate; 34. Water cooling chamber; 341. Water inlet channel; 342. Water outlet channel; 35. First partition; 36. Second partition; 37. Spoiler rib; 371. First spoiler rib; 372. Second spoiler rib; 4. Second circuit board; 41. First thermal conductive boss; 42. Second connector; 43. Third connector; 5. Lower cover; 6. Antenna; 7. Third circuit board; 71. Second thermal conductive boss; 72. Second fixing bracket; 8. Mounting bracket; 9. Thermal adhesive. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] The Z axis in the accompanying drawings represents the vertical direction, that is, the up and down position, and the positive direction of the Z axis represents the top, and the reverse direction of the Z axis represents the bottom; the X axis in the accompanying drawings represents the horizontal direction, and is designated as the front and back position, and the positive direction of the X axis represents the front side, and the reverse direction of the X axis represents the back side; the Y axis in the accompanying drawings represents the left and right positions, and the positive direction of the Y axis represents the left side, and the reverse direction of the Y axis represents the right side. It should also be noted that the aforementioned Z axis, Y axis, and X axis are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein.

[0033] Combination Figures 1 to 3 As shown, an embodiment of the utility model provides a cockpit host, including an upper cover 1, a first circuit board 2, a middle frame 3, a second circuit board 4 and a lower cover 5 arranged in sequence from top to bottom, the upper cover 1 and the first circuit board 2 are respectively connected to the upper end of the middle frame 3, the lower cover 5 and the second circuit board 4 are respectively connected to the lower end of the middle frame 3, the cockpit host also includes an antenna 6 arranged on the middle frame 3, the antenna 6 is electrically connected to the first circuit board 2, and a water cooling cavity 34 is provided on the middle frame 3, the water cooling cavity 34 is arranged adjacent to the second circuit board 4, and is used to contain a coolant to dissipate heat from the second circuit board 4.

[0034] Specifically, the cockpit host usually has two circuit boards, a first circuit board 2 and a second circuit board 4, wherein the first circuit board 2 can be a sub-board, such as a SUB (Substrate, SUB for short) board, i.e., a package substrate, etc., and the second circuit board 4 can be a main board, and the main board and the sub-board are electrically connected through connectors. The main board is usually equipped with heating elements such as APU (Accelerated Processing Unit, i.e., accelerated processor) and other chips, so the second circuit board 4 is the main heating component of the cockpit host. The upper cover 1, the middle frame 3 and the lower cover 5 constitute the shell part of the cockpit host, wherein the upper cover 1 and the lower cover 5 are usually detachably connected with the upper end and the lower end of the middle frame 3 by screws, and a cavity is formed between the upper cover 1 and the middle frame 3, and the first circuit board 2 is arranged in the cavity and fixed to the upper end of the middle frame 3 by screws, and the second circuit board 4 is arranged between the lower cover 5 and the middle frame 3, and fixed to the lower end of the middle frame 3 by the common screws with the lower cover 5, and the antenna 6 of the cockpit host is usually arranged on the left and right sides of the middle frame 3, and the antenna 6 is usually a Bluetooth / WIFI antenna, which is used to provide wireless connection support for user devices such as mobile phones, and to realize the needs of interconnection between the vehicle and the mobile phone. A water cooling chamber 34 is provided in the middle frame 3, and the water cooling chamber 34 is used to fill a coolant such as a 50% ethylene glycol solution, and the coolant usually comes from the vehicle's thermal management water cooling system, that is, the cockpit host and the whole vehicle share a water cooling system. Moreover, the water cooling cavity 34 is usually located in the front half of the middle frame 3, the first circuit board 2 is usually located in the rear half of the middle frame 3, and the second circuit board 4 usually covers the entire lower end of the middle frame 3, that is, the water cooling cavity 34 is not adjacent to the first circuit board 2, but adjacent to the second circuit board 4, so as to water-cool the second circuit board 4. The water cooling cavity 34 and the second circuit board 4 are arranged adjacent to each other, which can be understood as the second circuit board 4 is in contact with the part of the middle frame 3 where the water cooling cavity 34 is located, or there is a small distance between the second circuit board 4 and the part of the middle frame 3 where the water cooling cavity 34 is located.

[0035] The cockpit host in this embodiment can be installed and fixed in the cockpit host by arranging the first circuit board 2 between the upper cover 1 and the middle frame 3, and fixing it to the upper end of the middle frame 3 with fasteners such as screws, and arranging the second circuit board 4 between the lower cover 5 and the middle frame 3, and fixing it to the lower end of the middle frame 3 with fasteners such as screws. At the same time, by arranging a water cooling chamber 34 in the middle frame 3, and arranging the water cooling chamber 34 adjacent to the second circuit board 4 equipped with, for example, APU and other chips, the water cooling chamber 34 is filled with coolant to dissipate the heat of the second circuit board 4, so that the cockpit host can meet the heat dissipation requirements of high-computing power chips, thereby ensuring the stable operation of the cockpit host. Moreover, by arranging an antenna 6 on the middle frame 3, wireless connection support is provided for user devices such as mobile phones, and the need for interconnection between the vehicle machine and the mobile phone is realized, thereby improving the entertainment and safety of driving. In addition, arranging the antenna 6 on the middle frame 3 is not only convenient for layout, but also the middle frame 3 with high structural strength can be used to support the antenna 6 to ensure the stability of the installation of the antenna 6.

[0036] Furthermore, the upper cover 1 is provided with a heat dissipation grille 11, and the heat dissipation grille 11 is arranged corresponding to the first circuit board 2. In this way, the heat dissipation grille 11 can be used to achieve air cooling and heat dissipation for the first circuit board 2, so that on the basis of achieving water cooling and heat dissipation through the water cooling chamber 34, the heat dissipation grille 11 can be further used to achieve air cooling and heat dissipation, so as to further improve the heat dissipation effect of the cockpit host.

[0037] Furthermore, combined with Figure 1 and Figure 7 As shown, the first circuit board 2 is provided with a first connector 21, the second circuit board 4 is provided with a second connector 42, and the middle frame 3 is further provided with a first via hole 314, and the second connector 42 passes through the first via hole 314 and plugs and mates with the first connector 21. In this way, the electrical connection between the first circuit board 2 and the second circuit board 4 is achieved.

[0038] Furthermore, combined with Figure 1 As shown, an antenna 6 is provided on each of the two opposite sides of the middle frame 3. That is to say, two antennas 6 are provided on the cockpit host, and the two antennas 6 are symmetrically installed on the left and right sides of the middle frame 3, so as to increase the coverage range of the electrical signal.

[0039] Optionally, combined Figure 4 and Figure 5 As shown, the cockpit main unit also includes a third circuit board 7, which is located between the upper cover 1 and the middle frame 3 and connected to the upper end of the middle frame 3. A first partition plate 35 is provided on the middle frame 3, and the first circuit board 2 and the third circuit board 7 are respectively located on both sides of the first partition plate 35, and the third circuit board 7 is arranged corresponding to the water cooling cavity 34.

[0040] In this embodiment, the cockpit host is also equipped with a third circuit board 7, which is usually a GPU (Graphics Processing Unit, i.e., a graphics processor) board, to improve the computing power of the cockpit host chip, so that the cockpit host does not need to be equipped with a dual system-on-chip (System On Chip, referred to as SOC), i.e., dual SOC, which greatly improves the iteration space of the software platform. The first partition 35 of the middle frame 3 divides the cavity between the middle frame 3 and the upper cover 1 into a front half and a rear half, the first circuit board 2 is located in the front half of the cavity, the third circuit board 7 is located in the rear half of the cavity, and is arranged corresponding to the water cooling cavity 34, i.e., the third circuit board 7 is located directly above the water cooling cavity 34. In this way, the coolant in the water cooling cavity 34 can be used to water-cool the third circuit board 7, so that the cockpit host can further meet the heat dissipation requirements of high-computing power chips and ensure the stable operation of the cockpit host.

[0041] Furthermore, combined with Figure 1 and Figure 7 As shown, the second circuit board 4 is further provided with a third connector 43, the third circuit board 7 is provided with a fourth connector, and the middle frame 3 is further provided with a second via hole 315, and the third connector 43 passes through the second via hole 315 and is plugged and matched with the fourth connector. In this way, the electrical connection between the third circuit board 7 and the second circuit board 4 is achieved.

[0042] Optionally, combined Figure 1 and Figure 3 As shown, a first heat-conducting boss 41 is provided between the second circuit board 4 and the middle frame 3, and a second heat-conducting boss 71 is provided between the third circuit board 7 and the middle frame 3. The first heat-conducting boss 41 and the second heat-conducting boss 71 are respectively coated with heat-conducting glue 9 for heat transfer.

[0043] In this embodiment, the first heat-conducting boss 41 can be set on the second circuit board 4, or on the upper end of the frame 31 of the middle frame 3, such as the frame body 31 described later, or on both the second circuit board 4 and the frame body 31; like the first heat-conducting boss 41, the second heat-conducting boss 71 can be set on the third circuit board 7, or on the water-cooling plate 32 of the middle frame 3, such as the water-cooling plate 32 described later, or on both the third circuit board 7 and the water-cooling plate 32. In actual applications, the setting can be selected as needed, and no specific limitation is made here. In this way, by applying the heat-conducting glue 9 on the first heat-conducting boss 41 and the second heat-conducting boss 71, the heat exchange effect between the second circuit board 4 and the coolant and between the third circuit board 7 and the coolant is improved, so that the coolant can quickly take away the heat generated by the second circuit board 4 and the third circuit board 7, thereby achieving efficient heat dissipation.

[0044] Furthermore, a first heat-conducting boss 41 is provided on a side of the second circuit board 4 facing the water-cooling cavity 34 , and a first fixing bracket is provided on a side of the second circuit board 4 facing away from the water-cooling cavity 34 , and the first fixing bracket is arranged correspondingly to the first heat-conducting boss 41 .

[0045] In this embodiment, the first fixing bracket is usually fixed to the second circuit board 4 by screws and is located directly below the first heat-conducting boss 41. In this way, the first fixing bracket can be used to press the first heat-conducting boss 41 onto the water-cooling plate 32, so that the first heat-conducting boss 41 and the water-cooling plate 32 are tightly fitted to facilitate heat exchange.

[0046] Furthermore, combined with Figure 5 As shown, a second heat-conducting boss 71 is provided on the side of the third circuit board 7 facing the water-cooling cavity 34 , and a second fixing bracket 72 is provided on the side of the third circuit board 7 facing away from the water-cooling cavity 34 , and the second fixing bracket 72 is arranged correspondingly to the second heat-conducting boss 71 .

[0047] In this embodiment, the second fixing bracket 72 is usually fixed to the third circuit board 7 by screws and is located directly above the second heat-conducting boss 71. In this way, the second fixing bracket 72 can be used to press the second heat-conducting boss 71 above the water-cooling cavity 34, so that the second heat-conducting boss 71 is tightly fitted with the frame 31 where the water-cooling cavity 34 is located, so as to facilitate heat exchange.

[0048] Optionally, combined Figure 3 , Figure 4 , Figure 6 and Figure 8 As shown, the middle frame 3 includes a frame body 31 and a water-cooling plate 32. The water-cooling plate 32 is connected to the frame body 31 and encloses a water-cooling chamber 34 together with the frame body 31. A second partition plate 36 is provided in the water-cooling chamber 34. The second partition plate 36 divides the water-cooling chamber 34 into a water inlet channel 341 and a water outlet channel 342 that are interconnected. A water inlet 311 and a water outlet 312 are provided on the frame body 31. The water inlet 311 and the water outlet 312 are respectively connected to the water inlet channel 341 and the water outlet channel 342.

[0049] In this embodiment, the water cooling plate 32 is usually fixed to the lower end of the frame 31 by screws and is sealed with the frame 31. In addition, a groove structure with a notch facing downward is provided in the frame 31. The groove structure forms an open water cooling chamber 34. The water cooling plate 32 is used to block the notch of the groove structure to form a closed water cooling chamber 34. The second partition 36 can be as follows Figure 4As shown in the figure, it is arranged on the frame 31, and can also be arranged on the water cooling plate 32, and the second partition plate 36 divides the water cooling chamber 34 into a water inlet channel 341 and a water outlet channel 342. Correspondingly, a water inlet 311 and a water outlet 312 are provided on the frame 31, and joints are usually provided at the water inlet 311 and the water outlet 312 to facilitate the connection of pipes. The water inlet 311 and the water outlet 312 can be arranged at the same end of the frame 31, or at different ends of the frame 31. In actual applications, the design can be selected according to the layout space of the cockpit host. In this way, the water inlet 311 and the water outlet 312 can be connected to the thermal management water cooling system of the whole vehicle through a pipeline to realize the circulation of the coolant in the water cooling chamber 34, thereby continuously dissipating heat.

[0050] Optionally, combined Figure 3 and Figure 4 As shown, a spoiler rib 37 is further provided in the water cooling cavity 34 , and the spoiler rib 37 is provided in the water inlet channel 341 and / or the water outlet channel 342 .

[0051] In this embodiment, a plurality of spoiler ribs 37 are usually provided, and the plurality of spoiler ribs 37 can be provided on the frame 31, on the water cooling plate 32, or on both the frame 31 and the water cooling plate 32. In this way, by providing spoiler ribs 37 in the water inlet channel 341 and / or the water outlet channel 342, the steady flow mode of the coolant is changed to a turbulent flow mode, so that the turbulent coolant is used to quickly exchange heat, thereby improving the heat exchange efficiency.

[0052] Optionally, combined Figure 4 As shown, the spoiler rib 37 includes a first spoiler rib 371 and a second spoiler rib 372. The first spoiler rib 371 is disposed on the frame 31, and the second spoiler rib 372 is disposed on the water cooling plate 32. The orthographic projections of the first spoiler rib 371 and the second spoiler rib 372 on the water cooling plate 32 do not overlap.

[0053] In this embodiment, a plurality of first spoiler ribs 371 and second spoiler ribs 372 are usually provided and are evenly distributed in the water cooling chamber 34. One of the first spoiler rib 371 and the second spoiler rib 372 may be provided at the connection point between the water inlet channel 341 and the water outlet channel 342, and the other may be provided in the water inlet channel 341 and / or the water outlet channel 342; or the first spoiler rib 371 and the second spoiler rib 372 may be provided in the water inlet channel 341 and the water outlet channel 342, respectively, which is not specifically limited here. Regardless of the arrangement, the orthographic projections of the first spoiler rib 371 and the second spoiler rib 372 on the water cooling plate 32 do not overlap, that is, the first spoiler rib 371 and the second spoiler rib 372 are on the horizontal plane (i.e. Figure 4The plurality of first spoiler ribs 371 and the plurality of second spoiler ribs 372 may be staggered and arranged at intervals, and at this time, the area where the plurality of first spoiler ribs 371 are located overlaps with the area where the plurality of second spoiler ribs 372 are located at least partially, or the area where the plurality of first spoiler ribs 371 are located does not overlap with the area where the plurality of second spoiler ribs 372 are located at all, for example, the plurality of first spoiler ribs 371 are located in the water inlet channel 341, and the plurality of second spoiler ribs 372 are located in the water outlet channel 342. Such arrangement can increase the coverage area of ​​the spoiler ribs 37, thereby increasing the turbulent range of the coolant and improving the heat dissipation effect.

[0054] Optionally, combined Figure 4 As shown, the spoiler ribs 37 are parallel to the side walls of the corresponding parts of the water cooling chamber 34 .

[0055] In this embodiment, if the side wall of the water-cooling cavity 34 corresponding to the spoiler rib 37 is a curved surface, the spoiler rib 37 is a curved plate structure parallel to the curved surface; if the side wall of the water-cooling cavity 34 corresponding to the spoiler rib 37 is a plane, the spoiler rib 37 is a flat plate structure parallel to the plane. Figure 4 As shown, the side wall of the water cooling chamber 34 at the connection between the water inlet channel 341 and the water outlet channel 342 is a curved surface, and the first spoiler rib 371 arranged at the connection between the water inlet channel 341 and the water outlet channel 342 is a curved plate rib parallel to the curved surface, and the side wall of the water cooling chamber 34 at the water outlet channel 342 is a plane, and the second spoiler rib 372 arranged in the water inlet and outlet channels 342 is a flat plate rib parallel to the plane. In this way, the arrangement direction of the spoiler rib 37 is basically consistent with the flow direction of the coolant, so that the contact area between the coolant and the spoiler rib 37 can be increased while achieving spoiler flow, thereby improving the heat exchange effect.

[0056] Optionally, combined Figure 6 As shown, the middle frame 3 also includes a side panel 33, an opening 313 is provided at one end of the frame body 31, the side panel 33 is detachably connected to the opening 313 of the frame body 31, and the interface end of the first circuit board 2 and the interface end of the second circuit board 4 are respectively located at the opening 313 and are respectively connected to the side panel 33.

[0057] In this embodiment, the side panel 33 is usually arranged at the rear end of the frame 31, and the interface end of the first circuit board 2 and the interface end of the second circuit board 4 are usually provided with various electrical interfaces for electrical connection with external electrical equipment to exchange electrical signals. In this way, by respectively arranging the interface end of the first circuit board 2 and the interface end of the second circuit board 4 at the opening 313 of the frame 31, a larger installation space is provided for the electrical interface on the first circuit board 2 and the second circuit board 4. At the same time, by respectively connecting the interface end of the first circuit board 2 and the interface end of the second circuit board 4 to the side panel 33, the interface end of the first circuit board 2 and the interface end of the second circuit board 4 are supported by the side panel 33, thereby improving the firmness of the electrical interface on the first circuit board 2 and the second circuit board 4. In addition, the side panel 33 and the frame 31 are detachably connected by fasteners such as screws to facilitate disassembly and assembly, and then the side panel 33 is conveniently removed to inspect the circuit board at the opening of the frame 31.

[0058] Furthermore, combined with Figure 6 As shown, a water inlet 311 and a water outlet 312 are provided at one end of the frame 31, and an opening 313 is provided at the other end of the frame 31. For example, the water inlet 311 and the water outlet 312 are provided at the front end of the frame 31, and the opening 313 is provided at the rear end of the frame 31. In this way, the water inlet 311 and the water outlet 312 are provided at the same end of the frame 31 to facilitate the connection of the cooling pipeline, and the opening 313 and the water inlet 311 are provided at opposite ends of the frame 31 to facilitate the electrical connection of the cockpit main unit with external electrical equipment.

[0059] Another embodiment of the utility model provides a cockpit host cooling system, including a temperature acquisition module, a thermal management water cooling system and the cockpit host as described above;

[0060] The temperature acquisition module is used to collect the temperature of the target heating components in the cockpit host in real time;

[0061] The cockpit host is used to send coolant flow request information to the thermal management water cooling system when the temperature collected by the temperature collection module meets the preset temperature range;

[0062] The thermal management water cooling system is used to deliver coolant at a flow rate corresponding to a preset temperature range to the cockpit main engine based on the coolant flow request information.

[0063] Specifically, the temperature acquisition module is usually a temperature sensor, which is used to detect the temperature of the target heat-generating component of the cockpit host in real time. The key heat-generating components of the cockpit host are mainly the CPU and GPU. Moreover, the CPU and GPU are usually combined on a chip to form an APU, and are mounted on the second circuit board 4. Therefore, when the cockpit host includes the second circuit board 4 but does not include the third circuit board 7, that is, the cockpit host includes the APU board but does not include the GPU board, at this time, the target heat-generating component is usually the second circuit board 4, and the temperature acquisition module is used to collect the temperature of the second circuit board 4 in real time; when the cockpit host includes the second circuit board 4 and the third circuit board 7, that is, the cockpit host includes the APU board and the GPU board, at this time, the target heat-generating component is usually the GPU board with a larger heat generation, that is, the third circuit board 7, and the temperature acquisition module is used to collect the temperature of the third circuit board 7 in real time.

[0064] Exemplarily, when the temperature collected by the temperature acquisition module meets the preset temperature range, the cockpit host requests the corresponding flow of coolant from the thermal management water cooling system through the Flexray bus to cool the cockpit host. Among them, multiple preset temperature ranges can be set, that is, the temperature of the target heating component is divided into several temperature gears, and accordingly, the flow of the coolant is also divided into several levels. For example, the temperature of the target heating component can be divided into five temperature gears from low to high, namely, below 0°C, 0°C-70°C, 70°C-80°C, 80°C-90°C, and above 90°C, and the flow of the coolant is divided into four flow levels from low to high, namely, 1L / min, 4L / min, 6L / min, and 8L / min, wherein below 0°C corresponds to 1L / min, 0°C-70°C and 70°C-80°C both correspond to 4L / min, 80°C-90°C corresponds to 6L / min, and above 90°C corresponds to 8L / min.

[0065] The cockpit host cooling system in this embodiment can collect the temperature of the target heat-generating components in the cockpit host in real time through the temperature collection module. When the temperature collected by the temperature collection module meets the preset temperature range, the cockpit host can send coolant flow request information to the thermal management water cooling system through, for example, the Flexray bus, and the thermal management water cooling system delivers coolant with a flow rate corresponding to the preset temperature range to the cockpit host according to the coolant flow request information, so that the cockpit host cooling system can reasonably cool down the cabin host according to the actual cooling needs of the cockpit host.

[0066] Furthermore, for the two cases where the cockpit host is configured with a GPU board or not, the division of the preset temperature range can be the same, and the division of the coolant flow rate can be different. For example, when the cockpit host is configured with a GPU board, the coolant flow rate can be divided into five flow levels from low to high, namely, 1L / min, 4L / min, 6L / min, 8L / min, and 10L / min. Each temperature level corresponds to a flow level, and the higher the temperature level, the higher the corresponding flow level.

[0067] Furthermore, when the cockpit host needs to be shut down, the cockpit host sends a request for a coolant flow of 0L / min to the thermal management water cooling system before shutting down. When the thermal management water cooling system receives the request for a flow of 0L / min, it stops the water flow after 2 minutes. In this way, the cockpit host can continue to be cooled and dissipated after the cockpit host is shut down.

[0068] Furthermore, when the cockpit host is undergoing an OTA upgrade, the cockpit host sends a request to the thermal management water cooling system for a coolant flow rate of 4L / min, and after the OTA upgrade is completed, it sends a request to the thermal management water cooling system for a coolant flow rate of 0L / min. When the thermal management water cooling system receives the request for a flow rate of 0L / min, it stops the water flow after 2 minutes. In this way, the cockpit host can continue to be cooled and dissipated after the cockpit host upgrade is completed.

[0069] Another embodiment of the present invention provides a vehicle, including the cockpit host as described above, or including the cockpit host cooling system as described above.

[0070] The beneficial effects of the vehicle in this embodiment relative to the prior art are the same as those of the above-mentioned cockpit host, which will not be described again here.

[0071] Although the utility model is disclosed as above, the protection scope of the utility model is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the protection scope of the utility model.

Claims

1. A cockpit host, characterized in that: The cockpit host comprises an upper cover (1), a first circuit board (2), a middle frame (3), a second circuit board (4) and a lower cover (5) which are arranged in sequence from top to bottom, the upper cover (1) and the first circuit board (2) are respectively connected to the upper end of the middle frame (3), the lower cover (5) and the second circuit board (4) are respectively connected to the lower end of the middle frame (3), the cockpit host also comprises an antenna (6) arranged on the middle frame (3), the antenna (6) is electrically connected to the first circuit board (2), and a water cooling cavity (34) is arranged on the middle frame (3), the water cooling cavity (34) is arranged adjacent to the second circuit board (4) and is used to contain cooling liquid to dissipate heat from the second circuit board (4); the upper cover (1) is provided with a heat dissipation grille (11), and the heat dissipation grille (11) is arranged corresponding to the first circuit board (2).

2. The cockpit host according to claim 1, characterized in that: The invention also comprises a third circuit board (7), wherein the third circuit board (7) is located between the upper cover (1) and the middle frame (3) and is connected to the upper end of the middle frame (3); a first partition plate (35) is provided on the middle frame (3); the first circuit board (2) and the third circuit board (7) are respectively located on both sides of the first partition plate (35); and the third circuit board (7) is arranged corresponding to the water cooling chamber (34).

3. The cockpit host according to claim 2, characterized in that: A first heat-conducting boss (41) is provided between the second circuit board (4) and the middle frame (3), a second heat-conducting boss (71) is provided between the third circuit board (7) and the middle frame (3), and a heat-conducting glue (9) for heat transfer is coated on the first heat-conducting boss (41) and the second heat-conducting boss (71), respectively.

4. The cockpit host according to claim 1, characterized in that: The middle frame (3) comprises a frame body (31) and a water cooling plate (32); the water cooling plate (32) is connected to the frame body (31) and encloses the water cooling chamber (34) together with the frame body (31); a second partition plate (36) is provided in the water cooling chamber (34); the second partition plate (36) divides the water cooling chamber (34) into a water inlet channel (341) and a water outlet channel (342) which are interconnected; a water inlet (311) and a water outlet (312) are provided on the frame body (31); the water inlet (311) and the water outlet (312) are respectively connected to the water inlet channel (341) and the water outlet channel (342).

5. The cockpit host according to claim 4, characterized in that: The water cooling cavity (34) is further provided with a spoiler rib (37), and the spoiler rib (37) is arranged in the water inlet channel (341) and / or the water outlet channel (342).

6. The cockpit host according to claim 5, characterized in that: The spoiler rib (37) comprises a first spoiler rib (371) and a second spoiler rib (372), wherein the first spoiler rib (371) is arranged on the frame (31), and the second spoiler rib (372) is arranged on the water-cooling plate (32), and the orthographic projections of the first spoiler rib (371) and the second spoiler rib (372) on the water-cooling plate (32) do not overlap.

7. The cockpit host according to claim 5, characterized in that: The spoiler ribs (37) are parallel to the side wall of the corresponding portion of the water cooling cavity (34).

8. The cockpit host according to claim 4, characterized in that: The middle frame (3) further comprises a side panel (33); an opening (313) is provided at one end of the frame body (31); the side panel (33) is detachably connected to the opening (313) of the frame body (31); and an interface end of the first circuit board (2) and an interface end of the second circuit board (4) are respectively located at the opening (313) and are respectively connected to the side panel (33).

9. A cockpit host cooling system, characterized in that: It comprises a temperature acquisition module, a thermal management water cooling system and a cockpit host as claimed in any one of claims 1 to 8; The temperature acquisition module is used to acquire the temperature of the target heating unit in the cockpit host in real time; The cockpit host is used to send coolant flow request information to the thermal management water cooling system when the temperature collected by the temperature collection module meets the preset temperature range; The thermal management water cooling system is used to deliver coolant at a flow rate corresponding to the preset temperature range to the cabin main engine according to the coolant flow request information.

10. A vehicle, characterized in that: It comprises the cockpit host as described in any one of claims 1 to 8, or it comprises the cockpit host cooling system as described in claim 9.

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