High-efficiency heat dissipation assembly of string type inverter

Abstract

The utility model relates to the technical field of inverters, in particular to an efficient heat dissipation assembly of a string type inverter, which comprises an inverter body, a first heat conduction plate is arranged on the rear side of the inverter body in a penetrating manner, a plurality of first heat dissipation fins are arranged on the rear side of the first heat conduction plate, and a plurality of U-shaped openings are formed in the rear sides of the first heat dissipation fins. Semiconductor chilling plates penetrate through the left side and the right side of the inner wall of the inverter body, and a circulating airflow assembly is arranged at the bottom of the left side of the inner wall of the inverter body. According to the efficient heat dissipation assembly of the string type inverter, when the temperature sensor detects that the temperature in the inverter body reaches a set threshold value, the controller analyzes and processes an input electric signal and then controls the semiconductor chilling plate and the fan to work, the semiconductor chilling plate cools the interior of the inverter body, and the fan cools the interior of the inverter body. And the fan can enable air in the inverter body to flow, so that cold air generated by the semiconductor chilling plate is quickly diffused, and the cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, in particular to a high-efficiency heat dissipation component of a string inverter. Background Art

[0002] With the increasing popularity of distributed energy, string inverters have become particularly important due to their advantages in multi-string parallel connection in photovoltaic power plants and distributed power generation systems. This type of inverter can convert the direct current generated by multiple photovoltaic modules or wind turbines into alternating current that can be connected to the power grid. However, under continuous operation and high load conditions, the power devices inside the inverter will generate a lot of heat. If the heat cannot be dissipated in a timely and effective manner, it will cause the device to overheat, affect the efficiency of the inverter, and even cause failure or reduce the service life. This problem is particularly prominent in high temperature environments or places with poor heat dissipation conditions.

[0003] The patent with publication number CN211183818U discloses a string inverter with both dustproof and excellent heat dissipation performance, including an inverter box, a string inverter element installed in the inverter box, a dustproof plate provided on the inner wall of the inverter box near the bottom, a U-shaped mounting plate provided at the bottom of the inner wall of the inverter box, three groups of symmetrically distributed high-speed silent fans provided at the bottom of the inner wall of the U-shaped mounting plate and near the edges on both sides, a plurality of air inlets arranged at equal intervals are provided at the bottom of the inverter box, and symmetrically distributed triangular air outlets are provided at the top of both sides of the inverter box. The string inverter with both dustproof and excellent heat dissipation performance can blow air into the inverter box to dissipate heat through a high-speed silent fan, accelerate the heat dissipation of the inverter element, and prevent dust from entering the inverter box through the dustproof plate.

[0004] The above-mentioned prior art realizes heat dissipation in the inverter box through a high-speed silent fan and uses a dustproof plate to block dust. However, in harsh outdoor environments with a lot of dust, the limitations of this design become obvious. The fan is easy to be damaged, which affects the heat dissipation efficiency; the dustproof plate and the filter plate are easy to be blocked, which not only reduces the operating stability of the system, but also increases the maintenance cost. Fan damage and reduced dustproof performance will cause the temperature inside the box to rise, thereby accelerating the aging process of electronic components, seriously affecting the overall performance and service life of the string inverter. In view of this, we propose an efficient heat dissipation component for the string inverter. Utility Model Content

[0005] The purpose of the utility model is to provide a high-efficiency heat dissipation component for a string inverter to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A high-efficiency heat dissipation component of a string inverter includes an inverter body, a first heat conducting plate is provided through the rear side of the inverter body, a connection between the first heat conducting plate and the inverter body is sealed and bonded with high-temperature resistant and waterproof glue, a plurality of first heat dissipation fins are provided on the rear side of the first heat conducting plate and are arranged equidistantly from left to right, and the plurality of first heat dissipation fins can increase the contact surface between the rear side of the first heat conducting plate and the air, thereby improving the heat dissipation effect, and a plurality of U-shaped openings are provided on the rear side of the first heat dissipation fins and are arranged equidistantly from top to bottom, so that airflow can pass through the sides of the plurality of first heat dissipation fins, which is conducive to the heat dissipation of the first heat dissipation fins;

[0008] Semiconductor cooling sheets are provided through the middle of the left and right sides of the inner wall of the inverter body. The connection between the semiconductor cooling sheets and the inverter body is sealed and bonded with high-temperature resistant and waterproof glue. The heating surfaces of the two semiconductor cooling sheets are provided with a second heat conducting plate. The cooling surfaces of the semiconductor cooling sheets are located inside the inverter body, so as to cool the inside of the inverter body.

[0009] A circulating airflow component is provided at the bottom of the left side of the inner wall of the inverter body, and the circulating airflow component includes a U-shaped seat fixedly connected to the bottom of the left side of the inner wall of the inverter body, and a vent is provided at the top of the U-shaped seat. A fan is provided at the top of the U-shaped seat and located at the position of the vent. The fan can make the air inside the inverter body flow, so that the cold air generated by the semiconductor refrigeration sheet can be quickly diffused, thereby improving the cooling effect;

[0010] The front side of the inverter body is detachably connected with a front side plate through bolts, and the rear side of the front side plate is provided with a temperature sensor and a controller.

[0011] Preferably, a plurality of heat conducting plates equidistantly arranged left and right are provided on the front side of the first heat conducting plate, and a plurality of circular holes equidistantly arranged up and down are opened on the side of the heat conducting plate, which is beneficial for transferring heat inside the inverter body to the first heat conducting plate.

[0012] Preferably, silicone grease is filled between the second heat conducting plate and the semiconductor refrigeration fin to improve the heat conduction efficiency. A plurality of second heat dissipating fins arranged equidistantly from front to back are provided on the side of the second heat conducting plate away from the semiconductor refrigeration fin to improve the heat dissipation effect of the second heat conducting plate. A plurality of strip holes are provided on the side of the second heat dissipating fin to allow air flow to pass through the side of the second heat dissipating fin, which is beneficial to the dissipation of heat from the second heat dissipating fin.

[0013] Preferably, a rectangular air outlet duct is provided on the top of the U-shaped seat to concentrate the airflow output, which is conducive to generating circulating airflow. The fan is located in the rectangular air outlet duct, and a protective net is provided on the top of the inner wall of the rectangular air outlet duct to prevent objects from falling into the rectangular air outlet duct, thereby protecting the fan.

[0014] Preferably, the semiconductor refrigeration plate, fan and temperature sensor are electrically connected to the controller through wires respectively, and the temperature inside the inverter body is detected in real time by the temperature sensor. When the temperature detected by the temperature sensor reaches its set threshold, the temperature sensor transmits the detected electrical signal to the controller through the wire. The controller analyzes and processes the input electrical signal and controls the operation of the semiconductor refrigeration plate and the fan, and the working time of each time can be set to 20-40 minutes to ensure that the temperature inside the inverter body is reduced.

[0015] Preferably, a detachable drying box is provided on the top of the inner wall of the inverter body, and a bagged desiccant is placed in the drying box. A plurality of ventilation holes are provided on the left and right sides of the drying box so that air can pass through the drying box. The bagged desiccant can absorb moisture in the airflow to keep the inside of the inverter body dry.

[0016] Preferably, two fixed longitudinal rods are symmetrically arranged on the rear side of the inner wall of the inverter body and near the top, and hanging blocks are provided on the top of the left and right sides of the drying box. A circular through groove is opened on the front side of the hanging block, and the two fixed longitudinal rods are respectively located in the two circular through grooves, which is convenient for disassembly and assembly of the drying box.

[0017] Preferably, L-shaped mounting frames are provided at both left and right edges of the rear side of the inverter body, and mounting holes for bolts to pass through are opened on the L-shaped mounting frames to facilitate the installation of the inverter body and the bracket.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. The high-efficiency heat dissipation component of the string inverter is provided with a plurality of heat conducting plates on the front side of the first heat conducting plate, which is conducive to the heat transfer from the inside of the inverter body to the first heat conducting plate. The plurality of first heat dissipation fins can increase the contact surface between the rear side of the first heat conducting plate and the air, thereby improving the heat dissipation effect, so that the heat inside the inverter body can be transferred to the outside to achieve the heat dissipation effect. Due to the closed heat dissipation structure, the number of maintenance times can be effectively reduced.

[0020] 2. The high-efficiency heat dissipation component of this string inverter, when the temperature sensor detects that the temperature inside the inverter body reaches its set threshold, the temperature sensor transmits the detected electrical signal to the controller through a wire. The controller analyzes and processes the input electrical signal and controls the operation of the semiconductor refrigeration plate and the fan. The semiconductor refrigeration plate cools the inside of the inverter body, and the fan can make the air inside the inverter body flow, so that the cold air generated by the semiconductor refrigeration plate can be quickly diffused, thereby improving the cooling effect.

[0021] 3. The high-efficiency heat dissipation component of this string inverter has a rectangular air outlet duct on the top of the U-shaped seat to concentrate the airflow output, which is conducive to generating circulating airflow. The fan is located in the rectangular air outlet duct. A protective net is provided on the top of the inner wall of the rectangular air outlet duct to prevent objects from falling into the rectangular air outlet duct, thereby protecting the fan.

[0022] 4. The string inverter has an efficient heat dissipation component. A bagged desiccant is placed in the drying box. There are multiple ventilation holes on the left and right sides of the drying box so that air can pass through the drying box. The bagged desiccant can absorb moisture in the airflow to keep the inside of the inverter dry. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall first-view structure of the utility model;

[0024] Figure 2 It is a schematic diagram of the overall structure of the utility model from a second viewing angle;

[0025] Figure 3 It is one of the partial structural schematic diagrams of the utility model;

[0026] Figure 4 This is the second schematic diagram of the partial structure of the utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the circulating airflow component in the utility model;

[0028] Figure 6 It is a schematic diagram of the assembly structure of the semiconductor cooling plate and the second heat conducting plate in the utility model;

[0029] Figure 7 This is a schematic diagram of the structure of the first heat conducting plate in the utility model;

[0030] Figure 8 It is a schematic diagram of the drying box structure in the utility model.

[0031] In the figure: 1. inverter body; 10. fixed longitudinal rod; 11. L-shaped mounting frame; 2. front side plate; 3. first heat conducting plate; 30. heat conducting sheet; 300. circular hole; 31. first heat dissipating fin; 310. U-shaped opening; 4. semiconductor refrigeration sheet; 5. temperature sensor; 6. controller; 7. circulating airflow assembly; 70. U-shaped seat; 700. vent; 71. fan; 72. rectangular air outlet duct; 73. protective net; 8. drying box; 80. hanging block; 800. circular through groove; 81. vent; 9. second heat conducting plate; 90. second heat dissipating fin; 900. strip hole. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] See also Figure 1-Figure 8 , the utility model provides a technical solution:

[0035] The high-efficiency heat dissipation component of the string inverter includes an inverter body 1, a first heat conducting plate 3 is provided through the rear side of the inverter body 1, the connection between the first heat conducting plate 3 and the inverter body 1 is sealed and bonded by high-temperature resistant and waterproof glue, a plurality of first heat dissipation fins 31 are provided on the rear side of the first heat conducting plate 3 and are arranged equidistantly from left to right, and the plurality of first heat dissipation fins 31 can increase the contact surface between the rear side of the first heat conducting plate 3 and the air, thereby improving the heat dissipation effect, and a plurality of U-shaped openings 310 are provided on the rear side of the first heat dissipation fins 31 and are arranged equidistantly from top to bottom, so that airflow can pass through the sides of the plurality of first heat dissipation fins 31, which is conducive to the heat dissipation of the first heat dissipation fins 31;

[0036] Semiconductor cooling sheets 4 are provided through the middle of the left and right sides of the inner wall of the inverter body 1. The connection between the semiconductor cooling sheets 4 and the inverter body 1 is sealed and bonded with high-temperature resistant and waterproof glue. The heating surfaces of the two semiconductor cooling sheets 4 are provided with second heat conducting plates 9. The cooling surfaces of the semiconductor cooling sheets 4 are located inside the inverter body 1, so as to cool the inside of the inverter body 1.

[0037] A circulating airflow component 7 is provided at the bottom of the left side of the inner wall of the inverter body 1. The circulating airflow component 7 includes a U-shaped seat 70 fixedly connected to the bottom of the left side of the inner wall of the inverter body 1. A vent 700 is provided at the top of the U-shaped seat 70. A fan 71 is provided at the top of the U-shaped seat 70 and located at the position of the vent 700. The fan 71 can make the air inside the inverter body 1 flow, so that the cold air generated by the semiconductor cooling sheet 4 can be quickly diffused, thereby improving the cooling effect;

[0038] The front side of the inverter body 1 is detachably connected to a front side plate 2 via bolts, and a temperature sensor 5 and a controller 6 are provided on the rear side of the front side plate 2 .

[0039] In this embodiment, a plurality of heat conducting sheets 30 equidistantly arranged left and right are provided on the front side of the first heat conducting plate 3, and a plurality of circular holes 300 equidistantly arranged up and down are opened on the side of the heat conducting sheet 30, thereby increasing the contact surface between the heat conducting sheet 30 and the air inside the inverter body 1, which is beneficial to the heat transfer from the inside of the inverter body 1 to the first heat conducting plate 3.

[0040] Specifically, silicone grease is filled between the second heat conducting plate 9 and the semiconductor refrigeration sheet 4 to improve the heat conduction efficiency. A plurality of second heat dissipating fins 90 equidistantly arranged front to back are provided on the side of the second heat conducting plate 9 away from the semiconductor refrigeration sheet 4 to improve the heat dissipation effect of the second heat conducting plate 9. A plurality of strip holes 900 are provided on the side of the second heat dissipating fins 90 so that airflow can pass through the side of the second heat dissipating fins 90, which is beneficial to the heat dissipation of the second heat dissipating fins 90.

[0041] Furthermore, a rectangular air outlet duct 72 is provided on the top of the U-shaped seat 70 to concentrate the airflow output, which is conducive to generating circulating airflow. The fan 71 is located in the rectangular air outlet duct 72. A protective net 73 is provided on the top of the inner wall of the rectangular air outlet duct 72 to prevent objects from falling into the rectangular air outlet duct 72, thereby protecting the fan 71.

[0042] Furthermore, the semiconductor cooling plate 4, the fan 71 and the temperature sensor 5 are electrically connected to the controller 6 through wires respectively. The temperature inside the inverter body 1 is detected in real time by the temperature sensor 5. When the temperature detected by the temperature sensor 5 reaches its set threshold, the temperature sensor 5 transmits the detected electrical signal to the controller 6 through the wire. The controller 6 analyzes and processes the input electrical signal and then controls the semiconductor cooling plate 4 and the fan 71 to work. The working time of each time can be set to 20-40 minutes to ensure that the temperature inside the inverter body 1 is reduced.

[0043] Furthermore, a detachable drying box 8 is provided at the top of the inner wall of the inverter body 1, and a bagged desiccant is placed in the drying box 8. A plurality of ventilation holes 81 are provided on the left and right sides of the drying box 8 so that air can pass through the drying box 8. The bagged desiccant can absorb moisture in the airflow to keep the interior of the inverter body 1 dry.

[0044] Furthermore, two fixed longitudinal rods 10 are symmetrically arranged on the rear side of the inner wall of the inverter body 1 and near the top. Hanging blocks 80 are provided on the tops of the left and right sides of the drying box 8. A circular through groove 800 is opened on the front side of the hanging block 80. The two fixed longitudinal rods 10 are respectively located in the two circular through grooves 800, which facilitates the disassembly and assembly of the drying box 8.

[0045] Furthermore, L-shaped mounting frames 11 are provided at the left and right edges of the rear side of the inverter body 1 , and mounting holes for bolts to pass through are provided on the L-shaped mounting frames 11 , so as to facilitate the installation of the inverter body 1 and the bracket.

[0046] When the high-efficiency heat dissipation component of the string inverter of this embodiment is in use, under normal conditions, the heat in the inverter body 1 is transferred to the first heat conducting plate 3 through the multiple heat conducting plates 30, and the first heat conducting plate 3 transfers the heat to the multiple first heat dissipation fins 31, thereby quickly transferring the heat to the outside. When the temperature sensor 5 detects that the temperature in the inverter body 1 reaches its set threshold, the temperature sensor 5 transmits the detected electrical signal to the controller 6 through a wire. The controller 6 analyzes and processes the input electrical signal and then controls the semiconductor refrigeration plate 4 and the fan 71 to work. The semiconductor refrigeration plate 4 cools the inside of the inverter body 1. The fan 71 can make the air inside the inverter body 1 flow, so that the cold air generated by the semiconductor refrigeration plate 4 can quickly diffuse, thereby improving the cooling effect. At the same time, the bagged desiccant in the drying box 8 can absorb the moisture in the airflow to keep the inside of the inverter body 1 dry. The working time of the semiconductor refrigeration plate 4 and the fan 71 is set to 20-40 minutes each time to ensure that the temperature in the inverter body 1 is reduced.

[0047] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A high-efficiency heat dissipation component for a string inverter, comprising an inverter body (1), characterized in that: A first heat conducting plate (3) is provided through the rear side of the inverter body (1), a plurality of first heat dissipation fins (31) are provided on the rear side of the first heat conducting plate (3) and are arranged equidistantly from left to right, a plurality of U-shaped openings (310) are provided on the rear side of the first heat dissipation fins (31) and are arranged equidistantly from top to bottom, semiconductor cooling plates (4) are provided through the middle of the left and right sides of the inner wall of the inverter body (1), the heating surfaces of the two semiconductor cooling plates (4) are provided with second heat conducting plates (9), and the left inner wall of the inverter body (1) is provided with a plurality of first heat dissipation fins (31) and a plurality of first heat dissipation fins (310) are provided on the rear side of the first heat dissipation fins (31) and are arranged equidistantly from top to bottom. A circulating airflow component (7) is provided at the bottom of the side, the circulating airflow component (7) comprising a U-shaped seat (70) fixedly connected to the bottom of the left side of the inner wall of the inverter body (1), a vent (700) is provided at the top of the U-shaped seat (70), a fan (71) is provided at the top of the U-shaped seat (70) and located at the position of the vent (700), the front side of the inverter body (1) is detachably connected to the front side plate (2) by bolts, and the rear side of the front side plate (2) is provided with a temperature sensor (5) and a controller (6).

2. The high-efficiency heat dissipation assembly of the string inverter according to claim 1, characterized in that: The front side of the first heat conducting plate (3) is provided with a plurality of heat conducting sheets (30) arranged equidistantly from left to right, and the side surface of the heat conducting sheet (30) is provided with a plurality of circular holes (300) arranged equidistantly from top to bottom.

3. The high-efficiency heat dissipation assembly of a string inverter according to claim 1, characterized in that: Silicone grease is filled between the second heat conducting plate (9) and the semiconductor cooling plate (4); a plurality of second heat dissipation fins (90) arranged equidistantly from front to back are provided on the side of the second heat conducting plate (9) away from the semiconductor cooling plate (4); and a plurality of strip holes (900) are provided on the side of the second heat dissipation fins (90).

4. The high-efficiency heat dissipation assembly for a string inverter according to claim 1, characterized in that: A rectangular air outlet pipe (72) is provided on the top of the U-shaped seat (70), the fan (71) is located in the rectangular air outlet pipe (72), and a protective net (73) is provided on the top of the inner wall of the rectangular air outlet pipe (72).

5. The high-efficiency heat dissipation assembly for a string inverter according to claim 1, characterized in that: The semiconductor cooling sheet (4), the fan (71) and the temperature sensor (5) are electrically connected to the controller (6) via wires respectively.

6. The high-efficiency heat dissipation assembly for a string inverter according to claim 1, characterized in that: A detachable drying box (8) is provided at the top of the inner wall of the inverter body (1), a bagged desiccant is placed in the drying box (8), and a plurality of ventilation holes (81) are provided on both the left and right sides of the drying box (8).

7. The high-efficiency heat dissipation assembly of a string inverter according to claim 6, characterized in that: Two fixed longitudinal rods (10) are provided at the rear side of the inner wall of the inverter body (1) and near the top, and are arranged symmetrically on the left and right sides. The tops of the left and right sides of the drying box (8) are both provided with hanging blocks (80). The front side of the hanging blocks (80) is provided with circular through grooves (800), and the two fixed longitudinal rods (10) are respectively located in the two circular through grooves (800).

8. The high-efficiency heat dissipation assembly for a string inverter according to claim 1, characterized in that: L-shaped mounting frames (11) are provided at the left and right edges of the rear side of the inverter body (1), and mounting holes for bolts to pass through are provided on the L-shaped mounting frames (11).

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