Adjustable ic bonding machine

Abstract

The utility model discloses an adjustable ic bonding machine, relates to IC chip processing bonding technical field, including bonding cabinet and adjusting assembly, the middle part of bonding cabinet is provided with conduction positioning mechanism in the wall-attached manner, and the bottom side of conduction positioning mechanism is provided with carrying mechanism, the middle part of bonding cabinet is provided with material plate, and the material plate is provided with the material plate. The material plate is located on the right side of the carrying mechanism, and the adjusting assembly is fixedly installed on the top wall of the middle of the bonding cabinet. According to the adjustable ic bonding machine, a metal screw rod is controlled to rotate through a rotating handle, and the inner wall of a mounting cover is matched to limit the motion trail of a movable block, so that the movable block can translate under rotation driving of the metal screw rod, a connecting piece and a lifting air cylinder at the bottom of the connecting piece are driven to move, and the purpose of adjusting the pressing position of a pressing head is achieved; according to the improved IC bonding machine, the position of the pressing head can be adjusted, the purpose of adjusting the bonding position is achieved, the adjusting process is simple and convenient, and the IC bonding machine can be well suitable for bonding work of IC chips of various models.

Description

Technical Field

[0001] The utility model relates to the technical field of IC chip processing and bonding, in particular to an adjustable IC bonding machine. Background Art

[0002] The bonding machine is a device that accurately positions IC or LCM chips on LCD glass and binds them. It is a production equipment widely used in the electronics, touch screen and other industries. It adopts pulse heating and cooperates with titanium alloy hot pressing heads to achieve rapid heating, rapid cooling, and accurate temperature control to effectively ensure product quality. It is mainly used for welding the inner leads of semiconductor devices such as digital tubes, dot matrices, integrated circuit soft packages, thick mold integrated circuits, and transistors. The IC chip is an integrated circuit formed by a large number of microelectronic components placed on a plastic base to make a chip. The IC chip includes a wafer chip and a packaged chip. The corresponding IC chip production line consists of a wafer production line and a packaging production line.

[0003] For example, the patent document with application number CN202321091623.5 provides an IC bonding machine, which achieves the purpose of highly stable IC chip bonding processing through the alignment of the feeding structure and the positioning assistance of the downward pressing process. It does not require material suction and transmission and re-bonding processes, saves steps, and improves processing alignment stability, thereby reducing chip bonding displacement and instability and other quality problems. The positioning stakes around the lifting cylinder are engaged with the top surface of the plastic base carrier to maintain further positioning during the bonding process, thereby avoiding instability.

[0004] However, the existing IC bonding machines similar to the above-mentioned applications still have some shortcomings. During the bonding process of the existing IC chip, the IC chip integrated circuit needs to be stably fitted and positioned on the surface of the plastic base material through a pressure head in cooperation with the placement base below, and then bonded. However, in the actual production process, due to the different processing techniques of different types of IC chips, there are differences in their bonding positions. The existing IC bonding machines can usually only be pressed down and bonded at a fixed position, and cannot be well applied to the bonding work of various types of IC chips.

[0005] Therefore, it is urgent to improve this shortcoming. The utility model studies and improves the existing structure and shortcomings, and provides an adjustable IC bonding machine. Utility Model Content

[0006] The purpose of the utility model is to provide an adjustable IC bonding machine to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an adjustable IC bonding machine, comprising a bonding cabinet and an adjustment component, a conductive positioning mechanism is arranged on the wall in the middle of the bonding cabinet, and a carrying mechanism is arranged on the bottom side of the conductive positioning mechanism, a material plate is arranged in the middle of the bonding cabinet, and the material plate is located on the right side of the carrying mechanism, the adjustment component is fixedly installed on the middle top wall of the bonding cabinet, and the bottom of the adjustment component is connected to a lifting cylinder, the bottom end of the lifting cylinder is fixedly connected to a buffer component, and the bottom of the buffer component is connected to a pressure head.

[0008] Furthermore, the carrying mechanism includes an operating table, a carrying plate, a handle and a plastic-based carrier, and the operating table is fixed in the middle of the bonding cabinet, and the top of the operating table is connected to the carrying plate, and the operating table and the carrying plate form a sliding structure, and at the same time, a handle is welded on the left side of the carrying plate, and the top of the carrying plate is fixed with a plastic-based carrier, and the plastic-based carrier is installed on the top of the operating table through the carrying plate.

[0009] Furthermore, the adjustment assembly includes a mounting cover, a guide groove, a metal wire rod and a rotary handle, and the bottom of the mounting cover is provided with a guide groove, and the inner wall of the mounting cover is movably connected to the metal wire rod through a bearing, and one end of the metal wire rod is fixedly connected to the rotary handle.

[0010] Furthermore, the adjustment component also includes a movable block, and the movable block is sleeved on the metal wire rod, and the inner wall of the movable block is threadedly connected to the outer wall of the metal wire rod, and the outer wall of the movable block is in contact with the inner wall of the mounting cover.

[0011] Furthermore, the adjustment component also includes a connecting piece, and the connecting piece is welded to the bottom of the movable block, and the bottom of the connecting piece is fixedly connected to the top of the lifting cylinder.

[0012] Furthermore, the buffer assembly includes a connecting plate, a pressure sensor and a sleeve, and the top of the connecting plate is fixedly connected to the bottom end of the lifting cylinder, and the pressure sensor is installed at the bottom center of the connecting plate, and the top of the connecting plate is embedded with a sleeve.

[0013] Furthermore, the buffer assembly also includes a guide rod and a limit plate, and the bottom end of the guide rod is fixedly connected to the top of the pressure head, and the guide rod and the sleeve form a through structure, and the top end of the guide rod is welded with a limit plate.

[0014] Furthermore, the buffer assembly also includes a buffer spring, and the buffer spring is arranged between the pressure head and the connecting plate, one end of the buffer spring is fixedly connected to the connecting plate, and the other end of the buffer spring is fixedly connected to the pressure head.

[0015] The utility model provides an adjustable IC bonding machine, which has the following beneficial effects:

[0016] 1. The utility model is provided with an adjustment component, which controls the rotation of the metal wire rod by turning the handle, and cooperates with the inner wall of the mounting cover to limit the movement trajectory of the movable block, so that the movable block can translate under the rotation drive of the metal wire rod, thereby driving the connecting piece and the lifting cylinder at the bottom thereof to move, so as to achieve the purpose of adjusting the downward pressing position of the pressure head. The improved IC bonding machine can adjust the position of the pressure head to achieve the purpose of adjusting the bonding position, and the adjustment process is relatively simple, which can be well applied to the bonding work of various types of IC chips.

[0017] 2. The utility model is provided with a buffer component. During the pressing process of the pressure head, the buffer spring at the bottom of the connecting plate is compressed, so that the top end of the guide rod extends along the sleeve. At the same time, the pressure sensor monitors the pressure change in real time to avoid problems such as IC chip breakage caused by excessive pressure of the pressure head. The improved IC bonding machine not only has a buffer structure, but also can strictly control the pressure, and is not prone to excessive pressure or inadequate bonding, which is beneficial to improving the bonding quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a front view structural diagram of an adjustable IC bonding machine of the utility model;

[0019] Figure 2 The utility model is an adjustable IC bonding machine Figure 1 A schematic diagram of the structure enlargement in the middle;

[0020] Figure 3 This is a front cross-sectional structural diagram of an adjustable mounting cover of an IC bonding machine of the utility model;

[0021] Figure 4 The utility model is a schematic diagram of the three-dimensional structure of a buffer component of an adjustable IC bonding machine.

[0022] In the figure: 1. bonding cabinet; 2. conduction positioning mechanism; 3. carrying mechanism; 301. operating table; 302. carrying plate; 303. handle; 304. plastic base carrier; 4. material plate; 5. adjustment assembly; 501. mounting cover; 502. guide groove; 503. wire rod; 504. rotary handle; 505. movable block; 506. connector; 6. lifting cylinder; 7. buffer assembly; 701. connecting plate; 702. pressure sensor; 703. sleeve; 704. guide rod; 705. limit plate; 706. buffer spring; 8. pressure head. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0024] like Figure 1 and Figure 3 As shown, an adjustable IC bonding machine includes a bonding cabinet 1 and an adjustment component 5, a conductive positioning mechanism 2 is arranged on the wall in the middle of the bonding cabinet 1, and a carrying mechanism 3 is arranged on the bottom side of the conductive positioning mechanism 2, the carrying mechanism 3 includes an operating table 301, a carrying plate 302, a handle 303 and a plastic base carrier 304, and the operating table 301 is fixed in the middle of the bonding cabinet 1, and the top of the operating table 301 is connected with the carrying plate 302, and the operating table 301 and the carrying plate 302 form a sliding structure, and at the same time, a handle 303 is welded on the left side of the carrying plate 302, a plastic base carrier 304 is fixed on the top of the carrying plate 302, and the plastic base carrier 304 is installed on the top of the operating table 301 through the carrying plate 302, a material plate 4 is arranged in the middle of the bonding cabinet 1, and the material plate 4 is located on the right side of the carrying mechanism 3, the adjustment component 5 is fixedly installed on the middle top wall of the bonding cabinet 1, and the bottom of the adjustment component 5 The bottom of the mounting cover 501 is provided with a guide groove 502, a wire rod 503 and a rotary handle 504, and the bottom of the mounting cover 501 is provided with a guide groove 502, and the inner wall of the mounting cover 501 is movably connected with the wire rod 503 through a bearing, and one end of the wire rod 503 is fixedly connected with the rotary handle 504, the adjusting component 5 also includes a movable block 505, and the movable block 505 is sleeved on the wire rod 503, and the inner wall of the movable block 505 is threadedly connected with the outer wall of the wire rod 503, and the outer wall of the movable block 505 is fitted with the inner wall of the mounting cover 501, the adjusting component 5 also includes a connecting piece 506, and the connecting piece 506 is welded to the bottom of the movable block 505, and the bottom of the connecting piece 506 is fixedly connected to the top of the lifting cylinder 6, the bottom end of the lifting cylinder 6 is fixedly connected with a buffer component 7, and the bottom of the buffer component 7 is connected with a pressure head 8;

[0025] The specific operation is as follows: holding the handle 303, insert the carrying plate 302 carrying the plastic base carrier 304 into the operating table 301, and then adjust the position of the pressure head 8 according to the position of the plastic base carrier 304; holding the rotary handle 504, rotate the metal wire rod 503, and cooperate with the inner wall of the mounting cover 501 to limit the movement trajectory of the movable block 505, so that the movable block 505 can translate under the rotation drive of the metal wire rod 503, thereby driving the connecting piece 506 and the lifting cylinder 6 at the bottom thereof to move, so as to achieve the purpose of adjusting the downward pressing position of the pressure head 8; after the position of the pressure head 8 is adjusted appropriately, the material to be bonded is mounted on the conductive positioning mechanism 2, the conductive positioning mechanism 2 is started, and the conductive positioning mechanism 2 is used to transport the material to the top of the plastic base carrier 304, and the lifting cylinder 6 is started, and the pressure head 8 is driven to be pressed down by the lifting cylinder 6, so that the IC circuit at the bottom of the pressure head 8 is aligned with the plastic base sheet material on the top surface of the plastic base carrier 304 for bonding.

[0026] like Figure 1 , Figure 2 and Figure 4 As shown, the bottom end of the lifting cylinder 6 is fixedly connected with a buffer assembly 7, and the bottom of the buffer assembly 7 is connected with a pressure head 8, the buffer assembly 7 includes a connecting plate 701, a pressure sensor 702 and a sleeve 703, and the top of the connecting plate 701 is fixedly connected to the bottom end of the lifting cylinder 6, and the pressure sensor 702 is installed at the bottom center position of the connecting plate 701, and the top of the connecting plate 701 is embedded with a sleeve 703, the buffer assembly 7 also includes a guide rod 704 and a limit plate 705, and the bottom end of the guide rod 704 is fixedly connected to the top of the pressure head 8, and the guide rod 704 and the sleeve 703 form a through structure, and the top of the guide rod 704 is welded with a limit plate 705, the buffer assembly 7 also includes a buffer spring 706, and the buffer spring 706 is arranged between the pressure head 8 and the connecting plate 701, and one end of the buffer spring 706 is fixedly connected to the connecting plate 701, and the other end of the buffer spring 706 is fixedly connected to the pressure head 8;

[0027] The specific operation is as follows: the buffer assembly 7 and the pressure head 8 are pressed downward by the lifting cylinder 6. When the pressure head 8 reaches the material, the lifting cylinder 6 continues to drive the connecting plate 701 to move downward, so that the buffer spring 706 at the bottom of the connecting plate 701 is compressed, and the top of the guide rod 704 gradually extends out of the sleeve 703. At the same time, the pressure sensor 702 will monitor the pressure change in real time, and when the downward pressure reaches the target value, the lifting cylinder 6 will be stopped to avoid problems such as IC chip breakage caused by excessive downward pressure of the pressure head 8. The buffer assembly 7 set up can not only play a buffering role, but also strictly control the downward pressure, which is beneficial to improving the product bonding quality.

[0028] In summary, according to Figure 1-Figure 4As shown in the figure, the working principle of the adjustable IC bonding machine is as follows: first, hold the pull handle 303, insert the carrying plate 302 carrying the plastic base carrier 304 into the operating table 301, and then adjust the position of the pressure head 8 according to the position of the plastic base carrier 304, hold the rotating handle 504 to rotate the metal wire rod 503, and cooperate with the inner wall of the mounting cover 501 to limit the movement trajectory of the movable block 505, so that the movable block 505 can be translated under the rotation drive of the metal wire rod 503, thereby driving the pressure head 8 to move, and after the position of the pressure head 8 is adjusted to be appropriate, the material to be bonded is placed on the conductive positioning mechanism 2, and the conductive positioning mechanism 2 is used. Mechanism 2 transports the material to the top of the plastic base carrier 304, starts the lifting cylinder 6, and drives the pressure head 8 to press down through the lifting cylinder 6, so that the IC circuit at the bottom of the pressure head 8 is aligned with the plastic base sheet on the top surface of the plastic base carrier 304 for bonding. During this process, when the pressure head 8 reaches the material, the lifting cylinder 6 continues to drive the connecting plate 701 to move downward, so that the buffer spring 706 at the bottom of the connecting plate 701 is compressed, and the top of the guide rod 704 gradually extends out of the sleeve 703. At the same time, the pressure sensor 702 is used to monitor the pressure change in real time, and when the downward pressure reaches the target value, the lifting cylinder 6 is stopped to end the bonding operation.

[0029] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An adjustable IC bonding machine, comprising a bonding cabinet (1) and an adjustment component (5), characterized in that: A conductive positioning mechanism (2) is disposed on the wall in the middle of the bonding cabinet (1), and a carrying mechanism (3) is disposed on one side of the bottom of the conductive positioning mechanism (2). A material plate (4) is disposed in the middle of the bonding cabinet (1), and the material plate (4) is located on the right side of the carrying mechanism (3). The adjustment component (5) is fixedly mounted on the middle top wall of the bonding cabinet (1), and the bottom of the adjustment component (5) is connected to a lifting cylinder (6). The bottom end of the lifting cylinder (6) is fixedly connected to a buffer component (7), and the bottom of the buffer component (7) is connected to a pressure head (8).

2. An adjustable IC bonding machine according to claim 1, characterized in that: The carrying mechanism (3) includes an operating table (301), a carrying plate (302), a handle (303) and a plastic-based carrier (304), and the operating table (301) is fixed in the middle of the bonding cabinet (1), and the top of the operating table (301) is connected to the carrying plate (302), and the operating table (301) and the carrying plate (302) form a sliding structure, and the handle (303) is welded on the left side of the carrying plate (302), and the top of the carrying plate (302) is fixed with a plastic-based carrier (304), and the plastic-based carrier (304) is installed on the top of the operating table (301) through the carrying plate (302).

3. An adjustable IC bonding machine according to claim 1, characterized in that: The adjustment assembly (5) comprises a mounting cover (501), a guide groove (502), a metal wire rod (503) and a rotary handle (504), wherein the bottom of the mounting cover (501) is provided with a guide groove (502), the inner wall of the mounting cover (501) is movably connected to the metal wire rod (503) via a bearing, and one end of the metal wire rod (503) is fixedly connected to the rotary handle (504).

4. An adjustable IC bonding machine according to claim 3, characterized in that: The adjustment assembly (5) further comprises a movable block (505), and the movable block (505) is sleeved on the metal wire rod (503), and the inner wall of the movable block (505) is threadedly connected to the outer wall of the metal wire rod (503), and the outer wall of the movable block (505) is in contact with the inner wall of the mounting cover (501).

5. An adjustable IC bonding machine according to claim 4, characterized in that: The adjustment assembly (5) further comprises a connecting piece (506), and the connecting piece (506) is welded to the bottom of the movable block (505), and the bottom of the connecting piece (506) is fixedly connected to the top of the lifting cylinder (6).

6. An adjustable IC bonding machine according to claim 1, characterized in that: The buffer assembly (7) comprises a connecting plate (701), a pressure sensor (702) and a sleeve (703), wherein the top of the connecting plate (701) is fixedly connected to the bottom end of the lifting cylinder (6), the pressure sensor (702) is installed at the center of the bottom of the connecting plate (701), and the sleeve (703) is embedded in the top of the connecting plate (701).

7. An adjustable IC bonding machine according to claim 6, characterized in that: The buffer assembly (7) further comprises a guide rod (704) and a limit plate (705), wherein the bottom end of the guide rod (704) is fixedly connected to the top of the pressure head (8), the guide rod (704) and the sleeve (703) form a through structure, and the limit plate (705) is welded to the top end of the guide rod (704).

8. An adjustable IC bonding machine according to claim 7, characterized in that: The buffer assembly (7) also includes a buffer spring (706), and the buffer spring (706) is arranged between the pressure head (8) and the connecting plate (701), and one end of the buffer spring (706) is fixedly connected to the connecting plate (701), and the other end of the buffer spring (706) is fixedly connected to the pressure head (8).

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