Single-station wafer thinning machine

Abstract

The utility model discloses a single-station wafer thinning machine, which relates to the field of wafer thinning machines and comprises a top plate, supporting rods are fixedly mounted at four corners of the bottom of the top plate, the bottoms of the supporting rods are fixedly mounted at four corners of the top of a workbench, a fixed table is fixedly mounted in the middle of the top of the workbench, and the fixed table is fixedly mounted at the bottom of the top of the workbench. A positioning vacuum suction cup is installed in a cavity in the top of the fixing table, a grinding motor is fixedly installed at the top in the cavity of the workbench, and the output end of the grinding motor is connected with the fixing table. Mounting openings are correspondingly formed in the two ends of the top of the workbench, a water retaining ring is arranged on the outer side of the top of the workbench, an electric telescopic rod is fixedly mounted at the bottom of the top plate, and a grinding block is fixedly mounted at the bottom of the electric telescopic rod. The interior of the wafer thinning machine is cleaned in time through the cleaning mechanism, waste materials polished by the wafer thinning machine are cleaned away, and the situation that the surface smoothness of the subsequent polished wafer is affected due to the fact that the waste materials fall on the subsequent to-be-polished wafer is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning machines, in particular to a single-station wafer thinning machine. Background Art

[0002] With the continuous development of society, electronic products are increasing and developing, and wafers used to make silicon semiconductor circuits are widely used. Wafers are usually made of silicon materials and have a certain thickness. Therefore, in the semiconductor production process, the thickness of the wafer needs to be reduced. This process step is wafer thinning.

[0003] Patent No. CN218533845U is a wafer thinning machine with a reinforcement structure, comprising a machine body and a grinding table arranged on the top surface of the machine body, a vacuum suction cup is arranged on the top of the grinding table, and a wafer product is placed on the vacuum suction cup, two reinforcement mechanisms are symmetrically arranged on the top of the grinding table, the reinforcement mechanism comprises a base fixed on the top surface of the grinding table and a limit assembly, a movable groove is opened in the base, and a bottom block is movably arranged in the movable groove, the top end of the bottom block extends to the top of the base, and is rotatably connected with a top block; by arranging the reinforcement mechanism on the original wafer thinning machine, when the wafer thinning machine performs thinning and grinding on the center of the wafer product, the wafer product can be effectively pressed and reinforced, the stability of the wafer product during thinning and grinding is ensured, and it is prevented from falling off the vacuum suction cup, so as to ensure the stable operation of the wafer thinning machine. There is a lack of cleaning mechanism during use, so that the waste polished by the wafer thinning machine affects the subsequent wafer grinding.

[0004] The surface of the wafer needs to be kept smooth, and the wafer thinning machine will produce a lot of waste after grinding the wafer. If the waste is not cleaned out of the wafer thinning machine in time, it will affect the subsequent polishing of the wafer, and it is very easy to make the surface of the subsequent polished wafer lack smoothness. Utility Model Content

[0005] The utility model aims to provide a single-station wafer thinning machine to solve the problem in the above-mentioned background technology that waste generated by the wafer thinning machine during wafer grinding is not cleaned up in time, which will affect the smoothness of the subsequent wafer surface grinding.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single-station wafer thinning machine, comprising: a top plate, the four corners of the bottom of the top plate are fixedly installed with support rods, the bottoms of the support rods are fixedly installed at the four corners of the top of the workbench, a fixed table is fixedly installed in the middle of the top of the workbench, a positioning vacuum suction cup is installed in the cavity at the top of the fixed table, and the top of the positioning vacuum suction cup is flush with the top of the fixed table, a grinding motor is fixedly installed on the top of the workbench cavity, and the output end of the grinding motor is connected to the fixed table;

[0007] Mounting openings are correspondingly provided at both ends of the top of the workbench, a water retaining ring is provided on the outer side of the top of the workbench, an electric telescopic rod is fixedly installed at the bottom of the top plate, a grinding block is fixedly installed at the bottom of the electric telescopic rod, and the grinding block is aligned with the fixed platform up and down;

[0008] A cleaning mechanism is provided in the workbench cavity, and waste materials generated by grinding of the wafer thinning machine are cleaned by the cleaning mechanism;

[0009] A shock absorbing mechanism is provided below the workbench, and the shock absorbing mechanism is used to absorb vibrations of the working wafer thinning machine to prevent vibrations from affecting the operation of the wafer thinning machine.

[0010] Furthermore, the cleaning mechanism includes a liquid storage tank, a water pump is fixedly installed under one side of the liquid storage tank, and the liquid storage tank is fixedly installed on one side of the workbench cavity.

[0011] Furthermore, one end of the water pump is fixedly connected to one end below the Y-shaped connecting pipe, the two ends above the Y-shaped connecting pipe are respectively fixedly connected to one side of the two assembly pipes, and the tops of the two assembly pipes are respectively fixedly installed at the two ends of the bottom of the top plate.

[0012] Furthermore, a plurality of connecting branch pipes are arranged in an array at the bottom of one side of the two assembly pipes along the length of the assembly pipes, a nozzle is installed one by one on one side of the connecting branch pipes, and a collecting block is fixedly installed in each of the two installation ports.

[0013] Furthermore, a sewage pipe is fixedly installed at the bottom of each of the two collecting blocks, and the bottoms of the two sewage pipes are respectively fixedly installed at the two ends of the top of the waste box.

[0014] Furthermore, the shock absorbing mechanism includes a base plate, a soft rubber pad is fixedly installed in the middle of the top of the base plate, and the soft rubber pad is made of rubber material, and the workbench is placed above the soft rubber pad.

[0015] Furthermore, a plurality of connecting columns are provided in an array at both ends of the top of the base plate, and connecting plates are installed below both ends of the workbench. Moving holes are opened in an array on the tops of the two connecting plates, and the connecting columns on both sides of the base plate pass through the moving holes one by one. Shock-absorbing springs are provided on the outsides of the connecting columns, and the shock-absorbing springs are located between the base plate and the connecting columns. Support feet are installed at both ends of the bottom of the base plate.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. Use the cleaning mechanism to clean the wafer thinning machine in time to remove the waste polished by the wafer thinning machine to prevent the waste from falling on the wafer to be polished later, thereby affecting the smoothness of the surface of the wafer after subsequent polishing.

[0018] 2. Use the cleaning liquid in the liquid storage tank to clean the fixed table and other positions on the workbench to provide a clean polishing space for the subsequent wafers to be polished. The water pump provides power for the flow of the cleaning liquid in the liquid storage tank. At the same time, use the collection block and waste box to collect waste and sewage to prevent waste and sewage from affecting polishing.

[0019] 3. The cleaning fluid can be used to cool the polished wafers and polishing blocks, improve the quality of the wafers, and prevent the polishing temperature from being too high and affecting the quality of the wafers.

[0020] 4. The shock absorbing mechanism reduces the vibration of the workbench to prevent the wafer thinning machine from being affected by vibration when working, thereby reducing the accuracy of the wafer thinning machine in polishing the wafer.

[0021] 5. Use soft rubber pads to reduce the shock of the workbench, and use the shock-absorbing springs on the connecting columns to assist in shock absorption. Double shock absorption makes shock absorption more reliable and effectively prevents the impact of vibration on the wafer thinning machine polishing wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the workbench of the utility model;

[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of the fixed platform of the utility model;

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the Y-shaped connecting pipe of the utility model;

[0026] Figure 5 This is a schematic diagram of the three-dimensional structure of the assembly tube of the utility model;

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the base plate of the utility model.

[0028] In the figure: 1. Top plate; 2. Support rod; 3. Workbench; 4. Fixed table; 5. Positioning vacuum suction cup; 6. Grinding motor; 7. Mounting port; 8. Water retaining ring; 9. Electric telescopic rod; 10. Grinding block; 11. Liquid storage tank; 12. Water pump; 13. Y-type connecting pipe; 14. Assembly pipe; 15. Connecting branch pipe; 16. Nozzle; 17. Collecting block; 18. Drain pipe; 19. Waste box; 20. Base plate; 21. Soft rubber pad; 22. Connecting column; 23. Connecting plate; 24. Moving hole; 25. Shock-absorbing spring; 26. Support foot. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 6 The utility model provides the following technical solution: a single-station wafer thinning machine, comprising: a top plate 1, the four corners of the bottom of the top plate 1 are fixedly mounted with support rods 2, and the bottoms of the support rods 2 are fixedly mounted on the four corners of the top of the workbench 3;

[0031] Embodiment 1

[0032] like Figure 1-Figure 3 As shown, the device is designed to rotate and polish the wafer, reduce the thickness of the wafer, and make the wafer better for use in silicon semiconductor circuits, as follows:

[0033] A fixed table 4 is fixedly installed in the middle of the top of the workbench 3, a positioning vacuum suction cup 5 is installed in the cavity on the top of the fixed table 4, and the top of the positioning vacuum suction cup 5 is flush with the top of the fixed table 4, a grinding motor 6 is fixedly installed on the top of the cavity of the workbench 3, and the output end of the grinding motor 6 is connected to the fixed table 4; mounting openings 7 are correspondingly opened at both ends of the top of the workbench 3, a water retaining ring 8 is provided on the outer side of the top of the workbench 3, an electric telescopic rod 9 is fixedly installed at the bottom of the top plate 1, and a grinding block 10 is fixedly installed at the bottom of the electric telescopic rod 9, and the grinding block 10 is aligned with the fixed table 4 up and down;

[0034] The position of the wafer is fixed by the positioning vacuum suction cup 5 in the fixing table 4, and the fixing table 4 is rotated by the grinding motor 6 to rotate the wafer fixed on the fixing table 4. The electric telescopic rod 9 moves the grinding block 10 downward to make the grinding block 10 close to the wafer and grind the contact part to make the wafer thinner.

[0035] Embodiment 2

[0036] like Figure 3-Figure 5 As shown, the device cleans the wafer thinning machine through a cleaning mechanism to prevent the polishing waste from affecting the subsequent wafer polishing, as follows:

[0037] A cleaning mechanism is provided in the cavity of the workbench 3, and the cleaning mechanism is used to clean the waste generated by the grinding of the wafer thinning machine; a shock-absorbing mechanism is provided below the workbench 3, and the shock-absorbing mechanism is used to reduce the vibration of the working wafer thinning machine to prevent the vibration from affecting the operation of the wafer thinning machine; the cleaning mechanism includes a liquid storage tank 11, and a water pump 12 is fixedly installed below one side of the liquid storage tank 11, and the liquid storage tank 11 is fixedly installed on one side of the cavity of the workbench 3; one end of the water pump 12 is fixedly connected to one end below the Y-shaped connecting pipe 13, and the two ends above the Y-shaped connecting pipe 13 are respectively fixedly connected to one side of the two assembly pipes 14, and the tops of the two assembly pipes 14 are respectively fixedly installed at the two ends of the bottom of the top plate 1;

[0038] A plurality of connecting branch pipes 15 are arranged in an array at the bottom of one side of the two assembly pipes 14 along the length of the assembly pipes 14. A nozzle 16 is installed on one side of the connecting branch pipes 15 in a one-to-one correspondence. A collecting block 17 is fixedly installed in each of the two installation ports 7. A sewage pipe 18 is fixedly installed at the bottom of each of the two collecting blocks 17. The bottoms of the two sewage pipes 18 are fixedly installed at the two ends of the top of the waste box 19 respectively.

[0039] The liquid storage tank 11 is used to store cleaning liquid for cleaning, and the water pump 12 provides power for the flow and spraying of the cleaning liquid. The water pump 12 and the Y-type connecting pipe 13 are used to make the cleaning liquid enter the assembly pipe 14, and then spray out from the nozzle 16 installed on the connecting branch pipe 15 of the assembly pipe 14. The sprayed cleaning liquid cleans the fixed platform 4, etc., and then the collection block 17 and the sewage pipe 18 are used to make the waste enter the waste box 19 with the water flow for collection.

[0040] Embodiment 3

[0041] like Figure 1 and Figure 6 As shown, the shock-absorbing mechanism designed in the equipment can reduce the impact of vibration on wafer polishing when the equipment is polishing the wafer, as follows:

[0042] The shock absorbing mechanism includes a base plate 20, a soft rubber pad 21 is fixedly installed in the middle of the top of the base plate 20, and the soft rubber pad 21 is made of rubber material, and the workbench 3 is placed above the soft rubber pad 21; a plurality of connecting columns 22 are arranged in an array at both ends of the top of the base plate 20, and connecting plates 23 are arranged below the two ends of the workbench 3, and moving holes 24 are arranged in an array at the top of the two connecting plates 23, and the connecting columns 22 on both sides of the base plate 20 pass through the moving holes 24 one by one, and shock absorbing springs 25 are sleeved on the outer sides of the connecting columns 22, and the shock absorbing springs 25 are located between the base plate 20 and the connecting columns 22, and supporting feet 26 are arranged at both ends of the bottom of the base plate 20;

[0043] When the soft rubber pad 21 is used to reduce the shock of the workbench 3, the shock-absorbing spring 25 assists in cooperating with the soft rubber pad 21 to reduce the shock of the workbench 3. The double shock absorption makes the shock absorption effect better and more reliable. The supporting foot 26 is used to better support the equipment, and the connecting plate 23 assembles the shock-absorbing mechanism and the workbench 3 together.

[0044] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A single-station wafer thinning machine, characterized in that: include: A top plate (1), support rods (2) are fixedly mounted at the four corners of the bottom of the top plate (1), the bottoms of the support rods (2) are fixedly mounted at the four corners of the top of a workbench (3), a fixed table (4) is fixedly mounted in the middle of the top of the workbench (3), a positioning vacuum suction cup (5) is mounted in the cavity at the top of the fixed table (4), and the top of the positioning vacuum suction cup (5) is flush with the top of the fixed table (4), a grinding motor (6) is fixedly mounted at the top of the cavity of the workbench (3), and the output end of the grinding motor (6) is connected to the fixed table (4); Mounting openings (7) are correspondingly provided at both ends of the top of the workbench (3); a water retaining ring (8) is provided on the outer side of the top of the workbench (3); an electric telescopic rod (9) is fixedly installed at the bottom of the top plate (1); a grinding block (10) is fixedly installed at the bottom of the electric telescopic rod (9); and the grinding block (10) is aligned with the fixed platform (4) in the vertical direction; The workbench (3) has a cleaning mechanism in the cavity, which is used to clean the waste generated by the wafer thinning machine; A shock absorbing mechanism is provided below the workbench (3), and the shock absorbing mechanism is used to absorb the vibration of the wafer thinning machine in operation, thereby preventing vibration from affecting the operation of the wafer thinning machine.

2. A single-station wafer thinning machine according to claim 1, characterized in that: The cleaning mechanism comprises a liquid storage tank (11), a water pump (12) is fixedly installed below one side of the liquid storage tank (11), and the liquid storage tank (11) is fixedly installed on one side of the cavity of the workbench (3).

3. A single-station wafer thinning machine according to claim 2, characterized in that: One end of the water pump (12) is fixedly connected to one end below the Y-shaped connecting pipe (13), and the two ends above the Y-shaped connecting pipe (13) are respectively fixedly connected to one side of two assembly pipes (14), and the tops of the two assembly pipes (14) are respectively fixedly mounted on the two ends of the bottom of the top plate (1).

4. A single-station wafer thinning machine according to claim 3, characterized in that: A plurality of connecting branch pipes (15) are arranged in an array at the bottom of one side of the two assembly pipes (14) along the length of the assembly pipes (14), a nozzle (16) is installed on one side of the connecting branch pipes (15) in a one-to-one correspondence, and a collecting block (17) is fixedly installed in each of the two installation ports (7).

5. A single-station wafer thinning machine according to claim 4, characterized in that: A sewage pipe (18) is fixedly mounted at the bottom of each of the two collecting blocks (17), and the bottoms of the two sewage pipes (18) are respectively fixedly mounted at the two ends of the top of the waste box (19).

6. The single-station wafer thinning machine according to claim 1, characterized in that: The shock absorbing mechanism comprises a base plate (20), a soft rubber pad (21) is fixedly mounted in the middle of the top of the base plate (20), and the soft rubber pad (21) is made of rubber material, and the workbench (3) is placed above the soft rubber pad (21).

7. A single-station wafer thinning machine according to claim 6, characterized in that: A plurality of connecting columns (22) are arranged in an array at the two ends of the top of the base plate (20), and connecting plates (23) are installed below the two ends of the workbench (3). The tops of the two connecting plates (23) are arranged with movable holes (24) in an array, and the connecting columns (22) on both sides of the base plate (20) pass through the movable holes (24) one by one. Shock-absorbing springs (25) are sleeved on the outer sides of the connecting columns (22), and the shock-absorbing springs (25) are located between the base plate (20) and the connecting columns (22). Support feet (26) are installed at the two ends of the bottom of the base plate (20).

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