CPU support with heat dissipation mechanism

Abstract

The utility model provides a CPU (Central Processing Unit) support with a heat dissipation mechanism, which comprises a support main body, the support main body is square, a CPU mounting groove is formed in the middle of the support main body, and the CPU mounting groove is contacted and tightly attached to the side wall of a CPU; the interior of the support body is of a hollow structure, a circulating air chamber is formed, and heat conduction fins are arranged on the inner side wall, making contact with a CPU, of the circulating air chamber. An air inlet and an air outlet which are communicated with the circulating air chamber are respectively formed in the side wall of the bracket main body; a small fan is inserted into the air inlet; the CPU support with the heat dissipation mechanism is provided with an active heat dissipation structure, heat generated by a CPU can be transmitted into the circulating air chamber through the heat conduction fins, the heat of the CPU is transmitted to the outside through circulating air flow in the circulating air chamber, and the purpose of reducing the temperature of the CPU is achieved.

Description

Technical Field

[0001] The utility model relates to the field of CPU brackets, in particular to a CPU bracket with a heat dissipation mechanism. Background Art

[0002] The central processing unit (hereinafter referred to as CPU) is the computing core and control core of a computer launched in 1971. It is the final execution unit for information processing and program running. The CPU contains computing logic components, register components and control components, and has functions such as processing instructions, executing operations, controlling time, and processing data. The CPU is installed in a slot on the surface of the motherboard, and is generally fixed by a CPU bracket. With the advent of the information age, the operating frequency of the CPU is getting higher and higher, and the temperature of the CPU during operation is also getting higher and higher. After the CPU is installed through the bracket, a cooling fan is required to dissipate heat during operation. As the temperature of the CPU increases during operation, the cooling effect of the cooling fan becomes lower and lower, resulting in a slower drop in the temperature of the CPU, affecting the service life and efficiency of the CPU.

[0003] In the related technology, a utility model patent with patent announcement number CN216387954U was searched and proposed a CPU bracket structure with excellent heat dissipation performance. The lower surface of the base is coated with a pressure-sensitive adhesive layer, and a protrusion is integrally formed in the middle of the upper surface of the base. A card slot is provided on the surface of the protrusion, and a frame is installed on one side of the protrusion. Guide pillars are symmetrically welded on the inside of the frame. A spring is sleeved on the surface of the guide pillar, and the length of the spring is the same as that of the guide pillar. A first through hole is provided at both ends of the frame, and sliders are movably provided at both ends of the spring. A card block is integrally formed on the side wall of the slider, and the card block corresponds to the first through hole.

[0004] According to the above-mentioned prior art, the inventor combined relevant technologies and found in actual applications that the CPU brackets in the prior art all cool the CPU by passive heat dissipation by providing the CPU with heat dissipation space, and the bracket itself does not have a mechanism for actively dissipating heat for the CPU, resulting in poor heat dissipation effect, and can no longer cope with CPUs with increasingly higher operating frequencies. Utility Model Content

[0005] In order to solve the problem that the CPU bracket in the prior art can only dissipate heat passively and has no active heat dissipation mechanism, resulting in poor heat dissipation effect and slow CPU temperature reduction, the utility model provides a CPU bracket with a heat dissipation mechanism;

[0006] The utility model provides a CPU bracket with a heat dissipation mechanism adopts the following technical solution:

[0007] A CPU bracket with a heat dissipation mechanism comprises a bracket body, the bracket body is in a "mouth" shape, a CPU mounting slot is formed in the middle of the bracket body, the CPU mounting slot is in contact with and tightly fits with the side wall of the CPU; the interior of the bracket body is a hollow structure and is formed with a circulating air chamber, the inner side wall of the circulating air chamber in contact with the CPU is provided with heat conducting fins; the side walls of the bracket body are respectively provided with an air inlet and an air outlet connected to the circulating air chamber, and the air inlet is plugged with a small fan;

[0008] Furthermore, a plurality of fixing holes for connecting the bracket body to the main board are provided at the top of the bracket body near the edge, and the fixing holes are cylindrical countersunk holes;

[0009] Furthermore, slots are respectively provided on the side walls of the air inlet and the air outlet, and filter screens for filtering dust are pluggably connected in the slots;

[0010] Furthermore, an air guide plate is provided inside the circulating air chamber;

[0011] Furthermore, the number of the heat conducting fins is N, where N≥2;

[0012] Furthermore, the contacting parts of the CPU mounting slot and the side wall of the CPU are both smooth and coated with thermal conductive silicone grease;

[0013] Furthermore, the heat conducting fins are pure copper fins.

[0014] In summary, the beneficial effects of the utility model are:

[0015] The utility model arranges a circulating air chamber and heat-conducting fins inside the bracket body, so that the heat generated by the CPU can be transferred into the circulating air chamber through the heat-conducting fins, thereby reducing the temperature of the CPU; by arranging an air inlet, an air outlet and a small fan, a circulating airflow can be generated in the circulating air chamber to transfer the heat of the heat-conducting fins to the outside; by arranging slots and filters on the side walls of the air inlet and the air outlet, dust adsorbed by static electricity generated when the computer is working can be blocked outside the circulating air chamber, and because the filter is pluggable, the filter can be regularly removed for cleaning to ensure heat dissipation; by arranging an air guide plate inside the circulating air chamber, the internal airflow direction is made consistent, thereby accelerating the airflow circulation in the circulating air chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a top view schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the specific structure of the utility model;

[0018] Figure 3It is a top view cross-sectional schematic diagram of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure A of the utility model.

[0020] As shown in the figure: 1- bracket body, 2- CPU installation slot, 3- circulating air chamber, 4- heat transfer fins, 5- air inlet, 6- air outlet, 7- small fan, 8- slot, 9- filter, 10- air guide plate, 11- fixing hole. DETAILED DESCRIPTION

[0021] The following is combined with Figure 1 -Attached Figure 4 The utility model is further described in detail:

[0022] The utility model embodiment discloses a CPU bracket with a heat dissipation mechanism, such as Figure 1 , Figure 3 As shown, a CPU bracket with a heat dissipation mechanism of the utility model comprises a bracket body 1, the bracket body 1 is in the shape of a "mouth", a CPU mounting slot 2 is formed in the middle of the bracket body 1, and the CPU mounting slot 2 is in contact with and closely fit with the side wall of the CPU; the inside of the bracket body 1 is a hollow structure and a circulating air chamber 3 is formed, and the inner side wall of the circulating air chamber 3 in contact with the CPU is provided with heat conducting fins 4; the side wall of the bracket body 1 is respectively provided with an air inlet 5 and an air outlet 6 connected to the circulating air chamber 3, and the air inlet 5 is plugged with a small fan 7; in this embodiment, the inside of the bracket body 1 is a hollow structure, and by arranging the circulating air chamber 3 and the heat conducting fins 4 inside the bracket body 1, the heat generated by the CPU can be transferred to the circulating air chamber 3 through the heat conducting fins 4. By arranging the air inlet 5, the air outlet 6 and the small fan 7, a circulating airflow can be generated in the circulating air chamber 3, and the heat of the heat conducting fins 4 can be transferred to the outside from the air outlet 6. Preferably, the parts where the CPU mounting slot 2 contacts the side wall of the CPU are smooth and coated with thermal grease. The advantage of this is that the thermal grease can fill the gap between the CPU mounting slot 2 and the side wall of the CPU, and at the same time, the heat of the CPU can be better transferred to the thermal fins 4 inside the circulating air chamber 3. Preferably, the number of thermal fins 4 is N, N ≥ 2. In this embodiment, the number of thermal fins 4 is 4, and the number of thermal fins 4 can be adjusted according to the number of CPU mounting slots 2 and the side walls of the CPU in contact. Preferably, the thermal fins 4 are pure copper fins. Since copper has good thermal conductivity, the material of the thermal fins 4 in this embodiment is copper. The material of the thermal fins 4 can also be silver or copper with nickel plating on the surface.

[0023] like Figure 1 , Figure 2As shown, a plurality of fixing holes 11 for connecting the bracket body 1 to the main board are provided at the top near the edge, and the fixing holes 11 are cylindrical countersunk holes. In this embodiment, by providing the fixing holes 11, the bracket body 1 can be more firmly fixed on the main board, and the bracket body 1 can also be fixed by gluing or other methods. The fixing holes 11 are provided at the four corners of the bracket body 1 and do not enter the circulating air chamber 3, and do not affect the airflow direction in the circulating air chamber 3. Preferably, the fixing holes 11 are cylindrical countersunk holes.

[0024] like Figure 2 , Figure 4 As shown, slots 8 are respectively provided on the side walls of the air inlet 5 and the air outlet 6, and a filter 9 for filtering dust is pluggably connected in the slot 8; in this embodiment, by arranging the slots 8 and the filter 9 on the side walls of the air inlet 5 and the air outlet 6, the dust adsorbed by static electricity generated when the computer is working can be blocked outside the circulating air chamber 3, and since the filter 9 is pluggable, the filter 9 can be removed regularly for cleaning.

[0025] like Figure 3 As shown, an air guide plate 10 is provided inside the circulating air chamber 3; in this embodiment, by providing the air guide plate 10 inside the circulating air chamber 3, the internal air flow direction is made consistent, thereby accelerating the air flow circulation in the circulating air chamber 3.

[0026] The implementation principle of the embodiment of the utility model is:

[0027] The heat generated by the CPU is transferred to the circulating air chamber 3 through the thermal fins 4. When the small fan 7 is working, the air enters from the air inlet 5 and flows out from the air outlet 6. The heat in the thermal fins 4 is taken away by the flow of the air flow, thereby cooling the CPU. When dust blocks the filter 9, the filter 9 is pulled out from the slot 8 and reinserted after cleaning.

[0028] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. The various components mentioned in the utility model are common technologies in the existing field. The technicians in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A CPU bracket with a heat dissipation mechanism, comprising a bracket body (1), wherein the bracket body (1) is in the shape of a "mouth", and a CPU mounting groove (2) is formed in the middle of the bracket body (1), characterized in that: The CPU installation slot (2) contacts and fits tightly with the side wall of the CPU; the interior of the bracket body (1) is a hollow structure and is formed with a circulating air chamber (3); the inner side wall of the circulating air chamber (3) in contact with the CPU is provided with heat conducting fins (4); the side walls of the bracket body (1) are respectively provided with an air inlet (5) and an air outlet (6) connected to the circulating air chamber (3); the air inlet (5) is plugged with a small fan (7).

2. A CPU bracket with a heat dissipation mechanism according to claim 1, characterized in that: A plurality of fixing holes (11) for connecting the bracket body (1) to the main board are provided at the top of the bracket body (1) near the edge, and the fixing holes (11) are cylindrical countersunk holes.

3. A CPU bracket with a heat dissipation mechanism according to claim 2, characterized in that: Slots (8) are respectively provided on the side walls of the air inlet (5) and the air outlet (6), and filter screens (9) for filtering dust are pluggably connected in the slots (8).

4. A CPU bracket with a heat dissipation mechanism according to claim 3, characterized in that: An air guide plate (10) is arranged inside the circulating air chamber (3).

5. The CPU bracket with a heat dissipation mechanism according to claim 1, characterized in that: The number of the heat-conducting fins (4) is N, where N≥2.

6. The CPU bracket with a heat dissipation mechanism according to claim 1, characterized in that: The parts of the CPU installation slot (2) that contact the side wall of the CPU are both smooth and coated with thermal conductive silicone grease.

7. The CPU bracket with a heat dissipation mechanism according to claim 1, characterized in that: The heat conducting fins (4) are pure copper fins.

Images